JP2009124222A - Crystal vibrator, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a crystal vibrator which can be mass-produced by allowing a supporter to be easily and surely attached to a nail lead of a hermetic base. <P>SOLUTION: A crystal vibrator (100) includes; a crystal piece (1) having excitation electrodes (3) provided on both principal surfaces and having end face electrodes (4) electrically connected to the excitation electrodes, on both end surfaces of an outer peripheral path thereof; a base (2) having at least a pair of lead terminals (8) having nail head parts projected therefrom in opposition to the principal surfaces of the crystal piece; at least a pair of supporters (9-1) supporting the crystal piece (1) and having openings (14) for the nail head parts; and a bonding material (12) which connects the openings and the nail head parts and is fused at a prescribed temperature. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a crystal resonator, and more particularly, to a structure improvement of a support for a crystal resonator.

  Conventionally, as a crystal resonator, there is a highly stable crystal resonator using a thermostatic bath for communication equipment. The crystal resonators used for these are also required to cope with further downsizing and higher frequency.

  2. Description of the Related Art Conventionally, a high-stability crystal resonator includes, for example, an AT-cut circular crystal piece that is horizontally accommodated in a package and bonded to an electrode portion in the package. The package includes a metal hermetic base and a cover, and the hermetic base has a pair of nail lead terminals hermetically sealed with glass and penetrating the base. The nail lead terminal is formed by joining L-shaped supporters by laser welding. The quartz crystal vibrating piece is joined to the supporter by brazing.

In order to increase the impact resistance when dropped, the crystal resonator for high stability fixes the crystal vibrating piece with four supporters. A technique described in Patent Document 1 is known as a technology for fixing by this supporter.
JP 2002-261666 A Japanese Patent Laid-Open No. 05-55860

  The method of joining the supporter to the nail lead terminal disclosed in Patent Document 1 has a problem in mass productivity because the supporter is attached to the nail lead as disclosed in Patent Document 2 by laser welding one by one. . In addition, due to the difference in adhesion between the nail lead terminal and the supporter, there are problems such as the strength of the connection by welding and the supporter tilting.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a crystal unit capable of easily and surely attaching a supporter to a hermetic base nail lead, thereby enabling mass production, and a method for manufacturing the crystal unit. .

A crystal resonator according to a first aspect includes a crystal piece having excitation electrodes provided on both main surfaces and end electrodes electrically connected to the excitation electrodes on both end surfaces of the outer peripheral portion, and a nail facing the main surface of the crystal piece. A base having at least a pair of lead terminals protruding from the head, at least a pair of supporters supporting the crystal piece and having an opening with respect to the nail head, and the opening and the nail head are connected at a predetermined temperature. A bonding material that melts.
With this configuration, the opening and the nail head can be connected by using a bonding material that melts at a predetermined temperature. For this reason, large quantities can be produced at once by placing supporters in a furnace.

In the crystal resonator according to the second aspect, the supporter supports the crystal piece on the main surface of the crystal piece.
In the crystal resonator according to the third aspect, the supporter supports the crystal piece on the side surface between the main surface and the main surface of the crystal piece.

In the crystal resonator according to the fourth aspect, the area of the opening is smaller than the area of the nail head.
With this configuration, the nail head does not penetrate the opening when the opening is positioned with respect to the nail head.

The bonding material for the crystal resonator according to the fifth aspect is solder having a melting temperature higher than 260 ° C.
In general, when a crystal resonator is soldered to a printed circuit board or the like in a reflow furnace, it is fixed with a reflow solder that melts at 260 ° C. or less. For this reason, if the bonding material has a melting temperature higher than 260 ° C., the supporter and the nail head are not peeled off in the reflow furnace.

The opening of the crystal unit of the sixth aspect has a bridge near the center and has two openings.
With this configuration, the bonding area can be increased and the bonding strength can be increased.

The opening of the crystal resonator according to the seventh aspect has a bent portion, and the bent portion and the nail head fit each other.
Since the bent portion and the nail head can be fitted and temporarily fixed, positioning is easy and workability is improved.

According to an eighth aspect of the present invention, there is provided a crystal resonator manufacturing method comprising: a first disposing step of disposing a base having at least a pair of lead terminals projecting from a nail head on a heat-resistant jig; and at least an opening with respect to the nail head. A second arrangement step of arranging a pair of supporters; a third arrangement step of arranging a bonding material that melts at a predetermined temperature in the opening; and a heating step of heating the heat-resistant jig, the supporter, and the bonding material. The nail head and the supporter are connected by the material.
With this configuration, since the nail head and the supporter can be connected by the bonding material by heating, a large amount of connection between the nail head and the supporter can be performed at a time.

  In the crystal resonator manufacturing method according to the ninth aspect, the heat-resistant jigs can be stacked on each other, and a plurality of supporters and nail heads can be connected in a single heating process.

In the method for manufacturing a crystal resonator according to the tenth aspect, the supporter has a first pair of supporters and a second supporter arranged at a position different from the first pair of supporters, and the first pair of supporters. The bonding material that connects the supporter and the nail head is different from the bonding material that connects the second supporter and the nail head.
When a plurality of supporters cannot be connected by simultaneous heating, they can be connected by changing the melting temperature of the bonding material.

  The supporter is prevented from tilting and mass production can be easily achieved.

Hereinafter, embodiments of the crystal resonator according to the present invention will be described.
<Configuration of crystal unit>
<< First Example >>
1A is a cross-sectional view taken along the line XX ′ of FIG. 1B with the cover of the first crystal unit 100 of the first embodiment removed, and FIG. 1B is a plan view excluding the cover and the hermetic base 2. is there. (C) is an enlarged view of a range surrounded by an alternate long and short dash line in (a).

  The first crystal unit 100 includes an AT-cut or SC-cut circular crystal piece 1 and holds its main surface in parallel with the surface of the hermetic base 2. Excitation electrodes 3a and 3b are formed on both main surfaces of the crystal piece 1, and extraction electrodes 4a and 4b are formed up to the end surfaces (both end surfaces) of the outer peripheral portions of both ends. An end face electrode 5 is formed on the end faces of the extraction electrodes 4a and 4b by applying a conductive material mainly composed of silver (Ag).

  The hermetic base 2 is made of Kovar alloy or the like, and a hole 2h is formed in a part thereof. In the hole 2h, a pair of nail lead terminals 8a and 8b are hermetically sealed by the glass 6 in a state of projecting to the surface through the base body. Each of the pair of nail lead terminals 8a and 8b has a nail head 7 formed at the tip thereof. L-shaped first supporters 9-1a and 9-1b whose inner surfaces face each other are horizontally joined to the nail heads 7 of the pair of nail lead terminals 8a and 8b. Gold brazing material 10 of gold germanium (Au · Ge) is applied to the inner surfaces of the first supporters 9-1a and 9-1b, and brazed (brazed) to both end surfaces of the crystal piece 1 by thermocompression bonding. Thereby, the both ends of the crystal piece 1 are electrically and mechanically connected to the first supporters 9-1a and 9-1b. In the first embodiment, the first supporters 9-1a and 9-1b are formed to support the main surface on the back side of the crystal piece 1.

  As shown in FIG. 1A (b), a pair of nail lead terminals (not shown) are further provided in a direction orthogonal to the pair of nail lead terminals 8a and 8b. L-shaped first supporters 9-1c and 9-1d whose inner surfaces are opposed to each other are joined horizontally. The first supporters 9-1c and 9-1d mechanically bond the end surface of the crystal piece 1 with the adhesive 11. Note that the L-shaped first supporters 9-1c and 9-1d are not necessarily required, and the crystal piece 1 may be supported by three first supporters.

  After brazing the crystal piece 1 to the first supporters 9-1a and 9-1b, and mechanically connecting the end face of the crystal piece 1 to the first supporters 9-1c and 9-1d by the adhesive material 11, A cover (not shown) is joined to the hermetic base 2 by resistance welding or the like and hermetically sealed.

  The nail heads 7 of the pair of nail lead terminals 8a and 8b and the first supporters 9-1a and 9-1b are connected by high-temperature solder 12. As shown in FIG. 1A (c), the high temperature solder 12 is melted in a state where the opening 14 of the first supporter 9-1 and the nail head 7 of the nail lead terminal 8 are aligned. For example, a gold germanium (Au · Ge) alloy or a gold silicon (Au · Si) alloy having a melting point of 350 ° C or higher can be applied to the high-temperature solder 12.

  FIG. 2A is a perspective view of the first supporter 9-1, and FIG. 2B is a perspective view of a supporter support frame 9-5 having a plurality of first supporters 9-1.

  As shown in FIG. 2A, the first supporter 9-1 has an opening 14. The opening 14 is circular and is slightly smaller than the size of the nail head 7 of the nail lead terminal 8 and can be easily filled with the high-temperature solder 12. The opening 14 may be circular or polygonal.

  As shown in FIG. 2B, a part of the first supporter 9-1 is connected to the supporter support frame 9-5. The supporter support frame 9-5 connects, for example, 20 first supporters 9-1. For this reason, it can handle in the unit of one supporter support frame 9-5, without handling each 1st supporter 9-1.

  FIG. 3A is a perspective view showing a configuration of the first embodiment when the first supporter 9-1 and the nail lead terminal 8 are joined and put into an electric furnace, and FIG. 3B is a cross-sectional view of FIG. FIG.

  The jig used in the first embodiment shown in FIG. 3A includes a first heat-resistant tray 40 and a tray support 45. The first heat-resistant tray 40 is a plate-like member in which grooves 42 are formed so that the hermetic bases 2 can be arranged side by side. A hole 40 h through which the nail lead terminal 8 passes is formed at a predetermined position of the first heat-resistant tray 40. The tray support 45 has a shape having a support portion 47 that supports the first heat-resistant tray 40 and a placement portion 49 on which the supporter support frame 9-5 is placed. In a state where the tray support 45 is placed on the support 47, the lower end of the nail lead terminal 8 can be positioned without being in contact with the tray support 45. A metal or ceramic material (refractory) is used for the first heat-resistant tray 40 and the tray support 45.

  Next, a process of connecting the first supporter 9-1 to the nail head 7 of the nail lead terminal 8 will be described.

  First, the hermetic base 2 including the nail lead terminals 8 a and 8 b is set on the first heat resistant tray 40, and the first heat resistant tray 40 is placed on the support portion 47 of the tray support 45. A pair of supporter support frames 9-5 including the first supporter 9-1 are placed on the placement portions 49 on both sides of the tray support 45. Although not shown, the jig has a reference for positioning the hermetic base 2 and the supporter support frame 9-5. Then, the hot solder 12 is placed on the opening 14 of the first supporter 9-1 in a state where the opening 14 of the first supporter 9-1 and the nail head 7 of the nail lead terminal 8 are aligned. The shape of the high-temperature solder 12 may be spherical or conical, but the high-temperature solder 12 has a volume suitable for connecting the first supporter 9-1 and the nail head 7 of the nail lead terminal 8, Try not to be missing or too much.

  Next, the tray support 45 with the high-temperature solder 12 placed on the opening 14 of the first supporter 9-1 is placed in an electric furnace. The electric furnace is maintained at a temperature of 360 ° C or higher. When the tray support 45 is heated for a predetermined time in the electric furnace, the high temperature solder 12 is melted and the first supporter 9-1 and the nail lead terminals 8a and 8b are connected. And the tray support tool 45 is taken out from an electric furnace, and the 1st supporter 9-1 is cut off from the supporter support frame 9-5. As a result, L-shaped first supporters 9-1a and 9-1b whose inner surfaces face each other are horizontally joined to the nail heads 7 of the pair of nail lead terminals 8a and 8b.

  The reason why the temperature of the electric furnace is set to 360 ° C. or more is that the high-temperature solder 12 uses, for example, a gold germanium (Au · Ge) alloy or a gold silicon (Au · Si) alloy having a melting point of 350 ° C. or more. It is preferable not to use a material whose melting temperature of the high-temperature solder 12 is 260 ° C. or less. When the first crystal unit 100 is soldered to a printed circuit board or the like in a reflow furnace, the temperature of the reflow furnace becomes about 260 ° C., the high-temperature solder 12 is melted again, and the nail lead terminals 8a, 8b This is because the connection between the nail head 7 and the first supporter 9-1 may be lost.

  As shown in FIG. 1A (b), when the first supporters 9-1c and 9-1d are provided, the hermetic base 2 is taken out from the first heat-resistant tray 40, and the hermetic base 2 is rotated 90 degrees and then again. Place on the first heat-resistant tray 40. And the hot solder 12 is mounted in the opening part 14 in the state which aligned the opening part 14 of the 1st supporter 9-1, and the nail head part of a nail lead terminal. The high-temperature solder 12 used here is, for example, a gold-tin (Au · Sn) alloy of the high-temperature solder 12 having a melting point of 280 ° C. Then, the first heat-resistant tray 40 is placed on the support portion 47 of the tray support 45, placed in an electric furnace at about 300 ° C., the high-temperature solder 12 is melted, and the first supporters 9-1c and 9-1d are connected. Thereafter, the tray support 45 is taken out from the electric furnace, and the supporter 9-1 is separated from the supporter support frame 9-5. Thereby, the L-shaped first supporters 9-1c and 9-1d whose inner surfaces face each other are horizontally joined to the nail heads 7 of the pair of nail lead terminals.

  That is, for the first supporters 9-1a and 9-1b, a gold germanium (Au · Ge) alloy or a gold silicon (Au · Si) alloy having a melting point of 350 ° C or higher is used, and the first supporters 9-1c, For 9-1d, a gold-tin (Au.Sn) alloy of high-temperature solder 12 having a melting point of 280 ° C. is used. In this way, high-temperature solder having a low melting temperature is used for the supporter 9 to be connected later. As a result, the joint between the first supporters 9-1a and 9-1b joined first and the nail head 7 is prevented from being loosened or deformed.

  Returning to FIG. 3 (a) again, FIG. 3 (a) shows a state where seven hermetic bases 2 are set. For example, the supporter support frame 9-5 includes 20 first supporters 9-1. The twenty hermetic bases 2 are connected and can be placed on the first heat-resistant tray 40. And 20 pairs of 1st supporters 9-1 can be fixed to a nail lead terminal only by putting the 1st heat-resistant tray 40 on the tray support 45, and putting in an electric furnace. Unlike conventional methods of attaching supporters to nail leads one by one by laser welding, they can be mass-produced efficiently.

  When the tray support 45 is transported to an electric furnace or the like, the supporter support frame 9-5 is displaced from the placement portions 49 on both sides of the tray support 45, or the first heat-resistant tray 40 is moved to the tray support 45. Such a clamping mechanism or the like may be provided on the tray support 45 so as not to be displaced from the support portion 47 of the tray.

<< Second Example >>
4A is a cross-sectional view taken along the line XX ′ of FIG. 4B with the cover of the second crystal unit 110 of the second embodiment removed, and FIG. 4B is a plan view excluding the cover and the hermetic base 2. is there. (C) is an enlarged view of a range surrounded by an alternate long and short dash line in (a).

  The second crystal unit 110 and the first crystal unit 100 are different in the shape of the supporter 9. As shown in FIG. 1 and the like, in the first embodiment, the first supporters 9-1a and 9-1b support the main surface on the back side of the crystal piece 1, whereas in the second embodiment, the second supporter 9-1a and 9-1b Supporters 9-2a and 9-2b support the side surface of the crystal piece 1.

  L-shaped second supporters 9-2a and 9-2b whose inner surfaces face each other are horizontally joined to the nail heads 7 of the pair of nail lead terminals 8a and 8b. Gold brazing material 10 is applied to the inner surfaces of the second supporters 9-2a and 9-2b, and brazed by thermocompression bonding with both end surfaces of the crystal piece 1. Both ends of the crystal piece 1 are electrically and mechanically connected to the second supporters 9-2a and 9-2b.

  In FIG. 4B, L-shaped second supporters 9-2c and 9-2d are joined horizontally in a direction orthogonal to the pair of second supporters 9-2a and 9-2b. The second supporters 9-2c and 9-2d mechanically bond the end face of the crystal piece 1 with the adhesive 11. If the holding strength of the crystal blank 1 is ensured by the pair of second supporters 9-2a and 9-2b, it is not necessary to prepare the second supporters 9-2c and 9-2d.

  As shown in FIG. 4C, the second supporter 9-2 is provided with an opening 14. With the opening 14 of the second supporter 9-2 and the nail head 7 of the nail lead terminal 8 aligned, a gold germanium (Au · Ge) alloy, a gold tin (Au · Sn) alloy, and gold silicon ( Any one of the high-temperature solders 12 such as Au · Si) alloy is put into the opening 14 of the supporter 9 and melted to connect the second supporter 9-2 and the nail lead terminal 8.

  FIG. 5A is a cross-sectional view showing the configuration of the second heat-resistant tray 30 when the second supporter 9-2 and the nail lead terminal 8 are joined, and the second heat-resistant tray 30 is placed in the electric furnace, and FIG. 2 is a perspective view of a heat resistant tray 30. FIG.

  As shown in FIGS. 5A and 5B, the second heat-resistant tray 30 includes a hole 30h through which the nail lead terminal 8 passes at a predetermined position. The second heat-resistant tray 30 is made of a refractory material, and is, for example, a cordierite-type or mullite-type round sheath (boiled bowl). The second heat-resistant tray 30 is lightweight, has a small coefficient of thermal expansion, and is not deformed by heating.

  A first fitting portion 31 a is formed on the outer periphery of the bottom portion of the second heat-resistant tray 30, and overlaps the tip 31 b of the outer peripheral wall 30 p of the second heat-resistant tray 30. For this reason, a plurality of second heat resistant trays 30 can be stacked. The height L1 of the outer peripheral wall 30p is such that the second supporter 9-2 is overlapped when the hermetic base 2 having the nail lead terminals 8 is placed in the second heat-resistant tray 30 and the second supporter 9-2 is attached. The height does not collide with the bottom surface of the combined second heat-resistant tray 30.

  Next, a process in which the second supporter 9-2 is connected to the nail head 7 of the nail lead terminal 8 will be described.

  As shown in FIG. 5A, the hermetic base 2 provided with the nail lead terminals 8 is set on the second heat-resistant tray 30. Further, the four second supporters 9-2 are placed on the four nail lead terminals 8. Then, with the opening 14 of the second supporter 9-2 and the nail head 7 of the nail lead terminal 8 aligned, the high-temperature solder 12 is put into the opening 14 of the second supporter 9-2. In this manner, the second heat-resistant tray 30 containing the hermetic base 2 and the second supporter 9-2 is sequentially loaded in the electric furnace. And by heating the inside of an electric furnace to predetermined temperature, many 2nd supporters 9-2 can be fixed to a nail lead terminal at once, and it can mass-produce efficiently.

  FIG. 6A is a cross-sectional view showing the configuration of the third heat-resistant tray 35 when the supporter 9 and the nail lead terminal 8 are joined, and FIG. 6B is a perspective view of the third heat-resistant tray 35. It is.

  The third heat-resistant tray 35 shown in FIG. 6 has a hole 35h through which the nail lead terminal 8 passes at a predetermined position. The third heat-resistant tray 35 is made of a refractory material, and is, for example, a cordierite or mullite H-shaped sheath. Since the outer wall 35p is not formed in one direction of the third heat-resistant tray 35 and is released, it is easy to set the hermetic base 2 provided with the nail lead terminals and is excellent in workability.

  A second fitting portion 35a is formed at the tip of the lower outer wall 35p of the H-shaped sheath of the third heat-resistant tray 35, and a third fitting portion 35b is formed at the tip of the upper outer wall 35p of the H-shaped sheath. ing. The 2nd fitting part 35a and the 3rd fitting part 35b are piled up. For this reason, a plurality of third heat-resistant trays 35 can be stacked. The height L2 of the outer wall 35p on the upper side of the H-shaped sheath and the height L3 of the outer wall 35p on the lower side of the H-shaped sheath are provided with the nail lead terminals 8 in the third heat-resistant tray 35. When the hermetic base 2 is inserted and the second supporter 9-2 is attached, the second supporter 9-2 does not collide with the bottom surface of the second heat-resistant tray 30 superimposed.

  In FIG. 6, the hermetic base 2 having the nail lead terminal 8 is set on the third heat-resistant tray 35. Further, the four second supporters 9-2 are placed on the four nail lead terminals 8. Then, with the opening 14 of the second supporter 9-2 and the nail head 7 of the nail lead terminal 8 aligned, the high-temperature solder 12 is put into the opening 14 of the second supporter 9-2. In this manner, the third heat-resistant tray 35 containing the hermetic base 2 and the second supporter 9-2 is sequentially loaded in the electric furnace. The third heat-resistant tray 35 can be easily stacked not only in the vertical direction but also in the horizontal direction in the electric furnace. And by heating the inside of an electric furnace to predetermined temperature, many 2nd supporters 9-2 can be fixed to a nail lead terminal at once, and it can mass-produce efficiently.

  FIG. 7A is a perspective view of the second supporter 9-2. 7B and 7C are perspective views showing modifications of the second supporter.

  As shown in FIG. 7A, an opening 14 is provided in the second supporter 9-2. The opening 14 is circular and is slightly smaller than the size of the nail head 7 of the nail lead terminal 8 and can be easily filled with the high-temperature solder 12.

  FIG. 7B shows a first modification of the second supporter, and the supporter 9-2 'is provided with an opening 15. The opening 15 is square and slightly smaller than the size of the nail head 7 of the nail lead terminal 8 and is punched on both sides leaving a bridge portion 15c having a width of one third of one side at the center. For this reason, two small openings are provided, and the bonding area between the supporter 9-2 'and the high-temperature solder 12 is increased, and the bonding strength can be increased.

  FIG. 7C-1 shows a second modification of the second supporter 9-2. The supporter 9-2 ″ has an opening 16. The opening 16 is rectangular and the bent portion 16S has a long side LL. The short side LS is smaller than the size of the nail head 7 of the nail lead terminal 8, and the bent portion 16S of the opening 16 is fitted into the nail head 7 of the nail lead terminal 8 by pressing (caulking). Since the short side LS is not crimped to the nail head 7 and pushed too much, positioning is easy and workability is good.

  FIG. 7 (c-2) is a cross-sectional view showing a state where the bent portion 16 </ b> S of the opening 16 is pushed into the nail head 7 of the nail lead terminal 8. The bonding area between the supporter 9-2 ″ and the high-temperature solder 12 is increased, and the bonding strength can be increased.

  In addition, although the supporter 9-2 ′ of the first modification and the supporter 9-2 ″ of the second modification are shown with respect to the second supporter 9-2, the first supporter 9- shown in FIG. The opening 15 or the opening 16 can be applied to 1.

  In the above embodiment, the hermetic base 2 is made of Kovar alloy, but may be glass or ceramic. In the above embodiment, the main surface of the crystal piece 1 is arranged parallel to the horizontal plane of the hermetic base 2, but the main surface of the crystal piece 1 is arranged perpendicular to the horizontal plane of the hermetic base 2. Anyway.

(A) is X-X 'sectional drawing of (b) which removed the cover of the crystal oscillator of 1st Example. (B) is a plan view excluding the cover and the hermetic base 2. (C) is the elements on larger scale of (a). (A) is a perspective view of the 1st supporter 9-1 of 1st Example. (B) is a perspective view of the supporter support frame 9-5 of the first embodiment. (A) is a perspective view which shows the structure at the time of putting the hermetic base 2 of 1st Example in an electric furnace. (B) is sectional drawing of (a). (A) is X-X 'sectional drawing of (b) which removed the cover of the crystal oscillator of 2nd Example of this invention. (B) is a plan view excluding the cover and the hermetic base 2. (C) is the elements on larger scale of (a). (A) is sectional drawing which shows the structure of the 2nd heat resistant tray 30 at the time of putting in an electric furnace. FIG. 4B is a perspective view of the second heat resistant tray 30. FIG. (A) is sectional drawing which shows the structure of the 3rd heat resistant tray 35 at the time of putting in an electric furnace. FIG. 4B is a perspective view of the third heat resistant tray 35. (A) is a perspective view of the 2nd supporter 9-2. (B) is a perspective view of Modification 1 of the second supporter 9-2. (C) is a perspective view of Modification 2 of the second supporter 9-2.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Crystal piece 2 ... Hermetic base 3 ... Excitation electrode 4 ... Extraction electrode 5 ... End surface electrode 6 ... Glass 7 ... Nail head 8a, 8b ... Nail lead terminal 8h ... Nail lead terminal passage hole 9-1 ... 1st supporter, 9-2, 9-2 ', 9-2 "... second supporter 9-5 ... supporter support frame 10 ... brazing material 11 ... adhesive 12 ... high-temperature solder 14, 15, 16 ... opening 16S ... bent portion 30, 35, 40 ... heat-resistant tray 45 ... tray support 100 ... first crystal unit 110 ... second crystal unit

Claims (10)

A crystal piece having excitation electrodes provided on both main surfaces and end electrodes electrically connected to the excitation electrodes on both end faces of the outer peripheral portion;
A base having at least a pair of lead terminals protruding from a nail head to face the main surface of the crystal piece;
At least a pair of supporters that support the crystal piece and have an opening with respect to the nail head;
A bonding material that connects the opening and the nail head and melts at a predetermined temperature;
A crystal resonator comprising:   The crystal resonator according to claim 1, wherein the supporter supports the crystal piece on a main surface of the crystal piece.   2. The crystal resonator according to claim 1, wherein the supporter supports the crystal piece on a side surface between the main surface and the main surface of the crystal piece.   4. The crystal resonator according to claim 1, wherein an area of the opening is smaller than an area of the nail head. 5.   The crystal unit according to claim 1, wherein the bonding material is solder having a melting temperature higher than 260 ° C.   6. The crystal resonator according to claim 1, wherein the opening has a bridge portion in the vicinity of the center thereof and has two openings. 7.   6. The crystal resonator according to claim 1, wherein the opening includes a bent portion, and the bent portion and the nail head are fitted to each other. A method of manufacturing a crystal resonator,
A first disposing step of disposing a base having at least a pair of lead terminals protruding from a nail head on a heat-resistant jig;
A second disposing step of disposing at least a pair of supporters having an opening with respect to the nail head;
A third arrangement step of arranging a bonding material that melts at a predetermined temperature in the opening;
A heating step of heating the heat-resistant jig, the supporter and the bonding material,
A method for manufacturing a crystal resonator in which the nail head and the supporter are connected by the bonding material.   9. The method for manufacturing a crystal resonator according to claim 8, wherein the heat-resistant jigs can be stacked on each other, and a plurality of the supporters and the nail heads can be connected in a single heating process. The supporter has a first pair of supporters and a second supporter disposed at a position different from the first pair of supporters,
9. The bonding material for connecting the first pair of supporters and the nail head and the bonding material for connecting the second supporter and the nail head are different from each other. A method for manufacturing a crystal unit.