JP2009125963A - 熱可塑性樹脂部材の溶着方法 - Google Patents

熱可塑性樹脂部材の溶着方法 Download PDF

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JP2009125963A
JP2009125963A JP2007300033A JP2007300033A JP2009125963A JP 2009125963 A JP2009125963 A JP 2009125963A JP 2007300033 A JP2007300033 A JP 2007300033A JP 2007300033 A JP2007300033 A JP 2007300033A JP 2009125963 A JP2009125963 A JP 2009125963A
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thermoplastic resin
resin member
infrared
light source
infrared ray
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Yasuo Kurosaki
晏夫 黒▲崎▼
Kimitoshi Sato
公俊 佐藤
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Campus Create Co Ltd
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Campus Create Co Ltd
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
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  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

【課題】赤外線照射による熱可塑性樹脂部材の溶着において、熱可塑性樹脂部材重合せ群の第１層の熱可塑性樹脂部材の赤外線照射側表層の熱損傷による表面性状の劣化を回避する。
【解決手段】赤外線照射による熱可塑性樹脂部材の溶着において、支持体１に対して熱可塑性樹脂部材３を複数層重合せし、さらに赤外線照射側に赤外線透過性固体５を重合せして重合せ群を形成し、この重合せ群に対して赤外線透過性固体側の光源９から赤外線を照射するに際して、該光源としてＥｒ：ＹＡＧレーザーまたはファイバーレーザーを用いる。
【選択図】図１

Description

この発明は熱可塑性樹脂部材の溶着方法に関するものであり、より詳しくは熱可塑性樹脂部材の複数層を含む重合せ群に対して赤外線レーザーを照射して、熱可塑性樹脂部材を互いに溶着させる赤外線溶着法に関するものである。
熱可塑性樹脂部材は一般に波長２μｍ以上の赤外線に対して高い吸収性を示し、それ未満の波長の場合には高い透過性を示す。したがって赤外線透過性の高い熱可塑性樹脂部材にはカーボンブラックなどの無機顔料やシアニン系の有機色素を添加して吸収性を高くする。
かかる場合赤外線を照射すると、熱可塑性樹脂部材は照射側表層からレーザーエネルギーを吸収するが、そのエネルギーは熱可塑性樹脂部材重合せ群の内部に進むに従って減衰する。つまり熱可塑性樹脂部材重合せ群内部の接合すべき熱可塑性樹脂部材界面を溶着させるには、重合せ群の赤外線照射側表層の温度を熱可塑性樹脂部材界面温度より高くする必要があり、この高温の故に熱可塑性樹脂部材が赤外線照射側表層において溶融変形して溶着後の表面性状が著しく損なわれる。
かかる欠点の改善策のひとつとしては本出願人による特願２００３−５４１７１４号に提案された発明がある。この従来技術は図１のような構成を有したものである。
赤外線レーザー光源９に対して、赤外線レーザー照射側から、赤外線透過性固体材料５、第１・２層の熱可塑性樹脂部材３および支持体１の順で重ね合せて重合せ群を形成して、７で示す方向に適宜圧縮力を印加する。
第１層目の熱可塑性樹脂部材３の赤外線照射側表層で生じる高い赤外線吸収に伴う温度上昇を赤外線透過性固体材料５への強い放熱により抑制しつつ、熱可塑性樹脂部材３同士の界面近傍において熱可塑性樹脂部材３の溶融温度より高い温度域を作り出す。これにより赤外線照射側表層における表面性状を良好に維持して、かつ短時間で界面での溶着を行う。ものである。
特願２００３−５４１７１４号
図2に赤外線レーザーの光源としてＣＯ2を用いた場合の熱可塑性樹脂部材重合せ群内部の温度分布１７を示す。この図から明らかなように、照射した赤外線に対して熱可塑性樹脂部材が高い吸収性を示す場合には、熱可塑性樹脂部材の持つ低い熱伝導性の故に、熱可塑性樹脂部材が最高温度となる箇所は図２に示すように赤外線透過性固体材料５と接触する熱可塑性樹脂部材３の赤外線照射側表層近傍に止まる。従って肉厚の熱可塑性樹脂部材を溶着しようとする場合には、熱可塑性樹脂部材の界面を溶着に必要な温度に高めようとすると、第１層の熱可塑性樹脂部材の赤外線照射側表層の温度を高くする必要があり、この結果熱損傷により該表層の表面性状が劣化する。
この発明の目的は、赤外線照射による熱可塑性樹脂部材重合せ群の第１層の熱可塑性樹脂部材の赤外線照射側表層の熱損傷による表面性状の劣化を回避する、ことにある。
このためこの発明においては、支持体に対して熱可塑性樹脂部材を複数層重ね合せ、さらに赤外線透過性固体を重ね合せて重合せ群を形成し、この重合せ群に対して赤外線透過性固体側の光源から赤外線を照射するに際して、該光源としてＥｒ：ＹＡＧレーザーまたはファイバーレーザーを用いることを要旨とするものである。
赤外線透過性固体と接触する熱可塑性樹脂部材の境界温度が相対的に低くなり、浸透したレーザーエネルギーにより重合せ群の内部でより高温となる領域を発現し得る。その結果熱可塑性樹脂部材の赤外線照射側表層での熱損傷による表面性状の劣化が抑制される。
図１に示すのはこの発明の溶着方法を実施するシステムの典型的実施例の基本的構成である。支持体１に対向接触して第１層の熱可塑性樹脂部材と第２層の熱可塑性樹脂部材３が重合せされており、さらにこれら重合せされた熱可塑性樹脂部材３に対して支持体１とは反対側にヒートシンク作用をする赤外線透過性固体５が対向接触重合せして、全体として重合せ群を構成している。この重合せ群に矢印７で示すように圧縮力を印加して重合せ群を構成する要素１，３，５を、密着状態にする。ついでこの重合せ群に対して赤外線透過性固体５側から赤外線を光源とする赤外線ビーム１１を照射する。
この発明において用いる支持体１とは、赤外線ビーム１１照射中に赤外線透過性固体５と熱可塑性樹脂部材３および溶着する熱可塑性樹脂部材界同士が安定して密着接触状態を保つためのものである。その機能を持つ限りにおいては支持体１の材質や形状はどのようなものであってもよい。例えば圧縮力によっても塑性変形が生じ難く、適度な剛性を有したスチール、アルミニウム合金、銅合金などの金属製ブロックや板が用いられる。
さらに支持体１はその赤外線ビーム照射側表層がゴム緩衝層であってもよい。厚さが薄いまたは熱収縮性が高い熱可塑性樹脂部材同士を溶着するに当たって、熱可塑性樹脂部材自身の表面起伏などにより赤外線透過性固体５と、熱可塑性樹脂部材３、および熱可塑性樹脂部材界面同士の物理的接触状態（接触圧力および接触面積）が不足し、溶着後に溶着部でボイドや破れ、顕著な収縮などの欠陥が生じ易い場合がある。このような場合に、支持体１の赤外線ビーム照射側表層がゴム緩衝層であることによって、赤外線透過性固体５と熱可塑性樹脂部材３、および熱可塑性樹脂部材界面の物理的接触状態が改善され、溶着後のボイドや破れ、顕著な収縮などの欠陥の発生を抑制することができる。
赤外線透過性固体５としてはセレン化亜鉛（ＺｎＳｅ）、硫化亜鉛（ＺｎＳ）、シリコン（Ｓｉ）、ゲルマニウム（Ｇｅ）、サファイア（Ａｌ2Ｏ3）または砒素化ガリウム（ＧａＡｓ）などの、熱伝導度１５ｗ／ｍ・Ｋ以上を有する赤外結晶材料が挙げられる。
この発明の溶着方法により溶着できる熱可塑性樹脂部材としては、従来の溶着方法では難溶着性を呈する熱可塑性樹脂部材、つまり高周波帯域での誘電損失が低くかつ軟質であるが故に高周波溶着および超音波溶着のいずれを適用しても溶着が困難である熱可塑性樹脂部材、および高周波帯域では誘電損失が低くかつ融点が高い熱可塑性樹脂部材が挙げられる。具体例としてはオレフィン系熱可塑性エラストマー、フッ素系樹脂、液晶ポリマー、ポリカーボネイトおよびポリアミドがある。
図３に示すのは光源として従来のＣＯ2を用いた場合（１９）とこの発明による光源を用いた場合（２１）の重合せ群内部での温度分布である。図から明らかなようにこの発明によった場合には熱可塑性樹脂部材の界面１３近傍において温度分布が最高になり、熱可塑性樹脂部材の赤外線照射側表層ではこれより温度がかなり低くなる。つまり該表層における熱損傷による表面性状の劣化を回避できる。
図４に示すのはポリカーボネイト（ＰＣ）についての赤外線の波長と透過率の関係である。図から明らかなようにポリカーボネイトはＣＯ2の波長である１０．６μｍ帯では赤外線透過性が非常に低い。したがってこれを肉厚にした場合には、重合せ群内部への赤外線エネルギーの浸透量が少なく、熱可塑性樹脂部材界面の温度は上がり難い。しかし３μｍ帯における浸透性は１０，６μｍの場合に比べて遥かに大きく、かつ適度な吸収性も呈する。この発明で採用するＥｒ：ＹＡＧレーザーの場合にはこの３μｍ帯近傍に発振波長を有しているので、上記の重合せ群内部への赤外線エネルギー浸透量を確保し、熱可塑性樹脂部材界面の温度を高くすることができるのである。
図５に示すのはポリアミド（ＰＡ）についての赤外線の波長と透過率の係である。図から明らかなようにポリアミドはＣＯ2の波長である１０．６μｍ帯では赤外線透過性が非常に低い。したがってこれを肉厚にした場合には、重合せ群内部への赤外線エネルギーの浸透量が少なく、熱可塑性樹脂部材界面の温度は上がり難い。しかし２μｍ帯における浸透性は１０，６μｍの場合に比べて遥かに大きく、かつ適度な吸収性も呈する。この発明で採用するファイバーレーザーの場合にはこの２μｍ帯近傍に発振波長を有しているので、上記の重合せ群内部への赤外線エネルギー浸透量を確保し、熱可塑性樹脂部材界面の温度を高くすることができるのである。
この発明は熱可塑性樹脂部材の溶着において広く利用できるものである。
熱可塑性樹脂部材重合せ群の内部構造を示す断面模型図である。 従来の光源を用いた場合の同重合せ群内部の温度分布を示すグラフである。 従来の光源およびこの発明の光源を用いた場合の同重合せ群内部の温度分布を示すグラフである。 ポリカーボネイト（ＰＣ）についての赤外線の波長と透過率の関係を示すグラフである。 ポリアミド（ＰＡ）についての赤外線の波長と透過率の関係を示すグラフである。
符号の説明
１ 支持体
３ 熱可塑性樹脂部材
５ 赤外線透過性固体材料
９ 赤外線光源

Claims (3)

  1. 支持体に対して２個以上の熱可塑性樹脂部材を重ね合せ、さらに赤外線透過性固体を重ね合せて重合せ群を形成し、この重合せ群に対して赤外線透過性固体側の光源から赤外線を照射するに際して、該光源としてＥｒ：ＹＡＧレーザーまたはファイバーレーザーを用いることを特徴とする熱可塑性樹脂部材の溶着方法
  2. 前記の光源として用いるＹＡＧレーザーの波長が２．９４μｍ帯である
    ことを特徴とする請求項１に記載の方法。
  3. 前記の光源として用いるファイバーレーザーの波長が１．９μｍ帯である
    ことを特徴とする請求項１に記載の方法。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020018916A (ja) * 2015-04-08 2020-02-06 出光ユニテック株式会社 ジッパーテープ、ジッパーテープ付袋体、および、ジッパーテープ付袋体の製造方法
US11370064B2 (en) 2015-04-08 2022-06-28 Idemitsu Unitech Co., Ltd. Zipper tape, bag with zipper tape, method for manufacturing bag with zipper tape, long member-bonding method capable of favorably bonding long members, device therefor, and zipper tape-bonding device

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WO2003039843A1 (en) * 2001-11-07 2003-05-15 Mitsui Chemicals Inc Process for welding of thermoplastic resins
JP2004351873A (ja) * 2003-05-30 2004-12-16 Fine Device:Kk 樹脂材間の接合方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003039843A1 (en) * 2001-11-07 2003-05-15 Mitsui Chemicals Inc Process for welding of thermoplastic resins
JP2004351873A (ja) * 2003-05-30 2004-12-16 Fine Device:Kk 樹脂材間の接合方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020018916A (ja) * 2015-04-08 2020-02-06 出光ユニテック株式会社 ジッパーテープ、ジッパーテープ付袋体、および、ジッパーテープ付袋体の製造方法
US11370064B2 (en) 2015-04-08 2022-06-28 Idemitsu Unitech Co., Ltd. Zipper tape, bag with zipper tape, method for manufacturing bag with zipper tape, long member-bonding method capable of favorably bonding long members, device therefor, and zipper tape-bonding device

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