JP2009164385A - 裏面照射型撮像素子 - Google Patents

裏面照射型撮像素子 Download PDF

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Publication number
JP2009164385A
JP2009164385A JP2008001250A JP2008001250A JP2009164385A JP 2009164385 A JP2009164385 A JP 2009164385A JP 2008001250 A JP2008001250 A JP 2008001250A JP 2008001250 A JP2008001250 A JP 2008001250A JP 2009164385 A JP2009164385 A JP 2009164385A
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Japan
Prior art keywords
photoelectric conversion
center
light
conversion element
image sensor
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JP2008001250A
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Japanese (ja)
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JP2009164385A5 (enExample
Inventor
Masamitsu Hashimoto
正光 橋本
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Fujifilm Corp
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Fujifilm Corp
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Priority to JP2008001250A priority Critical patent/JP2009164385A/ja
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JP2008001250A 2008-01-08 2008-01-08 裏面照射型撮像素子 Pending JP2009164385A (ja)

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JP2008001250A JP2009164385A (ja) 2008-01-08 2008-01-08 裏面照射型撮像素子

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JP2008001250A JP2009164385A (ja) 2008-01-08 2008-01-08 裏面照射型撮像素子

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JP2009164385A true JP2009164385A (ja) 2009-07-23
JP2009164385A5 JP2009164385A5 (enExample) 2010-08-05

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6444098A (en) * 1987-08-12 1989-02-16 Fujikura Ltd Superconducting electromagnetic shielding material
JP2010199668A (ja) * 2009-02-23 2010-09-09 Sony Corp 固体撮像装置および電子機器
US7989908B2 (en) * 2006-12-27 2011-08-02 Dongbu Hitek Co., Ltd. Image sensor and method for manufacturing the same
JP2012169530A (ja) * 2011-02-16 2012-09-06 Sony Corp 固体撮像装置、および、その製造方法、電子機器
US8928795B2 (en) 2010-02-25 2015-01-06 Nikon Corporation Backside illumination image sensor and image-capturing device
JP2016048801A (ja) * 2015-12-02 2016-04-07 ソニー株式会社 固体撮像装置、および、その製造方法、電子機器
JP2016096359A (ja) * 2016-02-10 2016-05-26 キヤノン株式会社 固体撮像装置
JP2017055127A (ja) * 2016-10-28 2017-03-16 ソニー株式会社 固体撮像装置、および電子機器
US9601539B2 (en) 2010-03-31 2017-03-21 Sony Corporation Solid-state imaging device, method of manufacturing the same, and electronic equipment
JP2017143517A (ja) * 2017-02-09 2017-08-17 株式会社ニコン 撮像素子および撮像装置
US9893106B2 (en) 2013-05-24 2018-02-13 Sony Corporation Solid-state imaging device and electronic apparatus
JP2018129525A (ja) * 2018-03-28 2018-08-16 ソニー株式会社 固体撮像装置、および電子機器
WO2019038999A1 (ja) * 2017-08-24 2019-02-28 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置およびその製造方法
WO2021215303A1 (ja) * 2020-04-20 2021-10-28 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子および電子機器
WO2023149154A1 (ja) * 2022-02-03 2023-08-10 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、電子機器

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63170959A (ja) * 1987-01-08 1988-07-14 Matsushita Electronics Corp カラ−固体撮像装置
JP2003018476A (ja) * 2001-07-02 2003-01-17 Dainippon Printing Co Ltd 撮像装置
JP2003338615A (ja) * 2002-05-20 2003-11-28 Sony Corp 固体撮像装置
JP2004235621A (ja) * 2003-01-06 2004-08-19 Koji Eto 裏面照射型撮像素子
JP2005347708A (ja) * 2004-06-07 2005-12-15 Sony Corp 固体撮像素子及びその製造方法
JP2006019588A (ja) * 2004-07-02 2006-01-19 Sony Corp 固体撮像装置及びその製造方法
JP2006032497A (ja) * 2004-07-13 2006-02-02 Sony Corp 固体撮像素子と固体撮像装置、固体撮像素子の製造方法
JP2006080457A (ja) * 2004-09-13 2006-03-23 Sony Corp 固体撮像素子及びその製造方法
JP2006191023A (ja) * 2004-12-30 2006-07-20 Dongbuanam Semiconductor Inc Ｃｍｏｓイメージセンサおよびその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63170959A (ja) * 1987-01-08 1988-07-14 Matsushita Electronics Corp カラ−固体撮像装置
JP2003018476A (ja) * 2001-07-02 2003-01-17 Dainippon Printing Co Ltd 撮像装置
JP2003338615A (ja) * 2002-05-20 2003-11-28 Sony Corp 固体撮像装置
JP2004235621A (ja) * 2003-01-06 2004-08-19 Koji Eto 裏面照射型撮像素子
JP2005347708A (ja) * 2004-06-07 2005-12-15 Sony Corp 固体撮像素子及びその製造方法
JP2006019588A (ja) * 2004-07-02 2006-01-19 Sony Corp 固体撮像装置及びその製造方法
JP2006032497A (ja) * 2004-07-13 2006-02-02 Sony Corp 固体撮像素子と固体撮像装置、固体撮像素子の製造方法
JP2006080457A (ja) * 2004-09-13 2006-03-23 Sony Corp 固体撮像素子及びその製造方法
JP2006191023A (ja) * 2004-12-30 2006-07-20 Dongbuanam Semiconductor Inc Ｃｍｏｓイメージセンサおよびその製造方法

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6444098A (en) * 1987-08-12 1989-02-16 Fujikura Ltd Superconducting electromagnetic shielding material
US7989908B2 (en) * 2006-12-27 2011-08-02 Dongbu Hitek Co., Ltd. Image sensor and method for manufacturing the same
JP2010199668A (ja) * 2009-02-23 2010-09-09 Sony Corp 固体撮像装置および電子機器
USRE46729E1 (en) 2009-02-23 2018-02-20 Sony Corporation Solid-state imaging device and electronic apparatus having a light blocking part
US8493452B2 (en) 2009-02-23 2013-07-23 Sony Corporation Solid-state imaging device and electronic apparatus having a light blocking part
USRE46769E1 (en) 2009-02-23 2018-03-27 Sony Corporation Solid-state imaging device and electronic apparatus having a light blocking part
US11979672B2 (en) 2010-02-25 2024-05-07 Nikon Corporation Backside illumination image sensor and image-capturing device
US9184197B2 (en) 2010-02-25 2015-11-10 Nikon Corporation Backside illumination image sensor and image-capturing device
US8928795B2 (en) 2010-02-25 2015-01-06 Nikon Corporation Backside illumination image sensor and image-capturing device
US9466633B2 (en) 2010-02-25 2016-10-11 Nikon Corporation Backside illumination image sensor and image-capturing device
US10777595B2 (en) 2010-02-25 2020-09-15 Nikon Corporation Backside illumination image sensor and image-capturing device
US9704902B2 (en) 2010-02-25 2017-07-11 Nikon Corporation Backside illumination image sensor and image-capturing device
US11601624B2 (en) 2010-02-25 2023-03-07 Nikon Corporation Backside illumination image sensor and image-capturing device
US10204949B2 (en) 2010-02-25 2019-02-12 Nikon Corporation Backside illumination image sensor and image-capturing device
US9601539B2 (en) 2010-03-31 2017-03-21 Sony Corporation Solid-state imaging device, method of manufacturing the same, and electronic equipment
US9666632B2 (en) 2010-03-31 2017-05-30 Sony Corporation Solid-state imaging device, method of manufacturing the same, and electronic equipment
JP2012169530A (ja) * 2011-02-16 2012-09-06 Sony Corp 固体撮像装置、および、その製造方法、電子機器
US11894406B2 (en) 2013-05-24 2024-02-06 Sony Group Corporation Solid-state imaging device and electronic apparatus
US11569286B2 (en) 2013-05-24 2023-01-31 Sony Corporation Solid-state imaging device and electronic apparatus
US9893106B2 (en) 2013-05-24 2018-02-13 Sony Corporation Solid-state imaging device and electronic apparatus
US10615207B2 (en) 2013-05-24 2020-04-07 Sony Corporation Solid-state imaging device and electronic apparatus
US10319769B2 (en) 2013-05-24 2019-06-11 Sony Corporation Solid-state imaging device and electronic apparatus
JP2016048801A (ja) * 2015-12-02 2016-04-07 ソニー株式会社 固体撮像装置、および、その製造方法、電子機器
JP2016096359A (ja) * 2016-02-10 2016-05-26 キヤノン株式会社 固体撮像装置
JP2017055127A (ja) * 2016-10-28 2017-03-16 ソニー株式会社 固体撮像装置、および電子機器
JP2017143517A (ja) * 2017-02-09 2017-08-17 株式会社ニコン 撮像素子および撮像装置
WO2019038999A1 (ja) * 2017-08-24 2019-02-28 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置およびその製造方法
JP2018129525A (ja) * 2018-03-28 2018-08-16 ソニー株式会社 固体撮像装置、および電子機器
WO2021215303A1 (ja) * 2020-04-20 2021-10-28 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子および電子機器
WO2023149154A1 (ja) * 2022-02-03 2023-08-10 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、電子機器

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