JP2009172936A - Method for precisely assembling metallic mold - Google Patents

Method for precisely assembling metallic mold Download PDF

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JP2009172936A
JP2009172936A JP2008015823A JP2008015823A JP2009172936A JP 2009172936 A JP2009172936 A JP 2009172936A JP 2008015823 A JP2008015823 A JP 2008015823A JP 2008015823 A JP2008015823 A JP 2008015823A JP 2009172936 A JP2009172936 A JP 2009172936A
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die
mold
die hole
precisely
hole
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Japanese (ja)
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Shulan Liu
淑蘭 劉
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SENYUN OPTICAL CORP
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SENYUN OPTICAL CORP
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  • Presses And Accessory Devices Thereof (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To precisely fit a die of a metallic mold to a die hole and to prevent breakage of the die due to collision with the die hole by providing a clearance in the die. <P>SOLUTION: A method for precisely assembling the metallic mold includes a first step of heating a mold frame 3 on a heat plate 2, a second step of fitting the die 4 into the die hole 31, an inside diameter of which is enlarged by thermal expansion at the first step, and a third step of precisely fitting the die 4 into the die hole 31 by gradually reducing the inside diameter of the die hole 31 by cooling the mold frame 3 where the die 4 is fitted at the second step. By these steps, the die 4 can be precisely fitted into the die hole 31 and further breakage of the die 4 due to collision with the die hole 31 can be prevented by providing the clearance in the die. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、金型を精密に組立てる方法に関し、特に、ダイとダイ孔とを精密に嵌合でき、ダイがダイ孔との隙間によって破損することを防止できる金型を精密に組立てる方法に関する。 The present invention relates to a method for precisely assembling a mold, and more particularly, to a method for precisely assembling a mold capable of precisely fitting a die and a die hole and preventing the die from being damaged by a gap with the die hole.

従来技術による金型の組立方法は、図１に示すように型枠１１上にダイ孔１２が設けられ、ダイ孔１２にダイ１３が嵌合されてダイ１３が型枠１１に固定される。しかし、従来技術による型枠１１のダイ孔１２の内径１５とダイ１３の外径１４とはほぼ同一であり、組立時、ダイ１３をダイ孔１２内に強制的に押し入れる必要があり、それによってダイ１３が破損または変形することがあるので、組立に不便であり、精密性も劣る。   In the mold assembling method according to the prior art, as shown in FIG. 1, a die hole 12 is provided on a mold 11, a die 13 is fitted into the die hole 12, and the die 13 is fixed to the mold 11. However, the inner diameter 15 of the die hole 12 and the outer diameter 14 of the die 13 of the mold 11 according to the prior art are almost the same, and it is necessary to force the die 13 into the die hole 12 during assembly. As a result, the die 13 may be damaged or deformed, which is inconvenient for assembly and inferior in precision.

その他の従来技術として、図２に示すように、ダイ孔１２の内径１５をダイ１３の外径１４よりもやや大きくしたものがあり、組立に便利であるが、ダイ孔１２とダイ１３との間の隙間によって金型の精密性が劣り、同時にダイ孔１２とダイ１３との隙間によってお互いに衝突して破損することがある。   As another conventional technique, as shown in FIG. 2, there is one in which the inner diameter 15 of the die hole 12 is slightly larger than the outer diameter 14 of the die 13, which is convenient for assembly. The precision of the mold is inferior due to the gap between them, and at the same time, the gap between the die hole 12 and the die 13 may collide with each other and be damaged.

本発明の発明者は、従来技術の組立に不便で、精密性に劣る点に鑑み、研究開発を行い、ついにダイとダイ孔とを精密に嵌合でき、同時に組立に便利な金型を精密に組立てる方法を案出した。
特許第３８５０１１２号公報 特開２０００−２０２６０８号公報 The inventor of the present invention has conducted research and development in view of the inconvenience of assembly of the prior art and inferior precision. Finally, the die and the die hole can be precisely fitted, and at the same time, a mold convenient for assembly is precisely I devised a method to assemble.
Japanese Patent No. 3850112 JP 2000-202608 A

本発明の主な目的は、型枠をヒートプレート上に置いて加熱する第１のステップと、
第１のステップによって熱膨張して内径が拡大したダイ孔内にダイを嵌合する第２のステップと、第２のステップのダイが嵌合された型枠を冷却し、ダイ孔の内径が徐々に縮小されてダイとダイ孔とが精密に嵌合される第３のステップと、を含む、金型を精密に組立てる方法を提供することにある。 The main object of the present invention is to place a mold on a heat plate and heat the first step;
A second step of fitting the die into a die hole that has been thermally expanded by the first step and having an enlarged inner diameter; and cooling the mold in which the die of the second step is fitted; A third step of gradually reducing the size of the die and the die hole so that the die and the die hole are precisely fitted is provided.

上述の目的を解決するために、請求項１の発明は、型枠をヒートプレート上に置いて加熱する第１のステップと、第１のステップによって熱膨張して内径が拡大したダイ孔内にダイを嵌合する第２のステップと、第２のステップのダイが嵌合された型枠を冷却環境に置いて自然冷却し、ダイ孔の内径が除々に縮小されてダイとダイ孔とが精密に嵌合される第３のステップと、を含むことを特徴とする金型を精密に組立てる方法である。 In order to solve the above-mentioned object, the invention of claim 1 includes a first step in which a mold is placed on a heat plate for heating, and a die hole whose inner diameter is expanded by thermal expansion by the first step. The second step of fitting the die and the mold in which the die of the second step is fitted are placed in a cooling environment and naturally cooled, and the inner diameter of the die hole is gradually reduced so that the die and the die hole are separated. A method of precisely assembling a mold, comprising: a third step of precisely fitting.

請求項２の発明は、加熱温度は１２０℃〜１５０℃であり、加熱時間は３０分であることを特徴とする請求項１記載の金型を精密に組立てる方法である。   The invention according to claim 2 is a method for precisely assembling the mold according to claim 1, wherein the heating temperature is 120 ° C. to 150 ° C. and the heating time is 30 minutes.

請求項３の発明は、冷却時間は２時間であり、冷却環境の温度は２０℃であり、湿度は６０％ＲＨであることを特徴とする請求項１記載の金型を精密に組立てる方法である。   The invention according to claim 3 is a method for precisely assembling the mold according to claim 1, wherein the cooling time is 2 hours, the temperature of the cooling environment is 20 ° C., and the humidity is 60% RH. is there.

本発明の方法によって、ダイとダイ孔とを精密に嵌合でき、ダイが隙間があることによってダイ孔と衝突して破損するのを防止できる。 According to the method of the present invention, the die and the die hole can be precisely fitted, and the die can be prevented from colliding with the die hole and being damaged due to the gap.

本発明の目的、特徴および効果を示す実施例を図に沿って詳細に説明する。 Embodiments showing the objects, features, and effects of the present invention will be described in detail with reference to the drawings.

図３に示すように、本発明の主な目的は金型を精密に組立てる方法を提供するものであり、下記のステップを含む。 As shown in FIG. 3, the main object of the present invention is to provide a method for precisely assembling a mold, and includes the following steps.

第１のステップ：型枠３を加熱する。図４に示すように、型枠３をヒートプレート２上に置いて加熱する。 加熱温度は１２０℃〜１５０℃であり、加熱時間は３０分である。 First step: The mold 3 is heated. As shown in FIG. 4, the mold 3 is placed on the heat plate 2 and heated. The heating temperature is 120 ° C. to 150 ° C., and the heating time is 30 minutes.

第２のステップ：図５に示すように、ダイ４を第１のステップのダイ孔３１内に嵌合する。図６に示すように、型枠３のダイ孔３１は熱膨張しているので、ダイ孔３１の内径は拡大しており、ダイ４を容易にダイ孔３１内に嵌合することができる。   Second step: As shown in FIG. 5, the die 4 is fitted into the die hole 31 of the first step. As shown in FIG. 6, since the die hole 31 of the mold 3 is thermally expanded, the inner diameter of the die hole 31 is enlarged, and the die 4 can be easily fitted into the die hole 31.

第３のステップ：第２のステップのダイ１３を嵌合した型枠３を冷却環境に置いて自然冷却する。図７に示すように、ダイ孔３１の内径が除々に縮小されるので、ダイ４とダイ孔３１とが精密に嵌合される。冷却環境の温度は２０℃であり、湿度は６０％ＲＨであり、冷却時間は２時間である。 Third step: The mold 3 fitted with the die 13 of the second step is placed in a cooling environment and naturally cooled. As shown in FIG. 7, since the inner diameter of the die hole 31 is gradually reduced, the die 4 and the die hole 31 are precisely fitted. The temperature of the cooling environment is 20 ° C., the humidity is 60% RH, and the cooling time is 2 hours.

上述のステップによってダイ４とダイ孔３１とを精密に嵌合でき、隙間によってダイ４とダイ孔３１とが衝突して破損するのを防止できる。 The die 4 and the die hole 31 can be accurately fitted by the above-described steps, and the die 4 and the die hole 31 can be prevented from colliding and being damaged by the gap.

本発明の進歩性および実用性を明らかにするために従来技術との比較を下記に示す。   In order to clarify the inventive step and practicality of the present invention, a comparison with the prior art is shown below.

従来技術の欠点：
１、組立に不便である。
２、ダイが変形および破損しやすい。
３、ダイとダイ孔との隙間が大きすぎる。 Disadvantages of the prior art:
1. Inconvenient for assembly.
2. The die is easily deformed and damaged.
3. The gap between the die and the die hole is too large.

本発明の長所：
１、組立に便利である。
２、ダイが変形しない。
３、ダイとダイ孔との間に隙間がない。 Advantages of the present invention:
1. Convenient for assembly.
2. The die does not deform.
3. There is no gap between the die and the die hole.

従来技術のダイ孔の内径とダイの外径とがほぼ等しい構造を示す断面図である。It is sectional drawing which shows the structure where the internal diameter of the die hole of a prior art and the outer diameter of die | dye are substantially equal. 従来技術のダイ孔の内径がダイの外径より大きい構造を示す断面図である。It is sectional drawing which shows the structure where the internal diameter of the die hole of a prior art is larger than the outer diameter of die | dye. 本発明のステップを示す流れ図である。3 is a flowchart illustrating the steps of the present invention. 本発明の型枠を加熱する状態を示す断面図である。It is sectional drawing which shows the state which heats the formwork of this invention. 本発明のダイをダイ孔に嵌合する前の状態を示す断面図である。It is sectional drawing which shows the state before fitting the die | dye of this invention to die hole. 本発明のダイをダイ孔に嵌合したばかりの状態を示す断面図である。It is sectional drawing which shows the state which just fitted the die | dye of this invention to the die hole. 本発明のダイをダイ孔に嵌合し、冷却後に精密に嵌合された状態を示す断面図である。It is sectional drawing which shows the state which fitted the die | dye of this invention to the die hole, and was closely fitted after cooling.

符号の説明Explanation of symbols

２ ヒートプレート
３ 型枠
３１ ダイ孔
４ ダイ 2 Heat plate 3 Form 31 Die hole 4 Die

Claims (3)

型枠をヒートプレート上に置いて加熱する第１のステップと、
前記第１のステップによって熱膨張して内径が拡大したダイ孔内にダイを嵌合する第２のステップと、
前記第２のステップのダイが嵌合された型枠を冷却環境に置いて自然冷却し、ダイ孔の内径が徐々に縮小されてダイとダイ孔とが精密に嵌合される第３のステップと、からなることを特徴とする金型を精密に組立てる方法。 A first step of placing the mold on a heat plate and heating;
A second step of fitting the die into a die hole whose inner diameter is expanded by thermal expansion by the first step;
The mold in which the die of the second step is fitted is placed in a cooling environment and naturally cooled, and the inner diameter of the die hole is gradually reduced to precisely fit the die and the die hole. A method for precisely assembling a mold characterized by comprising: 前記加熱温度は１２０℃〜１５０℃であり、加熱時間は３０分であることを特徴とする請求項１記載の金型を精密に組立てる方法。   2. A method for precisely assembling a mold according to claim 1, wherein the heating temperature is 120 [deg.] C. to 150 [deg.] C. and the heating time is 30 minutes. 前記冷却時間は２時間であり、前記冷却環境の温度は２０℃であり、湿度は６０％ＲＨであることを特徴とする請求項１記載の金型を精密に組立てる方法。   2. The method of precisely assembling a mold according to claim 1, wherein the cooling time is 2 hours, the temperature of the cooling environment is 20 [deg.] C., and the humidity is 60% RH.
JP2008015823A 2008-01-28 2008-01-28 Method for precisely assembling metallic mold Pending JP2009172936A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101441520B1 (en) 2013-07-24 2014-09-17 금능정밀(주) Method and die for insert molding

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02121909A (en) * 1988-10-28 1990-05-09 Kanebo Ltd Cosmetic for pimple
JPH10514A (en) * 1996-06-12 1998-01-06 Ibiden Co Ltd Jig for shrinkage fit of part having different quality, its method, and device
JPH1024473A (en) * 1996-07-11 1998-01-27 Shiro Takada Cylinder for molding machine
JPH11129107A (en) * 1997-10-31 1999-05-18 Daishowa Seiki Co Ltd Tool chuck method and shrinkage-fitting for collet chuck
JP2001170824A (en) * 1999-12-20 2001-06-26 Canon Inc Shrink fitting method for member and support axis having the member
JP2004114384A (en) * 2002-09-25 2004-04-15 Tdk Corp Mold component and mold assembly
JP2007106058A (en) * 2005-10-17 2007-04-26 Fujifilm Corp Molding die
JP2007196428A (en) * 2006-01-24 2007-08-09 Fujifilm Corp Mold and molding method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02121909A (en) * 1988-10-28 1990-05-09 Kanebo Ltd Cosmetic for pimple
JPH10514A (en) * 1996-06-12 1998-01-06 Ibiden Co Ltd Jig for shrinkage fit of part having different quality, its method, and device
JPH1024473A (en) * 1996-07-11 1998-01-27 Shiro Takada Cylinder for molding machine
JPH11129107A (en) * 1997-10-31 1999-05-18 Daishowa Seiki Co Ltd Tool chuck method and shrinkage-fitting for collet chuck
JP2001170824A (en) * 1999-12-20 2001-06-26 Canon Inc Shrink fitting method for member and support axis having the member
JP2004114384A (en) * 2002-09-25 2004-04-15 Tdk Corp Mold component and mold assembly
JP2007106058A (en) * 2005-10-17 2007-04-26 Fujifilm Corp Molding die
JP2007196428A (en) * 2006-01-24 2007-08-09 Fujifilm Corp Mold and molding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101441520B1 (en) 2013-07-24 2014-09-17 금능정밀(주) Method and die for insert molding

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