JP2009135369A - Substrate for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for mounting electronic components, correcting the inclination of a mounting surface and an error in height in measurement of mounting position accuracy after mounting the electronic component. <P>SOLUTION: The substrate 1 for mounting electric components has land groups 3-9 which are different in shape and size and used for mounting electric components. Height reference marks 83 each having a reference surface related to the height of the surface of each of the lands 81 are additionally provided on at least a part of the land groups such as bump-attached component land groups 8. Thus, the inclination of a mounting surface or an error in height is corrected in mounting position measurement after mounting the electronic components. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component mounting board on which electronic components are mounted.

  A mounting substrate used for an electronic device is manufactured by mounting an electronic component on a substrate manufactured for mounting an electronic component by an electronic component mounting apparatus. The electronic component mounting board is provided with a plurality of lands for soldering the terminals of the electronic parts and the connection leads, and a dedicated board is manufactured for each product type of the mounting board. In addition to a dedicated board used as an actual product as described above, there is an evaluation board used for function evaluation of an electronic component mounting apparatus. This evaluation board demonstrates the device functions, such as whether the electronic component mounting device that holds the electronic components by the mounting head and transports them to the substrate is functioning normally, and how much mounting position accuracy is ensured. Used to confirm. For example, during the final inspection performed at the factory of the device manufacturer at the time of shipment, the adjustment performed by the user, the confirmation inspection after repair, etc., actual electronic components or dedicated dummy components manufactured for inspection are used as evaluation boards. The device functions such as mounting position accuracy are evaluated by actually mounting and measuring the mounting position and mounting posture with a measuring device using image recognition, displacement detection by laser light, and the like (see Patent Documents 1 and 2).

In Patent Document 1, a jig work is mounted on a glass jig board on which a board-side mark is provided in advance by a component mounter, and the board-side mark and the jig work are imaged with a camera after mounting, so that the X direction and the Y direction are obtained. An example of measuring the amount of deviation in the Θ direction is shown. Further, Patent Document 2 shows an example of height measurement performed when the three-dimensional positional accuracy of a part is included as an item to be measured.
JP-A-2005-317806 JP 2003-247810 A

  By the way, in recent years, the mounting accuracy required for component mounting work has become increasingly sophisticated, and in addition to the two-dimensional position measurement that has been the main body of the conventional mounting accuracy measurement, there is a need for a technique for accurately measuring the three-dimensional position of a component. It has become. For this reason, an electronic component mounting apparatus or a mounting inspection apparatus that includes a three-dimensional sensor for measuring mounting accuracy three-dimensionally is used. Thereby, the shape of the electronic component mounted on the substrate can be detected three-dimensionally, and the mounting position accuracy including the inclination of the component posture can be detected more precisely.

  However, in the case of targeting a substrate having a flexible characteristic such as a thin resin substrate, the component mounting accuracy on the substrate is not necessarily detected correctly only by three-dimensionally detecting the outer shape of the mounted electronic component. Must not. That is, when the board itself is bent and the flatness and height of the mounting surface are not properly maintained, the detected external data of the electronic component represents the three-dimensional position of the component on the mounting surface. It does not become correct position data, but gives incorrect information for the mounting surface inclination and height error.

  Accordingly, an object of the present invention is to provide an electronic component mounting board capable of correcting a mounting surface inclination and height error in mounting position accuracy measurement after mounting the electronic component.

  An electronic component mounting board according to the present invention is an electronic component mounting board used in an electronic component mounting apparatus in which an electronic component is held by a mounting head and mounted on the board, and a plurality of land groups having different shapes and sizes are used. Further, at least a part of the land group is provided with a height reference mark having a height reference plane associated with the height of the surface of the land constituting the land group. .

  According to the present invention, in an electronic component mounting substrate in which lands having different shapes and sizes for mounting electronic components are formed, the height associated with the height of the land surface is at least part of the lands. By providing a height reference mark having a reference surface, the inclination and height error of the mounting surface can be corrected in mounting position accuracy measurement after mounting the electronic component.

(Embodiment 1)
FIG. 1 is a plan view showing an overall configuration of an electronic component mounting board according to the first embodiment of the present invention, and FIG. 2 is a land layout for package type components on the electronic component mounting board according to the first embodiment of the present invention. It is explanatory drawing of height reference mark arrangement | positioning.

  First, with reference to FIG. 1, the overall configuration of a substrate 1 for mounting electronic components will be described. The substrate 1 is an electronic component mounting substrate used in an electronic component mounting apparatus that holds an electronic component by a mounting head and mounts the electronic component on the substrate. A plurality of land groups having different shapes and sizes are formed on the substrate 1 according to the type of electronic component to be mounted.

  That is, the substrate 1 includes a deformed part land group 3, a multi-pin QFP land group 4, a narrow adjacent land group 5, a small chip part land group 6, a chip part land group 7, a bumped part land group 8 and a QFP part land group. 9 is arranged.

  The odd-shaped component land group 3 includes a plurality of pairs of lands 31 that are paired, and an evaluation mounting operation for deformed components such as connectors is performed on each pair of lands 31. Height reference marks 32 for height measurement are provided at diagonal positions in a rectangular area that encloses each pair of lands 31, and the three-dimensional mounting accuracy of electronic components mounted on the deformed component land group 3 When performing the measurement, the height reference mark 32 is used as a reference height position indicating the height of the upper surface of the substrate in the substrate region.

  The multi-pin QFP land group 4 is intended for a large package component such as a multi-pin type QFP. The multi-pin QFP land group 4 includes a land row 4a arranged in a rectangular shape corresponding to each lead row, and each land row 4a has a plurality of lands 41 arranged in accordance with the lead arrangement pitch of the electronic component. Composed. Furthermore, the multi-pin QFP land group 4 includes recognition marks 42 for position recognition arranged at diagonal positions. The narrow adjacent land group 5 is a micro component land 51 for a micro component or a narrow adjacent land 52 for narrow adjacent mounting.

  The chip component land group 6 and the chip component land group 7 include a plurality of pairs of lands 61 and 71, respectively, and evaluation of chip-type electronic components such as capacitors and resistors for each pair of lands 61 and 71. Implementation operation is performed. The bump-equipped component land group 8 is intended for bumped components (see the bumped component 84 shown in FIG. 2) having bonding bumps on the lower surface, and is used for bump bonding provided in a frame-like arrangement. A plurality of lands 81, a recognition mark 82 for position recognition, and a height reference mark 83 for height measurement are provided. The QFP component land group 9 is intended for a large package component such as QFP as in the multi-pin QFP land group 4. The QFP component land group 9 includes a land row 9 a arranged in a rectangular shape corresponding to each lead row, and each land row 9 a includes a plurality of lands 91.

  Next, the configuration and function of the bump-equipped component land group 8 in the substrate 1 will be described with reference to FIG. In FIG. 2, a bump-equipped land land group 8 for a bumped component includes a plurality of bump bonding lands 81 provided in a frame-like arrangement, a recognition mark 82 for position detection of the bump-equipped component land group 8, and A height reference mark 83 for height measurement is provided separately from the recognition mark 82. On the bump-equipped component land group 8, a bump-equipped component 84 having a lower surface provided with a bump 84a is test-mounted.

  The height reference mark 83 is used as a height reference for the upper surface of the substrate 1 in the vicinity of the bump-equipped component land group 8, and the wiring film 1a such as a copper foil adhered to the upper surface of the substrate 1 is etched. In the patterning process for forming the land 81 and the recognition mark 82, the wiring film 1a is partially left together with these lands. Therefore, the upper surface of the height reference mark 83 can be used as a height reference surface associated with the height of the surface of the land 81 to which the bump is bonded. That is, at least a part of the land group on the substrate 1 is provided with a height reference mark 83 having a height reference plane associated with the height of the surface of the land 81 constituting the land group.

  In the mounting state inspection performed after mounting the electronic component on the substrate 1, the upper surface of the height reference mark 83 is measured together with the three-dimensional shape measurement (arrow c) of the bumped component 84 mounted on the bumped component land group 8. The target height measurement (arrow d) is also performed. As a result, the three-dimensional shape of the bumped component 84 can be obtained as the relative height h with respect to the upper surface of the height reference mark 83 as the height reference surface of the substrate 1. As a result, even if the target substrate 1 has a flexible characteristic such as a thin resin substrate and the substrate 1 is warped and deformed, the mounting surface inclination and height error are corrected. It is possible to measure the three-dimensional component mounting accuracy with high accuracy. The height reference mark 32 in the odd-shaped part land group 3 has a similar function.

(Embodiment 2)
FIG. 3 is a plan view showing the overall configuration of the evaluation substrate according to the second embodiment of the present invention, FIG. 4 is an explanatory view of the evaluation mounting operation on the evaluation substrate according to the second embodiment of the present invention, and FIG. FIG. 6 is an explanatory diagram of land adjacent arrangement patterns on the evaluation substrate according to the second embodiment of the present invention, and FIG. 7 is a second embodiment of the present invention. FIG. 8 is an explanatory diagram of the land layout and height reference mark layout for package type components on the evaluation board according to the second embodiment of the present invention.

  The second embodiment shows an embodiment in which the electronic component mounting substrate 1 in the first embodiment is an evaluation substrate 1A used for test mounting performed for functional evaluation of the electronic component mounting apparatus. It is. First, the overall configuration of the evaluation substrate 1A will be described with reference to FIG. The evaluation substrate 1A is made of resin, and in an electronic component mounting apparatus in which electronic components are held by a mounting head and mounted on the substrate, functions of the apparatus, such as mounting position accuracy and mounting operation tact time, are actually mounted. This is a dedicated board used to evaluate items for which results are obtained by executing work operations.

  The evaluation substrate 1A is formed with a plurality of land groups for joining components having different shapes and sizes in order to cover as wide as possible the types of electronic components to be mounted in the normal mounting substrate manufacturing process. . The present embodiment includes at least a highly versatile type such as a chip-type electronic component having a solder bonding terminal and a package-type electronic component having a solder bonding lead among these component types. A plurality of land groups are formed for performing an evaluation mounting operation for each of a plurality of types of electronic components.

  The evaluation substrate 1A is divided into a first quadrant [1], a second quadrant [2], a second quadrant [3], and a fourth quadrant [4] by XY coordinates with the center point as the origin O. A land group described below is formed in the quadrant. In the first quadrant [1], a cross mount land group 2, a deformed component land group 3, a multi-pin QFP land group 4, and a narrow adjacent land group 5 are arranged. The narrow adjacent land group 5 is formed across the fourth quadrant [4].

  The cross mount land group 2 has a cross-shaped configuration in which a plurality of component-specific land groups 2a in which land rows corresponding to leads of package-type electronic components are arranged in a rectangular shape are arranged adjacent to each other. The land row of each component land group 2a is configured by arranging a plurality of lands 21 in rows in accordance with the lead arrangement pitch of electronic components. In the mounting operation for evaluation, one package-type electronic component is test-mounted with respect to each component land group 2a.

  The odd-shaped part land group 3 and the multi-pin QFP land group 4 have the same configuration as the odd-shaped part land group 3 and the multi-pin QFP land group 4 shown in the first embodiment, and thus description thereof is omitted. In the narrow adjacent land group 5, the micro component land 51 for the evaluation mounting operation targeting the micro component and the narrow adjacent land 52 for the narrow adjacent mounting are arranged in one area as an arrangement close to each other. Arranged. In the example shown in the second embodiment, the narrow adjacent land group 5 is arranged in the central region of the evaluation substrate 1A.

  In the second quadrant [2], a chip part land group 6, a chip part land group 7, a bumped part land group 8, and a QFP part land group 9 are arranged. The chip part land group 6, the chip part land group 7 and the QFP part land group 9 have the same configuration as that of the first embodiment, and a description thereof will be omitted here. The bump-equipped component land group 8 is intended for a bumped component in which bonding bumps are provided on the lower surface shown in the first embodiment, and includes a plurality of bump bonding lands 81 provided in a frame-like arrangement. The configuration includes a recognition mark 82 for position recognition and a height reference mark 83 for height measurement. The QFP component land group 9 is intended for a large package component such as QFP as in the multi-pin QFP land group 4. The QFP component land group 9 includes a land row 9 a arranged in a rectangular shape corresponding to each lead row, and each land row 9 a includes a plurality of lands 91.

  In the third quadrant [3] and the fourth quadrant [4], land groups similar to the first quadrant [1] and the second quadrant [2] are formed, respectively. That is, in the third quadrant [3], the cross-mount land group 2, the deformed component land group 3, the multi-pin QFP land group 4 and the narrow adjacent land group 5 are in the first quadrant [1] with respect to the origin O. It is arranged in point symmetry with the group. Similarly, in the fourth quadrant [4], the chip component land group 6, the chip component land group 7, the bump-equipped component land group 8, and the QFP component land group 9 are in the second quadrant [2] with respect to the origin O. It is arranged in point symmetry with the group.

  That is, a plurality of land groups having the same configuration and shape are formed on the evaluation substrate 1A by two in a point-symmetric arrangement with respect to the origin O. As a result, it is possible to easily and easily evaluate the rotational position accuracy of the component mounting mechanism that involves the rotational operation of the nozzle that sucks and holds the electronic component. For example, the same type of electronic component (for example, an electronic component mounted on the multi-pin QFP land group 4 in the first quadrant [1] and the third quadrant [3]) using the evaluation substrate 1A shown in the present embodiment. When the test mounting is performed for the evaluation, the evaluation mounting operation as shown in FIG. 2 is performed.

In this case, electronic components are mounted on two mounting points P1 (x1, y1) and P2 (-x1, -y1) that are point-symmetrical positions in the first quadrant [1] and the third quadrant [3]. To do. First, the electronic component is mounted in a specified mounting direction (arrow a direction) with the mounting point P1 (x1, y1) as a target. Next, the electronic component is mounted in a specified mounting direction (arrow a direction) with the mounting point P2 (-x1, -y1) as a target.

  In these two mounting operations for evaluation, the mounting head moving mechanism is controlled using two data x1 and y1 for plane position control, and the mounting direction (arrow a) at the mounting point P1 is changed to the mounting point P2. In order to reverse the mounting direction (arrow b), the nozzle rotation mechanism is commanded to rotate 180 °. As a result, a mounting position accuracy evaluation result in the case of 180 ° rotation in which the largest rotation error is likely to occur in the nozzle rotation operation can be obtained. That is, in this case, the rotational position accuracy can be easily and easily evaluated only by observing how much the angle error occurs with respect to the orthogonal axis (XY axis) in the mounting direction of the electronic component after mounting. Is possible.

  Next, with reference to FIG. 3, the arrangement | positioning form of the narrow adjacent land group 5 in the board | substrate 1A for evaluation is demonstrated. As shown in FIG. 5A, the narrow adjacent land group 5 is disposed in a central region R set including the center point of the evaluation substrate 1A. In the present embodiment, a mounting operation for evaluation is performed for package-type electronic components such as the cross mount land group 2, the multi-pin QFP land group 4, the bump-equipped component land group 8, the QFP component land group 9, and the like. The land group is arranged so as to avoid the vicinity of the central portion of the evaluation substrate 1A. That is, the central region R corresponds to a position sandwiched between lands for performing an evaluation mounting operation for such a package-type electronic component, and the central region R thus set includes Narrow adjacent land groups for performing an evaluation mounting operation for a narrow adjacent mounting pattern in which minute parts are arranged and mounted at a narrow pitch are arranged.

  Narrow adjacent mounting patterns in which minute parts are arranged with a narrow pitch are mounted, so it is difficult to perform observation work for evaluating positional accuracy after mounting. However, as shown in the present embodiment, by selecting the central region R in the vicinity of the center of the evaluation substrate 1A as the arrangement region of such narrow adjacent land groups 5, the workability of the evaluation work after mounting is improved. It is possible to improve. In addition, as a standard of the range of the center area | region R in the evaluation board | substrate 1 appropriate for such a purpose, the long side dimension A and the short side dimension of the rectangular-shaped evaluation board | substrate 1 shown in FIG.3 (b) are shown. The ratio of a and b of the rectangular central region R to B is preferably set to a range of 0.1 to 0.9, and more preferably 0.7 to 0.85 for a / A. . Further, b / B is preferably set to 0.05 or more and 0.5 or less, and more preferably 0.1 to 0.2 or less. In addition, these numerical ranges are a standard of a suitable range, Comprising: It is not necessarily limited to these numerical ranges.

  Next, the configuration of the cross mount land group 2 on the evaluation substrate 1A and the evaluation mounting operation executed for the cross mount land group 2 will be described with reference to FIGS. The cross-mount land group 2 includes package-type electronic components such as QFP-type components having connecting leads extending outward from each side of a resin mold having a rectangular outer shape in plan view at a predetermined arrangement pitch. This is a group of lands dedicated to the target mounting evaluation operation.

  In the present embodiment, the land layout pattern of the cross-mount land group 2 is a land layout in which a mounting evaluation operation can be performed using a mounting pattern in which the above-described five electronic components are arranged adjacently in a cross shape. It has become. The mounting pattern shown here is a mounting pattern in which one electronic component located at the center and four electronic components adjacent to each side of the electronic component are adjacent to each other. The land arrangement pattern in the cross mount land group 2 is an adjacent arrangement pattern in which land groups of individual parts are adjacent to each other in correspondence with such a mounting pattern.

The configuration of the cross mount land group 2 will be described. In FIG. 6, the component-specific land group 2a constituting the cross-mount land group 2 indicates a land group provided corresponding to one electronic component, and the component-specific land group 2a extends from each side of the electronic component. The land rows 2b provided in a row corresponding to the leads to be read are arranged in a rectangular shape. In the cross mount land group 2, the land row 2b * of the component-specific land group 2a * located in the center of the cross arrangement is provided with the land row 2b of the adjacent component-specific land group 2a overlapping in the same area. . By overlapping the land row 2b * and the land row 2b in the same area, an overlapping arrangement land row 2c in which the two land rows are arranged in an overlapping manner is formed. In the overlappingly arranged land row 2c, the land 21 * belonging to the component-specific land group 2a * is located in the middle of the arrangement pitch p of the lands 21 belonging to the adjacent component-specific land group 2a, that is, at the midpoint p / 2.

  That is, in the state where the electronic component is test-mounted on the cross mount land group 2, as shown in FIG. 7, the electronic component 22 * mounted on the component-specific land group 2a * is paired with the electronic component as shown in FIG. 22 is mounted on the adjacent land group 2a. The paired electronic component 22 *, two land rows 2b * and land rows 2b corresponding to a plurality of leads 23 * and 23 respectively extending from two opposite sides of the electronic component 22 with a predetermined arrangement pitch p. Form the overlapping arrangement land row 2c overlapping the same area as described above. In the overlapping arrangement land row 2c, the lead 23 * of one electronic component 22 * is arranged in the middle of the arrangement pitch of the leads 23 of the other electronic component 22, and is overlapped in the same area. .

  That is, as shown in FIG. 7, the adjacent arrangement pattern shown by the cross mount land group 2 in the present embodiment has a plurality of plural extending respectively from the two opposite sides of the paired electronic components at a predetermined arrangement pitch. The two land rows arranged in a row corresponding to the leads are the same, with the land corresponding to the lead of one electronic component positioned in the middle of the arrangement pitch of the lands corresponding to the leads of the other electronic component. It has the form which has the overlapping arrangement | positioning land row | line | column provided in the area overlappingly.

  The overlap-arranged land row 2c includes four other electronic components adjacent to each other in four directions with the four sides of the component-specific land group 2a * located at the center, that is, one electronic component 22 * located at the center of the cross array. 22 are provided respectively. Of these four overlappingly arranged land rows 2c, adjacent two overlappingly arranged land rows 2c are arranged orthogonal to each other as shown in FIG.

  Next, with reference to FIG. 7, the evaluation mounting operation executed for the cross mount land group 2 will be described. In this evaluation mounting operation, first, the electronic component 22 * is test-mounted on the component-specific land group 2a * shown in FIG. 6 with the mounting point MP * as the target position. Next, the electronic component 22 (1) is test-mounted on the component-specific land group 2a adjacent to the right side of the component-specific land group 2a * with the mounting point MP1 as a target position. At this time, the mounting point MP1 is set to be offset in the Y direction by Δy equal to p / 2 of the arrangement pitch p of the leads 23 with respect to the mounting point MP *, and the mounting position accuracy in the test mounting is good. The lead 23 of the electronic component 22 (1) is correctly positioned in the middle of the lead 23 * of the electronic component 22 *. On the other hand, if the mounting position accuracy is poor for some reason, the lead 23 of the electronic component 22 (1) is not positioned correctly in the middle of the lead 23 * of the electronic component 22 *, and the defective state is easily observed by visual observation. Can be confirmed.

Thereafter, the electronic component 22 (2) is test-mounted on the component-specific land group 2a * adjacent to the component-specific land group 2a * with the mounting point MP2 as a target position. Here, a nozzle Θ-axis rotation operation for rotating the suction nozzle holding the electronic component 22 (2) by 90 ° is executed. At this time, the mounting point MP2 is set with respect to the mounting point MP * by being offset in the X direction by Δx equal to p / 2 of the arrangement pitch p of the leads 23, and the mounting position accuracy in the test mounting is the nozzle Θ-axis. If the rotational positioning accuracy is satisfactory, the lead 23 of the electronic component 22 (2) is correctly positioned in the middle of the lead 23 * of the electronic component 22 *. On the other hand, if the mounting position accuracy is poor for some reason, the lead 23 of the electronic component 22 (2) is not positioned correctly in the middle of the lead 23 * of the electronic component 22 *, and the defective state is easily observed by visual observation. Can be confirmed.

  In the above embodiment, five electronic components are arranged in a cross shape, and are formed by an electronic component 23 * located at the center and four electronic components 23 adjacent to each side of the electronic component 23 *. Although an example is shown in which mounting patterns having a pair of adjacent relations and land adjacent arrangement patterns corresponding to these adjacent relations are provided, the present invention is not limited to such mounting patterns. That is, a mounting pattern in which only one pair of electronic components is combined may be used as long as the mounting pattern can perform an evaluation mounting operation in which the leads 23 separated by a narrow arrangement pitch p are alternately aligned. A mounting pattern in which a plurality of pairs of electronic components are adjacent to each other in a form other than a cross arrangement may be used. At this time, the rotation positioning accuracy of the nozzle Θ-axis is evaluated as described above by adopting a mounting pattern in which two adjacent overlapping arrangement land rows 2c out of the plurality of overlapping arrangement land rows 2c are orthogonal to each other. It can be done easily.

  Next, the configuration and function of the bump-equipped component land group 8 in the evaluation substrate 1A will be described with reference to FIG. In FIG. 8, a bump-equipped land land group 8 for a bumped component includes a plurality of bump bonding lands 81 provided in a frame-like arrangement, a recognition mark 82 for position detection of the bump-equipped component land group 8, and A height reference mark 83 for height measurement is provided separately from the recognition mark 82. On the bump-equipped component land group 8, a bump-equipped component 84 having a lower surface provided with a bump 84a is test-mounted.

  A reference reference line 85 is provided at a position offset outward by a predetermined dimension from the outline of the bumped component 84 in a state where it is mounted at the correct position. The reference reference line 85 visually observes whether or not the bumped component 84 is in a correct position in a state where the bumped component 84 is test-mounted on the bumped component land group 8 and the upper side of the land 81 is covered. It is provided for reference. If the bump-equipped component 84 that has been test-mounted is positioned at a uniform interval with respect to the reference reference line 85, it is determined that the component is mounted at the correct position.

  The height reference mark 83 is used as a height reference of the upper surface of the evaluation substrate 1A in the vicinity of the bump-equipped component land group 8, and is a wiring film such as a copper foil adhered to the upper surface of the evaluation substrate 1A. In the patterning process of forming the land 81 and the recognition mark 82 by etching 1a, the wiring film 1a is partially left together with these lands. Therefore, the upper surface of the height reference mark 83 can be used as a height reference surface associated with the height of the surface of the land 81 to which the bump is bonded. That is, at least a part of the land group on the evaluation substrate 1A is provided with a height reference mark 83 having a height reference surface associated with the height of the surface of the land 81 constituting the land group. .

  In the evaluation mounting operation in which the bump-equipped component 84 is test-mounted on the bump-equipped component land group 8, the height of the bump-equipped component 84 with respect to the upper surface of the height reference mark 83 is measured together with the three-dimensional shape measurement (arrow c). Measurement (arrow d) is also performed. Thereby, the three-dimensional shape of the bumped component 84 can be obtained as the relative height h with respect to the upper surface of the height reference mark 83 as the height reference surface of the evaluation substrate 1A. As a result, even if the target evaluation substrate 1A has a flexible characteristic, such as a thin resin substrate, and the evaluation substrate 1A is warped, the mounting surface tilt or height error It is possible to measure the three-dimensional component mounting accuracy with high accuracy. The height reference mark 32 in the odd-shaped part land group 3 has a similar function.

  As described above, in the second embodiment, a shape for performing an evaluation mounting operation for each of a plurality of types of electronic components including at least a chip-type electronic component and a package-type electronic component on the evaluation substrate. By forming a plurality of land groups having different sizes, it is possible to realize an evaluation substrate excellent in multi-product compatibility.

  Also, as a land arrangement pattern for mounting package-type electronic components, by providing overlapping arrangement land rows in which lands corresponding to leads provided on opposite sides of adjacent electronic components are overlapped in the same area In addition, it is possible to visually confirm the mounting position accuracy, and among the land groups, a narrow adjacent land group in which minute parts are arranged at a narrow pitch is subjected to an evaluation mounting operation for a plurality of package type electronic components. By disposing in the center region sandwiched between the lands for the purpose, it is possible to mount a micro component requiring high measurement accuracy on the center of the substrate that is easy to perform measurement work, and to realize an evaluation substrate with excellent usability.

  The substrate for mounting electronic components of the present invention has a mounting surface inclination and height error in the mounting position accuracy measurement after mounting the electronic components, and further in the evaluation mounting operation for the purpose of evaluating the function of the electronic component mounting apparatus. It has the advantage that it can be corrected, and can be used in the field of manufacturing a mounting board by mounting electronic components on the board.

The top view which shows the whole structure of the board | substrate for electronic component mounting of Embodiment 1 of this invention Explanatory drawing of land arrangement | positioning and height reference mark arrangement | positioning for package type components in the board | substrate for electronic component mounting of Embodiment 1 of this invention The top view which shows the whole structure of the board | substrate for evaluation of Embodiment 2 of this invention Explanatory drawing of the mounting operation | movement for evaluation in the board | substrate for evaluation of Embodiment 2 of this invention Explanatory drawing of land arrangement in evaluation board of Embodiment 2 of the present invention Explanatory drawing of the adjacent arrangement pattern of the land in the board | substrate for evaluation of Embodiment 2 of this invention Explanatory drawing of evaluation component mounting operation in the evaluation board of Embodiment 2 of the present invention Explanatory drawing of land arrangement | positioning and height reference mark arrangement | positioning for package type components in the evaluation board | substrate of Embodiment 2 of this invention

Explanation of symbols

1 Board 1A Evaluation Board 2 Cross-mount Land Group 2a Land Group by Part 2b Land Line 2c Overlapping Arranged Land Line 3 Deformed Land Group 4 Multi-Pin QFP Land Group 5 Narrow Adjacent Land Group 6, 7 Chip Component Land Group 8 With Bump Component land group 9 QFP component land group 21, 31, 41, 51, 61, 71, 81, 91 Land 22, 22 * Electronic component 23, 23 * Lead 32, 83 Height reference mark 42, 82 Recognition mark 84 With bump parts

Claims (3)

An electronic component mounting substrate used in an electronic component mounting apparatus that holds an electronic component by a mounting head and mounts the electronic component on the substrate,
A plurality of land groups having different shapes and sizes are formed, and at least a part of the land groups has a height reference surface having a height reference surface associated with the height of the surface of the land constituting the land group. A board for mounting an electronic component, wherein a mark is provided along with the mark.   2. The electronic component mounting board according to claim 1, wherein the height reference mark is formed by partially leaving a wiring film forming the land.   3. The electronic component mounting substrate according to claim 1, wherein the height reference mark is provided separately from a recognition mark provided for detecting the position of the land group. .

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