JP2009137002A5 - - Google Patents

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Publication number
JP2009137002A5
JP2009137002A5 JP2008266367A JP2008266367A JP2009137002A5 JP 2009137002 A5 JP2009137002 A5 JP 2009137002A5 JP 2008266367 A JP2008266367 A JP 2008266367A JP 2008266367 A JP2008266367 A JP 2008266367A JP 2009137002 A5 JP2009137002 A5 JP 2009137002A5
Authority
JP
Japan
Prior art keywords
strip
void
substrates
voids
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008266367A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009137002A (ja
Filing date
Publication date
Priority claimed from FR0707213A external-priority patent/FR2922203B1/fr
Application filed filed Critical
Publication of JP2009137002A publication Critical patent/JP2009137002A/ja
Publication of JP2009137002A5 publication Critical patent/JP2009137002A5/ja
Pending legal-status Critical Current

Links

JP2008266367A 2007-10-15 2008-10-15 穿孔されたシール・ストリップを有する構造体を製造する方法およびこの方法により得られる構造体 Pending JP2009137002A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0707213A FR2922203B1 (fr) 2007-10-15 2007-10-15 Procede de realisation d'une structure ayant un cordon de scellement ajoure et structure obtenue.

Publications (2)

Publication Number Publication Date
JP2009137002A JP2009137002A (ja) 2009-06-25
JP2009137002A5 true JP2009137002A5 (OSRAM) 2011-11-24

Family

ID=39487232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008266367A Pending JP2009137002A (ja) 2007-10-15 2008-10-15 穿孔されたシール・ストリップを有する構造体を製造する方法およびこの方法により得られる構造体

Country Status (4)

Country Link
US (1) US8112882B2 (OSRAM)
EP (1) EP2050713B1 (OSRAM)
JP (1) JP2009137002A (OSRAM)
FR (1) FR2922203B1 (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4942671B2 (ja) * 2008-01-24 2012-05-30 株式会社フジクラ 半導体装置およびその製造方法
DE102009029180B4 (de) * 2009-09-03 2017-07-20 Robert Bosch Gmbh Mikrosystem
US9102517B2 (en) 2012-08-22 2015-08-11 International Business Machines Corporation Semiconductor structures provided within a cavity and related design structures
CN103395736B (zh) * 2013-08-09 2015-12-09 杭州士兰集成电路有限公司 Mems玻璃浆料键合结构及其制造方法
US20190202684A1 (en) * 2017-12-29 2019-07-04 Texas Instruments Incorporated Protective bondline control structure
US12384861B2 (en) 2020-06-24 2025-08-12 Dow Global Technologies Llc Crosslinked compositions from olefin/silane interpolymers
CN114824148A (zh) * 2021-01-29 2022-07-29 上海和辉光电股份有限公司 一种oled封装结构及其制备方法和应用

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5837935A (en) * 1996-02-26 1998-11-17 Ford Motor Company Hermetic seal for an electronic component having a secondary chamber
US6428650B1 (en) * 1998-06-23 2002-08-06 Amerasia International Technology, Inc. Cover for an optical device and method for making same
US6136128A (en) * 1998-06-23 2000-10-24 Amerasia International Technology, Inc. Method of making an adhesive preform lid for electronic devices
WO2000044497A1 (en) * 1999-01-29 2000-08-03 Genomic Instrumentation Services, Inc. Pipetter
KR100347436B1 (ko) * 1999-12-16 2002-08-03 엘지.필립스 엘시디 주식회사 액정 표시장치의 씰 패턴 형성방법 및 그 방법에 의해제조된 씰 패턴
US6589625B1 (en) * 2001-08-01 2003-07-08 Iridigm Display Corporation Hermetic seal and method to create the same
US6791660B1 (en) * 2002-02-12 2004-09-14 Seiko Epson Corporation Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances
JP4069639B2 (ja) * 2002-02-12 2008-04-02 セイコーエプソン株式会社 電気光学装置の製造方法
DE102004027501A1 (de) 2004-06-04 2005-12-22 Robert Bosch Gmbh Mikromechanisches Bauelement mit mehreren Kavernen und Herstellungsverfahren
US20060076634A1 (en) * 2004-09-27 2006-04-13 Lauren Palmateer Method and system for packaging MEMS devices with incorporated getter
US20060076631A1 (en) * 2004-09-27 2006-04-13 Lauren Palmateer Method and system for providing MEMS device package with secondary seal
FR2901639B1 (fr) * 2006-05-24 2008-08-22 Commissariat Energie Atomique Micro-composant integre associant les fonctions de recuperation et de stockage de l'energie

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