JP2009138954A - High frequency processing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high frequency processing device capable of shortening a cooking time by improving heating efficiency. <P>SOLUTION: The information is acquired by detecting high frequency reflected power supplied to a heating chamber 8 from power supply portions 7a, 7b of a first high frequency power supply means 1A and returned through a heated object 9, and heating cooking of the heating object 9 is performed while controlling power supply portions 7a to 7d of the first high frequency power supply means 1A and a second high frequency power supply means 1B according to a result of the detection, thus the heating efficiency can be improved. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a high-frequency treatment apparatus including a high-frequency power supply unit that can heat an object to be heated.

  A conventional high-frequency heating device using high frequency is a semiconductor oscillation unit, a distribution unit that divides the output of the oscillation unit into a plurality of units, a plurality of amplification units that amplify the distributed output, and the output of the amplification unit. There is a known combination including a combining unit and a phase shifter provided between the distributing unit and the amplifying unit (see, for example, Patent Document 1).

In the high-frequency heating device described in Patent Document 1 described above, the phase shifter is configured to switch the high-frequency pass line length by the on / off characteristics of the diode. In addition, the synthesis unit can use two 90 degree and 180 degree hybrids, so that the output of the synthesis unit can be made two. By controlling the phase shifter, the power ratio of the two outputs can be changed, or the phase between the two outputs can be changed. Can be in-phase or out-of-phase. In addition, this type of high-frequency heating apparatus generally uses a vacuum tube called a magnetron in a high-frequency generator as represented by a microwave oven.
JP 56-132793 A

  By the way, in recent years, when cooking using a high-frequency heating apparatus, in order to perform desired cooking in a short time without consuming wasteful electric power, improvement in heating efficiency is required.

  The present invention has been made to satisfy the above-described demand, and an object of the present invention is to provide a high-frequency processing apparatus capable of shortening cooking time by improving heating efficiency.

  The high-frequency treatment apparatus of the present invention includes a heating chamber that accommodates an object to be heated, an oscillation unit that generates high-frequency power, a power supply unit that supplies high-frequency power generated in the oscillation unit to the heating chamber, and the heating chamber A first high-frequency power supply means having a power detection unit for detecting high-frequency reflected power returning from the direction toward the oscillation unit, an oscillation unit for generating high-frequency power, and the high-frequency power generated by the oscillation unit in the heating chamber A second high-frequency power supply unit having a power supply unit to be supplied, and a first high-frequency power supply unit and a second high-frequency power supply unit based on a detection signal from a power detection unit of the first high-frequency power supply unit. A high frequency power supplied from at least one power supply unit and / or a control unit for controlling an oscillation frequency, and the high frequency power by the power supply unit of the first high frequency power supply means and the second It is constituted having different directions of excitation field and the excitation magnetic field with the high-frequency power by the power supply unit of the frequency power supply means.

  With this configuration, based on the detection signal from the power detection unit of the first high frequency power supply unit, the high frequency supplied from at least one of the power supply units of the first high frequency power supply unit and the second high frequency power supply unit is optimized. Therefore, the heating efficiency is improved, and the heating time is shortened and uniform heating is possible. Further, since the directions of the excitation electric field and the excitation magnetic field are different between the high-frequency power from the power supply unit of the first high-frequency power supply means and the high-frequency power from the power supply unit of the second high-frequency power supply means, Does not interfere. Since there is no mutual interference between the high frequencies radiated from the first high-frequency power supply means and the second high-frequency power supply means, the direction of the oscillating section is determined via the electromagnetic field distribution in the heating chamber formed by the first high-frequency power supply means and the power supply section. The high frequency radiated from the second high frequency power supply means does not affect the high frequency performance such as the high frequency reflected power to return to. For this reason, the detection in the first high-frequency power supply means can be performed without being affected by the simultaneous heating by the second high-frequency power supply means. Conversely, the high frequency radiated from the first high frequency power supply means does not affect the high frequency performance formed by the second high frequency power supply means. Therefore, the high frequency performance produced by each high frequency power supply means is not deteriorated.

  In the high frequency processing apparatus of the present invention, the first high frequency power supply means includes a plurality of power supply units and power detection units, and the control unit detects from a plurality of power detection units of the first high frequency power supply unit. Based on the signal, the high frequency power and / or oscillation frequency supplied from at least one of the first high frequency power supply means and the second high frequency power supply means, or the power supply section of the first high frequency power supply means The phase of the supplied high frequency is controlled, and the direction of the excitation electric field or excitation magnetic field of the high frequency power by the plurality of power feeding sections of the first high frequency power supply means is made to coincide.

  With this configuration, it is possible to measure the power returning to the power feeding unit that radiates the high frequency and the power transmitted to the other power feeding unit using the plurality of power feeding units and the power detection unit of the first high-frequency power supply unit, Based on the signal, the high frequency supplied from at least one of the first high-frequency power supply means and the second high-frequency power supply means is controlled to an optimum condition, so that the information obtained in the power detection section increases and the accuracy is increased. Therefore, more optimal control can be selected, and more optimal heating performance can be obtained. In addition, since the directions of the excitation electric field or excitation magnetic field of the high-frequency power by the plurality of power supply units of the first high-frequency power supply means are matched, the radiated high frequencies interfere with each other. Since there is mutual interference between multiple radiated high frequencies, by adjusting the oscillation frequency and phase difference, it is possible to adjust the high-frequency performance such as the electromagnetic field distribution in the heating chamber and the high-frequency reflected power that returns to the oscillating unit through the feeding unit .

  In the high frequency processing apparatus of the present invention, the second high frequency power supply unit includes a plurality of power supply units, and further from the heating chamber toward the oscillation unit of the second high frequency power supply unit. A plurality of power detection units for detecting returning high-frequency reflected power are provided, and the control unit detects detection signals from a plurality of power detection units of the first high-frequency power supply unit and a plurality of power detections of the second high-frequency power supply unit. Based on the detection signal from the unit, the high-frequency power and / or the oscillation frequency or phase supplied from at least one of the first high-frequency power supply unit and the second high-frequency power supply unit is controlled, and the first (2) The direction of the excitation electric field or excitation magnetic field of the high-frequency power by the plurality of power supply units of the high-frequency power supply means is made to coincide.

  With this configuration, using the plurality of power feeding units and the power detection unit of the first high frequency power supply unit and the plurality of power feeding units and the power detection unit of the second high frequency power supply unit, power returning to the power feeding unit that radiates the high frequency, The power transmitted to the other power supply unit can be measured, and based on these detection signals, the high frequency supplied from at least one of the first high frequency power supply unit and the second high frequency power supply unit is set to an optimum condition. Since the control is performed, the information obtained in the power detection unit is increased, more accurate estimation can be performed, more optimal control can be selected, and more optimal heating performance can be obtained. In addition, since the directions of the excitation electric field or excitation magnetic field of the high frequency power by the plurality of power supply units of the second high frequency power supply means are matched, the radiated high frequencies interfere with each other. Since there is mutual interference between multiple radiated high frequencies, it is possible to adjust the high frequency performance such as the electromagnetic field distribution in the heating chamber and the high frequency reflected power that returns to the oscillating unit through the power supply unit by adjusting the oscillation frequency and phase difference. .

  Further, in the high frequency processing apparatus of the present invention, the plurality of power feeding units of the first high frequency power supply means are provided on a pair of wall surfaces facing each other in the heating chamber so that the directions of the excitation electric field or the excitation magnetic field coincide with each other. The plurality of power feeding portions of the second high frequency power supply means are different from the wall surface provided with the plurality of power feeding portions of the first high frequency power supply means, and a pair of wall surfaces facing each other, The directions of the excitation magnetic fields coincide with each other and are different from the directions of the excitation electric field and the excitation magnetic field of the plurality of power feeding units of the first high-frequency power supply means.

  With this configuration, the direction of the excitation electric field or the excitation magnetic field for each high-frequency power supply means coincides with the opposing wall surface where the first high-frequency power supply means and the second high-frequency power supply means are different, and between different high-frequency power supply means Since the directions of the excitation electric field and the excitation magnetic field are different from each other, the mutual interference of the high frequencies supplied from the first high frequency power supply means and the second high frequency power supply means is suppressed, and cooking by the first high frequency power supply means is performed. Even when the cooking by the second high-frequency power supply means is performed at the same time, there is little influence on each other and it is possible to ensure the optimal cooking progress.

  In the high-frequency treatment apparatus of the present invention, one of a plurality of power feeding sections of the first high-frequency power supply means and one of the pair of wall surfaces facing each other in the heating chamber and the second high-frequency power supply means And the second of the plurality of power feeding sections of the first high-frequency power supply means on the other of the pair of wall surfaces facing each other in the heating chamber, and the second The other of the plurality of power supply units of the high-frequency power supply means is provided, and the direction of the excitation electric field or excitation magnetic field is made to coincide with each other for each of the first high-frequency power supply means and the second high-frequency power supply means, and The first and second high-frequency power supply means and the second high-frequency power supply means have different excitation electric fields and excitation magnetic field directions.

  With this configuration, one of the first high frequency power supply means and the second high frequency power supply means is provided on one of the opposing wall surfaces, and the first high frequency power supply means and the second high frequency power supply are provided on the other of the opposing wall surfaces. Since the other power supply unit is provided, the power supply units of the first high-frequency power supply unit and the second high-frequency power supply unit are provided on the same opposing wall surface, and the first high-frequency power supply unit and the second high-frequency power supply unit The high-frequency power supply state such as the distribution of each generated electromagnetic field has the same tendency, and heating with a clear pattern of heating intensity such as heating concentrated on the object to be heated is facilitated.

  The present invention controls high-frequency power supplied from at least one of the first high-frequency power supply means and the second high-frequency power supply means based on a detection signal from the power detection section of the first high-frequency power supply means. Therefore, it is possible to provide a high-frequency processing apparatus capable of improving the heating efficiency and shortening the heating time or uniform heating.

Hereinafter, a high frequency processing apparatus according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a configuration diagram of a high-frequency processing device according to a first embodiment of the present invention, FIG. 2A is an explanatory diagram showing a case where the excitation direction by the power feeding unit is the same, and FIG. 2B is an excitation by the power feeding unit. It is explanatory drawing which shows the case where directions differ.

  In FIG. 1, the high frequency generator 1 includes first high frequency power supply means 1A and second high frequency power supply means 1B. The first high-frequency power supply means 1A and the second high-frequency power supply means 1B are respectively composed of oscillation units 2a and 2b configured using semiconductor elements, and power distribution units 3a and 3b that distribute the outputs of the oscillation units 2a and 2b to two. Amplifying units 5a to 5d configured using semiconductor elements that amplify the outputs of the respective power distribution units 3a and 3b, and power feeding units 7a to 7d that radiate high-frequency outputs amplified by the amplifying units 5a to 5d into the heating chamber 8 Have. Also, phase variable units 4a to 4d that are inserted into a high-frequency transmission line connecting the power distribution units 3a and 3b and the amplifiers 5a to 5d and generate an arbitrary phase difference between the input and output, the oscillation units 2a and 2b, and the power feeding unit 7a. To 7d (here, between the amplifying units 5a to 5d and the power feeding units 7a to 7d) are inserted into a high-frequency transmission line that detects power reflected from the power feeding units 7a to 7d. 6d, and a control unit 10 that controls the oscillation frequencies of the oscillation units 2a and 2b and the phase amounts of the phase variable units 4a to 4d in accordance with the reflected power detected by the power detection units 6a to 6d.

  The control unit 10 can control the first high frequency power supply unit 1A and the second high frequency power supply unit 1B independently and separately by controlling the oscillation units 2a and 2b and the phase variable units 4a to 4d. . Note that an operation unit 11 having various switches is connected to the control unit 10, and the user selects a cooking menu through the operation unit 11.

  In addition, the high-frequency processing apparatus of the present embodiment has a heating chamber 8 having a substantially rectangular parallelepiped structure that accommodates an object 9 to be heated. It is composed of an open / close door (not shown) that opens and closes to store the back wall and the object to be heated, and a mounting table on which the object to be heated is placed, and is configured to confine the supplied high frequency inside. Yes.

  The power feeding units 7 a to 7 d that transmit the output of the high frequency generator 1 and radiate the high frequency into the heating chamber 8 are arranged on the wall surface of the heating chamber 8. Here, the first high-frequency power supply means 1A has a pair (plurality) of power feeding portions 7a and 7b arranged at substantially the center of the upper wall surface and the bottom wall surface of the heating chamber 8, respectively. ) Are provided at substantially the center of the left wall surface and the right wall surface of the opposing structure. That is, the power feeding units 7a and 7b of the first high frequency power supply unit 1A and the power feeding units 7c and 7d of the second high frequency power supply unit 1B are provided on different opposing wall surfaces.

  It should be noted that the excitation electric field directions A of the plurality of power feeding units 7a and 7b in the first high frequency power supply unit 1A are the same and are different from the excitation electric field directions B of the power feeding units 7c and 7d in the second high frequency power supply unit 1B. Is arranged. That is, as shown in FIG. 2A, when the excitation electric field direction A of the plurality of power feeding units 7a and 7b in the first high-frequency power supply means 1A is set in the depth direction, for example, the second high-frequency power supply means 1B. The excitation electric field direction B of the power feeding units 7c and 7d is set to the vertical direction, and the excitation electric field directions of the first high frequency power supply means 1A and the second high frequency power supply means 1B are made different.

  In this way, the power supply units 7a and 7b of the first high-frequency power supply unit 1A and the power supply units 7c and 7d of the second high-frequency power supply unit 1B are provided on different opposing wall surfaces, and the high-frequency power radiated from each power supply unit The direction of the excitation electric field or the excitation magnetic field is made to coincide with each other for the high-frequency power supply means, and further different between the different high-frequency power supply means, so that heating under the optimum conditions by the first high-frequency power supply means 1A and the second high-frequency power supply means Even if the heating under the optimum conditions by the supply means 1B is performed simultaneously, the influence of mutual interference can be suppressed, and the optimum finished cooking expected by each of the high-frequency power supply means can be performed. Moreover, since the first high frequency power supply means and the second high frequency power supply means are provided on the opposing wall surfaces and the high frequency is supplied from the four wall surfaces, cooking can be performed evenly.

  The amplifying units 5a to 5d constitute a circuit with a conductor pattern formed on one surface of a dielectric substrate made of a low dielectric loss material, and each semiconductor is operated in order to operate a semiconductor element that is an amplifying element of each amplifying unit satisfactorily. Matching circuits are arranged on the input side and output side of the element, respectively. The high-frequency transmission line connecting each functional block forms a transmission circuit having a characteristic impedance of about 50Ω by a conductor pattern provided on one side of the dielectric substrate.

  The power distribution units 3a and 3b may be in-phase distributors that do not cause a phase difference between outputs such as Wilkinson type distributors, or may have a phase difference between outputs such as branch line type or rat race type. It may be the resulting distributor. The power distribution units 3a and 3b transmit substantially half of the high frequency power input from the oscillation units 2a and 2b to the respective outputs.

  Further, the phase variable sections 4a to 4d are configured by using variable capacitance elements whose capacitance changes according to the applied voltage, and each phase variable range is a range from 0 degrees to about 180 degrees. As a result, the phase difference of the high-frequency power output from the phase varying units 4a to 4d can be controlled in the range of 0 to ± 180 degrees.

  The power detection units 6a to 6d extract high-frequency reflected power that returns from the heating chamber 8 side through the power feeding units 7a to 7d in the direction of the oscillation units 2a and 2b. The power coupling degree is, for example, about 40 dB. An amount of power that is approximately 1/10000 of the reflected power is extracted. The power signals are rectified by a detection diode (not shown), smoothed by a capacitor (not shown), and the output signal is input to the control unit 10.

  Based on the heating information obtained from the heating condition of the article 9 to be heated or the heating state of the article 9 to be heated and the detection information detected by the power detectors 6a to 6d, the controller 10 directly inputs the user. The driving power supplied to each of the oscillators 2a and 2b and the amplifiers 5a to 5d, which are constituent elements of the high frequency generator, and the voltage supplied to the phase variable parts 4a to 4d are controlled and stored in the heating chamber 8. The heated object 9 thus heated is optimally heated.

  Further, the high frequency generator 1 is provided with a heat radiating means (not shown) that mainly radiates heat generated by the semiconductor elements provided in the amplifiers 5a to 5d.

About the high frequency processing apparatus comprised as mentioned above, the operation | movement and an effect | action are demonstrated below.
First, the object to be heated 9 is stored in the heating chamber 8, the heating condition is input from the operation unit 11, and the heating start key is pressed. In response to the control output signal of the controller 10 that has received the heating start signal, the high frequency generator 1 starts its operation. The control means 10 operates a drive power supply (not shown) to supply power to the oscillation units 2a and 2b. At this time, the initial oscillation frequency of the oscillation units 2a and 2b is supplied with a voltage signal set to 2400 MHz, for example, and oscillation starts.

When the oscillating units 2a and 2b are operated, their outputs are distributed approximately ½ each by the power distributing units 3a and 3b, and become four high-frequency power signals. Thereafter, the drive power supply is controlled to operate the amplifying units 5a to 5d.
Then, the respective high frequency power signals are output to the power feeding units 7 a to 7 d through the amplifying units 5 a to 5 d and the power detection units 6 a to 6 d operating in parallel, and are radiated into the heating chamber 8. At this time, the amplifying units 5a to 5d each output high-frequency power of less than 100 W, for example, 50 W.

  When 100% of the high-frequency power supplied into the heating chamber 8 is absorbed by the object 9 to be heated, the high-frequency reflected power from the heating chamber 8 becomes 0 W. In practice, however, the type, shape, amount, High-frequency reflected power reflected from the heating chamber 8 side toward the oscillating units 2a and 2b through the power feeding units 7a to 7d due to a mismatch between the impedance determined by the heating chamber 8 including the heated object and the output impedance of the high-frequency generating unit 1 Occurs. The power detectors 6a to 6d detect the high-frequency reflected power and detect a signal proportional to the amount of power. The control unit 10 that receives the detection signal oscillates the high-frequency reflected power at a minimum value. Select frequency and phase difference.

  The control unit 10 detects the high frequency reflected power with the power detection units 6a to 6d while changing the oscillation frequency of the oscillation units 2a and 2b from 2400 MHz to 2500 MHz which is the upper limit of the frequency variable range at a 1 MHz pitch, for example. Information on the oscillation frequency that minimizes the reflected power is obtained. Similarly, the control unit 10 detects the high-frequency reflected power by the power detection units 6a to 6d while changing the phase difference generated by the phase variable units 4a to 4d from 0 degrees, thereby reducing the phase difference that minimizes the high-frequency reflected power. get information.

  Since the directions of the excitation electric field or the excitation magnetic field are the same for each of the first high frequency power supply means 1A and the second high frequency power supply means 1B, the high frequency supplied by the combination of the power feeding units 7a and 7b and 7c and 7d is used. Mutual interference occurs between the two high-frequency power supply units 1A and 1B, and the electromagnetic field distribution in the heating chamber 8 generated by each of the high-frequency power supply units 1A and 1B and the high frequency to each of the high-frequency power supply units 1A and 1B. The reflected power is affected and fluctuates.

  Further, since the directions of the excitation electric field and the excitation magnetic field are different between the first high-frequency power supply means 1A and the second high-frequency power supply means 1B, the influence of mutual interference is suppressed between the two high-frequency power supply means, and the first Heating can be performed independently under the optimum conditions of the high-frequency power supply means 1A and the second high-frequency power supply means 1B.

  The control unit 10 controls the oscillation frequency of the oscillation units 2a and 2b and the phase difference of the phase variable units 4a to 4d where the high frequency reflected power is minimized, and obtains an output corresponding to the input heating condition. To be controlled. Thereby, each amplification part 5a-5d outputs predetermined high frequency electric power, respectively. Each output is transmitted to the power feeding units 7 a to 7 d and radiated into the heating chamber 8.

By operating in this way, it is possible to start heating under the condition that the high-frequency reflected power is minimized even for objects to be heated having various shapes, sizes, and amounts, and the amplifiers 5a to 5d are provided. The semiconductor element can be prevented from excessively generating heat due to the high-frequency reflected power, and thermal destruction can be avoided.
In the above description, the example in which two phase variable units are inserted has been described. However, the phase change width is set to 0 degree to 360 degrees by inserting only one of the outputs of the power distribution unit 3a. You can also

  Further, the first and second high-frequency power supply means are respectively provided with power supply units, the directions of the high-frequency excitation electric field or excitation magnetic field radiated from the respective power supply units to the heating chamber are the same, and the control unit is the first Based on the detection signal from each power detection unit of the second high frequency power supply unit, the high frequency supplied from the power supply unit of the first high frequency power supply unit and the second high frequency power supply unit is controlled independently. However, the high-frequency control may be one of the first and second high-frequency power supply means, and the power detection unit is provided only in one of the high-frequency power supply means, and both high-frequency power supply means are detected by the detection signal. Or the high frequency power supply means having a plurality of power supply sections may be controlled, or the power supply section of one of the high frequency power supply means may simply supply a high frequency as one. In the range Is a further possible.

  As described above, according to the control method of the high-frequency processing apparatus described above, the first high-frequency power supply means 1A and the second high-frequency power supply means 1B are supplied to the heating chamber 8 from the power feeding units 7a to 7d and return via the object 9 to be heated. Information is obtained by detecting the incoming high-frequency reflected power, and the control unit 10 controls the power supply units 7a to 7d of the first high-frequency power supply means 1A and the second high-frequency power supply means 1B according to the detection result. Since the cooking of the article to be heated 9 is performed under the condition that minimizes the heating, the heating efficiency can be improved. At this time, the control unit 10 can independently control the first high-frequency power supply means 1A and the second high-frequency power supply means 1B independently, and the first high-frequency power supply means 1A and the second high-frequency power supply means 1B. Since there is little mutual interference between the two, there is no effect on the respective heating, so based on the detected information, the first high-frequency power supply means 1A and the second high-frequency power supply means 1B are controlled under their optimum conditions, Efficient cooking can be performed.

Next, a method for controlling the above-described high frequency processing apparatus will be described.
FIG. 3 is a flowchart showing the overall flow of the control method of the high-frequency processing apparatus, FIG. 4 is a flowchart showing the flow of determination of operating conditions in the power feeding unit, FIG. 5 is a flowchart showing the flow of detection operation, and FIG. FIG. 7 is a flowchart showing a flow of judgment of the cooking progress state, and FIG. 8 is a flowchart showing a flow of changing operating conditions.

  In this method of controlling the high-frequency processing apparatus, the high-frequency reflected power returning from the heating chamber 8 through the object to be heated 9 is detected by the power detection units 6a and 6b of the first high-frequency power supply means 1A. By independently controlling the power feeding units 7a to 7d of the first high-frequency power supply means 1A and / or the second high-frequency power supply means 1B based on the reflected power, the high-frequency power is supplied to the heating chamber 8 for cooking. Do. The high-frequency reflected power is different from the high-frequency reflected power that is reflected from the high-frequency radiation radiated from the power supply unit 7 a to the heating chamber 8 through the heated object 9 to the same power supply unit 7 a and the heated object 9. The transmitted high-frequency power transmitted to the power feeding unit 7b is meant.

  As shown in FIG. 3, when cooking of the article 9 to be heated is started (step SS), the door provided on the front surface of the heating chamber 8 is closed from the open state, or the key input by the operation plate 11 is performed. If there is none, the monitoring is continued. On the other hand, when the door is closed from the open state, the high-frequency power is supplied into the heating chamber 8 using the power feeding units 7a and 7b of the first high-frequency power supply means 1A, and the high frequency returned through the object 9 to be heated. The reflected power is detected and detected by the power detection units 6a and 6b, and a detection signal is transmitted to the control unit 10 (step S102). At this time, the excitation directions of the high-frequency power supplied from the power feeding units 7a and 7b to the heating chamber 8 are matched (see FIG. 2A). Note that FIG. 2B shows an example where the excitation directions do not match. Further, detection is performed by setting a minimum electric power necessary for detection or a predetermined small electric power and changing the frequency to obtain frequency characteristic information. In addition, the power detection units 6a and 6b detect both the high-frequency power transmitted through the object to be heated 9 and the high-frequency power reflected from the object to be heated 9 as high-frequency reflected power.

  The control unit 10 determines the presence or absence of the object 9 to be heated from the detection signals from the power detection units 6a and 6b (step S103), and when it is determined that there is no object 9 to be heated, the control unit 10 returns to the beginning. When it is determined that there is the article 9 to be heated, the control unit 10 determines a heat treatment condition (first operation condition) by the second high-frequency power supply unit 1B (step S104). In addition, also when it is judged that there existed key input in step S101, heat processing conditions are determined similarly.

In determining the heat treatment conditions, as shown in FIG. 4, the control unit 10 uses the power feeding units 7 c and 7 d of the second high-frequency power supply unit 1 </ b> B provided on the left and right wall surfaces facing the heating chamber 8 to reduce power. Are simultaneously operated (step S201), and the operating frequency and phase are determined (step S202).
In determining the operating frequency and phase, first, the frequency is determined by searching for a value that minimizes the reflected power while varying the operating frequency. Next, the phase is determined by searching for a value that minimizes the reflected power while varying the phase difference between the power feeding units 7c and 7d.

  After a certain time has elapsed after the frequency and phase are determined (step S203), the setting condition is cleared (step S106), and the process returns to the beginning (see FIG. 3). If the menu key on the operation panel 11 is selected before the fixed time has elapsed (step S204), it is determined whether the selected menu is compatible with the detected operating condition (step S205). If they are not compatible, the conditions are reviewed (step S206), and the process returns to step S202 to determine the operating frequency and phase. If it is determined in step S205 that the selection menu and the operating condition are compatible, the determination of the first operating condition is terminated (step SE).

Referring to FIG. 3 again, when the first operating condition is determined in step S104, monitoring is performed until a predetermined time elapses (step S105), and the setting condition is cleared when the predetermined time elapses (step S106). Return to the beginning. If there is an input of the start key of the operation panel 11 before the fixed time has elapsed (step S107), cooking is started under the set conditions (step S108).
That is, the control unit 10 starts cooking by controlling the power supply units 7c and 7d of the second high-frequency power supply unit 1B according to the determined first operating condition (step S109), and supplies power to the first high-frequency power supply unit 1A. The units 7a and 7b are controlled to perform detection (step S110).

  In the detection, as shown in FIG. 5, the control unit 10 continuously performs cooking based on the above-described operating conditions by the power supply units 7 c and 7 d of the second high-frequency power supply unit 1 </ b> B (step S <b> 301). Detection is performed by operating a plurality (two in this case) of power supply units 7a and 7b of one high-frequency power supply unit 1A (step S302). The detection is performed by changing the frequency of the high frequency power supplied from the power supply units 7a and 7b and the phase difference between the power supply units 7a and 7b, and the high frequency reflected power is detected by the power detection units 6a and 6b. 10 is transmitted. It is determined whether or not the menu requires specific detection such as thawing (step S303). If the menu is not necessary, the detection ends (step SE31), and the process returns to step S110. When specific detection is required, the control unit 10 performs detection using the plurality of power supply units 7a and 7b of the first high-frequency power supply unit 1A (step S304). At this time, the operation is performed with a phase having an intentional radio wave distribution, the specific load portion of the article 9 to be heated is detected, and the process returns to step S110.

FIG. 6 shows another detection operation. That is, as described above with reference to FIG. 5, the control unit 10 continuously performs cooking by using the power supply units 7 c and 7 d of the second high-frequency power supply unit 1 </ b> B based on the operation conditions described above (step S <b> 301). Then, the operating frequency is varied using one power supply unit 7a (or 7b), and detection is performed using the reflected high-frequency power to itself and the transmitted high-frequency power to another power supply unit 7b (or 7a) (step) S305). Then, it is determined whether necessary information has been collected (step S306). When it is determined that the necessary information has not been collected, the power feeding units 7a and 7b are switched (step S307), and the process returns to step S305 to perform detection. On the other hand, if the necessary information is available, the detection ends (step SE32) and the process returns to step S110.
Note that either one of the detection operations described in FIGS. 5 and 6 can be used, but both can be used together.

  Referring to FIG. 3 again, after performing the above-described detection in step S110, if there is other detection means such as an infrared sensor, detection information is obtained from these detection means (step S111), and the previous detection result And the progress of cooking is determined (step S112).

  As shown in FIG. 7, in determining the progress of cooking, the control unit 10 controls the power supply units 7c and 7d of the second high-frequency power supply unit 1B to continue cooking under designated operating conditions (step S401). Then, detection information by detection is acquired (step S402). The detection information includes the frequency and phase characteristics of the high-frequency reflected power supplied from the power supply units 7a and 7b of the first high-frequency power supply unit 1A and detected by the power detection units 6a and 6b, and the temperature of other detection units used in combination. There is information such as humidity.

  The control unit 10 obtains the temperature rise and the fluctuation of the power absorption amount from the obtained detection information, and determines the presence or absence of the heated object 9 as a load (step S403). When it is determined that there is no object 9 to be heated, a display indicating that the object to be heated 9 is completed is displayed (step S404), the cooking is completed, and the determination of the cooking progress state is terminated. The process returns to step S112 (step SE41). On the other hand, if it is determined in step 403 that there is an object 9 to be heated, it is determined whether or not the detection result corresponds to the end of the previously selected selection menu (step S405), and the selection menu ends. When it is determined that the cooking has been completed, the cooking is completed, the cooking progress state is determined, and the process returns to step S112 (step SE41). In addition, when it is not recognized that the selection menu ends in step 405, it is determined whether or not the upper limit of the heating time of the selection menu is exceeded (step S406), and when it is determined that the upper limit time is exceeded, It memorize | stores that cooking was complete | finished, complete | finishes determination of the progress state of cooking, and returns to step S112 (step SE41). On the other hand, if it is not determined in step S406 that the upper limit time has been exceeded, the continuation of cooking is stored and the process returns to step S112 (step SE42).

  Returning to FIG. 3, when it is determined that cooking is completed in the determination of the cooking progress state in step S <b> 112, cooking is ended (step SE). On the other hand, when it is determined that cooking is continued in the determination of the cooking progress state in step S112, it is determined whether or not the operating condition needs to be changed (step S113). Returning to S110, detection is performed again. If it is determined in step S113 that the operating condition needs to be changed, the operating condition is changed as follows (step S114).

  In changing the operating condition, as shown in FIG. 8, the corresponding operating condition is determined from the sequence of the selection menu and the progress determination result (step S501). It is determined whether or not the operating condition corresponds to the progress status (step S502). If it is determined that the operating condition corresponds, the power supply units 7c and 7d and the power detection unit 6c of the second high-frequency power supply unit 1B are determined. , 6d is used to determine whether the high-frequency reflected power from the object to be heated 9 has increased (step S503). If the high-frequency reflected power is not increased, it is stored that there is no change in the operating condition, and the process returns to step S110 through step S113 to perform detection (step SE51).

  On the other hand, if it is determined in step S502 that the operating condition does not correspond to the progress, the operating condition is changed in accordance with the sequence of the selection menu (step S504), and the operating frequency and phase are reviewed (step S504). S505). Also, when it is determined in step S503 that the high-frequency reflected power has increased as a result of detection by the second high-frequency power supply means 1B, the operating frequency and phase are reviewed (step S505). In the review, first, the frequency is determined by searching for a value that minimizes the high-frequency reflected power (reflected power) while changing the operating frequency. Next, the phase is determined by searching for a value that minimizes the high-frequency reflected power while varying the phase difference between the power feeding units.

  Subsequently, the heating operation condition is changed (step S506). The heating operation condition is changed using the power supply units 7a to 7d of the first high-frequency power supply unit 1A and the second high-frequency power supply unit 1B, and the operation frequency, the phase difference between the power supply units, and the operation thermal power are determined. The change of the condition is finished (step SE52), and the process returns to step S113.

  Returning to FIG. 3, when it is determined that the operating condition does not need to be changed, the process returns to step S <b> 110 and detection is performed again. On the other hand, when the operating condition is changed (step S114), the process returns to step 109 to start heating.

As described above, according to the control method of the high-frequency processing apparatus described above, the high-frequency reflected power supplied to the heating chamber 8 from the power feeding units 7a and 7b of the first high-frequency power supply means 1A and returned through the object to be heated 9 is detected. Thus, information is obtained, and the control unit 10 controls the power supply units 7a to 7d of the first high-frequency power supply unit 1A and the second high-frequency power supply unit 1B according to the detection result to perform cooking of the article 9 to be heated. Therefore, the heating efficiency can be improved. At this time, since the control unit 10 can independently control the first high-frequency power supply unit 1A and the second high-frequency power supply unit 1B independently, based on the information detected by the first high-frequency power supply unit 1A. The first high frequency power supply means 1A and the second high frequency power supply means 1B can be controlled to perform efficient cooking. In this case, when the detection is performed by the first high-frequency power supply unit 1A, cooking by the second high-frequency power supply unit 1B may be stopped, but may be continued.
In addition, the first high frequency power supply means cooks the first high frequency power supply means so that the high frequency frequency by the power supply section of the first high frequency power supply means is different from the high frequency frequency of the second high frequency power supply means. It is desirable to perform accurate detection by the high frequency power supply means.

Next, a second embodiment of the high-frequency processing device according to the present invention will be described.
FIG. 9 is a block diagram showing a high frequency processing apparatus according to the second embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the site | part which is common in the high frequency processing apparatus concerning 1st Embodiment mentioned above, and the overlapping description is abbreviate | omitted.

  As shown in FIG. 9, the high frequency processing apparatus according to the second embodiment has a power feeding section 7a in the first high frequency power supply means 1A on one (left wall surface) of a pair of opposing wall surfaces in the heating chamber 8. 7b and one of the power supply portions 7c and 7d (7c) in the second supplier 1B are provided, and the other of the pair of wall surfaces facing each other in the heating chamber 8 (right The wall surface is provided with the other one of the power supply portions 7a and 7b in the first high frequency power supply means 1A (7b) and the other of the power supply portions 7c and 7d in the second high frequency power supply means 1B (7d). Yes. That is, the power supply portions 7a and 7b of the first high-frequency power supply means 1A and the power supply portions 7c and 7d of the second high-frequency power supply means 1B are provided on the same opposing wall surface.

  Even if comprised in this way, the effect similar to the case of 1st Embodiment mentioned above can be acquired.

  The high-frequency processing apparatus of the present invention is not limited to the above-described embodiments, and appropriate modifications and improvements can be made.

  Further, the arrangement of the power feeding portions 7a to 7d is not restricted in the case shown in FIGS. 1 and 9 described above, and a plurality of power feeding portions may be provided on any one of the wall surfaces. A pair of adjacent power supply units such as a bottom wall surface may be configured. For example, the power supply unit in the first high-frequency power supply unit and the power supply unit in the second high-frequency power supply unit can be provided on the same wall surface in the heating chamber, respectively. As a result, since the power supply unit of the first high-frequency power supply unit and the power supply unit of the second high-frequency power supply unit are all provided on the same wall surface of the heating chamber, the wiring and structure are simplified.

  Moreover, although the 1st high frequency electric power supply means 1A was mainly used for detection and the 2nd high frequency electric power supply means 1B was mainly used for cooking, it is not limited to this. For example, the second high frequency power supply means 1B is mainly used for detection and the first high frequency power supply means is mainly used for cooking so that an optimum heating pattern can be obtained according to the progress of cooking or the object 9 to be heated. You can also

  As described above, the high-frequency processing apparatus according to the present invention obtains information by detecting the high-frequency reflected power supplied to the heating chamber from the power feeding unit of the first high-frequency power supply means and returning through the object to be heated. Since the cooking of the object to be heated is performed by controlling the power feeding unit of the first high-frequency power supply means or the second high-frequency power supply means according to the detection result, the heating efficiency can be improved. It is useful as a high-frequency processing apparatus that detects an object to be heated and cooks the object to be heated based on the detection result.

The block diagram of the high frequency processing apparatus in the 1st Embodiment of this invention (A) is explanatory drawing which shows the case where the excitation direction by a feed part is the same, (B) is explanatory drawing which shows the case where the excitation direction by a feed part differs Flow chart showing overall flow of control method of high-frequency processing apparatus Flow chart showing the flow of determination of operating conditions in the power feeding unit Flow chart showing the flow of detection operation Flow chart showing an example of detection operation deployment Flow chart showing flow of determination of cooking progress Flow chart showing the flow of changing operating conditions The block diagram of the high frequency processing apparatus in the 2nd Embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1A 1st high frequency electric power supply means 1B 2nd high frequency electric power supply means 2a, 2b Oscillation part 6a-6d Electric power detection part 7a-7d Feeding part 8 Heating chamber 9 To-be-heated object 10 Control part

Claims (5)

A heating chamber for storing an object to be heated;
An oscillating unit that generates high-frequency power, a power supply unit that supplies high-frequency power generated by the oscillating unit to the heating chamber, and a power detection unit that detects high-frequency reflected power returning from the heating chamber toward the oscillating unit. First high frequency power supply means comprising:
A second high-frequency power supply means comprising: an oscillating unit that generates high-frequency power; and a power supply unit that supplies the high-frequency power generated by the oscillating unit into the heating chamber;
Based on a detection signal from a power detection unit of the first high-frequency power supply unit, high-frequency power and / or oscillation supplied from at least one power supply unit of the first high-frequency power supply unit and the second high-frequency power supply unit A control unit for controlling the frequency,
A high frequency processing apparatus in which the directions of the excitation electric field and the excitation magnetic field are different between the high frequency power from the power supply unit of the first high frequency power supply means and the high frequency power from the power supply unit of the second high frequency power supply means. There are a plurality of power supply units and power detection units of the first high-frequency power supply means,
The control unit is supplied from at least one of the first high frequency power supply unit and the second high frequency power supply unit based on detection signals from a plurality of power detection units of the first high frequency power supply unit. Controlling the phase of the high frequency power and / or the oscillation frequency or the high frequency supplied from the power supply unit of the first high frequency power supply means,
The high frequency processing apparatus according to claim 1, wherein directions of an excitation electric field or an excitation magnetic field of the high frequency power by the plurality of power feeding units of the first high frequency power supply unit are matched. The second high frequency power supply means has a plurality of power supply sections, and the second high frequency power supply means further detects a high frequency reflected power returning from the heating chamber toward the oscillation section of the second high frequency power supply means. Provide a detector,
The control unit is configured to supply the first high-frequency power supply based on detection signals from a plurality of power detection units of the first high-frequency power supply unit and detection signals from a plurality of power detection units of the second high-frequency power supply unit. High frequency power and / or oscillation frequency or phase supplied from at least one of the power supply means of the means and the second high frequency power supply means,
The high frequency processing apparatus according to claim 2, wherein directions of an excitation electric field or an excitation magnetic field of the high frequency power by the plurality of power feeding units of the second high frequency power supply unit are matched. A plurality of power feeding portions of the first high-frequency power supply means are provided on a pair of wall surfaces facing each other in the heating chamber so that the directions of the excitation electric field or the excitation magnetic field coincide with each other,
The plurality of power feeding portions of the second high frequency power supply means are different from the wall surface provided with the plurality of power feeding portions of the first high frequency power supply means, and a pair of wall surfaces facing each other, The high frequency processing apparatus according to claim 3, wherein the directions of the excitation magnetic fields coincide with each other and are different from the directions of the excitation electric field and the excitation magnetic field of the plurality of power feeding units of the first high frequency power supply unit. One of a plurality of power supply portions of the first high-frequency power supply means and one of a plurality of power supply portions of the second high-frequency power supply means on one of a pair of opposing wall surfaces in the heating chamber Is provided,
The other of the plurality of power feeding sections of the first high frequency power supply means and the other of the plurality of power feeding sections of the second high frequency power supply means on the other of the pair of wall surfaces facing each other in the heating chamber Is provided,
Further, the direction of the excitation electric field or the excitation magnetic field is made to coincide for each of the first high-frequency power supply means and the second high-frequency power supply means, and excitation is performed between the first high-frequency power supply means and the second high-frequency power supply means. The high frequency processing apparatus according to claim 3, wherein the directions of the electric field and the excitation magnetic field are different.

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