JP2009147229A - Carrier for washing and drying substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent liquid from remaining on a substrate surface, and also to reduce particles discharged from a carrier as much as possible. <P>SOLUTION: In a carrier, connecting materials 11 made of resin are fixed to an upper portion of a U-shaped frame 1 having electrolytically polished and treated surfaces and being made of stainless, and right and left frames 1 are spaced by spacer materials 12. The bottom sections of the frames 1 are fixed with screws, arranging holding bars 20, 21 and 22 forming a V-shaped holding groove 3 to a round bar made of a polyvinylidene fluoride at proper interval in a triangular shape between both frames 1. Holes 13 and 13 for fixing the holding bars for the frames 1 are formed in slots, and the positions of fixings can be adjusted finely. The angle of the V-shaped holding groove of the holding bar 2 is set at 106&deg;, and the thread surface of a substrate is formed in a point contact, so that a washing liquid is spread. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a substrate cleaning / drying carrier used when a photomask glass substrate, a liquid crystal display substrate, a wafer, or the like is cleaned in a cleaning apparatus.

A carrier made of polyvinylidene fluoride (PVDF) shown in FIG. 5 is known as a cleaning / drying carrier used when cleaning a substrate in a cleaning apparatus. This is because three substrate support bars 2 are arranged in a triangle between left and right frames 1 made of polyvinylidene fluoride, and a V-shaped holding groove of 90 degrees (θ ₁ ) is usually formed on the substrate support bars. . A reinforcing material 15 is provided in the middle portion of the frame 1. Polyvinylidene fluoride has good processability and relatively high mechanical strength as a fluororesin. The carrier for cleaning and drying is held in a V-shaped holding groove, cleaned with a cleaning device, and dried. is doing.
Depending on the material and shape of the carrier used for cleaning / drying a substrate such as a photomask substrate or a wafer, there is a problem that a solvent or cleaning water may remain on the substrate surface and remain on the substrate. In order to solve this problem, the present applicant, as disclosed in Patent Document 1 (utility model registration No. 2565386), provided an opening less than the thickness of the substrate to be cleaned and dried in the V-shaped holding groove, Furthermore, it has been proposed to provide a triangular liquid escape groove at the end of the opening.
Utility model registration No. 2565386

The side surface of the photomask substrate is chamfered at a chamfer angle of 45 degrees (θ ₂ ). Therefore, when the angle of the V-groove (θ ₁ ) is 90 degrees, the substrate is placed on a cleaning / drying carrier. As shown in FIG. 6, the chamfered portion (thread surface) of the substrate is in close contact with the V-shaped groove of the support rod, the cleaning liquid does not rotate sufficiently, and the liquid remains in a fine gap, resulting in insufficient drying. Become. Furthermore, in recent years, it has been a problem that particles emitted from the carrier itself adhere to the substrate.
SUMMARY OF THE INVENTION An object of the present invention is to prevent a liquid adhering to a substrate surface from remaining in a cleaning / drying carrier used in a bath-type cleaning apparatus, and to minimize the emission of particles from the carrier.
It is another object of the present invention to increase the cleaning effect by reducing the number of members that hinder the cleaning liquid from hitting the substrate and allowing the cleaning liquid to efficiently hit the target substrate.

Therefore, in the tank-type cleaning / drying carrier for holding the substrate by the side and lower V-shaped holding grooves, the angle (θ ₁ ) of the V-shaped holding groove is set so that the substrate yarn surface and the V-type holding groove when the substrate is set are set. angle of (theta ₃₎ are intended to suppress the residual of the cleaning liquid as in the range of 5 to 15 degrees.
Further, the left and right frames of the carrier are made of stainless steel whose surface is electropolished, thereby reducing the number of particles adhering to the substrate as compared with the conventional carrier.

According to the present invention, by using an electropolished stainless steel material as the left and right frame materials, the cross section can be made thinner than that using conventional PVDF. In addition, since it is made of stainless steel, it has higher rigidity than PVDF, and no frame reinforcing member is required. Therefore, there are fewer members that impede the cleaning liquid from hitting the substrate. Rise.
In addition, the V-shaped groove is not parallel to the substrate yarn surface, and the contact between the substrate and the V-shaped holding groove becomes a point contact, and the residue of the cleaning liquid can be almost eliminated, thereby preventing the occurrence of stains during cleaning and drying. In addition, the adhesion of particles from the contact surface to the substrate can be prevented as much as possible.
Furthermore, since almost no particles are generated from the electropolished stainless steel, the number of particles adhering to the substrate is drastically reduced to one-third or less compared with the conventional one, and the yield of products is improved in semiconductor manufacturing. be able to.

Hereinafter, the present invention will be described in detail with reference to the drawings, taking as an example the case of a substrate having a chamfer angle (θ ₂ ) of 45 degrees. Incidentally, the V-groove angle (theta _1), the relationship of the chamfered angle of the substrate (theta ₂₎ and the angle (theta ₃₎ formed by the substrate fiber surface and V-shaped groove is a _{θ 3 = θ 1/2 +} θ 2 -90 .
1 is a front view and a plan view of a substrate cleaning / drying carrier of the present invention, FIG. 2 is a side view, and FIG. 3 is an enlarged view of a holding rod having a V-shaped holding groove.
The carrier has a connecting material 11 fixed to the upper part of a U-shaped frame 1 made of stainless steel (SUS316) whose surface is electropolished, and the left and right frames 1 are held at intervals by spacer materials 12. At the bottom of the frame 1, holding rods 20, 21, and 22 having V-shaped grooves formed at appropriate intervals on a round bar made of polyvinylidene fluoride (φ16mm) are arranged in a triangle between both frames 1 and fixed with screws. It is. The holes 13 and 13 for fixing the holding rod of the frame 1 are elongated holes, and the fixing position can be finely adjusted.
In the present embodiment, the V-shaped holding groove 3 of the holding rod 2 has an angle θ ₁ of about 106 degrees as shown in FIG. It is preferable from the viewpoint of stability that the depth of the V-shaped holding groove 3 is changed in accordance with the thickness of the substrate of the object to be cleaned so that the substrate is in contact with the middle portion of the V-shaped groove.

  FIG. 4 shows the result of counting the number of particles having a particle size of 0.3 μm or more remaining on the glass substrate by cleaning the glass substrate using the carrier of the present invention and a conventional carrier made of polyvinylidene fluoride. The maximum number of particles was 80, which was about 1/4 compared with the conventional product, and the average was about 20, which was about 1/3.

The angle of the V-shaped groove (θ ₁ ) is changed from 95 degrees in increments of 1 degree, and a normal glass substrate with a chamfer angle (θ ₂ ) of 45 degrees is held and washed water remaining after cleaning When the appearance and the occurrence of stains were examined, if the angle (θ ₃ ) between the V-shaped groove and the substrate yarn surface was 5 ° or more, the glass surface yarn surface and the holding rod V-shaped holding groove A space was formed between them, there was almost no residual water, and no spots were generated. If the angle is further increased, the distance between the V-shaped grooves is increased, which is uneconomical, and water may remain at the bottom of the V-shaped grooves. Therefore, about 120 degrees, that is, the angle formed between the V-shaped groove and the substrate yarn surface (θ ₃ ) The upper limit is 15 degrees. From the viewpoint of securing the space between the substrate and the support rod groove and the stability of the substrate support, it is more preferable that the angle is 105 degrees to 110 degrees.

The front view and top view of the washing | cleaning / drying carrier of this invention. The side view of the carrier for washing | cleaning and drying of this invention. The enlarged view of the holding | maintenance rod of the carrier for washing | cleaning and drying of this invention. Comparison graph of the number of particles. The front view of the conventional washing | cleaning and drying carrier. Explanatory drawing of the relationship between a V-shaped groove and a substrate chamfering angle.

Explanation of symbols

1 Frame 2 Holding rod 3 V-type holding groove θ ₁ V-type holding groove angle θ ₂ Chamfering angle

Claims (2)

In a cleaning / drying carrier in which both sides and lower side of a chamfered substrate are held by a support rod having a V-shaped holding groove, an angle (θ ₃ ) between the yarn surface of the substrate and the V-shaped holding groove Is a substrate cleaning / drying carrier having an angle (θ ₁ ) of 5 to 15 degrees. 2. The substrate cleaning / drying carrier according to claim 1, wherein the carrier frame is made of stainless steel, and the surface of the stainless steel is subjected to electrolytic polishing treatment.

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