JP2009177011A - 導電性部材ならびにそれを用いた部品および装置 - Google Patents

導電性部材ならびにそれを用いた部品および装置 Download PDF

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Publication number
JP2009177011A
JP2009177011A JP2008015127A JP2008015127A JP2009177011A JP 2009177011 A JP2009177011 A JP 2009177011A JP 2008015127 A JP2008015127 A JP 2008015127A JP 2008015127 A JP2008015127 A JP 2008015127A JP 2009177011 A JP2009177011 A JP 2009177011A
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Japan
Prior art keywords
conductive
hole
member according
conductive member
main surface
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Pending
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JP2008015127A
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English (en)
Japanese (ja)
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JP2009177011A5 (enExample
Inventor
Tetsuya Inome
哲也 猪目
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Ferrotec Material Technologies Corp
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Ferrotec Ceramics Corp
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Priority to JP2008015127A priority Critical patent/JP2009177011A/ja
Publication of JP2009177011A publication Critical patent/JP2009177011A/ja
Publication of JP2009177011A5 publication Critical patent/JP2009177011A5/ja
Pending legal-status Critical Current

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2008015127A 2008-01-25 2008-01-25 導電性部材ならびにそれを用いた部品および装置 Pending JP2009177011A (ja)

Priority Applications (1)

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JP2008015127A JP2009177011A (ja) 2008-01-25 2008-01-25 導電性部材ならびにそれを用いた部品および装置

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JP2008015127A JP2009177011A (ja) 2008-01-25 2008-01-25 導電性部材ならびにそれを用いた部品および装置

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JP2009177011A true JP2009177011A (ja) 2009-08-06
JP2009177011A5 JP2009177011A5 (enExample) 2010-12-16

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JP2008015127A Pending JP2009177011A (ja) 2008-01-25 2008-01-25 導電性部材ならびにそれを用いた部品および装置

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013077769A (ja) * 2011-09-30 2013-04-25 Nippon Zeon Co Ltd 回路基板
JP2014235814A (ja) * 2013-05-31 2014-12-15 株式会社Ｓｅｎ 絶縁構造及び絶縁方法
KR20190002292A (ko) * 2017-06-29 2019-01-08 주식회사 디아이티 프로브 핀의 내구성 강화를 위한 스페이스 트랜스포머 및 그의 제조 방법
CN110248466A (zh) * 2018-03-08 2019-09-17 斯坦雷电气株式会社 电路基板、电子电路装置和电路基板的制造方法
JP2020020553A (ja) * 2018-08-03 2020-02-06 富士電機株式会社 溶解装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62100404A (ja) * 1985-10-28 1987-05-09 Kawasaki Steel Corp 高純度六方晶窒化硼素粉末の製造方法
JPH06140484A (ja) * 1992-10-28 1994-05-20 Nippon Telegr & Teleph Corp <Ntt> プローブカード
JP2001354480A (ja) * 2000-06-09 2001-12-25 Sumitomo Metal Ind Ltd 黒色系快削性セラミックスとその製法および用途
JP2005136266A (ja) * 2003-10-31 2005-05-26 Matsushita Electric Ind Co Ltd セラミック多層配線基板およびセラミック多層配線基板の製造方法ならびに半導体装置
WO2006004779A1 (en) * 2004-06-28 2006-01-12 Sv Probe Pte Ltd. Substrate with patterned conductive layer
JP2006179782A (ja) * 2004-12-24 2006-07-06 Shinko Electric Ind Co Ltd 半導体基板の製造方法
JP2007324439A (ja) * 2006-06-02 2007-12-13 Mitsubishi Gas Chem Co Inc プリント配線板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62100404A (ja) * 1985-10-28 1987-05-09 Kawasaki Steel Corp 高純度六方晶窒化硼素粉末の製造方法
JPH06140484A (ja) * 1992-10-28 1994-05-20 Nippon Telegr & Teleph Corp <Ntt> プローブカード
JP2001354480A (ja) * 2000-06-09 2001-12-25 Sumitomo Metal Ind Ltd 黒色系快削性セラミックスとその製法および用途
JP2005136266A (ja) * 2003-10-31 2005-05-26 Matsushita Electric Ind Co Ltd セラミック多層配線基板およびセラミック多層配線基板の製造方法ならびに半導体装置
WO2006004779A1 (en) * 2004-06-28 2006-01-12 Sv Probe Pte Ltd. Substrate with patterned conductive layer
JP2006179782A (ja) * 2004-12-24 2006-07-06 Shinko Electric Ind Co Ltd 半導体基板の製造方法
JP2007324439A (ja) * 2006-06-02 2007-12-13 Mitsubishi Gas Chem Co Inc プリント配線板の製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013077769A (ja) * 2011-09-30 2013-04-25 Nippon Zeon Co Ltd 回路基板
JP2014235814A (ja) * 2013-05-31 2014-12-15 株式会社Ｓｅｎ 絶縁構造及び絶縁方法
CN104217913A (zh) * 2013-05-31 2014-12-17 斯伊恩股份有限公司 绝缘结构及绝缘方法
KR20190002292A (ko) * 2017-06-29 2019-01-08 주식회사 디아이티 프로브 핀의 내구성 강화를 위한 스페이스 트랜스포머 및 그의 제조 방법
KR102019794B1 (ko) * 2017-06-29 2019-09-09 주식회사 디아이티 프로브 핀의 내구성 강화를 위한 스페이스 트랜스포머 및 그의 제조 방법
CN110248466A (zh) * 2018-03-08 2019-09-17 斯坦雷电气株式会社 电路基板、电子电路装置和电路基板的制造方法
CN110248466B (zh) * 2018-03-08 2024-06-07 斯坦雷电气株式会社 电路基板、电子电路装置和电路基板的制造方法
JP2020020553A (ja) * 2018-08-03 2020-02-06 富士電機株式会社 溶解装置
JP7259227B2 (ja) 2018-08-03 2023-04-18 富士電機株式会社 溶解装置

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