JP2008130653A - Electronic component, electrooptical device, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component, an electrooptical device, and electronic equipment which certainly prevent the effect of external noises caused by static electricity, etc., while reducing costs. <P>SOLUTION: A circuit constituent element placed on a FPC board includes an electronic component body 30a having a pair of external connection electrodes 61 and 62 on its side faces. Sharp portions of the external connection electrodes 61 and 62 are rounded. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component, an electro-optical device, and an electronic apparatus.

  Currently, in various electronic devices such as a mobile phone and a portable information terminal, an electro-optical device such as a liquid crystal device is used as a display unit for visually displaying various information.

  As this liquid crystal device, a device in which liquid crystal is sealed between substrates on which a pair of electrodes are formed and bonded by a sealing material is known. This liquid crystal device is capable of displaying visible information by controlling the orientation of the liquid crystal by controlling the voltage applied to the conductive pattern sandwiching the liquid crystal.

  Such a liquid crystal device is known to be vulnerable to damage caused by static electricity. For example, if static electricity enters the liquid crystal panel, the drive elements and circuit components (electronic components) such as driver ICs formed in the panel are destroyed by static electricity, and the liquid crystal panel cannot be driven.

  A conventional electronic component 80 shown in FIG. 14 has a rectangular parallelepiped shape as an example, and corners t thereof are electrodes 81 and 81 for external connection. Such an electronic component 80 may be damaged by electrostatic discharge.

In view of this, a countermeasure is taken in which an electronic component disposed on the IC module substrate is covered with a mold resin. For example, the IC chip is covered with a mold resin, and a conductive metal plate is further provided on the mold resin so that the IC chip is sandwiched between the conductive metal plate and the IC module substrate. Direct discharge is avoided (see Patent Document 1).
JP 2003-99744 A

  However, in the configuration of the above document, since it is necessary to laminate a conductive metal plate after molding an electronic component with a resin, there is a concern about labor and cost increase due to an increase in configuration requirements.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an electronic component, an electro-optical device, and an electronic apparatus that can reliably prevent the influence of external noise such as static electricity while suppressing cost. It is to provide.

  The electronic component of the present invention is an electronic component placed on a wiring board, and the electronic component main body is provided with a pair of electrodes on its side surface, and sharp portions of the electrodes are rounded.

As a result of analyzing the damaged electronic component, the present inventor has noticed that a large amount of static electricity is discharged in the sharp part (corner part) of the electrode. Static electricity is more likely to be discharged at these parts because the charges are concentrated at the sharper part of the shape or the part having a higher height (projecting). Therefore, as in the conventional case, in an electronic component body having a rectangular parallelepiped shape, if an electrode is located at a corner (that is, the electrode has a sharp portion), static electricity is discharged to the electrode, It was a factor causing destruction.
On the other hand, the present inventor rounded the sharp part (corner part) of the electrode to eliminate the sharp part. Thereby, it can prevent that external noises, such as static electricity, discharge to an electrode. Therefore, it is possible to protect the electronic component and the IC connected to the tip of the electronic component, and it is possible to more stably and highly ensure resistance to surges such as ESD (electrostatic discharge). In this way, the influence of static electricity can be prevented without using separate parts, so the number of parts can be reduced and cost reduction can be expected. Furthermore, it is possible to avoid discharge of static electricity to the electronic component itself.

The electronic component of the present invention is an electronic component placed on a wiring board, and the electronic component main body includes a pair of electrodes on the side surface, one of the pair of electrodes being a ground electrode and the other being a non-electrode. The ground electrode is preferably a ground electrode forming region on the upper surface of the electronic component body, which is preferably positioned higher than the non-ground electrode forming region.
According to the present invention, the ground electrode forming region in which the ground electrode is formed is positioned higher than the non-ground electrode forming region in which the ground electrode is not formed on the upper surface of the electronic component body. It becomes easy to discharge to the formation region. In this way, by positively taking in static electricity into the ground electrode, the static resistance of the electronic component can be enhanced and the destruction of the electrode can be prevented.

The electronic component of the present invention is an electronic component mounted on a wiring board, the electronic component body is provided with a pair of electrodes on its side surface, and the pair of electrodes is provided without being exposed on the upper surface of the electronic component body, The upper part is covered with an insulator.
According to the present invention, since the pair of electrodes are not exposed on the upper surface of the electronic component main body and the upper surfaces thereof are covered with the insulator, it is possible to prevent static electricity from being directly discharged to the pair of electrodes. it can. Thereby, the influence of the static electricity on an electronic component main body can be reduced.

The electronic component of the present invention is an electronic component mounted on a wiring board. The electronic component main body includes a pair of electrodes on the side surface, one of the pair of electrodes being a ground electrode and the other being a non-ground electrode. At least the non-ground electrode is provided without being exposed on the upper surface of the electronic component main body, and the upper part thereof is covered with an insulator.
According to the present invention, since the non-ground electrode is not exposed on the upper surface of the electronic component main body and is covered with the insulator, it is possible to prevent static electricity from being directly discharged to the non-ground electrode. it can. Thereby, the influence of the static electricity on an electronic component main body can be reduced.

It is also preferable that an auxiliary electrode fixed to the ground potential is provided on the upper surface of the electronic component body.
According to such a configuration, since the auxiliary electrode fixed to the ground potential is provided on the upper surface of the electronic component body, it is possible to prevent the electronic component body from being charged even if static electricity is discharged to the auxiliary electrode. Is done. Therefore, destruction of the electrode is prevented, and electrostatic resistance is improved.

Moreover, it is also preferable that the auxiliary electrode is disposed at least at a corner portion on the upper surface of the electronic component body.
According to such a configuration, since the auxiliary electrode is disposed at the corner portion on the upper surface of the electronic component main body, even if static electricity is discharged at the corner portion, the static electricity is discharged to the ground. In other words, the electrostatic resistance of the electronic component can be improved by disposing the auxiliary electrode at the corner where the static electricity is likely to be discharged and actively taking in the static electricity to the auxiliary electrode. This prevents static electricity from affecting (damaging) the pair of electrodes provided on the side surface of the electronic component body.

The auxiliary electrode is preferably connected to the ground electrode.
According to such a configuration, static electricity discharged to the auxiliary electrode can be reliably discharged to the ground.

The electro-optical device of the present invention includes an electronic component as described above, a wiring substrate on which a plurality of electronic components are mounted, a light modulation device that is connected to the wiring substrate and can be driven by the electronic component, an illumination device, It is characterized by having.
According to the electro-optical device of the present invention, since the electronic component having excellent resistance to static electricity is provided, it is possible to provide a highly reliable electro-optical device in which occurrence of defects due to static electricity is prevented.

The electronic apparatus according to the present invention includes an electro-optical device.
According to the electric device of the present invention, high-quality image display can be maintained for a long period of time, so that product reliability is increased.

  Hereinafter, an embodiment in which the electro-optical device according to the invention is applied to a liquid crystal display device which is an example of an electro-optical device will be described as an example. Of course, the present invention is not limited to the embodiment. In the following description, various structures will be exemplified using drawings, but the structures shown in these drawings may be shown with different dimensions from the actual structures in order to show the characteristic parts in an easy-to-understand manner. Note that there is.

(Electro-optical device)
First, the liquid crystal display device according to the first embodiment of the electro-optical device will be described.
FIG. 1 shows a planar structure of the liquid crystal display device according to this embodiment. FIG. 2 shows a side structure of the liquid crystal display device. FIG. 3 is a diagram showing a planar structure of the wiring board in the liquid crystal display device, and is a bottom view of the wiring board as seen from the back side of FIG. FIG. 4 is a schematic configuration diagram of a circuit component. FIG. 5 shows a side structure when an LED provided on a wiring board is incorporated in a liquid crystal panel.

  As shown in FIGS. 1 to 5, the liquid crystal display device 1 includes a liquid crystal panel (light modulation device) 2, an illumination device 5 for irradiating the liquid crystal panel 2 with illumination light, the liquid crystal panel 2, and the illumination device 5. FPC (Flexible Printed Circuit) board 3 connected to the board.

  As shown in FIG. 2, the liquid crystal panel 2 includes an element substrate 6 and a counter substrate 4. These substrates are bonded to each other by an annular sealing material having a square shape or a rectangular shape shown in FIG. A gap, a so-called cell gap, is formed between the substrates 4 and 6, and liquid crystal (electro-optic material), for example, TN (Twisted Nematic) liquid crystal is sealed in the cell gap to form a liquid crystal layer.

  As shown in FIG. 2, the element substrate 6 has a first substrate 6a having translucency formed of glass, plastic or the like, and a polarizing plate 12a is attached to the outer surface of the substrate 6a by, for example, sticking. Has been.

  In FIG. 1, a plurality of linear data lines 8 are formed on the inner surface of the element substrate 6a, that is, the surface on the liquid crystal side, by using, for example, ITO (Indium Tin Oxide) as a material for photoetching processing (that is, photolithography processing and subsequent processing). Etching process). A plurality of TFD (Thin Film Diode) elements 9 are formed along the data lines 8, and pixel electrodes 11 are formed corresponding to the TFD elements 9. The TFD element 9 is a non-linear resistance element and functions as a switching element.

  Each TFD element 9 is formed, for example, by forming an insulating film on the first electrode and forming a second electrode on the insulating film. Such a laminated structure is sometimes called an MIM (Metal-Insulator-Metal) structure. The first electrode of each TFD element 9 is connected to, for example, the data line 8. Each pixel electrode 11 is connected to the second electrode of each TFD element 9. With the above configuration, the plurality of data lines 8 are arranged in parallel with each other and formed in a stripe shape as a whole. The plurality of pixel electrodes 11 are arranged in the row direction X and the column direction Y, and are arranged in a dot matrix as a whole. On the liquid crystal side surface of the element substrate 6, other optical elements such as an interlayer insulating film and an alignment film are formed in addition to the above-described elements as necessary.

  In FIG. 2, the counter substrate 4 facing the element substrate 6 has a second substrate 4a having translucency formed of glass, plastic or the like, and a polarizing plate 12b is pasted on the outer surface of the substrate 4a, for example. It is attached by wearing.

  An optical sheet 12c is provided on the outer surface of the polarizing plate 12b. As the optical sheet 12c, for example, a phase difference plate, a light scattering plate, a reflective polarizing plate, a prism sheet, or the like can be employed. In addition, a light guide plate 12d is provided on the outer surface of the optical sheet 12c, and guides illumination light of the LED 36 described later toward the entire surface of the optical sheet 12c. Further, a reflection plate (not shown) is provided on the outer surface of the light guide plate 12d, and the illumination light guided by the light guide plate 12d is reflected to the counter substrate 4 side.

  On the other hand, a plurality of strip electrodes 13 shown in FIG. 1 are formed on the inner surface of the second substrate 4b. These strip electrodes 13 function as scanning electrodes. Each of these strip-like electrodes 13 extends in a direction perpendicular to the data lines 8 (that is, the row direction X), and is formed in a stripe shape as a whole.

  Each strip electrode 13 overlaps with a plurality of pixel electrodes 11 arranged in the row direction X on the element substrate 6 in a dot shape in plan view. This dot-shaped area is an area that constitutes the minimum unit of display, and is sometimes called a sub-pixel. The reason why it is called a sub-pixel is as follows. When the liquid crystal panel 2 performs color display using the three primary colors R (red), G (green), and B (blue), or the three primary colors C (cyan), M (magenta), and Y (yellow). The dot-like areas, which are the minimum unit of display, are collected for three R, G, B or C, M, and Y to form one pixel. The above sub-pixel is called a sub-pixel in the sense that it is an element forming this one pixel. In the case of monochrome display or other two-color mono-color display, one pixel is formed by one sub-pixel.

  Further, on the liquid crystal side surface of the first substrate 6 a constituting the element substrate 6, a color filter layer, an alignment film, and other various optical elements as necessary are formed in addition to the band-like electrode 13. The color filter layer is formed by each color coloring element of R, G, B or C, M, Y, and a light shielding member, that is, a black mask provided between the coloring elements. Individual coloring elements are provided in areas overlapping with individual sub-pixels.

  The sub-pixels formed by overlapping the plurality of pixel electrodes 11 and the plurality of strip electrodes 13 are arranged in a dot matrix along the row direction X and the column direction Y in the same manner as the pixel electrode 11. A display region V (FIG. 1) is formed by the plurality of sub-pixels arranged in such a manner, and images such as characters, numbers, figures, etc. are displayed in the display region V.

  As shown in FIG. 3, the FPC board 3 connected to the liquid crystal panel 2 includes a plurality of input terminals 18, a control circuit unit 19, and a plurality of output terminals 21. Here, the FPC substrate 3 is a flexible substrate having a film substrate such as polyimide as a base. More specifically, a wiring pattern is formed by copper (Cu) wire or the like on the surface or both front and back surfaces of the base film, and the wiring pattern is covered with a protective film such as a coverlay or a resist. Further, although the protective film is formed over a wide range of the FPC board 3, no protective film is formed in the region where the input terminal 18, the control circuit unit 19, and the output terminal 21 are formed. , 21 and the control circuit unit 19 are secured.

  The input terminal 18 is a terminal connected to an integrated circuit attached to the liquid crystal display device 1. A signal input from the input terminal 18 is supplied to the control circuit unit 19 through the input wiring 18a.

  The control circuit unit 19 includes a plurality of circuit components (electronic components) 30A. For example, a capacitor 31, a coil 32, a resistor 33, an LED 36, and an IC component 50 such as a power supply IC 34 and a control IC 35 connected thereto are provided. Each circuit component 30 </ b> A is electrically connected through a wiring pattern formed on the FPC board 3. Here, three LEDs 36 are provided on the FPC board 3 so as to emit illumination light in the direction indicated by the symbol B.

  The circuit component 30 </ b> A in the present embodiment is provided with measures for avoiding electrostatic discharge (ESD). As shown in FIG. 4, the circuit component 30 </ b> A includes an electronic component body 30 a that has a substantially rectangular parallelepiped shape made of an insulating material such as resin or ceramics. Out of the side surfaces of the electronic component body 30a, external connection electrodes 61 and 62 are provided on a pair of opposite side surfaces. The surface of these external connection electrodes 61 and 62 is subjected to solderable surface treatment, and is electrically connected to the wiring pattern of the FPC board 3 by solder 55 applied to the side periphery of the circuit component 30A. Has been.

  In the present embodiment, the upper surface 30b of the electronic component main body 30a is a curved surface whose central portion protrudes from the side edge portion. Specifically, on the upper surface 30b, the region where the external connection electrodes 61 and 62 are formed is defined as an electrode formation region 60A, and the other region where the external connection electrodes 61 and 62 are not formed is defined as a non-electrode formation region 60B. The non-electrode forming region 60B protrudes upward from the electrode forming region 60A. In this way, by forming the electrode forming region 60A in such a shape that the upper surface 30b is curved so as to be positioned lower than the non-electrode forming region 60B, the external connection electrodes 61 and 62 are rounded and sharp portions are eliminated. Can do. In the electronic component main body (including the external connection electrodes 61 and 62), the corner portion composed of two adjacent side surfaces and the upper surface is formed into an R shape, and the connection portion between the upper surface and the side surface is formed into an R shape. It is reliably avoided that external noise (static electricity) is discharged to the external connection electrodes 61 and 62. Thus, electrostatic discharge can be more reliably prevented by forming an R shape so as not to form a clear boundary even at the connection portion between the side surface and the upper surface of the external connection electrodes 61 and 62. The above configuration is a shape particularly suitable for the resistor 33, but is not limited thereto.

  Since the FPC board 3 has flexibility, it can be bent as shown in FIG. In the present embodiment, the LED 36 is incorporated as a part of the liquid crystal panel 2 by bringing the light emitting side of the LED 36 into contact with the side surface of the light guide plate 12 d of the element substrate 6. Then, the illuminating device 5 is comprised by LED36, the light-guide plate 12, the optical sheet 12c, and a reflecting plate. By such an illuminating device 5, the illumination light emitted from the LED 36 travels in the direction indicated by reference numeral 36a inside the light guide plate 12d and is emitted in the direction indicated by reference numeral 36b by the optical sheet 12c and the reflecting plate. Thereby, it becomes possible to irradiate the liquid crystal panel 2 with the illumination light of LED36.

  In the configuration in which the FPC board 3 is curved and the LED 36 is incorporated in the liquid crystal panel 2 as described above, the control circuit unit 19 and the liquid crystal panel 2 are arranged to face each other. More specifically, the control circuit unit 19 is disposed opposite to a driving IC 23 (a driving circuit unit, which will be described later) constituting the liquid crystal panel 2.

  Further, in FIG. 5, the first substrate 6a has an overhanging portion 14 that projects outward from the second substrate 4a. As shown in FIG. 1, wirings (not shown) extending from the data lines 8 and external connection terminals 17 are formed on the surface of the overhanging portion 14 by photoetching using ITO as a material.

  A driving IC 23 is mounted on the overhanging portion 14 by COG (Chip On Glass) technology using an ACF (Anisotropic Conductive Film). Specifically, the entire driving IC 23 is fixed to the overhanging portion 14 by ACF resin, and is electrically connected to the wiring and the external connection terminal 17 extending from the data line 8 by conductive particles dispersed in the ACF resin. Yes.

  The FPC board 3 is connected to the overhanging portion 14 by ACF resin. Specifically, the entire FPC board 3 is fixed to the side edge of the overhanging portion 14 with an ACF resin. At the same time, the output terminal 21 of the FPC board 3 is conductively connected to the external connection terminal 17 on the overhanging portion 14 by the conductive particles in the ACF (see FIG. 1).

  Further, an insulating material 29 is provided at a connection portion between the overhanging portion 14 and the FPC board 3. As shown in FIGS. 1 and 2, the insulating material 29 is provided over the entire area in the width direction of the connection portion of the FPC board 3 to the liquid crystal panel 2. Thus, the insulating material 29 prevents all the output terminals 21 from being exposed to the outside.

  In the liquid crystal display device 1 configured as described above, when an image signal is supplied to the input terminal 18 of the FPC board 3 in FIG. 1, predetermined signal processing is performed in the control circuit unit 19, and the liquid crystal panel 2 is A signal for driving is transmitted to the driving IC 23 via the output terminal 21 of the FPC board 3 and the external connection terminal 17 of the liquid crystal panel 2. The driving IC 23 generates a data signal and a scanning signal based on the supplied signal, transmits the data signal to the data line 8, and transmits the scanning signal to the strip electrode 13.

The plurality of TFD elements 9 in the display region V are ON / OFF controlled for each sub-pixel according to the contents of the data signal and the scanning signal, thereby controlling the orientation of the liquid crystal molecules in the liquid crystal layer for each sub-pixel. Is done. When light is supplied to the liquid crystal layer, the light is modulated for each sub-pixel according to the alignment state of the liquid crystal molecules, and the modulated light passes through the polarizing plate 12a or the polarizing plate 12b in FIG. In addition, the light passage allowance and the light passage prohibition are selected according to the state of the polarization axis of the polarizing plates 12a and 12b. As a result, the letters, numbers, figures, etc. Such an image is displayed and is visually recognized by an observer.
Further, when there is no need to perform display by the liquid crystal panel 2, a reset signal is supplied to the input terminal 18 of the FPC board 3 from a host circuit (not shown). Then, the supply of the scanning signal and the data signal from the driving IC 23 to the liquid crystal panel 2 is stopped, and the display in the display area V disappears.

  With respect to the liquid crystal display device 1 according to the present embodiment, the shape of the circuit component 30A is configured by curving the upper surface 30b so that the electrode forming region 60A on the upper surface 30b is positioned lower than the non-electrode forming region 60B. The external connection electrodes 61 and 62 are rounded to prevent external noise such as static electricity from being discharged to the external connection electrodes 61 and 62. Static electricity has a property that a portion having a sharper shape or a portion having a higher shape is more likely to be discharged because charges are concentrated. Therefore, the circuit component 30A is prevented from being destroyed by static electricity by curving the upper surface 30b so that the electrode forming region 60A having the external connection electrodes 61 and 62 is positioned lower than the non-electrode forming region 60B. be able to. Thereby, the tolerance with respect to surges, such as ESD (electrostatic discharge), can be ensured more stably and highly.

If static electricity is discharged to the external connection electrodes 61 and 62, for example, an error that the display in the display area V disappears even though the reset signal is not supplied to the input terminal 18 of the FPC board 3. Operation may occur. Further, there is a risk that the IC component 50 or the like connected to the tip of each circuit component 30A will be destroyed. In this way, there is a concern that the electronic circuit malfunctions and the display on the liquid crystal panel 2 is disturbed. In this regard, in the present embodiment, the upper surface 30b of the electronic component main body 30a is curved so that the position of the electrode formation region 60A is lower than the non-electrode formation region 60B, thereby static electricity to the external connection electrodes 61 and 62. Discharge was prevented. Therefore, the tolerance to external noise such as static electricity can be increased, and a stable liquid crystal display device 1 can be realized.
Note that the upper surface of the non-electrode forming region 60B may be a flat surface as long as the sharp portions of the external connection electrodes 61 and 62 are eliminated.

(Second Embodiment of Circuit Component)
The circuit component 30B in the present embodiment is provided with a ground (GND) countermeasure against electrostatic discharge. As shown in FIG. 6, in the circuit component 30B, one of the pair of external connection electrodes 61, 62 provided on the electronic component body 30a has one external connection electrode 62 connected to the ground terminal on the FPC board 3 side. The other external connection electrode 61 is connected to the power supply terminal on the FPC board 3 side. That is, the external connection electrode 62 is connected to a ground terminal that is grounded and maintained at the ground potential. On the upper surface 30b of the electronic component main body 30a, the electrode forming region 60C (ground electrode forming region) in which the external connection electrode 62 leading to the ground is formed is separated from the other electrode forming region 60C ′ (non-ground electrode forming region) and the non-electrode forming region 60C ′. An inclination is formed from the electrode formation region 60C side to the electrode formation region 60C ′ side so as to protrude from the electrode formation region 60B (non-ground electrode formation region). Also in this embodiment, in the electronic component main body 30a (including the external connection electrodes 61 and 62), a corner portion formed by two adjacent side surfaces and the upper surface 30b, and a connection end portion between the upper surface 30a and the side surfaces. Has an R shape. This reliably prevents external noise (static electricity) from being discharged to the external connection electrodes 61 and 62.

In this way, by forming the electrode formation region 60C so as to protrude from the other electrode formation region 60C ′ (and the non-electrode formation region 60B), it is possible to positively apply static electricity to the external connection electrode 62 side connected to the ground terminal. Therefore, the static electricity resistance of the circuit component 30B can be increased, that is, the static electricity is released from the external connection electrode 62 to the ground terminal and connected to the external connection electrode 61 connected to the power supply terminal. By preventing the discharge, it is possible to prevent electric charges caused by external noise from accumulating in the circuit component 30 B. Therefore, it is possible to discharge static electricity to the outside through the external connection electrode 62 in which ground countermeasures are taken. Thus, the circuit component 30A can be protected and the IC component 50 connected to the tip of the circuit component 30A can be protected. Thereby, the abnormal operation and destruction of the control circuit unit 19 can be synergistically prevented.
The present embodiment is particularly suitable for the shape of the resistor 33, the diode, the multilayer inductor, etc., but is not limited thereto.

(Third embodiment of circuit component)
As in the first embodiment, the circuit component 30C of the present embodiment is provided with a measure for avoiding electrostatic discharge. As shown in FIGS. 7A and 7B, the circuit component 30C includes an electronic component body 30a having a substantially rectangular parallelepiped shape and a pair of external connection electrodes 61 and 62 that are not exposed on the upper surface 30b of the electronic component body 30a. And is constituted by. As for the electronic component main body 30a, the connection part of the upper surface 30b and each side surface is curving shape including a corner | angular part. Thus, by eliminating the sharp part of the circuit component 30C, it is possible to eliminate the part where the static charge is likely to concentrate and to prevent electrostatic discharge. Further, by forming the external connection electrodes 61 and 62 so as not to be exposed on the upper surface 30b of the electronic component main body 30a, it is possible to reliably prevent static electricity from being directly discharged to the external connection electrodes 61 and 62. . Further, by covering the exposed surfaces of the external connection electrodes 61 and 62 on the side of the electronic component main body 30a with the solder 55, the influence of static electricity is more reliably prevented.

(Fourth Embodiment of Circuit Component)
As in the second embodiment, the circuit component 30D in the present embodiment has a ground (GND) countermeasure against electrostatic discharge. As shown in FIG. 8A, the circuit component 30D includes an electronic component body 30a having a rectangular parallelepiped shape, an external connection electrode 62 connected to the ground terminal, and an external connection connected to the power supply terminal. And an electrode 61. The external connection electrode 62 connected to the ground terminal is exposed on the upper surface 30b of the electronic component body 30a, but the external connection electrode 61 connected to the power supply terminal is not exposed on the upper surface 30b. Yes. In addition to the external connection electrode 61, an auxiliary electrode 63 connected to the external connection electrode 61 is provided on the upper surface 30b.

  Specifically, as shown in FIG. 8B, the external connection electrode 62 on the upper surface 30b includes two adjacent corners p, and the auxiliary electrode 63 includes the other two corners q. It has become. The auxiliary electrode 63 is formed on the upper portion of the side surface facing the side surface on the external connection electrode 62 side, and extends along the connection edge between the side surface and the upper surface 30b. Of course, the auxiliary electrode 63 and the external connection electrode 61 formed at the lower part of the side surface are insulated.

  The auxiliary electrode 63 is connected to the external connection electrode 62 by a wiring 64 formed on the upper surface 30b.

  According to such a configuration, the external connection electrode 61 connected to the power supply terminal is not exposed to the upper surface 30b, and the corner q of the upper surface 30b of the electronic component main body 30a is covered with the auxiliary electrode 63 leading to the ground. Therefore, it is possible to prevent static electricity from being discharged directly to the external connection electrode 61. That is, even if static electricity is discharged to any one of the corners p and q on the upper surface 30b of the circuit component 30D, it can be released from the ground terminal to the outside via the external connection electrode 62 and the auxiliary electrode 63. In this way, the discharge of static electricity to the external connection electrode 61 on the power supply terminal side can be reliably prevented, and electric charges caused by external noise can be prevented from accumulating in the circuit component 30D. Therefore, the circuit component 30D and the IC component 50 connected to the tip of the circuit component 30D can be protected. Thereby, the abnormal operation and destruction of the control circuit unit 19 can be synergistically prevented.

  Although the third and fourth embodiments are particularly suitable for the shape of the capacitor 31 or the varistor, the present invention is not limited to this. Further, instead of connecting the auxiliary electrode 63 and the external connection electrode 62 by wiring, the auxiliary electrode 63 connected to the external connection electrode 62 may be formed on the entire upper surface 30b. As shown in FIG. 9, when the auxiliary electrode 63 is not used, the corner part q of the electronic component main body 30a is curved to promote electrostatic discharge toward the external connection electrode 62 connected to the ground terminal. Like that.

(Fifth Embodiment of Circuit Component)
As shown in FIG. 10, the circuit component 30E according to the present embodiment includes a rectangular parallelepiped electronic component body 30a and a pair of external connection electrodes 61 and 62 that are not exposed on the upper surface 30b of the electronic component body 30a. is doing. In the present embodiment, the GND electrode 65 is formed on the entire upper surface 30b of the electronic component main body 30a. Since the GND electrode 65 is connected to the ground terminal, static electricity discharged to the four corners on the upper surface 30b of the electronic component main body 30a can be released to the outside from the ground terminal. Thereby, the abnormal operation and destruction of the circuit component 30E can be further prevented.

  Further, although the GND electrode 65 is formed on the entire upper surface 30b, the upper surface 30b of the present embodiment is a flat surface, and it is sufficient that it is formed at least at the corner of the upper surface 30b. Thus, it comprises so that the corner | angular part which static electricity discharges easily is covered.

  This embodiment is particularly suitable as the shape of the LED element. When this configuration is applied to the LED 36, it can be protected by using three terminals of an anode terminal (external connection electrode), a cathode terminal (external connection electrode), and a ground terminal (GND electrode 65). The LED 36 has a plurality of light sources built in a housing 36a having a rectangular parallelepiped shape made of resin. As shown in FIG. 11, the housing 36a has a shape in which the light emission surface 36b having an opening for emitting light from the light source has a curved shape so that the emitted light has directivity, and the induction electrode 37 is provided on the upper surface 30b. Is formed. The induction electrode 37 is connected to a GND electrode 65 provided on the back side opposite to the light emission surface 36b of the housing 36a. Since the GND electrode 65 is connected to the ground terminal, even if static electricity is discharged at the corners of the four corners of the upper surface 30b of the LED 36, the GND electrode 65 is guided to the GND electrode 65 by the induction electrode 37 and discharged to the outside. Can do. Thereby, the light source inside the housing 36a can be protected.

  Further, the induction electrode 37 may not be formed on the entire surface as long as it is formed at least at the corner of the upper surface 30b. Thereby, since an electrode formation area decreases, it leads to cost reduction.

  In the above embodiment, the rectangular parallelepiped electronic component main body 30a is formed into a columnar shape as shown in FIG. 12, and the electronic component main body 30a is free from corners where external noise charges tend to concentrate. You may make it avoid discharge, such as static electricity.

  Further, the above embodiment can be applied not only to the circuit component 30A but also to the form of the IC component 50 such as the power supply IC 34 and the control IC 35.

(Another embodiment of electro-optical device)
In the above embodiment, the present invention is applied to a liquid crystal display device which is one of electro-optical devices. However, the present invention is an electro-optical device other than a liquid crystal display device, for example, an EL (electroluminescence) display device. Can be applied to. As an EL display device, organic EL or inorganic EL can be adopted.

  In the above embodiment, the present invention is applied to an active matrix liquid crystal display device using a TFD element that is a two-terminal element as a switching element. However, the present invention is not limited to a three-terminal switching element. The present invention can also be applied to an active matrix liquid crystal display device using a TFT (Thin Film Transistor) element. The present invention can also be applied to a simple matrix liquid crystal display device that does not use a switching element.

(Embodiment of electronic device)
Hereinafter, embodiments of an electronic apparatus according to the present invention will be described. In addition, this embodiment shows an example of this invention and this invention is not limited to this embodiment.

Next, FIG. 13 shows a mobile phone which is another embodiment of the electronic apparatus according to the present invention.
A cellular phone 130 shown here includes a main body 131 and a display body 132 provided on the main body 131 so as to be opened and closed. A display device 133 configured by an electro-optical device such as a liquid crystal display device is disposed inside the display body 132, and various displays related to telephone communication can be visually recognized on the display body 132 on the display screen 134. Operation buttons 136 are arranged on the main body 131.

  An antenna 137 is attached to one end portion of the display body 132 so as to be extendable. A speaker (not shown) is arranged inside the receiver 138 provided at the upper part of the display body 132. Further, a microphone (not shown) is built in the transmitter 139 provided at the lower end of the main body 131. A control unit for controlling the operation of the display device 133 is stored in the main unit 131 or the display unit 132 as a part of the control unit that controls the entire mobile phone or separately from the control unit. The

  The display device 133 can be configured using, for example, the liquid crystal display device 1 having high electrostatic resistance as described above. Since this liquid crystal display device includes the control circuit unit 19 composed of the circuit components 30A to 30E in which countermeasures against electrostatic discharge are taken, there is a high tolerance to external noise, and the display in the display area V disappears. Operation is prevented from occurring. Therefore, according to the mobile phone 130 of the present embodiment configured using the liquid crystal display device 1, stable display can be performed on the display unit. Therefore, it is highly reliable in that defects due to static electricity are prevented.

(Modification)
In addition to the above-described mobile phones and the like as electronic devices, personal computers, liquid crystal televisions, viewfinder type or monitor direct view type video tape recorders, car navigation devices, pagers, electronic notebooks, calculators, word processors, Examples include workstations, video phones, and POS terminals.

The top view which shows 1st Embodiment of the liquid crystal display device of this invention. The side view which shows 1st Embodiment of the liquid crystal display device of this invention. The principal part top view which shows 1st Embodiment of the liquid crystal display device of this invention. 1 is a schematic configuration diagram of a circuit component according to a first embodiment. The side view at the time of incorporating the wiring board of FIG. 2 in the electro-optical panel. It is a schematic block diagram of the circuit component based on 2nd Embodiment. It is a schematic block diagram of the circuit component concerning 3rd Embodiment. It is a schematic block diagram of the circuit component concerning 4th Embodiment. It is a schematic block diagram which shows other embodiment in 4th Embodiment. It is a schematic block diagram of the circuit component concerning 5th Embodiment. It is a schematic block diagram which shows embodiment of an LED element. It is a schematic block diagram which shows other embodiment of an electronic component main body. It is a perspective view which shows other embodiment of the electronic device which concerns on this invention. It is a schematic block diagram of the conventional electronic component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Liquid crystal display device (electro-optical device), 2 ... Liquid crystal panel (light modulation device), 3 ... FPC board (wiring board), 5 ... Illumination device, 30A, 30B, 30C, 30D, 30E ... Circuit component (electronic) Parts), 30a ... electronic component main body (electronic component main body), 61,62 ... external connection electrodes, 60A, 60C ... electrode formation region (ground electrode formation region), 60B, 60B ... non-electrode formation region (non-ground electrode formation) Area), 65 ... GND electrode, 130 ... mobile phone (electronic equipment)

Claims (9)

An electronic component placed on a wiring board,
The electronic component body has a pair of electrodes on its side surface,
An electronic component, wherein sharp portions of the pair of electrodes are rounded. An electronic component placed on a wiring board,
The electronic component body has a pair of electrodes on its side,
One of the pair of electrodes is a ground electrode, the other is a non-ground electrode,
The electronic component body is characterized in that a ground electrode formation region on an upper surface thereof is positioned higher than a non-ground electrode formation region. In electronic components mounted on wiring boards,
The electronic component body has a pair of electrodes on its side,
The pair of electrodes is provided without being exposed on an upper surface of the electronic component main body, and an upper part thereof is covered with an insulator. In electronic components mounted on wiring boards,
The electronic component body has a pair of electrodes on its side,
One of the pair of electrodes is a ground electrode, the other is a non-ground electrode,
At least the non-ground electrode is provided without being exposed on the upper surface of the electronic component main body, and an upper part thereof is covered with an insulator.     The electronic component according to claim 4, wherein an auxiliary electrode fixed to a ground potential is provided on an upper surface of the electronic component main body.     The electronic component according to claim 4, wherein the auxiliary electrode is disposed at least at a corner portion on the upper surface of the electronic component main body.     The electronic component according to claim 4, wherein the auxiliary electrode is connected to the ground electrode.     The electronic component according to any one of claims 1 to 7, a wiring substrate on which a plurality of the electronic components are mounted, a light modulation device to which the wiring substrate is connected and driven by the electronic component, an illumination device, An electro-optical device comprising:     An electronic apparatus comprising the electro-optical device according to claim 8.

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