JP2009147225A - Inspection-repair device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce man-hour and cost for inspection or repair of a substrate boring a non-through-hole or a through-hole. <P>SOLUTION: An inspection-repair device has a stage 1 for arranging the substrate 8, an image sensing means 2 image-sensing a non-through-hole or a through-hole bored to the substrate 8 arranged on the stage 1 and a defective detecting means 6 analyzing image data obtained by the image sensing means 2, detecting the defective non-through-hole or through-hole and acquiring the positional coordinates of the non-through-hole or through-hole. The inspection-repair device further has a repair means 3 capable of being relatively moved to the substrate 8 disposed on the stage 1 and capable of repairing the non-through-hole or through-hole bored to the substrate 8 and a control means 7 moving the repair means 3 to a position corresponding to the positional coordinates obtained by the defective detecting means 6 and repairing the defective non-through-hole or through-hole. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an apparatus for inspecting a non-through hole or a through hole made in a substrate and repairing the defective non-through hole or the through hole.

The following document discloses an inspection apparatus for inspecting vias, through holes and the like drilled in a substrate, particularly a printed wiring board. In this type of inspection device, image data obtained by imaging a substrate placed on a stage with a camera sensor is analyzed, and if the position and diameter are within tolerances, or if they are non-through holes, If there is no residue or if it is a through-hole, it is determined whether or not it has penetrated properly.
"Printed wiring board hole position / hole diameter inspection device", [online], December 6, 2007, Kaneko Electric Manufacturing Co., Ltd., Internet <URL http://www.kanekodenki.co.jp/> Japanese Patent No. 3385002

  At present, a substrate in which a defective non-through hole / through hole is found as a result of inspection by an inspection apparatus is moved to another place called a verification station and re-inspected manually. If the defect is repairable, repair is performed.

  However, innumerable non-through holes / through holes are drilled in the substrate, and it takes much time and effort to check with the verification station whether the non-through hole / through hole is determined to be defective by the inspection apparatus. . Further, since the inspection apparatus cannot distinguish between a false defect that can be easily repaired and a genuine defect that is difficult to repair, a considerable number of substrates flow to the verify station. Therefore, no matter how much the inspection speed of the inspection apparatus can be improved, the overall man-hour and cost cannot be reduced.

  The present invention, which has been made by paying attention to the above problems for the first time, is intended to reduce the number and cost of inspection or repair of a substrate having a non-through hole or a through hole.

  In the present invention, a stage for placing a substrate, an imaging means for imaging a non-through hole or a through hole made in the board placed on the stage, and image data obtained by the imaging means are analyzed. Detects defective non-through holes or through holes and obtains their position coordinates, and defect detection means that can move relative to the substrate placed on the stage and repair non-through holes or through holes drilled in the substrate An inspection / repair device comprising: a repair means; and a control means for moving the repair means to a position corresponding to the position coordinate obtained by the defect detection means to execute repair of a defective non-through hole or through hole. Configured. In this equipment, since inspection and repair are performed on the same stage, information on the position coordinates of defective non-through holes / through holes detected in the inspection process can be used in the repair process, and defective non-through holes / through holes are detected. Can be repaired promptly. After the repair, if an inspection is performed again with this apparatus, only genuine defects that are difficult to repair can be detected. This also reduces the number of substrates that flow to the verify station. Furthermore, it is possible to eliminate the need for a verify station.

  The repair means includes a laser projection head that projects a laser toward a substrate, for example.

  In order to make the repair means movable relative to the substrate, the stage is transported in a predetermined direction, and the repair means is movable in a direction intersecting the transport direction of the substrate by the stage. It is preferable.

  Since vias, through-holes, and the like are drilled everywhere on the substrate, it is necessary to obtain image data of the entire substrate for the inspection. If the imaging unit and the repairing unit are supported by a driving mechanism that can move in a direction that intersects the substrate conveyance direction by the stage, image data of the entire substrate can be acquired. In addition, the mechanism can be shared.

  According to the present invention, it is possible to reduce man-hours and costs for inspection or repair of a substrate having a non-through hole or a through hole.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows an overall outline of the inspection / repair device of this embodiment. The apparatus includes a stage (or table) 1 on which the substrate 8 is arranged, an imaging unit 2 that images the substrate 8, a repair unit 3 that repairs a non-through hole or a through-hole formed in the substrate 8, and a defective unit. A defect detection means 6 for detecting a non-through hole or a through hole and a control means 7 for causing the repair means 3 to repair the defective non-through hole or the through hole detected by the defect detection means 6 are provided.

  The stage 1 is moved forward and backward in the y-axis direction (front-rear direction) by a drive source such as a linear servo motor, for example, and can place the substrate 8 and transport it in the y-axis direction.

  The imaging means 2 includes, for example, a CCD (Charge Coupled Device) camera sensor 21 that captures an optical image of the substrate 8 disposed on the stage 1. The camera sensor 21 faces the stage 1 and images a belt-like region extending in the x-axis direction (left-right direction) on the surface of the substrate 8. In the present embodiment, a plurality of camera sensors 21 are arranged in the x-axis direction, and a wide range extended in the x-axis direction by these camera sensors 21 can be imaged at a time. If the substrate 8 is transported in the y-axis direction through the movement of the stage 1, the surface of the substrate 8 can be scanned. Furthermore, the camera mechanism 21 can be moved in the x-axis direction by a drive mechanism 4 described later, and the entire x-axis direction can be scanned.

  The repair means 3 includes a laser projection head (or nozzle) 31 that irradiates the substrate 8 with laser and perforates the substrate 8. An optical fiber 32 is connected to the projection head 31, and laser light supplied from a laser oscillator 33 is introduced via the optical fiber 32. However, an optical path that guides the laser light to the projection head 31 may be constructed using an optical element such as a lens or a mirror. The projection head 31 is above the stage 1 and projects a laser beam vertically downward. In the present embodiment, a beam 5 extending in the x-axis direction is placed directly above the stage 1, and a drive mechanism 4 that moves in the x-axis direction by a drive source such as a linear servo motor is installed on the beam 5. The projection mechanism 31 and the camera sensor 21 are supported by the drive mechanism 4. By combining the movement of the drive mechanism 4 in the x-axis direction and the movement of the stage 1 in the y-axis direction, the projection head 31 and the camera sensor 21 can be relatively moved to arbitrary positions with respect to the substrate 8.

  The defect detection means 6 and the control means 7 are mainly composed of one or a plurality of information processing apparatuses. As shown in FIG. 2, the information processing apparatus includes hardware resources such as a processor a, a main memory b, an auxiliary storage device c, a display control device d, a display e, an operation input device f, and a communication interface g. It is controlled by a controller (system controller, I / O controller, etc.) h to operate in cooperation. The auxiliary storage device c is a flash memory, a hard disk drive, an optical disk drive, or the like. The display control device d includes, as elements, a graphics processor that generates image data to be displayed based on a drawing command received from the processor a and sends the image data to the display e, a video memory that temporarily stores image data and the like. To do. The operation input device f is a pointing device such as a button, a keyboard, a mouse, a track pad, or a touch panel (which may overlap the display e) that can be operated with fingers. The communication interface g is a device for transmitting and receiving data and control signals, and is represented by NIC (Network Interface Card), wireless transceiver, USB (Universal Serial Bus), IEEE 1394, and the like. A program to be executed by the processor a is stored in the auxiliary storage device c. When the program is executed, the program is read from the auxiliary storage device c into the main memory b and is decoded by the processor a. Thus, the hardware resources are operated according to the program, and the functions as the defect detection means 6 and the control means 7 are exhibited.

  The defect detection means 6 acquires the image data captured by the camera sensor 21 via the communication interface g, stores it in the main memory b or the auxiliary storage device c, analyzes the image data, and analyzes the defective non-through hole or through hole. Is detected. An example of a defect is shown in FIG. In FIG. 3, the code | symbol 81 is a copper foil layer and the code | symbol 82 is a base material layer. In a non-through hole, a base residue 83 may remain at the bottom of the hole. This residue 83 causes a conduction failure between layers. In the through hole, the exit port (opening on the back surface side) 85 may be narrower than the entrance port (opening on the front surface side) 84. If the exit port 85 is narrow, it also causes a failure of conduction between the front and back sides. In addition, regardless of whether it is a non-through hole or a through hole, its position and diameter must be within an allowable error. The information processing terminal stores in advance in the main memory b or the auxiliary storage device c information on the positions and diameters of the non-through holes / through holes drilled in the substrate 8 to be inspected, tolerances, and threshold values for determination criteria. . Then, based on the pixel value of the image data, for example, a non-through hole / through hole entrance 84, a bottom residue 83 or an exit 85 is detected, and the position and diameter of the entrance 84 are within an allowable error. In the case of a non-through hole, if the amount of the residue 83 on the bottom of the hole exceeds the threshold value, and if it is a through hole, the case where the diameter of the exit port 85 is below the threshold value is determined to be defective. Thereafter, the position coordinates (x, y) of the non-through hole / through hole determined to be defective are stored in the main memory b or the auxiliary storage device c as the position coordinates of the non-through hole / through hole to be repaired.

  The control means 7 moves the laser projection head 31 to a location corresponding to the non-through hole / through hole to be repaired, and executes the repair of the non-through hole / through hole. Specifically, a control signal for outputting laser light having an output and frequency necessary for repair is input to the laser oscillator 33 via the communication interface g. In addition, a control signal corresponding to the position coordinates (x, y) obtained by the defect detection means 6 is input to each servo of the stage 1 and the drive mechanism 4 via the communication interface g, and the projection head 31 is applied to the substrate 8. To move relative. Then, a control signal for opening and closing a shutter attached to the projection head 31 is input to the projection head 31 via the communication interface g. Thereby, the laser emitted from the projection head 31 is irradiated to the defective portion of the substrate 8 to repair or clean the non-through hole / through hole.

  According to this embodiment, the stage 1 for arranging the substrate 8, the imaging means 2 for imaging a non-through hole or a through-hole drilled in the substrate 8 arranged on the stage 1, and the imaging means 2 The defect detection means 6 for detecting the defective non-through hole or the through hole by analyzing the image data obtained in step 1 and obtaining the position coordinates thereof, and the substrate 8 disposed relative to the substrate 8 disposed on the stage 1 Repair means 3 capable of repairing a non-through hole or a through-hole drilled in the hole, and the repair means 3 is moved to a position corresponding to the position coordinate obtained by the defect detection means 6 to obtain a defective non-through hole or through-hole. Since the inspection / repair device comprising the control means 7 for executing the repair is configured, the inspection and the repair are performed on the same stage 1, and the position coordinates of the defective non-through hole / through hole detected in the inspection process Information in the repair process Can use, it is possible to quickly Naru repair of defective non-through holes / through-hole. If the inspection is performed again with this apparatus after the repair, only genuine defects that are difficult to repair can be detected, and the number of substrates 8 flowing to the verification station is reduced. Furthermore, it is possible to eliminate the need for a verify station.

  The repair means 3 has a laser projection head 31 that projects a laser beam toward the substrate 8, and is particularly suitable for repairing non-through holes / through holes formed by laser processing.

  Since the stage 1 transports the substrate 8 in the y-axis direction and the repair means 3 is movable in the x-axis direction intersecting the transport direction of the substrate 8 by the stage 1, the repair means 3 is moved to the substrate 8. It can be moved to any position with respect to. Eventually, it becomes possible to repair non-through holes / through holes in any part of the substrate 8.

  Since the image pickup means 2 and the repair means 3 are supported by the drive mechanism 4 that can move in the direction intersecting the conveyance direction of the substrate 8 by the stage 1, the mechanism can be shared and the image data of the entire area of the substrate 8 can be stored. Acquisition is possible.

  The present invention is not limited to the embodiment described in detail above. For example, the repairing means is not limited to a laser projection head that performs laser processing on a substrate. As repairing means, a drill or the like for drilling in the substrate may be mounted.

  The mechanism that allows the repair means to move relative to the substrate is not limited to the above embodiment. The stage may be fixed and the repairing means may be movable in two directions of the x-axis and y-axis, or the repairing means may be fixed and the stage may be movable in two directions of the x-axis and y-axis. Instead of immobilizing the stage itself, the substrate may be transported by a transport mechanism such as a carriage traveling on the stage. The same applies to the mechanism that enables the imaging means to move relative to the substrate.

  Other specific configurations of each part can be variously modified without departing from the spirit of the present invention.

The perspective view which shows the inspection and repair apparatus of one Embodiment of this invention. The hardware resource block diagram of the defect detection means and control means in the inspection and repair apparatus of the embodiment. The top view and side end view which illustrate a defective non-through hole / through hole.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Stage 2 ... Imaging means 3 ... Repair means 4 ... Drive mechanism 6 ... Defect detection means 7 ... Control means

Claims (4)

A stage for placing the substrate;
Imaging means for imaging a non-through hole or a through hole made in the substrate disposed on the stage;
Failure detection means for analyzing the image data obtained by the imaging means to detect defective non-through holes or through holes and obtaining their position coordinates;
Repair means capable of moving relative to the substrate disposed on the stage and repairing a non-through hole or a through hole formed in the substrate;
An inspection / repair device comprising: a control unit that moves the repair unit to a position corresponding to the position coordinate obtained by the defect detection unit and repairs a defective non-through hole or through hole. The inspection / repair device according to claim 1, wherein the repair means includes a laser projection head that projects a laser toward the substrate. The stage conveys the substrate in a predetermined direction,
The inspection / repair device according to claim 1, wherein the repair means is movable in a direction intersecting a substrate transport direction by the stage. The inspection / repair device according to claim 3, wherein the imaging unit and the repair unit are supported by a drive mechanism that is movable in a direction that intersects a substrate transport direction by the stage.

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