JP2009139338A - 半導体圧力センサ及びその製造方法、半導体装置並びに電子機器 - Google Patents

半導体圧力センサ及びその製造方法、半導体装置並びに電子機器 Download PDF

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JP2009139338A
JP2009139338A JP2007318884A JP2007318884A JP2009139338A JP 2009139338 A JP2009139338 A JP 2009139338A JP 2007318884 A JP2007318884 A JP 2007318884A JP 2007318884 A JP2007318884 A JP 2007318884A JP 2009139338 A JP2009139338 A JP 2009139338A
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piezoelectric
substrate
pressure sensor
film
semiconductor
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JP2009139338A5 (enrdf_load_stackoverflow
Inventor
Teruo Takizawa
照夫 瀧澤
Makoto Furuhata
誠 古畑
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Seiko Epson Corp
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Seiko Epson Corp
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JP2007318884A 2007-12-10 2007-12-10 半導体圧力センサ及びその製造方法、半導体装置並びに電子機器 Withdrawn JP2009139338A (ja)

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JP2007318884A JP2009139338A (ja) 2007-12-10 2007-12-10 半導体圧力センサ及びその製造方法、半導体装置並びに電子機器

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JP2007318884A JP2009139338A (ja) 2007-12-10 2007-12-10 半導体圧力センサ及びその製造方法、半導体装置並びに電子機器

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JP2009139338A true JP2009139338A (ja) 2009-06-25
JP2009139338A5 JP2009139338A5 (enrdf_load_stackoverflow) 2010-12-24

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2579347A2 (en) 2011-10-04 2013-04-10 Fujifilm Corporation Piezoelectric device and method of manufacturing piezoelectric device
EP2579348A2 (en) 2011-10-04 2013-04-10 Fujifilm Corporation Piezoelectric device, method of manufacturing piezoelectric device, and liquid ejection head
CN109141731A (zh) * 2018-07-26 2019-01-04 西北工业大学 一种可用于水下湍流边界层壁面脉动压力测试的柔性基微传感器及其制造方法
CN112082674A (zh) * 2020-09-25 2020-12-15 长安大学 一种基于正挠曲电效应的土压力测量盒
US20210039946A1 (en) * 2019-08-08 2021-02-11 Rohm Co., Ltd. Mems sensor

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2579347A2 (en) 2011-10-04 2013-04-10 Fujifilm Corporation Piezoelectric device and method of manufacturing piezoelectric device
EP2579348A2 (en) 2011-10-04 2013-04-10 Fujifilm Corporation Piezoelectric device, method of manufacturing piezoelectric device, and liquid ejection head
EP2579347A3 (en) * 2011-10-04 2013-08-28 Fujifilm Corporation Piezoelectric device and method of manufacturing piezoelectric device
EP2579348A3 (en) * 2011-10-04 2013-08-28 Fujifilm Corporation Piezoelectric device, method of manufacturing piezoelectric device, and liquid ejection head
US20130229465A1 (en) * 2011-10-04 2013-09-05 Fujifilm Corporation Piezoelectric device, method of manufacturing piezoelectric device, and liquid ejection head
US8864288B2 (en) 2011-10-04 2014-10-21 Fujifilm Corporation Piezoelectric device, method of manufacturing piezoelectric device, and liquid ejection head
US9136459B2 (en) 2011-10-04 2015-09-15 Fujifilm Corporation Piezoelectric device and method of manufacturing piezoelectric device
CN109141731A (zh) * 2018-07-26 2019-01-04 西北工业大学 一种可用于水下湍流边界层壁面脉动压力测试的柔性基微传感器及其制造方法
US20210039946A1 (en) * 2019-08-08 2021-02-11 Rohm Co., Ltd. Mems sensor
US11643324B2 (en) * 2019-08-08 2023-05-09 Rohm Co., Ltd. MEMS sensor
CN112082674A (zh) * 2020-09-25 2020-12-15 长安大学 一种基于正挠曲电效应的土压力测量盒

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