JP2009130370A - 積層セラミック基板の製造方法 - Google Patents
積層セラミック基板の製造方法 Download PDFInfo
- Publication number
- JP2009130370A JP2009130370A JP2008300109A JP2008300109A JP2009130370A JP 2009130370 A JP2009130370 A JP 2009130370A JP 2008300109 A JP2008300109 A JP 2008300109A JP 2008300109 A JP2008300109 A JP 2008300109A JP 2009130370 A JP2009130370 A JP 2009130370A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- cutting
- ceramic green
- organic
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 165
- 239000000758 substrate Substances 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000005520 cutting process Methods 0.000 claims abstract description 70
- 238000010304 firing Methods 0.000 claims abstract description 17
- 238000010030 laminating Methods 0.000 claims abstract description 5
- 238000007639 printing Methods 0.000 claims description 11
- 239000011368 organic material Substances 0.000 claims description 9
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 5
- 239000003063 flame retardant Substances 0.000 claims description 5
- 238000006116 polymerization reaction Methods 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 claims description 4
- 239000001856 Ethyl cellulose Substances 0.000 claims description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 3
- 229920001249 ethyl cellulose Polymers 0.000 claims description 3
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 3
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- -1 Neodymium Yttrium Aluminum Chemical compound 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/481—Insulating layers on insulating parts, with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
Abstract
【解決手段】本発明にかかる積層セラミック基板の製造方法では、複数のセラミックグリーンシートを積層して形成されるセラミック積層体において、少なくとも一つのセラミックグリーンシート上に有機物ペーストで切断領域を印刷する。そして、積層されたセラミック積層体を焼成し、切断領域に沿って切断して積層セラミック基板を製造する。
【選択図】 図2c
Description
111、112、113、114、115 セラミックグリーンシート
A1、A2 可用領域
C2 切断領域
Claims (11)
- 複数のセラミックグリーンシートを積層して形成されるセラミック積層体において、前記セラミックグリーンシートの少なくとも一つのセラミックグリーンシート上に有機物ペーストで切断領域を印刷する段階と、
前記セラミック積層体を焼成する段階と、
前記焼成されたセラミック積層体の切断領域に沿って切断する段階と、を含む積層セラミック基板の製造方法。 - 前記切断領域を印刷する段階は、
前記セラミックグリーンシート上に前記有機物ペーストをスクリーンプリンティングまたはインクジェットプリンティングのいずれか一つの方法を利用して行われることを特徴とする請求項1に記載の積層セラミック基板の製造方法。 - 前記セラミック積層体は、前記セラミックグリーンシート上の前記切断領域が積層方向に整列されるよう積層されることを特徴とする請求項1に記載の積層セラミック基板の製造方法。
- 前記有機物ペーストは、難燃性有機物質を含むことを特徴とする請求項1に記載の積層セラミック基板の製造方法。
- 前記有機物ペーストは、重合度が高い高分子物質を含むことを特徴とする請求項1に記載の積層セラミック基板の製造方法。
- 前記有機物ペーストは、有機溶媒をさらに含むことを特徴とする請求項1に記載の積層セラミック基板の製造方法。
- 前記有機物ペーストは、エチルセルロース(Ethyl cellulose)、ポリビニルブチラル(Polyvinyl butyral)、メタクリレート(Metacrylate)及びこれらの混合物で構成された群から選択されたいずれか一つである有機物質を含むことを特徴とする請求項1に記載の積層セラミック基板の製造方法。
- 前記切断領域の幅は、前記セラミックグリーンシートの厚さの1倍〜2倍であることを特徴とする請求項1に記載の積層セラミック基板の製造方法。
- 前記切断段階は、前記切断領域に圧力または熱を加えて行われることを特徴とする請求項1に記載の積層セラミック基板の製造方法。
- 前記切断段階は、前記切断領域にレーザを印加して行われることを特徴とする請求項1に記載の積層セラミック基板の製造方法。
- 前記複数のセラミックグリーンシートのうちの一部のセラミックグリーンシートに切断領域が印刷され、
前記切断領域が印刷されたセラミックグリーンシートと切断領域が印刷されていないセラミックグリーンシートとは交互に積層されることを特徴とする請求項1に記載の積層セラミック基板の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070120470A KR100887127B1 (ko) | 2007-11-23 | 2007-11-23 | 적층 세라믹 기판의 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009130370A true JP2009130370A (ja) | 2009-06-11 |
Family
ID=40668715
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008300109A Pending JP2009130370A (ja) | 2007-11-23 | 2008-11-25 | 積層セラミック基板の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090133805A1 (ja) |
JP (1) | JP2009130370A (ja) |
KR (1) | KR100887127B1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111056858A (zh) * | 2019-12-20 | 2020-04-24 | 上海巴安水务股份有限公司 | 一种平板陶瓷膜支撑体的制备方法及其陶瓷泥料 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001332857A (ja) * | 2000-05-22 | 2001-11-30 | Kyocera Corp | 配線基板の製造方法 |
JP2002270459A (ja) * | 2001-03-06 | 2002-09-20 | Taiyo Yuden Co Ltd | 積層セラミック電子部品の製造方法 |
JP2003273267A (ja) * | 2002-03-15 | 2003-09-26 | Murata Mfg Co Ltd | セラミック電子部品の製造方法 |
JP2004106540A (ja) * | 2002-08-28 | 2004-04-08 | Kyocera Corp | 複合体およびその製造方法、並びにセラミック基板の製造方法 |
JP2005044886A (ja) * | 2003-07-24 | 2005-02-17 | Murata Mfg Co Ltd | 積層型セラミック電子部品の製造方法 |
JP2006032439A (ja) * | 2004-07-12 | 2006-02-02 | Noritake Co Ltd | セラミック積層基板の製造方法 |
WO2007060788A1 (ja) * | 2005-11-25 | 2007-05-31 | Murata Manufacturing Co., Ltd. | 多層セラミック基板の製造方法 |
WO2008018227A1 (fr) * | 2006-08-07 | 2008-02-14 | Murata Manufacturing Co., Ltd. | Procédé de production d'un substrat céramique multicouche |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2115223B (en) * | 1982-02-18 | 1985-07-10 | Standard Telephones Cables Ltd | Multilayer ceramic dielectric capacitors |
KR950007538B1 (ko) * | 1992-07-29 | 1995-07-11 | 엘지전자주식회사 | 캠코더의 고체 촬상장치 |
US5601673A (en) * | 1995-01-03 | 1997-02-11 | Ferro Corporation | Method of making ceramic article with cavity using LTCC tape |
US6760227B2 (en) * | 2000-11-02 | 2004-07-06 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component and manufacturing method thereof |
JP2003017851A (ja) * | 2001-06-29 | 2003-01-17 | Murata Mfg Co Ltd | 多層セラミック基板の製造方法 |
JP3940421B2 (ja) | 2003-07-09 | 2007-07-04 | Tdk株式会社 | 積層セラミック部品およびその製造方法 |
TWI345938B (en) * | 2003-10-17 | 2011-07-21 | Hitachi Metals Ltd | Multi-layered ceramic substrate and its production method, and electronic device comprising same |
CN101341808B (zh) * | 2006-05-29 | 2010-06-23 | 株式会社村田制作所 | 陶瓷多层基板的制造方法 |
-
2007
- 2007-11-23 KR KR1020070120470A patent/KR100887127B1/ko not_active IP Right Cessation
-
2008
- 2008-11-24 US US12/276,656 patent/US20090133805A1/en not_active Abandoned
- 2008-11-25 JP JP2008300109A patent/JP2009130370A/ja active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001332857A (ja) * | 2000-05-22 | 2001-11-30 | Kyocera Corp | 配線基板の製造方法 |
JP2002270459A (ja) * | 2001-03-06 | 2002-09-20 | Taiyo Yuden Co Ltd | 積層セラミック電子部品の製造方法 |
JP2003273267A (ja) * | 2002-03-15 | 2003-09-26 | Murata Mfg Co Ltd | セラミック電子部品の製造方法 |
JP2004106540A (ja) * | 2002-08-28 | 2004-04-08 | Kyocera Corp | 複合体およびその製造方法、並びにセラミック基板の製造方法 |
JP2005044886A (ja) * | 2003-07-24 | 2005-02-17 | Murata Mfg Co Ltd | 積層型セラミック電子部品の製造方法 |
JP2006032439A (ja) * | 2004-07-12 | 2006-02-02 | Noritake Co Ltd | セラミック積層基板の製造方法 |
WO2007060788A1 (ja) * | 2005-11-25 | 2007-05-31 | Murata Manufacturing Co., Ltd. | 多層セラミック基板の製造方法 |
WO2008018227A1 (fr) * | 2006-08-07 | 2008-02-14 | Murata Manufacturing Co., Ltd. | Procédé de production d'un substrat céramique multicouche |
Also Published As
Publication number | Publication date |
---|---|
US20090133805A1 (en) | 2009-05-28 |
KR100887127B1 (ko) | 2009-03-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101341808B (zh) | 陶瓷多层基板的制造方法 | |
US11019727B2 (en) | Methods for producing ceramic substrates and module components | |
WO2017002434A1 (ja) | 多層セラミック基板および多層セラミック基板の製造方法 | |
JP2003246680A (ja) | 多層セラミック基板の製造方法 | |
JP2009130370A (ja) | 積層セラミック基板の製造方法 | |
US7879169B2 (en) | Method for producing ceramic compact | |
US5800761A (en) | Method of making an interface layer for stacked lamination sizing and sintering | |
JPWO2009087845A1 (ja) | 多層セラミック基板、その製造方法およびその反り抑制方法 | |
JP4110536B2 (ja) | 多層セラミック集合基板および多層セラミック集合基板の製造方法 | |
KR100809257B1 (ko) | 저온 동시소성 세라믹 기판의 제조방법 | |
KR100586942B1 (ko) | 바인더 필름을 이용한 층간 적층방법 | |
WO2022131337A1 (ja) | セラミック板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法 | |
KR102466917B1 (ko) | 상호 결합 수단을 구비한 led용 다층 세라믹 기판 및 그의 제조 방법 | |
JP4645962B2 (ja) | 多層セラミック基板 | |
JPH06275953A (ja) | 多層回路基板の製造方法 | |
JP2011018783A (ja) | 多層セラミック基板の製造方法 | |
US5866470A (en) | Method of using an interface layer for stacked lamination sizing and sintering | |
WO2003090987A1 (fr) | Procede de fabrication de corps stratifie ceramique | |
EP1403228A4 (en) | CERAMIC COMPONENT AND ITS MANUFACTURING METHOD | |
WO2019111544A1 (ja) | 集合基板の製造方法、及び、集合基板 | |
KR20240016911A (ko) | 기판의 가공 방법 | |
JP2004022670A (ja) | 多層セラミック基板及びその製造方法 | |
JP2003101224A (ja) | セラミック多層基板の製造方法 | |
JP6065355B2 (ja) | 多層セラミック基板およびその製造方法 | |
JP2003224360A (ja) | キャビティ付き多層セラミック基板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20091126 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20100107 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20100108 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101116 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20110412 |