JP2009187999A - Mounting structure, electrooptical device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting structure which prevents a component from falling into an opening of an insulation film, is always normally soldered to component electrodes and enables easy confirmation of the soldering state to the component electrodes. <P>SOLUTION: In the mounting structure, a wiring 3 is formed on a substrate 2, an insulation film 4 is provided on the substrate 2 so as to cover the wiring 3, an opening 8 is formed in the insulation film 4, lands 9 are connected to the wiring 3 in the opening 8, a component 6 is disposed on the insulation film 4, the component 6 includes electrodes 6a, 6b, the lands 9 are conductively connected to the electrodes 6a, 6b by solders 11, and a part of the component 6 extends to the outside of the lands 9 in plan view and a part of each of the lands 9 protrudes the outside of the component 6 in plan view. Since the part of the component 6 protrudes the outside of the lands 9, the component 6 is prevented from falling into opening 8, and the lands 9 are normally conductively connected to the electrode 6a, 6b by the solders 11 at all times. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a mounting structure in which a wiring pattern is formed of a metal material such as copper on a base material made of plastic or the like. The present invention also relates to an electro-optical device such as a liquid crystal display device formed using the mounting structure. The present invention also relates to an electronic apparatus such as a mobile phone configured using the electro-optical device.

  2. Description of the Related Art Conventionally, electro-optical devices such as liquid crystal display devices and organic EL devices have been widely used in electronic devices such as mobile phones and portable information terminals. In many cases, a wiring substrate, that is, a mounting structure is connected to the electro-optical device by a conductive connection element such as an ACF (Anisotropic Conductive Film). The mounting structure is formed by, for example, forming a wiring pattern on a base, forming an insulating film on the base, and mounting a component such as a capacitor on the mounting structure, as disclosed in Patent Document 1, for example. Yes.

  Patent Document 1 discloses a wiring structure as shown in FIGS. 7A and 7B of the drawings of the present application. In these drawings, an opening 104 is provided in the insulating film 103 at a position corresponding to the terminal portion 102 of the wiring pattern 101. A land 106 is formed of gold or the like on the wiring terminal 102 in the opening 104. A component 107 is disposed on the insulating film 103, and electrodes 107 a and 107 b of the component 107 are disposed on the opening 104 of the insulating film 103. The land 106 and the component electrodes 107a and 107b are conductively connected by a conductive connecting material 108 such as solder.

  Further, Patent Document 1 discloses a technique in which the size of a land portion (that is, an opening in an insulating film) is made smaller than that of a component electrode, as shown in FIG. This technique is employed in order to increase the wiring density of the wiring pattern formed in the vicinity of the land.

JP 2000-091726 A (second page, FIG. 1)

  In the prior art shown in FIGS. 7A and 7B, the opening 104 is formed larger than the component electrodes 107a and 107b in the plan view shown in FIG. 107 a and 107 b are included in the opening 104. For this reason, as shown in FIG. 7B, the component 107 may tilt and move with the edge of the opening 104 of the insulating film 103 as a fulcrum, and its end may fall into the opening 104. When this drop occurs, the electrode 107b on the opposite side floats in the air, and there is a risk that a poor electrical connection with the land 106 will occur.

  Moreover, if the opening of the insulating film is formed smaller than the component electrode in a plan view as in the prior art shown in FIG. 1 of the conventional document 1, the above-described drop of the component into the opening is prevented. The However, in the case of this prior art, since the welding area of the solder to the component electrodes and lands is small, there is a possibility that a poor conductive connection may occur. Further, since the solder is hidden behind the component electrode, it is impossible to visually confirm whether the solder is normally welded to the component electrode and the land.

  The present invention has been made in view of the above-described problems, and can prevent a component from falling into the opening of the insulating film, and always performs conductive connection processing such as soldering normally on the component electrode. It is another object of the present invention to provide a mounting structure, an electro-optical device, and an electronic apparatus that can easily check a conductive connection processing state for a component electrode.

  A first mounting structure according to the present invention includes a wiring formed on a substrate and an insulating layer provided on the substrate so as to cover the wiring and having an opening corresponding to a part of the wiring. A film, a land connected to the wiring in the opening of the insulating film, a component provided with an electrode disposed on the insulating film, and a conductive material that conductively connects the land and the electrode, A part of the part extends outside the land in a plan view, and a part of the land protrudes outside the part in a plan view.

  In this specification, the mounting structure includes (1) a wiring board in which a wiring pattern is formed on a flexible board made of plastic or the like and an insulating film is provided thereon, and (2) an epoxy resin or the like. A wiring pattern is formed on a non-flexible substrate and a wiring substrate is provided with an insulating film thereon, or (3) a wiring pattern is formed on a glass substrate which is a non-flexible hard substrate. And a wiring board provided with an insulating film thereon. As a connection form between the wiring and the land, a case where the land is arranged on the wiring in a stacked state, a case where the wiring and the land are connected to each other on the same plane, or the like can be considered.

  Examples of the component include a capacitor, a resistor, a coil, and a varistor. The shape of the component is, for example, a rectangular parallelepiped shape, a cubic shape, a cylindrical shape, an ellipsoidal shape, a spherical shape, a circular shape in a plan view and a rectangular shape in a side view, and various other three-dimensional shapes as required. For example, solder is used as the conductive material. One or more of the electrodes provided on a part may be provided for one part. The electrodes may be provided at both ends of the component to constitute both ends of the component, or may be provided at a position slightly away from the tip of the component toward the central portion.

  According to the mounting structure according to the present invention, a part of the component extends outside the land, that is, outside the opening of the insulating film in a plan view. For example, the component exists in a plan view from one edge of the opening of the insulating film to the other edge facing the opening beyond the opening. For this reason, the component is prevented from falling into the opening of the insulating film, and the component is not inclined. Therefore, the component and the land can be always conductively connected stably by a conductive material such as solder. In this way, it is possible to prevent the occurrence of defective conductivity of the parts.

  In addition, since a part of the land protrudes to the outside of the part, for example, the outside of the electrode of the part in a plan view, a fillet of a conductive material such as solder (filled part, built-up part) between the land and the electrode of the part , Bottom part or fillet part) can be formed, and poor conduction of parts can be prevented. Further, by visually confirming the fillet, it can be confirmed that the component is normally conductively connected.

  A second mounting structure according to the present invention includes a wiring formed on a substrate and an insulating layer provided on the substrate so as to cover the wiring and having an opening corresponding to a part of the wiring. A film, a land connected to the wiring at the opening of the insulating film, and a component disposed on the insulating film and having an electrode conductively connected to the land via a conductive material, the component having a corner portion The corners are on the insulating film, and a part of the land protrudes to the outside of the component in plan view.

  According to this mounting structure, since the corner of the component is on the insulating film, the component is prevented from falling into the opening, and the component is not tilted. Therefore, a conductive material such as solder is used. Thus, the component and the land can be always conductively connected stably. In this way, it is possible to prevent the occurrence of defective conductivity of the parts. The angle of the corner may be approximately 90 °, or may be more obtuse or more acute. Further, the tip shape of the corner portion can be an arc shape, an elliptical arc shape, a long arc shape, or other rounded shapes.

  Further, according to the mounting structure, a part of the land protrudes to the outside of the component, for example, the outside of the electrode of the component in a plan view, so that a fillet of a conductive material such as solder is provided between the land and the electrode of the component. (A flesh portion, a built-up portion, a hem portion or a fillet portion) can be formed, and poor conduction of components can be prevented. Further, by visually confirming the fillet, it can be confirmed that the component is normally conductively connected.

  In the mounting structure according to the present invention, the component has a rectangular parallelepiped shape or a cubic shape, and electrodes are provided on both sides of a central portion of the component, and the electrodes are disposed on the opening of the insulating film. In addition, it is desirable that the corners of the parts in the vicinity of the electrodes are on the insulating film. The corner portion in the vicinity of the electrode may be a corner portion of the electrode itself, or may be a corner portion of the resin portion having a resin portion outside the electrode. According to the aspect of the present invention, the corners of the rectangular parallelepiped shape or the cubic shape are on the insulating film, so that the component can be placed in a stable state on the insulating film.

  In the mounting structure according to the present invention, the component has at least one electrode, and the land is a corner portion of the component and is viewed in plan from a side connecting two corner portions adjacent to each other in the vicinity of the electrode. It can be configured to go outside the part. In this configuration, for example, as shown in FIG. 1, the land 9 projects from the short side of the rectangular parallelepiped component 6.

  Further, in the mounting structure according to the present invention, the component has at least one electrode, and the land is a corner portion of the component, and a side connecting two corner portions adjacent to each other in the vicinity of the electrode. It can comprise so that it may come out of the said component by planar view from the adjacent edge | side. In this configuration, for example, as shown in FIG. 2, the land 9 projects from a part of the long side of the rectangular parallelepiped component 6.

Next, an electro-optical device according to the invention includes the mounting structure having the above-described configuration. Examples of such an electro-optical device include a liquid crystal display device, an organic EL device, and a plasma display. As described above, according to the mounting structure having the configuration described above, components such as capacitors are prevented from falling into the opening of the insulating film, and the components are not tilted. By using the material, the component and the land can be stably conductively connected at all times, and the occurrence of defective conductivity of the component can be prevented. Further, according to the mounting structure having the above-described configuration, a part of the land protrudes to the outside of the component in a plan view, so that a conductive material fillet such as solder is formed between the land and the component electrode. It is possible to prevent defective conduction of parts.
The electro-optical device according to the present invention can exhibit the above-described effect of the mounting structure, that is, the effect of preventing the occurrence of a conductive failure of a built-in component.

  Next, an electronic apparatus according to the present invention includes the electro-optical device described above. Examples of such electronic devices include mobile phones, portable information terminals, car navigation systems, and the like. The electronic apparatus according to the present invention can also exhibit the same effect as the electro-optical device and the mounting structure according to the present invention, that is, the effect that it is possible to prevent the occurrence of poor conduction in the built-in components.

(First Embodiment of Mounting Structure)
Hereinafter, a mounting structure according to the present invention will be described based on embodiments. Of course, the present invention is not limited to this embodiment. In the following description, the drawings will be referred to as necessary, but in this drawing, in order to show the important components of the structure made up of a plurality of components in an easy-to-understand manner, May be indicated by dimensions.

  1A and 1B show a main part of a mounting structure according to the present invention, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view according to a Za-Za line. The mounting structure 1A of this embodiment includes a base film 2 as a substrate, a wiring pattern 3 as wiring, a resist 4 as an insulating film, and a component 6. The base film 2 is made of a flexible synthetic resin such as polyimide or polyester. The base film 2 is set in various planar shapes and sizes according to the configuration of an electro-optical device (such as a mobile phone or a portable information terminal) in which the mounting structure 1A is used.

  Various electronic circuits are formed on the base film 2 as necessary. The wiring pattern 3 is one circuit element constituting this electronic circuit, and is usually formed as a number of linear patterns. In FIG. 1, only a part of the wiring pattern is shown. The wiring pattern 3 is formed to a thickness of about 18 to 25 μm with Cu (copper) according to, for example, a photoetching process. The resist 4 is formed to a thickness of about 25 to 35 μm by a photosensitive resin or a photosensitive film, for example, according to a photolithography process. The resist 4 is provided on substantially the entire surface of the base film 2 so as to cover the plurality of wiring patterns 3. The resist 4 ensures the insulation of the wiring pattern 3 even when the base film 2 is bent or bent.

  Each end portion of the plurality of wiring patterns 3 constitutes a terminal 3a having a large area. And the opening 8 is formed in the resist 4 of the part in which the terminal 3a was provided. The opening 8 is provided in a height region from the upper end of the resist 4 to the upper surface of the terminal 3a. The planar shape of the opening 8 is rectangular, and in the embodiment is rectangular, and the area thereof is set smaller than the area of the terminal 3a. After the resist 4 is formed, gold plating is performed in the opening 8, and a land 9 is formed with a thickness of about 0.6 μm by gold on the wiring terminal 3a inside the opening 8. The land 9 and the wiring terminal 3a are electrically connected. The land 9 may be formed on the same plane as the wiring terminal 3a and electrically connected to the terminal 3a.

  The component 6 is mounted on a portion of the resist 4 where the opening 8 is provided. The component 6 is, for example, a capacitor, a resistor, a coil, or a varistor. The component 6 is formed in a rectangular parallelepiped shape, and the planar dimension of the component in FIG. 1A is about 0.5 mm × 1 mm (vertical direction × horizontal direction in the drawing). Recently, a very small size of about 0.2 mm × 0.4 mm is also provided.

  The component 6 has electrodes 6a and 6b at both ends. That is, the central part of the component 6 is resin, and electrodes 6a and 6b are provided on both sides thereof. In this case, the four corners of the component 6 are the corners of the electrodes 6a and 6b. In the present embodiment, the electrodes 6a and 6b form both ends of the component 6, but instead of this, the electrodes 6a and 6b may be provided a little away from both ends of the component 6 toward the center. In this case, the four corners of the component 6 are not the corners of the electrodes but the corners of the resin portion. The external shapes of the electrodes 6a and 6b are also rectangular parallelepiped shapes. Further, the component 6 may be formed in a cubic shape.

  The component 6 is mounted on the resist 4 by a solder reflow process. Specifically, the solder paste is printed at a predetermined position on the resist 4, the component 6 is placed on the printed portion, and the solder is melted at a high temperature, whereby the electrodes 6a and 6b and the land 9 of the component 6 are electrically connected to each other. Conductive connection is made by the solder 11. In this way, the component 6 and the wiring 3 are conductively connected.

  In this embodiment, the width of the electrodes 6a and 6b of the component 6 in the short direction (the direction perpendicular to the longitudinal direction of the component 6 in FIG. 1A) is wider than the width of the opening 8 provided in the resist 4. ing. Then, the vicinity of both side surfaces of the electrodes 6 a and 6 b constituting both side surfaces on the long side of the component 6 is on the edge portion of the resist 4 forming the opening 8. In other words, in a portion where the component 6 and the opening 8 overlap in plan view, the component 6 extends from one edge of the opening 8 to the other edge that opposes the opening 8. Furthermore, the four corners of the electrodes 6 a and 6 b, that is, the four corners of the component 6 are all on the resist 4.

  Further, a part of the land 9 provided at the bottom of the opening 8 is hidden under the part 6 in a plan view, and the remaining part of the land 9 projects outside the part 6 in a plan view. More specifically, the land 9 projects to the outside of the electrodes 6a and 6b along the direction in which the line X0 connecting the centers of both end faces of the component 6 extends. In other words, the land 9 is a corner of the component 6 that connects two corners adjacent to each other in the vicinity of the electrodes 6a and 6b (the side on the short side of the component 6 extending in the vertical direction in the figure). ) To the outside of the part 6 in plan view.

  As can be seen from the above description, in this embodiment, a part of the part 6 extends to the outside of the land 9, that is, the opening 8 in plan view, and a part of the land 9 is part 6, particularly the electrode 6 a in plan view. , 6b. The solder 11 provided in the opening 8 of the resist 4 and in contact with the land 9 and the electrodes 6a and 6b is a side end face of the electrodes 6a and 6b at the portion where the land 9 projects to the outside of the component 6. A fillet (that is, a fillet portion, a built-up portion, a bottom portion or a fillet portion) is formed by adhering so as to ride on.

  In the present embodiment, since the four corners which are a part of the component 6 are on the resist 4 near the opening 8, the component 6 is the conventional one shown in FIGS. 7 (a) and 7 (b). As in the case of the component 107, the end portion does not fall into the opening 8 of the resist 4. For this reason, it is possible to prevent contact failure from occurring in the component 6. In addition, since a part of the land 9 protrudes to the outside of the component 6 in a plan view, a fillet of the solder 11 is formed on the end surfaces of the component electrodes 6a and 6b, so that poor welding to the electrodes 6a and 6b occurs. Can be prevented. Moreover, it can be easily confirmed by visually checking the fillet that the solder 11 is normally welded to the electrodes 6a and 6b.

(Second Embodiment of Mounting Structure)
FIG. 2 shows a second embodiment of the mounting structure according to the present invention. In this figure, the same reference numerals as those in FIG. 1 denote the same member elements. In the first embodiment shown in FIG. 1, the opening 8 and the land 9 extend outside the electrodes 6 a and 6 b along the longitudinal direction of the component 6. And the solder 11 formed the fillet between the end side surfaces of the electrodes 6a and 6b and the land 9 that protruded.

  On the other hand, in the mounting structure 1B shown in FIG. 2, the opening 8 and the land 9 are electrodes along the short direction of the component 6 (direction perpendicular to the longitudinal direction: vertical direction in FIG. 2A). It protrudes to the outside of 6a, 6b. That is, the opening 8 and the land 9 are projected to the outside of the electrodes 6a and 6b along the direction perpendicular to the direction in which the line X0 connecting the centers of both end faces of the component 6 extends. In other words, the opening 8 and the land 9 are corners of the component 6 and are sides connecting two corners adjacent to each other in the vicinity of the electrodes 6a and 6b (short sides of the component 6 extending in the vertical direction in the figure). It projects from the side (side extending in the left-right direction in the figure) to the outside of the component 6 in plan view. And the solder 11 forms the fillet between the end side surfaces of the electrodes 6a and 6b and the land 9 that protrudes.

  In the present embodiment, the width of the electrodes 6a and 6b along the longitudinal direction of the component 6 (the direction along the center line X0, the left-right direction) is larger than the width of the opening 8 provided in the resist 4, that is, the width of the land 9. It is getting wider. That is, the corners of the electrodes 6 a and 6 b (that is, the corners of the component 6) are on the peripheral edge of the opening 8 of the resist 4. That is, a part of the part extends outside the land 9 in plan view. Further, in a portion where the component 6 and the opening 8 overlap in plan view, the component 6 extends from one edge of the opening 8 to the other edge opposite to the opening 8. Further, the four corners of the electrodes 6 a and 6 b, that is, the four corners of the component 6 are all on the resist 4.

  Further, a part of the land 9 provided at the bottom of the opening 8 is hidden under the component 6 in a plan view, and both tip portions of the land 9 are outside the long side end side surface of the component 6 in a plan view, that is, a corner. It protrudes outside the section. That is, a part of the land protrudes to the outside of the component 6 in plan view. The solder 11 provided in the opening 8 of the resist 4 and in contact with the land 9 and the electrodes 6a and 6b is a side end face of the electrodes 6a and 6b at the portion where the land 9 projects to the outside of the component 6. A fillet is constructed by adhering so as to ride on.

  As described above, since the four corners in the plan view of the component 6 of the present embodiment are on the resist 4, the component 6 is the conventional component 107 shown in FIGS. 7 (a) and 7 (b). Thus, the end portion does not fall into the opening 8 of the resist 4. For this reason, it is possible to prevent contact failure from occurring in the component 6. Further, since a part of the land 9 protrudes to the outside of the component 6, the fillet of the solder 11 is formed on the end surfaces of the component electrodes 6a and 6b. Therefore, it is possible to prevent the occurrence of poor welding to the electrodes 6a and 6b. Moreover, it can be easily confirmed by visually checking the fillet that the solder 11 is normally welded to the electrodes 6a and 6b.

(Third embodiment of mounting structure)
FIG. 3 shows a third embodiment of the mounting structure according to the present invention. In this figure, the same reference numerals as those in FIGS. 1 and 2 denote the same member elements. In the first embodiment shown in FIG. 1, the opening 8 and the land 9 extend outside the electrodes 6 a and 6 b along the longitudinal direction of the component 6. And the solder 11 formed the fillet between the end side surfaces of the electrodes 6a and 6b and the land 9 that protruded.

  Further, in the second embodiment shown in FIG. 2, the opening 8 and the land 9 are along the short direction of the component 6 (direction perpendicular to the longitudinal direction: up and down direction in FIG. 2A). It protrudes to the outside of the electrodes 6a and 6b. And the solder 11 forms the fillet between the end side surfaces of the electrodes 6a and 6b and the land 9 that protrudes.

  With respect to each of the above embodiments, in the mounting structure 1C shown in FIG. 3A, the opening 8 extends along both the longitudinal direction (left-right direction in the figure) and the short direction (up-down direction in the figure) of the component 6. And the land 9 has come out to the outer side of the end side surface of electrode 6a, 6b. That is, the opening 8 and the land 9 project outside the electrodes 6a and 6b along both the direction in which the line X0 connecting the centers of both end faces of the component 6 extends and the direction perpendicular thereto. In other words, the opening 8 and the land 9 are corners of the component 6 and are sides connecting two corners adjacent to each other in the vicinity of the electrodes 6a and 6b (short sides of the component 6 extending in the vertical direction in the figure). (Side edge) and an adjacent edge (side on the long side of the component 6) are projected to the outside of the component 6 in plan view. And the solder 11 forms the fillet between the end side surfaces of the electrodes 6a and 6b and the land 9 that protrudes. That is, in this embodiment, the land 9 projects in three directions perpendicular to the electrodes 6a and 6b.

  In the present embodiment, the width of the electrodes 6a and 6b along the short direction of the component 6 (the direction perpendicular to the center line X0) and the longitudinal direction of the component 6 (the direction along the center line X0). Both the electrodes 6 a and 6 b are wider than the width of the opening 8 provided in the resist 4, that is, the width of the land 9. Further, in a portion where the component 6 and the opening 8 overlap in plan view, the component 6 extends from one edge of the opening 8 to the other edge opposite to the opening 8. Also in this embodiment, the four corners of the electrodes 6 a and 6 b, that is, the four corners of the component 6 are all on the resist 4.

Further, a part of the land 9 provided at the bottom of the opening 8 is hidden under the component 6 in plan view, and the tip portions of the three sides of the land 9 are outside the corresponding end side surface of the component 6 in plan view. That is, it protrudes outside the corner. More specifically, the land 9 protrudes to the outside of the end side surfaces of the electrodes 6a and 6b along the three directions, ie, the direction in which the center line X0 extends and the direction perpendicular thereto.
The solder 11 provided in the opening 8 of the resist 4 and in contact with the land 9 and the electrodes 6a and 6b is a side end surface of the electrodes 6a and 6b at the portion where the land 9 projects to the outside of the component 6. A fillet is constructed by adhering so as to ride on.

  Also in this embodiment, since the four corners in the plan view of the component 6 are on the resist 4, the component 6 is like the conventional component 107 shown in FIGS. 7 (a) and 7 (b). The end portion does not fall into the opening 8 of the resist 4. For this reason, it is possible to prevent contact failure from occurring in the component 6. Further, since the portion extending in the three right-angle directions of the land 9 protrudes to the outside of the component 6, fillets of the solder 11 are formed on the three end surfaces of the component electrodes 6a and 6b. It can be prevented from occurring. Moreover, it can be easily confirmed by visually checking the fillet that the solder 11 is normally welded to the electrodes 6a and 6b.

(Fourth Embodiment of Mounting Structure)
FIG. 4 shows a fourth embodiment of the mounting structure according to the present invention. In this figure, the same reference numerals as in FIGS. 1 to 3 denote the same member elements. In the mounting structure 1D of this embodiment, the opening 8 and the land 9 are outside the side surfaces of both ends of the electrodes 6a and 6b along one of the directions in which the center line X0 of the component 6 extends and one of the directions perpendicular thereto. I'm out. That is, the land 9 protrudes in two directions perpendicular to the electrodes 6a and 6b.

  In the present embodiment, the width of the electrodes 6a and 6b along the short direction of the component 6 (the direction perpendicular to the center line X0) and the longitudinal direction of the component 6 (the direction along the center line X0). Both the electrodes 6 a and 6 b are wider than the width of the opening 8 provided in the resist 4, that is, the width of the land 9. Further, in a portion where the component 6 and the opening 8 overlap in plan view, the component 6 extends from one edge of the opening 8 to the other edge opposite to the opening 8. Also in this embodiment, the four corners of the electrodes 6 a and 6 b, that is, the four corners of the component 6 are all on the resist 4.

Further, a part of the land 9 provided at the bottom of the opening 8 is hidden under the component 6 in a plan view, and the respective tip portions of the two sides of the land 9 are outside the corresponding end side surfaces of the component 6 in a plan view. That is, it protrudes outside the corner. More specifically, the land 9 protrudes outside the end side surfaces of the electrodes 6a and 6b along one direction in which the center line X0 extends and one direction perpendicular thereto.
The solder 11 provided in the opening 8 of the resist 4 and in contact with the land 9 and the electrodes 6a and 6b is a side end face of the electrodes 6a and 6b in the portion where the land 9 projects to the outside of the component 6. A fillet is constructed by adhering so as to ride on.

  Also in this embodiment, since the four corners in the plan view of the component 6 are on the resist 4, the component 6 is like the conventional component 107 shown in FIGS. 7 (a) and 7 (b). The end portion does not fall into the opening 8 of the resist 4. For this reason, it is possible to prevent contact failure from occurring in the component 6. Further, since the portion extending in two directions at right angles in the plan view of the land 9 protrudes to the outside of the component 6, fillets of the solder 11 are formed on the two end surfaces of the component electrodes 6a and 6b. It is possible to prevent the occurrence of poor welding. Moreover, it can be easily confirmed by visually checking the fillet that the solder 11 is normally welded to the electrodes 6a and 6b.

(Embodiment of electro-optical device)
Hereinafter, an electro-optical device according to the invention will be described based on embodiments. FIG. 5 shows a planar configuration of an embodiment of a liquid crystal display device which is an example of an electro-optical device. The liquid crystal display device 16 is configured as, for example, an active matrix liquid crystal display device capable of color display with a transmission type. As a switching element for realizing the active matrix system, for example, an amorphous silicon TFT (Thin Film Transistor) is used.

  The liquid crystal display device 16 of the present embodiment includes a liquid crystal panel 17 as an electro-optical panel, a mounting structure 18 connected to the liquid crystal panel 17, and an illumination device (not shown) provided on the back side of the liquid crystal panel 17. have. The liquid crystal panel 17 includes an element substrate 19 provided on the back side of the paper and a color filter substrate 21 provided on the front side of the paper so as to face the element substrate 19 by a frame-shaped sealing material 22 around them. It is formed by bonding. In a region between the element substrate 19 and the color filter substrate 21 and surrounded by the sealing material 22, for example, TN (Twisted Nematic) mode liquid crystal is sealed to form a liquid crystal layer. In the present embodiment, the color filter substrate 21 is arranged on the observation side (front side of the paper), and the element substrate 19 is arranged on the back side (back side of the paper) as viewed from the observation side.

  The element substrate 19 is made of, for example, glass, plastic, or the like, and includes a substrate (hereinafter referred to as a material substrate) as a material that is rectangular (rectangular or square) when viewed in plan from the observation side. This material substrate defines the overall shape of the element substrate 19. A polarizing film is provided on the outer surface (back side of the paper) of the material substrate, and other optical elements are provided as necessary. A plurality of source lines 23, gate lines 24, TFT elements 26, pixel electrodes 27, and the like are formed on the inner surface (liquid crystal layer side) of the material substrate.

  Each source line 23 extends in the column direction Y. Each gate line 24 extends in the row direction X. A TFT element 26 which is an active element functioning as a switching element is formed connected to the source line 23 and the gate line 24. The source line 23, the gate line 24, and the pixel electrode 27 are connected to the source, gate, and drain of the TFT element 26, respectively. The source line 23 functions as a data line for transmitting a data signal to the TFT element 26. The gate line 24 functions as a scanning line for transmitting a scanning signal to the TFT element.

  Next, the color filter substrate 21 facing the element substrate 19 is made of, for example, glass, plastic, or the like, and has a rectangular (rectangular or square) material substrate as viewed in plan from the observation side. This material substrate defines the overall shape of the color filter substrate 21. A polarizing film 28 is provided on the outer surface (front side of the paper) of the material substrate, and other optical elements are provided as necessary. On the inner surface (liquid crystal layer side) of the material substrate, for example, a lattice-shaped light shielding film (not shown) in a plan view, a colored film (not shown) facing the pixel electrode 27, and a common electrode 29 are provided. It has been. The common electrode 29 is a planar electrode facing the plurality of pixel electrodes 27 arranged in the row direction X and the column direction Y.

  Each of the colored films is an optical element that transmits one of R (red), G (green), and B (blue), and the colored films of R, G, and B have a predetermined arrangement when viewed in plan, For example, they are arranged in a stripe arrangement. The light shielding film is formed by overlapping colored films of different colors or by a predetermined material such as Cr (chromium).

  The plurality of pixel electrodes on the element substrate 19 and the common electrode on the color filter substrate 21 overlap with each other in a plurality of dot-shaped (that is, island-shaped) regions as viewed in a plan view. The overlapping area forms a sub-pixel which is a unit area for display, a pixel is formed by three sub-pixels corresponding to R, G, and B, and a plurality of pixels are arranged in the row direction X and the column direction. A rectangular effective display region V is formed by arranging them in a matrix in Y. Images such as letters, numbers, figures, etc. are displayed in the effective display area V.

  The element substrate 19 has an overhang portion 31 that protrudes outside the color filter substrate 21. A driving IC 32 is mounted on the surface of the overhanging portion 31 by a conductive adhesive element, for example, ACF. In addition, a plurality of wiring terminals 33 are formed at the side edge portion of the overhang portion 31. The plurality of input bumps provided on the mounting surface of the driving IC 32 are electrically connected to the wiring terminal 33, and the plurality of output bumps provided on the mounting surface of the driving IC 32 are the source line 23, the gate line 24, and the common electrode 29. Etc. are conducting.

  The mounting structure 18 is bonded to the side end portion of the overhang portion 31 of the element substrate 19 by a conductive adhesive element, for example, ACF. The mounting structure 18 has a plurality of output terminals 34 at the side end portion to be bonded to the element substrate 19, has a circuit formed by a plurality of components 6, and is further bonded to the element substrate 19. A plurality of input terminals 36 are provided at the side edges that are not. The input terminal 36, the component 6, and the output terminal 34 are electrically connected by a wiring pattern (not shown). The mounting structure 18 is configured by any one of the mounting structures 1A to 1D shown in FIGS. 1 to 4, for example. A component 6 denoted by reference numeral 6 in FIG. 5 is the same as the component 6 illustrated in each of FIGS. 1 to 4 and includes a capacitor, a resistor, a coil, a varistor, and the like.

  With the above configuration, when a predetermined driving signal is input from the input terminal 36 of the mounting structure 18, the driving IC 32 generates a scanning signal and a data signal for driving the liquid crystal, and these signals are transmitted to the sub-pixels constituting each pixel. The necessary TFT elements are turned on / off. A desired image is displayed in the effective display area V in accordance with the switching operation of the TFT element.

  By the way, in the mounting structure 18 of the present embodiment, the width of the electrodes 6a and 6b of the component 6 is wider than the width of the opening 8 provided in the resist 4 as described with reference to FIG. In the portion where the component 6 and the opening 8 overlap each other in plan view, the component 6 extends from one edge of the opening 8 to the other opposite edge beyond the opening 8. All of the corners are on the resist 4. That is, a part of the component 6 extends outside the land 9 in plan view. Therefore, the component 6 falls into the opening 8 (reference numeral 104 in FIG. 7B) of the resist 4 (reference numeral 103 in FIG. 7B) as in the case of the prior art shown in FIG. 7B. Therefore, there is no conduction failure in the component 6. Further, in FIG. 1A, a part of the land 9 protrudes outside the component 6 in a plan view. For this reason, the fillet of the solder 11 is formed on the end surfaces of the component electrodes 6a and 6b, and therefore it is possible to prevent the occurrence of poor welding with respect to the electrodes 6a and 6b. Moreover, it can be easily confirmed by visually checking the fillet that the solder 11 is normally welded to the electrodes 6a and 6b.

  Thus, according to the liquid crystal display device 16 shown in FIG. 5, the circuit composed of the components 6 can always be stably operated in the mounting structure 18, so that stable image display can be performed on the liquid crystal panel 17. it can.

(Embodiment of electronic device)
Next, an electronic apparatus according to the present invention will be described based on an embodiment. FIG. 6 shows a mobile phone as an example of an electronic apparatus, which is a mobile phone according to an embodiment of the present invention. The cellular phone 41 shown here has a main body 42 and a display body 43 provided so as to be openable and closable with respect to the main body 42. The display unit 43 is provided with a display device 44 and a receiver unit 46. Various displays relating to telephone communication are displayed on a display screen 47 of the display device 44. A control unit for controlling the operation of the display device 44 is stored inside the main body unit 42 or the display body unit 43 as a part of the control unit that controls the entire mobile phone or separately from the control unit. ing. The main body 42 is provided with an operation button 48 and a transmitter 49.

  The display device 44 is configured using, for example, the liquid crystal display device 16 shown in FIG. In the mounting structure 18 of the liquid crystal display device 16, for example, as described with reference to FIG. 1A, the width of the electrodes 6 a and 6 b of the component 6 is wider than the width of the opening 8 provided in the resist 4. In the portion where the part 6 and the opening 8 overlap in plan view, the part 6 extends from one edge of the opening 8 to the other edge opposite to the opening 8, and 4 of the part 6. All of the corners are on the resist 4. Therefore, the component 6 falls into the opening 8 (reference numeral 104 in FIG. 7B) of the resist 4 (reference numeral 103 in FIG. 7B) as in the case of the prior art shown in FIG. 7B. Therefore, there is no conduction failure in the component 6. Therefore, according to the liquid crystal display device 16 shown in FIG. 5, the circuit composed of the components 6 can always be stably operated in the mounting structure 18, so that stable image display can be performed on the liquid crystal panel 17. it can. As a result, the mobile phone 41 of FIG. 6 can always provide a stable display on the display device 44.

(Other embodiments)
The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made within the scope of the invention described in the claims. For example, in each of the mounting structures shown in FIGS. 1 to 4, the planar shape of the opening 8 is formed in the same shape so as to correspond to the two electrodes 6 a and 6 b of the component 6. The shapes of the openings 8 corresponding to 6a and 6b may be different from each other. Further, the electro-optical device according to the present invention is not limited to the liquid crystal display device shown in FIG. 5, and may be an organic EL device, a plasma display, or any other device. Further, the electronic device according to the present invention is not limited to the mobile phone shown in FIG. 6, but may be a portable information terminal, a car navigation system, or any other device.

The principal part of one Embodiment of the mounting structure which concerns on this invention is shown, (a) is a top view, (b) is sectional drawing. The principal part of other embodiment of the mounting structure which concerns on this invention is shown, (a) is a top view, (b) is sectional drawing. The principal part of other embodiment of the mounting structure which concerns on this invention is shown, (a) is a top view, (b) is sectional drawing. The principal part of other embodiment of the mounting structure which concerns on this invention is shown, (a) is a top view, (b) is sectional drawing. 1 is a plan view showing an embodiment of an electro-optical device according to the invention. It is a perspective view which shows one Embodiment of the electronic device which concerns on this invention. The principal part of an example of the conventional mounting structure is shown, (a) is a top view, (b) is sectional drawing.

Explanation of symbols

1A, 1B, 1C, 1D. 1. mounting structure; 2. Base film (substrate) Wiring pattern (wiring), 3a. Terminal, 4. Resist (insulating film); parts,
6a, 6b. Electrodes, 8. Opening, 9. Land, 11. Solder (conductive material),
16. 16. liquid crystal display device (electro-optical device), LCD panel (electro-optical panel),
18. 18. mounting structure; Element substrate, 21. Color filter substrate,
22. Sealing material, 23. Source line, 24. Gate line, 26. TFT element,
27. Pixel electrode, 28. Polarizing film, 29. Common electrode 31. Overhang,
32. Driving IC, 33. Wiring terminal, 34. Output terminal, 36. Input terminal,
41. Mobile phone (electronic device), 42. Main body, 43. Display body,
44. Display device, 46. Receiving part, 47. Display screen, 48. Manual operation button,
49. Sending part

Claims (7)

Wiring formed on the substrate;
An insulating film provided on the substrate so as to cover the wiring and having an opening corresponding to a part of the wiring;
A land connected to the wiring in the opening of the insulating film;
A component disposed on the insulating film and provided with an electrode;
A conductive material for conductively connecting the land and the electrode;
A part of the component extends outside the land in plan view;
A part of the land protrudes to the outside of the part in plan view. Wiring formed on the substrate;
An insulating film provided on the substrate so as to cover the wiring and having an opening corresponding to a part of the wiring;
A land connected to the wiring in the opening of the insulating film;
A component disposed on the insulating film and having an electrode conductively connected to the land via a conductive material;
The component has a corner, and the corner is on the insulating film,
A part of the land protrudes to the outside of the part in plan view. The mounting structure according to claim 1,
The component has a rectangular parallelepiped shape or a cubic shape, and electrodes are provided on both sides of the central portion of the component, and these electrodes are disposed on the opening of the insulating film and are located in the vicinity of the electrodes. The mounting structure according to claim 1, wherein corners of the component are on the insulating film. The mounting structure according to claim 2,
The component has at least one electrode;
The mounting structure according to claim 1, wherein the land protrudes to the outside of the component in plan view from a side connecting two corners adjacent to each other in the vicinity of the electrode. The mounting structure according to claim 2,
The component has at least one electrode;
The mounting structure is characterized in that the land protrudes to the outside of the component in plan view from a side adjacent to a side connecting two corners adjacent to each other in the vicinity of the electrode. body.   An electro-optical device comprising the mounting structure according to claim 1.   An electronic apparatus comprising the electro-optical device according to claim 6.

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