JP2009135263A - Optical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that there is the possibility of the flowing of a light-transmitting adhesive through an electrode section and an adhesion on the surface of the electrode section and there is the possibility of the generation of a peeling on an interface between a light-transmitting board material and a light-shielding sealer or the light-transmitting adhesive in an optical device bonding the light-transmitting board material with an optical device element through the light-transmitting adhesive. <P>SOLUTION: In the optical device, a weir section 9 is fitted between a light-receiving section 6 and the electrode section 7 on the top face of the optical device element 2. The weir section 9 inhibits an outflow to the electrode section 7 of the light-transmitting adhesive 8. The width of the upper section 19 of the weir section 9 is narrowed towards the upper sections, and the front end 19a of the upper section 19 is brought into contact with the underside of the light-transmitting board material 3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an optical device device provided in a digital still camera or the like, and more particularly to a solid-state imaging device.

  In the field of optical device devices, research and development have been extensively conducted on techniques for achieving high sensitivity, and many proposals from package structures have been seen in recent years. In particular, instead of the conventionally used hollow package structure, a direct-bonding package structure in which a light-transmitting adhesive is directly applied to a light-receiving portion of an optical device element and a light-transmitting plate material is bonded has been proposed.

  FIG. 11 is a cross-sectional view showing a conventional direct attachment package structure.

  In the directly attached package structure, the optical device element 32 is bonded to the package substrate 31 via an adhesive 42 and is sealed with a light blocking sealant 44. The translucent plate 33 is bonded to the light receiving part 36 of the optical device element 32 through a translucent adhesive 38. External lead terminals 34 and internal lead terminals 35 are electrically connected to the package substrate 31, and the internal lead terminals 35 are electrically connected to electrode portions 37 of the optical device element 32 through gold wires 43. Has been.

  The advantage of the directly attached package structure as shown in FIG. 11 is that by selecting a material with a small difference in refractive index among the three members of the translucent plate 33, the translucent adhesive 38, and the optical device element 32, It is possible to reduce the reflection component of light at each boundary and increase the sensitivity of the optical device device.

  On the other hand, the following can be said as one of the problems of the direct attachment package structure. An electrode part 37 is provided on the periphery of the upper surface of the optical device element 32 with respect to the light receiving part 36. However, when a light-transmitting adhesive 38 is applied to the light receiving part 36 or when the light-transmitting adhesive 38 is applied. When the translucent plate material 33 is pasted on the agent 38, the translucent adhesive 38 flows out to the electrode portion 37 and adheres to the surface of the electrode portion 37, and the electrode portion 37 and the gold in the subsequent wire bonding step. There is a risk of causing poor contact with the wire 43.

  Therefore, in Patent Document 1, as shown in FIG. 12, a dam portion 39 is provided between the light receiving portion 36 and the electrode portion 37 so that the translucent adhesive 38 applied to the light receiving portion 36 does not flow into the electrode portion 37. The dam portion 39 is dammed up. Further, the translucent plate 33 is brought into contact with and attached to the weir 39 so that the distance 48 between the light receiving unit 36 and the translucent plate 33 is kept constant, that is, the thickness of the translucent adhesive 38 is kept constant. Thus, it is possible to obtain uniform and good light transmission characteristics over the entire surface of the light receiving section 36.

  Another problem with the direct-bonding package structure is that stress occurs due to the difference in thermal expansion of the constituent materials, resulting in peeling at the interface and destruction in severe cases.

Therefore, in Patent Document 2, in the hollow package structure as shown in FIG. 13, a buffer part 50 is provided between the translucent plate member 33 and the light-shielding sealant 44, and the buffer part 50 absorbs the thermal expansion difference. ing.
JP 2007-150266 A JP 2007-141957 A

  By the way, in recent years, the optical device apparatus tends to reduce the light receiving area per pixel as the size and thickness of the optical device apparatus are reduced. Thus, in order to increase sensitivity, it is very effective to adopt a directly attached package structure having a dam portion as in Patent Document 1, but it is light-shielding sealing as compared with a translucent plate material that is a constituent material. Since the thermal expansion coefficient of the adhesive and the translucent adhesive is large, internal stress is generated by the subsequent application of heat (for example, a temperature of about 260 ° C. is reached in the reflow process for mounting on the user board). There is a problem that separation occurs at the interface, and as a result, bubbles are generated that cause image quality abnormalities.

  The reason why an image quality abnormality is caused when bubbles are generated will be described. FIG. 14 is a cross-sectional view showing a state in which bubbles 60 are generated in the vicinity of the dam portion 39 in the direct bonding package having the dam portion 39 of Patent Document 1. The light receiving unit 36 needs to receive the oblique light 40 incident at the incident angle α. However, if the bubble 60 exists inside the translucent adhesive 38 until the oblique light 40 reaches the light receiving unit 36, the bubble 60 is present. As a result, the oblique light 40 is reflected and does not reach the light receiving portion 36, resulting in a pixel defect.

  In order to suppress the generation of the bubbles 60, it is preferable to suppress the generation of internal stress in the heat application step. Therefore, the mechanism for generating the internal stress will be described with reference to FIG.

  First, a mechanism in which stress is generated between the translucent plate material 33 and the light blocking sealant 44 will be described. As shown in FIG. 11, the translucent plate member 33 is attached on the light receiving portion 36 of the optical device element 32 via a translucent adhesive 38. A light-blocking sealant 44 is formed around the translucent plate 33 by transfer molding or the like. The thermal expansion coefficient of the light-blocking sealant 44 is about one hundred times that of the translucent plate 33.

  That is, when the optical device apparatus is subjected to heat application in the reflow process of the user or the like, the light-transmitting plate member 33 and the light-blocking sealant 44 are expanded or contracted. As a result, the light-transmitting plate member 33 is sealed. The internal stress is generated in the horizontal direction by being pulled or compressed by the stopper 44. Thereby, the translucent plate material 33 and the light-shielding sealant 44 reach the strain limit, and peeling occurs at the interface between the translucent plate material 33 and the light-shielding sealant 44 or the translucent plate material 33 is destroyed. In some cases.

  Secondly, a mechanism for generating stress between the translucent plate 33 and the translucent adhesive 38 will be described. The coefficient of thermal expansion of the translucent adhesive 38 is about 100 times that of the translucent plate 33, and when heat is applied, the translucent plate 33 and the translucent adhesive 38 are expanded or contracted. The optical plate 33 is pulled or compressed by the translucent adhesive 38, and stress is generated in the bending direction 51 as shown in FIG. As a result, peeling occurs at the interface between the translucent plate 33 and the translucent adhesive 38 at the end of the translucent plate 33, that is, in the vicinity of the dam portion 39 where the translucent adhesive 38 suddenly becomes thin. Or, when the stress is large, the translucent plate 33 may be broken.

  Furthermore, since the thermal expansion coefficient of the translucent adhesive 38 is much larger than that of the translucent plate 33, the translucent adhesive 38 is more outward than the translucent plate 33 when heat is applied. The stress that tends to stretch increases. However, the translucent adhesive 38 cannot extend outward because of the weir 39, and stress concentration occurs in the vicinity of the weir 39.

  Here, the height of the dam portion 39 is usually about 10 μm, and the thickness of the translucent adhesive 38 between the light receiving portion 36 and the translucent plate member 33 is equal to the height of the dam portion 39. However, since the translucent adhesive 38 of several hundreds of thin films exists also on the weir part 39, the thickness of the translucent adhesive 38 is extremely thin at this location. Therefore, the stress is likely to be locally concentrated at the portion where the thickness of the translucent adhesive 38 changes rapidly from 10 μm to several hundreds of centimeters. The stress concentration in the bending direction 51 causes the translucent adhesive from the translucent plate 33. The agent 38 may be peeled off.

  As described above, in the optical device device disclosed in Patent Document 1, the difference in thermal expansion of the constituent materials cannot be eliminated. Therefore, in consideration of using the buffer portion 50 as in the technique described in Patent Document 2, it is necessary to provide the buffer portion 50 between the translucent plate 33 and the translucent adhesive 38. The buffer 50 must be provided also in the light receiving area. Therefore, the necessary condition for the buffer 50 is translucency, the refractive index is almost equal to that of the translucent plate 33 and the translucent adhesive 38, and has a Young's modulus of about 0.1 to 10 GPa. In addition, the resin material must have a thermal expansion coefficient substantially equal to that of the translucent plate 33 and the translucent adhesive 38, but it is difficult to satisfy all of the above conditions using existing organic materials. Therefore, it is considered difficult to eliminate the difference in thermal expansion of the constituent materials using the buffer portion 50 described in Patent Document 2.

  Further, when the buffer 50 is newly provided between the translucent plate member 33 and the translucent adhesive 38, the distance between the translucent plate member 33 and the light-shielding sealant 44 is increased. Therefore, it is difficult to obtain an optical device having excellent optical performance. In addition, since the distance between the light-transmitting plate member 33 and the light-shielding sealant 44 is increased, the thickness of the optical device device is increased, which causes another problem that the recent needs cannot be met.

  Furthermore, it is necessary to apply the buffer 50 to the translucent plate 33 in advance with a uniform thickness, and an additional step for applying the buffer 50 to the translucent plate 33 is added. This leads to an increased risk of image defects due to dust adhesion, which is a serious defect in the optical device apparatus.

  The present invention has been made in view of such points, and an object of the present invention is to provide an electrode in which a translucent adhesive flows from a light receiving portion to an electrode portion during manufacturing of an optical device device in a directly attached package structure. It is possible to suppress the adhesion to the surface of the part and to prevent the occurrence of peeling at the interface between the translucent plate and the light-shielding sealant or translucent adhesive.

  In the optical device device according to the present invention, a light receiving portion and an electrode portion are provided on the upper surface of the optical device element, and a light transmissive plate material is bonded to the light receiving portion via a light transmissive adhesive, Are electrically connected to terminals of the package substrate. Further, on the upper surface of the optical device element, a dam portion is provided between the light receiving portion and the electrode portion to suppress the translucent adhesive from flowing out to the electrode portion. The weir portion has an upper portion that becomes narrower as it goes upward, and the tip of the upper portion is in contact with the lower surface of the translucent adhesive.

  With the above configuration, it is possible to prevent the light-transmitting adhesive from adhering to the surface of the electrode part during the manufacture of the optical device device.

  Further, since the light-transmitting adhesive gradually becomes thinner from the light receiving portion toward the weir portion, it is possible to suppress stress from being concentrated in one place when the melted light-transmitting adhesive is solidified.

  The inventors of the present application consider the following as differences between Patent Documents 1 and 2 and the present invention.

  Patent Document 1 has a description that the shape of the side surface of the weir portion in the cross section is a curve. However, in the example of Patent Document 1, the shape of the side surface of the weir part in the cross section is curved in order to avoid stress concentration at the location where the thickness of the translucent adhesive changes rapidly as in the present invention. Instead, in order to prevent the translucent adhesive from flowing into the electrode part, the shape of the side surface of the weir part in the cross section is curved. That is, Patent Document 1 does not aim to relieve stress due to the difference in thermal expansion of the constituent materials, and Patent Document 1 discloses that a light-transmitting plate and a light-transmitting adhesive or light-shielding seal are formed as a result of stress concentration. There is no description regarding the occurrence of peeling at the interface with the stopper and the destruction of the translucent plate.

  Moreover, in patent document 1, since the cross-sectional shape of a dam part is not only a rectangle but the expression that it may be a curve, it is an effective solution with respect to the problem peculiar to the direct attachment package of relieving the stress by a thermal expansion difference. No means can be conceived, and there is no motivation for simply combining Patent Document 1 and Patent Document 2.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that a translucent adhesive adheres to the surface of an electrode part during manufacture of an optical device apparatus, Moreover, a translucent board | plate material, a light-shielding sealing agent, or a translucent adhesive, Generation of peeling at the interface can be prevented.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiment.

<< First Embodiment >>
An optical device device according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an optical device device according to the first embodiment of the present invention. In FIG. 1, a part of a light-transmitting plate 3 and a light-shielding seal are provided so that the internal structure of the optical device device can be easily understood. A part of the agent 14 is broken. 2 is a cross-sectional view taken along the line II-II shown in FIG.

  As shown in FIGS. 1 and 2, the optical device apparatus includes a package substrate 1, an optical device element 2, and a translucent plate 3. The package substrate 1 is made of ceramic, plastic, or the like, and has external lead terminals 4 and internal lead terminals 5 that are electrically connected to each other. The optical device element 2 is fixed to the package substrate 1 via an adhesive 42, and a light receiving portion 6 is provided on the upper surface thereof. A light-transmitting adhesive 8 is provided on the light receiving portion 6, and the light-transmitting plate 8 is bonded to the light-transmitting adhesive 8. Further, an electrode portion 7 is provided on the upper surface of the optical device element 2 at the periphery of the light receiving portion 6, and the electrode portion 7 is electrically connected to the internal lead terminal 5 of the package substrate 1 through the gold wire 13. Has been. Such an optical device element 2 is sealed with a light-shielding sealant 14.

  A weir portion 9 is provided between the light receiving portion 6 and the electrode portion 7 on the upper surface of the optical device element 2 and has a height of about 10 μm. The weir portion 9 is translucent when the translucent adhesive 8 is applied to the light receiving portion 6 of the optical device element 2 or when the translucent plate 3 is attached to the light receiving portion 6 of the optical device element 2. It is a breakwater that prevents the adhesive 8 from flowing into the electrode portion 7. Thereby, since it can prevent that the translucent adhesive agent 8 adheres to the surface of the electrode part 7 during manufacture of an optical device apparatus, the optical device apparatus resulting from peeling of the gold | metal wire 13 from the surface of the electrode part 7 is possible. Performance degradation can be suppressed. The weir portion 9 will be described in detail later.

  Due to the characteristics of the optical device device, it is necessary to receive light 10 (hereinafter referred to as “oblique light”) 10 incident at an incident angle α as shown in FIG. Therefore, if there is a defect such as dust, bubbles or scratches in the light incident region 11 where the oblique light enters or passes through the light transmissive plate 3 and the light transmissive adhesive 8, there is a possibility that an image defect is caused. Therefore, the occurrence of these defects must be prevented. Since these defects often occur during the manufacturing of the optical device apparatus, the manufacturing method of the optical device apparatus was examined. Below, the content of the examination is explained.

  FIGS. 3 and 4 show the manufacturing flow of the optical device device according to the embodiment of the present invention. FIGS. 3 and 4 show the optical when the translucent plate 3 is attached to the optical device element 2. The form of the device element 2 is different.

  That is, in FIG. 3, the optical device element 2 is connected to the optical device element 2 (wafer), and the translucent plate 3 is attached, and then the optical device is separated into individual pieces in the dicing process. The obtained optical device is die-bonded to the package substrate 1. On the other hand, in FIG. 4, after being separated from the wafer state in the dicing step, the separated optical device element 2 is die-bonded on the package substrate 1, and then the translucent plate 3 is attached. . Here, when the translucent plate 3 is attached to the wafer as shown in FIG. 3, the translucent plate 3 can be applied in a very clean environment such as a wafer diffusion process. Therefore, dust intrusion into the translucent adhesive 8 can be prevented very effectively.

  Specifically, in each step of forming the optical device element 2 (steps S301 and S401), the light receiving portion 6 is formed at the center of the upper surface of the optical device element 2, and the electrode portion 7 is provided at the periphery of the light receiving portion 6. And a dam portion 9 is formed between the light receiving portion 6 and the electrode portion 7.

  In the application process (steps S302 and S404) of the translucent adhesive 8, the translucent adhesive 8 is applied to the light receiving unit 6 of the optical device element 2. At this time, even if the translucent adhesive 8 flows out of the light receiving unit 6, the weir unit 9 blocks the outflow of the translucent adhesive 8, so that the translucent adhesive 8 adheres to the surface of the electrode unit 7. Can be suppressed.

  In the step of attaching the translucent plate 3 (steps S303 and S405), the translucent plate 3 is attached to the translucent adhesive 8. Even if the translucent adhesive 8 flows out to the outside of the light receiving unit 6 by attaching the translucent plate material 3, the translucent adhesive 8 that has flowed out is blocked by the weir unit 9. It can suppress that translucent adhesive agent 8 adheres to the surface.

  In the dicing process (steps S304 and S402), the wafer is singulated. At this time, in step S304, the wafer is singulated with the translucent plate 3 attached, so that the translucent plate 3 is also singulated together with the wafer.

  In the die bonding process (steps S305 and S403), the optical device element 2 is fixed to the package substrate 1 via the adhesive 12. When the package substrate 1 has a recess as shown in FIG. 2 and the like, it is preferable to accommodate the optical device element 2 in the recess.

  In the wire bonding process (steps S306 and S406), the gold wire 13 is used to bond the electrode portion 7 of the optical device element 2 and the internal lead terminal 5 of the package substrate 1. At this time, since the internal lead terminal 5 and the external lead terminal 4 are electrically connected to each other in the package substrate 1, the electrode portion 7 of the optical device element 2 and the external lead terminal 4 of the package substrate 1 are electrically connected. Can be connected to.

  In the filling process of the light-shielding sealant 14 (steps S307 and S404), the package substrate 1 is filled with the light-shielding sealant 14 using a method such as potting. Thereby, while being able to protect the gold | metal wire 13 and the optical device element 2, the penetration | invasion of the light from the side surface of the translucent board | plate material 3 (light which should not be light-received by the light-receiving part 6) can be prevented. Below, the filling process of the light-shielding sealant 14 will be described with reference to FIG.

  As shown in FIG. 5A, the light-shielding sealant 14 filled in the package substrate 1 covers the side surface of the translucent plate 3 and rises above the upper surface of the translucent plate 3. However, after that, when the light-shielding sealant 14 is cured by applying heat in a curing furnace or the like, curing shrinkage unique to the epoxy resin occurs, and the surface of the light-shielding sealant 14 as shown in FIG. The fillet portion 15 is formed around the translucent plate 3.

  In this specification, the fillet part 15 is that the light-shielding sealant 14 becomes thinner from the light receiving part 6 toward the electrode part 7. In other words, on the outer periphery of the translucent plate member 3, the upper surface of the light-shielding sealant 14 is lower than the upper surface of the translucent plate member 3 and becomes lower as the distance from the translucent plate member 3 increases.

  As described above, the light-shielding sealant 14 around the translucent plate 3 forms the fillet portion 15. Therefore, when the heat application is applied, the light shielding sealant 14 in the fillet portion 15 is thin, so that the stress exerted on the light transmissive plate 3 by the light shielding sealant 14 constituting the fillet portion 15 can be reduced. it can. Moreover, since the light-shielding sealant 14 in the fillet portion 15 is thin, the stress can be relaxed even when a stress is generated.

  Below, the dam part 9 is demonstrated.

  As shown in FIG. 6, the weir portion 9 of the present invention has an upper portion 19 that becomes narrower as it goes upward (toward the lower surface of the translucent plate 3). The shape of the side surface 19 b of the upper portion 19 in the cross section of the dam portion 9 is a curve, and the tip 19 a of the upper portion 19 is a flat surface and is in contact with the lower surface of the translucent plate 3. When the dam portion 9 has such an upper portion 19, the thickness of the translucent adhesive 8 gradually decreases in the dam portion 9, thereby suppressing the concentration of stress from the translucent adhesive 8. can do. Further, the distance 18 between the light receiving portion 6 and the translucent plate 3 can be adjusted by changing the height of the dam portion 9, and further, the distance 18 can be made constant by making the height of the dam portion 9 uniform. Therefore, the optical performance of the optical device apparatus can be improved.

  The following two methods can be considered as a method of manufacturing such a dam part 9.

  In the first method, the dam portion 9 is made of a photosensitive resin. Specifically, a resin layer is formed using a photosensitive resin, a portion that becomes the weir portion 9 is cured by photolithography, and an unnecessary portion is peeled off. At this time, when the resin layer is formed, there is a corner at the top of the resin layer, but when the pre-bake time is increased by several minutes when peeling the unnecessary part, the corner changes to a rounded shape. Can be made.

  FIG. 7 shows an enlarged view of the cross section of the weir 109 when the pre-bake time is excessive. If the pre-bake time is excessive as shown in FIG. 7, the exposure proceeds, and there is no flat portion at the tip 119 a of the upper portion 119 of the dam portion 109. Becomes a curve. As a result, the distance 118 between the light receiving unit 6 and the translucent plate 3 may be shortened.

  Therefore, as shown in FIG. 6, when the pre-bake time is controlled so that the side surface 19b of the upper portion 19 is rounded in the cross section of the dam portion 9 and a flat surface remains at the tip 19a of the upper portion 19, An effective weir portion 9 can be obtained.

  In the second method, the weir portion 9 is made of an etchable resin. Specifically, a resin layer is formed using an etchable resin, and a mask that covers a portion that becomes the weir portion 9 and is opened on the other portion is formed on the resin layer, and is etched to form a weir. The portion that becomes the portion 9 is left and unnecessary portions are removed. At this time, as in the first method, when the resin layer is formed, corners exist at the top of the resin layer. However, if the etching time is increased by several minutes when etching is performed, the etching progresses and the corners are increased. It can be changed from a part to a rounded shape.

  FIG. 8 is a cross-sectional view around the dam portion 109 when bubbles are generated around the dam portion. As described above, since the side surface 19b of the upper portion 19 is rounded in the cross section of the dam portion 9, the thickness of the translucent adhesive 8 is gradually reduced as it approaches the dam portion 9 without abrupt change. Become. Therefore, it can suppress that the stress from the translucent adhesive agent 8 concentrates.

  Even if stress occurs and peeling occurs at the interface between the translucent adhesive 8 and the weir 9, the bubbles 20 generated due to the peeling are present on the side surface 19 b of the weir 9. . Therefore, it is possible to suppress the presence of the bubbles 20 in the light incident region 11 of the oblique light 10 incident on the light receiving unit 6 at the incident angle α. Therefore, image defects can be suppressed.

<< Second Embodiment >>
In FIG. 9, sectional drawing of the optical device apparatus which concerns on the 2nd Embodiment of this invention is shown. The shape of the dam portion 9 is different between the present embodiment and the first embodiment. Specifically, in the first embodiment, the shape of the side surface 19b of the upper portion 19 is curved in the cross section of the dam portion 9, but the side surface of the upper portion 19 in the cross section of the dam portion 9 as in this embodiment. The shape of 19b may be a straight line. Even in such a case, as in the first embodiment, the thickness of the translucent adhesive 8 can be gradually reduced toward the periphery of the optical device element 2 around the dam portion 9. Therefore, it can suppress that the stress from the translucent adhesive agent 8 concentrates.

<< Third Embodiment >>
FIGS. 10A and 10B are sectional views of an optical device device according to the third embodiment of the present invention, respectively. The shape of the dam portion 9 is different between the present embodiment and the first embodiment. Specifically, in the first embodiment, the width of the dam portion 9 is made narrower on both the light receiving portion 6 side than the tip 19a and the electrode portion 7 side than the tip 19a of the side surface 19b of the upper portion 19. Is formed. However, as in the present embodiment, only the light receiving portion 6 side of the side surface 19b of the upper portion 19 is formed so as to narrow the width of the weir portion 9, and the electrode portion 7 side is closer to the tip portion 19a. You may form so that it may become substantially perpendicular | vertical with respect to the front-end | tip 19a. In other words, in the cross section of the dam part 9, both corners of the upper part 19 may be chamfered as in the first and second embodiments, and the corners of the upper part 19 as in the present embodiment. One (preferably, the light receiving part 6 side of the corners of the upper part 19) may be chamfered. As the chamfering method, R processing may be performed as in the first embodiment, or C processing may be performed as in the second embodiment.

  As described above, the present invention can be used for a digital still camera, for example.

The top view of the optical device apparatus which concerns on the 1st Embodiment of this invention Sectional view taken along line II-II shown in FIG. The flowchart figure which shows an example of the manufacturing method of the optical device apparatus which concerns on the 1st Embodiment of this invention. The flowchart figure which shows another example of the manufacturing method of the optical device apparatus which concerns on the 1st Embodiment of this invention. (A) And (b) is sectional drawing which shows the resin filling process by potting among the manufacturing methods of the optical device apparatus which concerns on the 1st Embodiment of this invention. Sectional drawing which expanded the circumference | surroundings of the dam part among the optical device apparatuses which concern on the 1st Embodiment of this invention Sectional drawing when prebaking time or etching time is too long in the process of manufacturing a dam part among the manufacturing methods of the optical device apparatus which concerns on the 1st Embodiment of this invention Sectional drawing when bubbles are generated around the weir in the optical device device according to the first embodiment of the present invention. Sectional drawing of the optical device apparatus which concerns on the 2nd Embodiment of this invention. Sectional drawing of the optical device apparatus which concerns on the 3rd Embodiment of this invention. Sectional drawing of the optical device apparatus which concerns on the conventional direct pasting package structure Sectional drawing of the optical device apparatus which concerns on the conventional direct pasting package structure Sectional view of a conventional optical device device Sectional drawing for demonstrating the problem in the conventional direct pasting package structure

Explanation of symbols

1 Package substrate
2 Optical device elements
3 Translucent plate material
6 Light receiving part
7 electrodes
8 Translucent adhesive
9 Weir
14 Shading sealant
15 Fillet
19 Top
19a tip
19b side view

Claims (6)

An optical device element having a light receiving portion provided on an upper surface, and an electrode portion provided on the periphery of the light receiving portion of the upper surface;
A translucent plate covering the light receiving portion;
A translucent adhesive that is provided on the light receiving unit and adheres the translucent plate and the optical device element;
A package substrate having a terminal electrically connected to the electrode portion, and fixing the optical device element;
A light-shielding sealant for sealing the optical device element,
Between the light receiving portion and the electrode portion of the upper surface of the optical device element, a dam portion for preventing the translucent adhesive from flowing to the electrode portion of the optical device element is provided,
The translucent plate material covers the weir part,
The optical device apparatus, wherein the upper portion of the dam portion is narrower toward the lower surface of the translucent plate material, and the tip of the upper portion is in contact with the lower surface of the translucent plate material. The optical device apparatus according to claim 1,
In the cross section of the dam portion, at least one of a portion of the upper portion disposed closer to the light receiving portion than the tip and a portion disposed closer to the electrode portion than the tip is a curve. Optical device apparatus. The optical device apparatus according to claim 2,
The optical device apparatus, wherein both of the upper side surface and the portion disposed closer to the light receiving portion than the tip and the portion disposed closer to the electrode portion than the tip are curved surfaces. In the optical device device according to any one of claims 1 to 3,
The optical device apparatus, wherein the tip of the upper portion of the dam portion is a flat surface that comes into contact with the lower surface of the translucent plate. In the optical device device according to any one of claims 1 to 4,
The light-shielding sealant is a thermosetting adhesive, and is provided so as to cover a side surface of the light-transmitting plate member and to expose an upper surface of the light-transmitting plate member. The optical device apparatus which has a fillet part in the part which covers the said side surface. In the optical device device according to any one of claims 1 to 4,
The light-shielding sealant is a thermosetting adhesive, and is provided so as to cover the side surface of the light-transmitting plate material while exposing the upper surface of the light-transmitting plate material,
The optical device apparatus in which the part which covers the said side surface of the said translucent board | plate material among the said light-shielding sealing agents becomes thin as it distances from the said translucent board | plate material.

Images