JP2009143061A - Solder printer and solder printing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solder printer by which the wear condition of a squeegee can be detected by detecting the compressed condition of the squeegee before printing by a simple constitution, the change of printing film thickness due to squeegee deterioration can be suppressed by exchanging the squeegee at a proper timing by an operator, and the film thickness of solder can be adjusted by automatically controlling the printing pressure in the case the squeegee wears. <P>SOLUTION: The solder printing machine comprises a load sensor 41 arranged protruding upward from the upper side surface of a metal mask 13 and detecting the load received by the metal mask 13 from the squeegee 12, a calculation means 100 calculating whether or not the load detected by the load sensor 41 is the predetermined set value set in advance or less, and an informing means 104 informing in the case where the load detected by the load sensor 41 is the set value or less as the result of the calculation of the calculation means 100. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a solder printer and a solder printing method. More specifically, the present invention relates to a technique capable of suppressing a change in the thickness of solder to be printed even when a squeegee is worn and a load applied to the mask from the squeegee changes.

Conventionally, a solder printing machine configured to perform solder printing by filling solder paste such as cream solder into the opening of a mask such as a metal mask with a squeegee and transferring the filled solder paste to a work to be printed has been put into practical use. ing.
Hereinafter, the configuration of a conventional solder printer will be described with reference to FIGS. 4 and 5. FIG. 4 is a schematic side sectional view of a conventional solder printing machine 10. As shown in FIG. 4, in the solder printer 10, the squeegee head 11 is provided with squeegees 12 (12 a and 12 b) made of urethane rubber. Then, the squeegee 12a is pressed against the metal mask 13 disposed on the substrate 21 in the direction of arrow F with a predetermined printing pressure (load), and at the same time, the squeegee head 11 and the squeegee 12a are moved in the direction of arrow A. It is configured. With such a configuration, the cream solder (hereinafter referred to as solder) 31 is pushed into the metal mask openings 13a and 13a while rolling, and the edge of the squeegee 12a scrapes off the solder so that the solder 31 has a predetermined thickness ( The metal mask openings 13a and 13a are filled with the film thickness. The solder 31 filled in the metal mask openings 13a and 13a is transferred to the substrate 21 to be printed with the solder 31, whereby the solder 31 is printed on the substrate 21.

FIG. 5A is a schematic side cross-sectional view of the conventional solder printer 10 in a state where the solder 31 is filled in a normal state, and FIG. 5B is also a schematic side view in the state where the solder 31 is filled when the squeegee 12a is worn. It is sectional drawing. The squeegee 12a is worn by the continuous use of the solder printer 10. However, when the squeegee 12a is worn, the contact area between the squeegee 12a and the metal mask 13 is increased. 13, the printing pressure per unit area from the squeegee 12a decreases.
Thereby, the film thickness d2 of the filling portion of the solder 31 when the squeegee 12a is worn (B) is larger than the film thickness d1 of the normal time (A), and the filling portion of the solder 31 is close to the film thickness d1. There was a problem that the solder 31 adjacent to each other may be in close contact after reflow.

In order to solve the above problems, a technique for grasping the state of the tip of the squeegee from the cross-sectional shape measurement information (for example, Patent Document 1), or a pressure sensor provided at the bottom of the substrate or the back side of the printing mask to detect the squeegee printing pressure Techniques (for example, Patent Document 2 and Patent Document 3) are disclosed.
JP-A-5-13926 Japanese Patent Laid-Open No. 10-41618 JP 2001-71455 A

  However, the technique described in “Patent Document 1” requires a complicated measuring device in order to measure the cross-sectional shape of the squeegee. Further, in the techniques described in “Patent Document 2” and “Patent Document 3”, since the pressure sensor is disposed at the lower part of the substrate or the back side of the printing mask, the apparatus becomes complicated and the pressure detection accuracy also deteriorates. It was.

  In order to solve the above-described problems, the present invention detects the pressure state of the squeegee before printing with a simple configuration, detects the wear state of the squeegee, and allows the operator to replace the squeegee at an appropriate time. The present invention provides a solder printing machine that can suppress changes in the printed film thickness due to deterioration of the squeegee, and can adjust the solder film thickness by automatically controlling the printing pressure when the squeegee is worn.

  The problems to be solved by the present invention are as described above. Next, means for solving the problems will be described.

  That is, in claim 1, a solder printing machine that performs printing on a work piece of solder paste by moving the squeegee while pressing it against the upper surface of the mask, and is provided on the upper surface of the mask. Load detecting means for detecting a load received by the mask from the squeegee, calculating means for calculating whether the load detected by the load detecting means is equal to or less than a predetermined set value, and calculation by the calculating means As a result, it is provided with notifying means for notifying when the load detected by the load detecting means is not more than the set value.

  According to a second aspect of the present invention, the solder printer includes pressure adjusting means for adjusting a load applied to the mask from the squeegee, and the load detected by the load detecting means as a result of the calculation by the calculating means. When it is less than the set value, the load is increased by the pressure adjusting means.

  The solder printing method according to claim 3, wherein a solder paste is printed on a workpiece by moving the squeegee while pressing the squeegee on the upper surface of the mask, and a load that the mask receives from the squeegee is applied to the upper surface of the mask. A load detection step for detecting the load, a calculation step for calculating whether or not the load detected in the load detection step is equal to or less than a predetermined set value set in advance, and a result of the calculation in the calculation step, the load detection A notification step of notifying when the load detected in the step is equal to or less than the set value.

  5. The solder printing method according to claim 4, wherein the load applied from the squeegee to the mask when the load detected in the load detection step is equal to or less than the set value as a result of the calculation in the calculation step. The pressure adjustment process which increases is further provided.

  As effects of the present invention, the following effects can be obtained.

  According to the present invention, by detecting the pressure state of the squeegee before printing with a simple configuration and grasping the wear state of the squeegee, it is possible to replace the squeegee at an appropriate time so that the printed film thickness due to squeegee deterioration is reduced. The change can be suppressed, and when the squeegee is worn, the printing film thickness can be adjusted by automatically controlling the printing pressure.

Next, embodiments of the invention will be described.
FIG. 1 is a schematic side sectional view and control block diagram of a solder printer according to the present invention.
FIG. 2A is a schematic side cross-sectional view of the solder printing machine according to the present invention in a normal printing pressure detection state, and FIG. 2B is a schematic side cross-sectional view in the printing pressure detection state during squeegee wear. is there.
FIG. 3A is a schematic side cross-sectional view of the solder printer of the present invention in a normal solder filling state, and FIG. 3B is a schematic side cross-sectional view of the solder filling state during squeegee wear.
FIG. 4 is a schematic side sectional view of a conventional solder printer.
FIG. 5A is a schematic side cross-sectional view of a conventional solder printing machine in a normal solder filling state, and FIG. 5B is a schematic side cross-sectional view in a solder filling state during squeegee wear.
It should be noted that the technical scope of the present invention is not limited to the following examples, but broadly covers the entire scope of the technical idea that the present invention truly intends, as will be apparent from the matters described in the present specification and drawings. It extends.

  The solder printer according to the present invention will be described below.

[Example 1]
First, a solder printer 10 according to Example 1 of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a schematic side sectional view and control block diagram of a solder printer according to the present invention. In the solder printer 10 shown in FIG. 1, a urethane rubber squeegee 12 (12a, 12b) is disposed on a squeegee head 11, and the squeegee 12a is placed on a metal on a substrate 21 with a predetermined printing pressure (load). The basic structure of the conventional solder printing machine 10 shown in FIGS. 4 and 5 is such that the paste-like solder 31 is pushed into the metal mask openings 13a and 13a while being moved while being pressed against the mask 13. It is comprised substantially the same. Therefore, in the following description, detailed description is omitted about the part which overlaps with the conventional solder printer 10 grade | etc.,.

  As shown in FIG. 1, the solder printer 10 according to the present invention includes a control means (calculation means) 100, an input means 102, a notification means 104, a horizontal drive means 106, and a vertical drive means (pressure adjustment means) 108. In the metal mask 13, a load detecting means (load sensor in the present embodiment) 41 is arranged on the upper surface.

  The control means 100 is mainly composed of a CPU constituting the arithmetic means, a microcomputer such as RAM and ROM constituting the storage means, and the input means 102, the notification means 104, the horizontal drive means 106, and the vertical drive means ( Pressure adjusting means) 108, a load sensor 41, and the like are connected to control the operation of the solder printer 10 according to the present invention.

  The input unit 102 is, for example, a numeric keypad, a cross switch, a dial, and other push button switches. As will be described later, a setting value of the printing pressure of the solder printer 10 is input, and the setting value is input to the control unit 100. Communicated.

The notifying means 104 is constituted by, for example, a lamp, a liquid crystal screen, and the like, and displays the information by a predetermined output method when the control means 100 determines that the printing pressure of the squeegee 12 is not more than a set value as will be described later. It is controlled to notify by this. The input unit 102 and the notification unit 104 may be configured as a single unit such as a touch panel.
Further, the notification means 104 can be configured to emit sound or vibration, and in this case, the information can be notified by the sound or vibration generated.

  The horizontal drive means 106 is an actuator such as an electric motor or a hydraulic cylinder, and is driven and controlled by the control means 100 to drive the squeegee head 11 horizontally. By driving the horizontal driving means 106, the squeegee 12 (12a, 12b) moves in the horizontal direction and pushes the solder 31 into the metal mask openings 13a, 13a while rolling.

  The vertical drive unit 108 is, for example, a fluid compressor, and is driven and controlled by the control unit 100 to apply a printing pressure to the squeegee head 11. The vertical driving means 108 includes pressure adjusting means, and the squeegee 12 is pressed against the metal mask 13 on the substrate 21 with a desired printing pressure by driving the pressure adjusting means while changing the printing pressure. .

  The load detecting means is a load sensor 41 in the present embodiment, and is arranged to be exposed on the upper surface of the metal mask 13. As will be described later, the load sensor 41 detects a printing pressure applied to the metal mask 13 by the squeegee 12 and transmits detection data to the control means 100.

  The squeegee head 11 is configured to be rotatable about a substantially central portion on the left and right in FIG. 1, and when the squeegee head 11 moves from right to left in FIG. 1, the squeegee 12a. When the squeegee head 11 is rotated in the direction in which the squeegee abuts the metal mask 13, the solder 31 is printed on the substrate 21 by the squeegee 12a, and the squeegee head 11 moves from the left to the right in FIG. The squeegee head 11 is rotated in a direction in which the squeegee 12b contacts the metal mask 13, and the solder 31 is printed on the substrate 21 by the squeegee 12b. That is, since the squeegee 12a and the squeegee 12b have substantially the same configuration and function, the description of the squeegee 12a in the present specification below also applies to the squeegee 12b.

  Next, the operation of the solder printer 10 according to the present invention will be described with reference to FIG. 2A is a schematic side cross-sectional view of the solder printer 10 according to the present invention in a normal printing pressure detection state, and FIG. 2B is a schematic view of the printing pressure detection state when the squeegee 12a is worn. It is side surface sectional drawing.

  When the operator operates the solder printing machine 10, the setting value of the printing pressure of the squeegee 12 (printing pressure of the squeegee 12 necessary for making the filling portion of the solder 31 to have an appropriate film thickness) is input to the input unit 102 in advance. Enter. The set value is transmitted to the control unit 100 and stored in the storage unit in the control unit 100.

FIG. 2 shows a state in which the squeegee head 11 is moved leftward (arrow A direction) by the horizontal driving means 106. Further, it is assumed that the squeegee head 11 is applied with a printing pressure downward (arrow F direction) by the vertical drive means (pressure adjusting means) 108.
As shown in FIGS. 2A and 2B, when the squeegee 12a slides on the metal mask 13 before printing, in the process of passing the portion where the load sensor 41 is disposed on the upper surface of the metal mask 13. The load sensor 41 is in contact with the load sensor 41 and detects the printing pressure by the squeegee 12a.

  The detected printing pressure information is transferred to the control means 100, and it is calculated by the calculation means whether or not the printing pressure is not more than a preset value set in advance by the input means 102. When the printing pressure is less than or equal to a set value, the notification means 104 allows the operator to recognize that the detected printing pressure is less than or equal to the set value by lighting the lamp or displaying the liquid crystal screen. To be notified.

Specifically, when printing pressure is applied to the squeegee head 11 and the squeegee 12a is pressed against the metal mask 13, the edge of the squeegee 12a is not yet worn in the normal state shown in FIG. The area in contact with the metal mask 13 is small, and the printing pressure per unit area applied to the metal mask 13 is large.
On the other hand, as shown in FIG. 2B, when the printing operation by the squeegee 12a is repeatedly performed and the edge portion of the squeegee 12a is worn, the contact area of the edge portion with the metal mask 13 increases. Thus, the printing pressure per unit area applied to the metal mask 13 is smaller than that in the above-described normal state, and the thickness of the printed solder 31 is thicker than that in the normal state.

Therefore, by setting the set value of the printing pressure to a predetermined value between the printing pressure at the normal time and the printing pressure at the time of wear, the detected printing pressure is equal to or less than the set value. It is possible to detect that the squeegee 12 is in a worn state.
That is, in the normal state shown in FIG. 2A, the edge portion of the squeegee 12a is not yet worn, and the printing pressure detected by the load sensor 41 is larger than the set value. It is determined that the edge portion 12a is not worn.
However, as the wear of the edge portion progresses as shown in FIG. 2B due to continuous use of the squeegee 12a, the printing pressure detected by the load sensor 41 gradually decreases, and eventually the setting is performed. Below the value. Thus, when the control means 100 calculates that the detected printing pressure has fallen below the set value, the control means 100 determines that the edge portion of the squeegee 12a is worn, Thus, the notification means 104 displays that the squeegee 12a is worn.
When the operator confirms the display on the notification means 104, the operator can appropriately grasp that the squeegee 12a is in the replacement period, and can replace the squeegee 12a in order to prevent the film thickness of the filled portion of the solder 31 from increasing.

  As described above, the solder printer 10 performs printing on the work of the solder 31 by moving the squeegee 12 while pressing it against the upper surface of the metal mask 13. A load sensor 41 that is provided exposed on the surface and detects the load received by the metal mask 13 from the squeegee 12, and whether the load detected by the load sensor 41 is equal to or less than a predetermined set value set in advance. Computation means 100 for computation, and notification means 104 for notifying when the load detected by the load sensor 41 is equal to or less than the set value as a result of computation by the computation means 100 are provided.

  Thereby, the pressure state of the squeegee 12 can be detected before printing, and the wear state of the squeegee 12 can be grasped. That is, when the operator replaces the squeegee 12 at an appropriate time, a change in the printed film thickness due to deterioration of the squeegee 12 can be suppressed.

[Example 2]
Next, a second embodiment of the solder printer 10 according to the present invention will be described with reference to FIGS. FIG. 3A is a schematic side cross-sectional view of the solder printer 10 according to the present invention in a normal solder filling state, and FIG. 3B is a schematic side cross-sectional view of the solder filling state when the squeegee 12a is worn. is there. In addition, about the solder printer 10 demonstrated in a present Example, about the part which is common in Example 1, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In the present embodiment, when the printing pressure detected by the load sensor 41 is equal to or lower than the set value, the solder printing machine 10 is controlled so that the printing pressure is increased by the vertical driving means (pressure adjusting means) 108. Is done. That is, for example, the printing pressure applied to the squeegee head 11 by a fluid compressor or the like is controlled to be large.

Specifically, since the edge portion of the squeegee 12a is not yet worn at the normal time shown in FIG. 3A, the printing pressure at normal time (arrow F1 shown in FIG. 3A) is applied. The film thickness of the solder 31 is d1.
However, as the wear of the edge portion progresses as shown in FIG. 3B due to continuous use of the squeegee 12a, the printing pressure detected by the load sensor 41 gradually decreases and eventually falls below the set value. . Thus, in the state where the wear of the edge portion has progressed, the film thickness of the solder 31 filled in the metal mask opening portions 13a and 13a becomes larger than the d1.
Therefore, in this case, as described above, the printing pressure (arrow F1) applied to the squeegee head 11 by the vertical driving means (pressure adjusting means) 108 is larger than the printing pressure in the normal state (in FIG. 3B). The vertical driving means (pressure adjusting means) 108 is controlled as indicated by arrow F2). Thus, the metal mask openings 13a and 13a can be filled with the solder 31 so that the film thickness of the solder 31 becomes d1 which is the same as that in the normal state even with the worn squeegee 12a.

  As described above, the solder printer 10 according to the present invention includes the vertical driving means (pressure adjusting means) 108 for adjusting the load applied from the squeegee 12 to the metal mask 13, and the calculation result of the calculation means 100. When the load detected by the load sensor 41 is equal to or less than the set value, the vertical drive means (pressure adjusting means) 108 increases the load.

  Thereby, the film thickness of the filling portion of the solder 31 can be kept constant by automatically controlling the printing pressure of the squeegee 12 in accordance with the degree of wear of the squeegee 12.

The schematic side surface sectional drawing and control block diagram which concern on the solder printer of this invention. (A) is a schematic side cross-sectional view in a normal printing pressure detection state according to the solder printer of the present invention, and (B) is a schematic side cross-sectional view in a printing pressure detection state during squeegee wear. (A) is a schematic side sectional view in a solder filling state in a normal state according to the solder printer of the present invention, and (B) is a schematic side sectional view in a solder filling state during squeegee wear. The schematic side surface sectional drawing of the conventional solder printer. (A) is a schematic side cross-sectional view in a normal solder filling state according to a conventional solder printer, and (B) is a schematic side cross-sectional view in a solder filling state during squeegee wear.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Solder printer 11 Squeegee head 12 Squeegee 13 Metal mask 21 Substrate 22 Substrate guide 31 Solder 41 Load sensor 100 Control means (calculation means)
102 Input means 104 Notification means 106 Horizontal drive means 108 Vertical drive means (pressure adjusting means)

Claims (4)

A solder printer that prints solder paste on a workpiece by moving the squeegee while pressing it against the upper surface of the mask.
A load detecting means that is exposed on the upper surface of the mask and detects a load that the mask receives from the squeegee;
Calculating means for calculating whether or not the load detected by the load detecting means is equal to or less than a predetermined set value set in advance;
As a result of the calculation by the calculation means, a notification means for notifying when the load detected by the load detection means is less than or equal to the set value, is provided.
A solder printer characterized by that. The solder printer includes pressure adjusting means for adjusting a load applied to the mask from the squeegee,
As a result of the calculation by the calculation means, when the load detected by the load detection means is less than or equal to the set value, the load is increased by the pressure adjustment means.
The solder printer according to claim 1. A solder printing method for printing a solder paste on a workpiece by moving the squeegee while pressing it against the upper surface of the mask,
A load detecting step of detecting a load received by the mask from the squeegee on an upper surface of the mask;
A calculation step of calculating whether the load detected in the load detection step is equal to or less than a predetermined set value set in advance;
As a result of the calculation in the calculation step, when the load detected in the load detection step is equal to or less than the set value, a notification step of notifying,
The solder printing method characterized by the above-mentioned. The solder printing method includes:
As a result of the calculation in the calculation step, when the load detected in the load detection step is less than or equal to the set value, the pressure adjustment step of increasing the load applied to the mask from the squeegee is further provided,
The solder printing method according to claim 3, wherein:

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