JP2009169394A5 - - Google Patents
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- JP2009169394A5 JP2009169394A5 JP2008274546A JP2008274546A JP2009169394A5 JP 2009169394 A5 JP2009169394 A5 JP 2009169394A5 JP 2008274546 A JP2008274546 A JP 2008274546A JP 2008274546 A JP2008274546 A JP 2008274546A JP 2009169394 A5 JP2009169394 A5 JP 2009169394A5
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- JP
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- Prior art keywords
- semiconductor region
- type semiconductor
- thin film
- region
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims 35
- 239000010409 thin film Substances 0.000 claims 13
- 239000010408 film Substances 0.000 claims 10
- 239000002184 metal Substances 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 5
- 238000005286 illumination Methods 0.000 claims 2
- 229910021417 amorphous silicon Inorganic materials 0.000 claims 1
- 229910021419 crystalline silicon Inorganic materials 0.000 claims 1
- 239000012535 impurity Substances 0.000 claims 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 claims 1
- 230000003287 optical Effects 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
Claims (10)
前記基板の一方面側から前記基板を照明する照明部と、
前記センサ領域に配置され、少なくともP型半導体領域とN型半導体領域を有し、前記基板の他方面側から入射する光を受光する薄膜フォトダイオードと、
前記基板の前記一方面側に絶縁膜を介して前記薄膜フォトダイオードと対向して形成され、前記照明部から発せられた光が前記一方面側から前記薄膜フォトダイオードに直接入射するのを抑制し、所定の電位に固定される金属膜と
を有し、
前記薄膜フォトダイオードにおいて、前記N型半導体領域に接続する方向に垂直な方向における前記P型半導体領域の幅と、前記P型半導体領域に接続する方向に垂直な方向における前記N型半導体領域の幅が異なるように形成されている
表示装置。 A substrate having a pixel region in which a pixel is formed and a sensor region in which an optical sensor unit is formed;
An illumination unit that illuminates the substrate from one side of the substrate;
A thin film photodiode disposed in the sensor region, having at least a P-type semiconductor region and an N-type semiconductor region, and receiving light incident from the other surface side of the substrate;
It is formed on the one surface side of the substrate so as to face the thin film photodiode via an insulating film, and suppresses light emitted from the illumination unit from directly entering the thin film photodiode from the one surface side. And a metal film fixed at a predetermined potential,
In the thin film photodiode, a width of the P-type semiconductor region in a direction perpendicular to a direction connecting to the N-type semiconductor region, and a width of the N-type semiconductor region in a direction perpendicular to the direction connecting to the P-type semiconductor region Display devices that are formed differently.
請求項1に記載の表示装置。 In the thin film photodiode, the area of the overlapping region of the P-type semiconductor region and the metal film when viewed from the one surface side or the other surface side is the area of the overlapping region of the N-type semiconductor region and the metal film. The display device according to claim 1.
前記薄膜フォトダイオードにおいて、前記N型半導体領域に接続する方向に垂直な方向における前記P型半導体領域の幅が、前記P型半導体領域に接続する方向に垂直な方向における前記N型半導体領域の幅より狭い
請求項1に記載の表示装置。 The metal film is connected to the N-type semiconductor region;
In the thin film photodiode, a width of the P-type semiconductor region in a direction perpendicular to a direction connecting to the N-type semiconductor region is a width of the N-type semiconductor region in a direction perpendicular to the direction connecting to the P-type semiconductor region. The display device according to claim 1, which is narrower.
請求項3に記載の表示装置。 In the thin film photodiode, the area of the overlapping region of the P-type semiconductor region and the metal film when viewed from the one surface side or the other surface side is the area of the overlapping region of the N-type semiconductor region and the metal film. The display device according to claim 3.
請求項3に記載の表示装置。 4. The display device according to claim 3, wherein in the thin film photodiode, a ratio R1 of a width of the P-type semiconductor region / a width of the N-type semiconductor region is in a range of 0.3 ≦ R1 <1.
前記薄膜フォトダイオードにおいて、前記N型半導体領域に接続する方向に垂直な方向における前記P型半導体領域の幅が、前記P型半導体領域に接続する方向に垂直な方向における前記N型半導体領域の幅より広い
請求項1に記載の表示装置。 The metal film is connected to the P-type semiconductor region;
In the thin film photodiode, a width of the P-type semiconductor region in a direction perpendicular to a direction connecting to the N-type semiconductor region is a width of the N-type semiconductor region in a direction perpendicular to the direction connecting to the P-type semiconductor region. The display device according to claim 1, which is wider.
請求項6に記載の表示装置。 In the thin film photodiode, the area of the overlapping region of the P-type semiconductor region and the metal film when viewed from the one surface side or the other surface side is the area of the overlapping region of the N-type semiconductor region and the metal film. The display device according to claim 6.
請求項6に記載の表示装置。 The display device according to claim 6, wherein in the thin film photodiode, a ratio R2 of a width of the N-type semiconductor region / a width of the P-type semiconductor region is in a range of 0.3 ≦ R2 <1.
請求項1に記載の表示装置。 The thin film photodiode has an intrinsic semiconductor region and / or a low concentration semiconductor region having a lower conductive impurity concentration than the N type semiconductor region and the P type semiconductor region between the N type semiconductor region and the P type semiconductor region. The display device according to claim 1.
請求項1に記載の表示装置。 The display device according to claim 1, wherein the semiconductor region including the P-type semiconductor region and the N-type semiconductor region constituting the thin film photodiode is formed of polycrystalline silicon, microcrystalline silicon, amorphous silicon, or crystalline silicon. .
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008274546A JP5154365B2 (en) | 2007-12-19 | 2008-10-24 | Display device |
TW097147177A TWI424558B (en) | 2007-12-19 | 2008-12-04 | Display |
US12/331,262 US7999259B2 (en) | 2007-12-19 | 2008-12-09 | Display device having a photodiode whose p region has an edge width different than that of the n region |
KR1020080125260A KR101543353B1 (en) | 2007-12-19 | 2008-12-10 | display |
CN2008101841812A CN101464579B (en) | 2007-12-19 | 2008-12-19 | Display |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007328065 | 2007-12-19 | ||
JP2007328065 | 2007-12-19 | ||
JP2008274546A JP5154365B2 (en) | 2007-12-19 | 2008-10-24 | Display device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009169394A JP2009169394A (en) | 2009-07-30 |
JP2009169394A5 true JP2009169394A5 (en) | 2011-11-10 |
JP5154365B2 JP5154365B2 (en) | 2013-02-27 |
Family
ID=40805238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008274546A Expired - Fee Related JP5154365B2 (en) | 2007-12-19 | 2008-10-24 | Display device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5154365B2 (en) |
KR (1) | KR101543353B1 (en) |
CN (1) | CN101464579B (en) |
TW (1) | TWI424558B (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5246795B2 (en) * | 2009-08-19 | 2013-07-24 | 株式会社ジャパンディスプレイウェスト | Sensor device, sensor element driving method, display device with input function, and electronic apparatus |
TWI507934B (en) | 2009-11-20 | 2015-11-11 | Semiconductor Energy Lab | Display device |
JP5721994B2 (en) * | 2009-11-27 | 2015-05-20 | 株式会社ジャパンディスプレイ | Radiation imaging device |
US9252171B2 (en) | 2010-09-06 | 2016-02-02 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device |
CN104867431B (en) * | 2015-06-12 | 2019-06-21 | 京东方科技集团股份有限公司 | A kind of pixel circuit and its driving method, detector |
CN106557193A (en) * | 2015-09-30 | 2017-04-05 | 南昌欧菲光科技有限公司 | Touch display unit |
US10663821B2 (en) | 2015-11-06 | 2020-05-26 | Sharp Kabushiki Kaisha | Display board having insulating films and terminals, and display device including the same |
CN107546337B (en) * | 2017-08-24 | 2020-07-24 | 京东方科技集团股份有限公司 | Organic light emitting device, brightness adjusting method thereof and display device |
WO2019061183A1 (en) * | 2017-09-28 | 2019-04-04 | 深圳传音通讯有限公司 | Display panel assembly, mobile terminal, image generation method, and storage medium |
CN107678600A (en) * | 2017-10-25 | 2018-02-09 | 京东方科技集团股份有限公司 | Digitizing plate, sender unit, digital panel device and its control method |
JP7377025B2 (en) * | 2019-08-27 | 2023-11-09 | 株式会社ジャパンディスプレイ | detection device |
CN111785745B (en) * | 2020-06-11 | 2023-09-08 | 上海交通大学 | Optical sensor, optical sensing device and preparation method thereof |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0014961D0 (en) * | 2000-06-20 | 2000-08-09 | Koninkl Philips Electronics Nv | Light-emitting matrix array display devices with light sensing elements |
KR100873497B1 (en) * | 2002-10-17 | 2008-12-15 | 삼성전자주식회사 | Integrated LCD with Fingerprint Recognition Device and Manufacturing Method Thereof |
JP2005043672A (en) * | 2003-07-22 | 2005-02-17 | Toshiba Matsushita Display Technology Co Ltd | Array substrate and its manufacturing method |
JP4737956B2 (en) * | 2003-08-25 | 2011-08-03 | 東芝モバイルディスプレイ株式会社 | Display device and photoelectric conversion element |
KR100669270B1 (en) * | 2003-08-25 | 2007-01-16 | 도시바 마쯔시따 디스플레이 테크놀로지 컴퍼니, 리미티드 | Display device and photoelectric conversion device |
US20070109239A1 (en) * | 2005-11-14 | 2007-05-17 | Den Boer Willem | Integrated light sensitive liquid crystal display |
JP2007184411A (en) * | 2006-01-06 | 2007-07-19 | Sony Corp | Light emitting diode and its manufacturing method, integrated light emitting diode and its manufacturing method, light emitting diode backlight, light emitting diode lighting apparatus, light emitting diode display, electronic equipment, and electronic device and its manufacturing method |
KR101224377B1 (en) * | 2006-02-17 | 2013-01-21 | 삼성디스플레이 주식회사 | Method for forming silicon layer and method for fabricating display substrate using the method |
US20070211184A1 (en) * | 2006-03-10 | 2007-09-13 | Luminus Devices, Inc. | Liquid crystal display systems including LEDs |
JP2007279100A (en) * | 2006-04-03 | 2007-10-25 | Epson Imaging Devices Corp | Display device |
JP2007311377A (en) * | 2006-05-16 | 2007-11-29 | Sony Corp | Manufacturing method of thin-film transistor, thin-film transistor, and display |
-
2008
- 2008-10-24 JP JP2008274546A patent/JP5154365B2/en not_active Expired - Fee Related
- 2008-12-04 TW TW097147177A patent/TWI424558B/en not_active IP Right Cessation
- 2008-12-10 KR KR1020080125260A patent/KR101543353B1/en not_active IP Right Cessation
- 2008-12-19 CN CN2008101841812A patent/CN101464579B/en not_active Expired - Fee Related
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