JP2009131911A - 封止型デバイスの製造方法および封止型デバイス - Google Patents

封止型デバイスの製造方法および封止型デバイス Download PDF

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Publication number
JP2009131911A
JP2009131911A JP2007307941A JP2007307941A JP2009131911A JP 2009131911 A JP2009131911 A JP 2009131911A JP 2007307941 A JP2007307941 A JP 2007307941A JP 2007307941 A JP2007307941 A JP 2007307941A JP 2009131911 A JP2009131911 A JP 2009131911A
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Japan
Prior art keywords
bonding film
manufacturing
bonding
film
support
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
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JP2007307941A
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English (en)
Japanese (ja)
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JP2009131911A5 (https=
Inventor
Kenji Otsuka
賢治 大塚
Yasuhide Matsuo
泰秀 松尾
Kosuke Wakamatsu
康介 若松
Kazuhisa Higuchi
和央 樋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to JP2007307941A priority Critical patent/JP2009131911A/ja
Publication of JP2009131911A publication Critical patent/JP2009131911A/ja
Publication of JP2009131911A5 publication Critical patent/JP2009131911A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives

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  • Mechanical Optical Scanning Systems (AREA)
  • Micromachines (AREA)
JP2007307941A 2007-11-28 2007-11-28 封止型デバイスの製造方法および封止型デバイス Withdrawn JP2009131911A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007307941A JP2009131911A (ja) 2007-11-28 2007-11-28 封止型デバイスの製造方法および封止型デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007307941A JP2009131911A (ja) 2007-11-28 2007-11-28 封止型デバイスの製造方法および封止型デバイス

Publications (2)

Publication Number Publication Date
JP2009131911A true JP2009131911A (ja) 2009-06-18
JP2009131911A5 JP2009131911A5 (https=) 2011-01-13

Family

ID=40864345

Family Applications (1)

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JP2007307941A Withdrawn JP2009131911A (ja) 2007-11-28 2007-11-28 封止型デバイスの製造方法および封止型デバイス

Country Status (1)

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JP (1) JP2009131911A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8848292B2 (en) 2010-11-15 2014-09-30 Seiko Epson Corporation Optical filter and method for manufacturing optical filter
US9448176B2 (en) 2011-09-29 2016-09-20 Seiko Epson Corporation Variable wavelength interference filter, optical filter device, optical module, and electronic apparatus
CN110858631A (zh) * 2018-08-22 2020-03-03 三星显示有限公司 有机发光显示装置及其制造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8848292B2 (en) 2010-11-15 2014-09-30 Seiko Epson Corporation Optical filter and method for manufacturing optical filter
US9448176B2 (en) 2011-09-29 2016-09-20 Seiko Epson Corporation Variable wavelength interference filter, optical filter device, optical module, and electronic apparatus
CN110858631A (zh) * 2018-08-22 2020-03-03 三星显示有限公司 有机发光显示装置及其制造方法
KR20200022555A (ko) * 2018-08-22 2020-03-04 삼성디스플레이 주식회사 유기 발광 표시 장치 및 제조 방법
US10978668B2 (en) 2018-08-22 2021-04-13 Samsung Display Co., Ltd. Organic light emitting display device and method of manufacturing the same
KR102638142B1 (ko) 2018-08-22 2024-02-19 삼성디스플레이 주식회사 유기 발광 표시 장치 및 제조 방법
CN110858631B (zh) * 2018-08-22 2024-05-31 三星显示有限公司 有机发光显示装置及其制造方法

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