JP2009117459A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component including an inductor enabling forming a resistor without adding a new insulation layer. <P>SOLUTION: A laminate 3 is formed by laminating a plurality of insulation layers 30. Coil electrodes 31 which are laminated together with the plurality of insulation layers 30 constitute a coil L by being electrically connected. Coil electrodes 41 which are laminated on the insulation layers 30 having the coil electrodes 31 laminated thereon constitute a resistor R electrically connected to the coil L by being electrically connected so as to cancel magnetic flux generated by each of the coil electrodes. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component, and more particularly to an electronic component in which an insulating layer and a coil electrode are laminated.

  Patent Document 1 describes a composite multilayer chip element including a resistor and a coil. In the composite laminated chip element, the conductor pattern constituting the resistor and the conductor pattern constituting the coil are formed on different insulating layers. As a result, a composite multilayer chip element having characteristics such as a desired resistance value and inductance value can be obtained.

However, in the composite multilayer chip element described in Patent Document 1, the conductor pattern constituting the resistor and the conductor pattern constituting the coil are formed in different insulating layers. It was necessary to add a new insulating layer that was formed, leading to an increase in manufacturing cost and an increase in the size of the device.
Special table 2007-500442 gazette

  Therefore, an object of the present invention is to provide an electronic component including an inductor that can form a resistor without adding a new insulating layer.

  The present invention is a laminated body formed by laminating a plurality of insulating layers, and a coil electrode laminated together with the plurality of insulating layers, and a plurality of first electrodes constituting a coil by being electrically connected. And the coil electrode laminated on at least a part of the insulating layer on which the first coil electrode is laminated, each of which is electrically connected so that the generated magnetic flux is canceled out. And a plurality of second coil electrodes constituting a resistor.

  According to the present invention, since the first coil electrode and the second coil electrode are formed on the same layer, it is not necessary to add a new insulating layer in order to form a resistor. As a result, the electronic component can be downsized and the manufacturing cost of the electronic component can be reduced.

  In the present invention, the plurality of second coil electrodes are coil electrodes having a spiral shape, and a current flowing through one second coil electrode of the two second coil electrodes connected to each other. May be electrically connected so that the direction of rotation of the current and the direction of rotation of the current flowing through the other second coil electrode are opposite to each other.

  In the present invention, the first coil electrodes may be electrically connected in an order different from the order of lamination.

  In the present invention, the plurality of first coil electrodes may overlap when viewed from the stacking direction.

  In the present invention, the laminate may be provided on a substrate formed of a magnetic material.

  In the present invention, the laminate may be formed smaller than the substrate when viewed from the lamination direction.

  In the present invention, the internal electrode may be produced by photolithography.

  In the present invention, the coil and the resistor may be electrically connected.

  According to the present invention, since the first coil electrode and the second coil electrode are formed on the same layer, it is not necessary to add a new insulating layer in order to form a resistor. As a result, the electronic component can be downsized and the manufacturing cost of the electronic component can be reduced.

  Hereinafter, an electronic component according to an embodiment of the present invention will be described with reference to the drawings.

(About the configuration of electronic components)
FIG. 1 is an external perspective view of an electronic component 1 according to an embodiment. FIG. 2 is an exploded perspective view of the electronic component 1 according to the embodiment.

An electronic component 1 shown in FIG. 1 includes a substrate 2, a laminate portion 3, and external electrodes 4 and 5. The substrate 2 is an insulating substrate made of, for example, a dielectric ceramic permeable material mainly composed of SiO ₂ and a magnetic ceramic material mainly composed of ferrite containing Ni, Zn, Cu and the like.

  The laminate portion 3 is provided on the substrate 2 and includes a coil L and a resistor R inside. The stacked body portion 3 is formed to be smaller than the substrate 2 when viewed from the stacking direction. The external electrodes 4 and 5 are respectively formed on the end surfaces of the electronic component 1 facing each other, and are electrically connected to the coil L or the resistor R. The external electrodes 4 and 5 are made of, for example, a conductive material containing Ag or Pd as a main component.

  Below, the laminated body part 3 is demonstrated in detail, referring FIG. The laminate portion 3 is configured by laminating insulating layers 30a, 30b, 30c, 30d, and 30z and coil electrodes 31a, 31b, 31c, 31d, 41a, 41b, 41c, and 41d.

  The insulating layers 30a, 30b, 30c, 30d, and 30z are rectangular layers made of an insulating material such as polyimide resin, for example. The insulating layers 30a, 30b, 30c, 30d, and 30z are formed smaller than the substrate 2 when viewed from the stacking direction. Thereby, the substrate 2 is in a state of protruding from the four sides of the insulating layers 30a, 30b, 30c, 30d, and 30z.

  The coil electrodes 31a, 31b, 31c, and 31d are formed on the main surfaces of the insulating layers 30a, 30b, 30c, and 30d, for example, with a conductive material mainly containing Ag or Pd.

  The coil electrodes 31a, 31b, 31c, and 31d are stacked in this order from above in the stacking direction, and are electrically connected by via-hole conductors (not shown) in an order different from the stacking order, thereby forming one coil L. This will be described in detail below.

  The coil electrode 31a includes a coil portion 32a and connection portions 34a and 35a. The coil electrode 31b includes a coil portion 32b and connection portions 34b and 35b. The coil electrode 31c includes a coil part 32c, a lead part 33c, and a connection part 35c. The coil electrode 31d includes a coil part 32d and a connection part 35d.

  The coil portions 32a, 32b, 32c, and 32d are electrodes that constitute a part of the coil L and have a spiral shape. A connecting portion 34a is formed at one end outside the spiral coil portion 32a, and a connecting portion 35a is formed at one end inside the coil portion 32a.

  A connection portion 34b is formed at one end outside the spiral coil portion 32b, and a connection portion 35b is formed at one end inside the coil portion 32b. A lead portion 33c is formed at one end outside the spiral coil portion 32c, and a connection portion 35c is formed at one end inside the coil portion 32c. The lead portion 33 c is electrically connected to the external electrode 4.

  A connecting portion 35d is formed at one end inside the spiral coil portion 32d. The other end of the spiral coil portion 32d is electrically connected to the coil electrode 41d.

  As described above, the coil electrodes 31a, 31b, 31c, and 31d are electrically connected in an order different from the stacking order. That is, the coil electrode 31a and the coil electrode 31c are disposed so as to sandwich the coil electrode 31b in the stacking direction and are electrically connected to each other. The coil electrode 31b and the coil electrode 31d are disposed so as to sandwich the coil electrode 31c in the stacking direction, and are electrically connected to each other. The coil electrode 31b and the coil electrode 31a are electrically connected to each other. More specifically, the coil electrode 31c and the coil electrode 31a are connected by connecting the connection portion 35c and the connection portion 35a with a via-hole conductor (not shown). The coil electrode 31a and the coil electrode 31b are connected by connecting the connection part 34a and the connection part 34b with a via-hole conductor (not shown). The coil electrode 31b and the coil electrode 31d are connected by connecting the connection part 35b and the connection part 35d with a via-hole conductor (not shown). Since the coil electrodes 31a, 31b, 31c, and 31d have the above connection relationship, the direction of rotation of the current flowing through each of the coil electrodes 31a, 31b, 31c, and 31d is the same. As a result, the coil L connected in the order of the coil electrode 31c, the coil electrode 31a, the coil electrode 31b, and the coil electrode 31d is formed. At this time, in order to generate parasitic capacitance between the coil electrodes 31a, 31b, 31c, and 31d, the coil portions 32a, 32b, 32c, and 32d are arranged so as to overlap each other when viewed from the stacking direction. .

  The coil electrodes 41a, 41b, and 41c are formed on the insulating layers 30a, 30b, and 30c on which the coil electrodes 31a, 31b, and 31c are formed so as not to overlap with the coil electrodes 31a, 31b, and 31c when viewed from the stacking direction. For example, the main surface is formed of a conductive material mainly composed of Ag or Pd. The coil electrode 41d is formed of a conductive material mainly composed of Ag or Pd on the substrate 2 on which the coil electrode 31d is formed so as not to overlap the coil electrode 31d when viewed from the stacking direction. .

  The coil electrodes 41a, 41b, 41c, and 41d are stacked in this order from above in the stacking direction, and are electrically connected by via hole conductors (not shown) in this order, thereby constituting a resistor R. This will be described in detail below.

  The coil electrode 41a includes a coil part 42a, a lead part 43a, and a connection part 45a. The coil electrode 41b includes a coil part 42b and connection parts 44b and 45b. The coil electrode 41c includes a coil part 42c and connection parts 44c and 45c. The coil electrode 41d includes a coil part 42d and a connection part 45d.

  The coil portions 42a, 42b, 42c, and 42d are electrodes that constitute a part of the resistor R and have a spiral shape. The coil portions 42a, 42b, 42c, and 42d are formed so as to rotate in the same direction (clockwise when viewed from the upper side in the stacking direction).

  A lead-out portion 43a is formed at one end outside the spiral coil portion 42a, and a connection portion 45a is formed at one end inside the coil portion 42a. The lead portion 43 a is electrically connected to the external electrode 5.

  A connecting portion 44b is formed at one end outside the spiral coil portion 42b, and a connecting portion 45b is formed at one end inside the coil portion 42b. A connection portion 44c is formed at one end outside the spiral coil portion 42c, and a connection portion 45c is formed at one end inside the coil portion 42c.

  A connecting portion 45d is formed at one end inside the spiral coil portion 42d. The other end of the spiral coil portion 42d is electrically connected to the coil electrode 31d. Thereby, the coil L and the resistance R are electrically connected.

  The coil electrodes 41a, 41b, 41c, and 41d are electrically connected in the order in which they are stacked as described above. That is, the coil electrode 41a and the coil electrode 41b are electrically connected to each other. The coil electrode 41b and the coil electrode 41c are electrically connected to each other. The coil electrode 41c and the coil electrode 41d are electrically connected to each other. More specifically, the coil electrode 41a and the coil electrode 41b are connected by connecting the connecting portion 45a and the connecting portion 45b with a via-hole conductor (not shown). The coil electrode 41b and the coil electrode 41c are connected by connecting the connection portion 44b and the connection portion 44c with a via-hole conductor (not shown). The coil electrode 41c and the coil electrode 41d are connected by connecting the connecting portion 45c and the connecting portion 45d with a via-hole conductor (not shown).

  As described above, the coil electrodes 41a, 41b, 41c, and 41d are configured to form the resistor R by being electrically connected so that the magnetic flux generated by each of them is canceled. This will be described below.

  As described above, the coil electrodes 41a, 41b, 41c, and 41d are formed to rotate in the same direction. Therefore, when the connection part 45a and the connection part 45b are connected, the connection part 44b and the connection part 44c are connected, and the connection part 45c and the connection part 45d are connected, the two coil electrodes 41a connected to each other, Of 41b, 41c and 41d, the direction of rotation of the current flowing through one coil electrode 41a, 41b, 41c and 41d is opposite to the direction of rotation of the current flowing through the other coil electrode 41a, 41b, 41c and 41d. . For example, when a current flows clockwise through the coil electrode 41a when viewed from the stacking direction, a current flows counterclockwise through the coil electrode 41b. Thereby, the magnetic flux which generate | occur | produces in coil electrode 41a, 41b, 41c, 41d is negated, and the function as a coil of coil electrode 41a, 41b, 41c, 41d is suppressed. As a result, the coil electrodes 41a, 41b, 41c and 41d function as the resistance R.

(effect)
According to the electronic component 1 having the above configuration, the coil electrodes 31a, 31b, 31c, and 31d and the coil electrodes 41a, 41b, 41c, and 41d are formed on the same layer, so that the resistor R is formed. Therefore, it is not necessary to add a new insulating layer. As a result, the electronic component 1 can be downsized and the manufacturing cost of the electronic component 1 can be reduced.

  Further, according to the electronic component 1, spiral coil electrodes 41a, 41b, 41c, and 41d are used as the resistance R. As described above, when the spiral coil electrodes 41a, 41b, 41c, and 41d are used, the length of the electrodes can be made longer than when the linear electrodes are used. As a result, the resistor R having a large resistance value can be formed in the electronic component 1.

  In addition, according to the electronic component 1, it is possible to obtain a resistor R having a desired resistance value by simply adjusting the lengths of the coil electrodes 41a, 41b, 41c, and 41d without adding a new insulating layer. . Therefore, the resistance value of the resistor R and the inductance value of the coil L can be adjusted independently.

  Further, according to the electronic component 1, the external electrodes 4 and 5 are formed by being bent at the corners of the substrate 2 across the main surface of the laminated body portion 3, the main surface and side surfaces of the substrate 2, as shown in FIG. 1. Has been.

  Further, according to the electronic component 1, the size of the parasitic capacitance can be changed without increasing the number of stacked layers only by changing the connection order of the coil electrodes 31a, 31b, 31c, and 31d. As a result, the resonance frequency can be set in a wide range in the electronic component 1.

  Hereinafter, the effects will be described with reference to the drawings. FIG. 3 is an equivalent circuit diagram of the electronic component 1 shown in FIG. FIG. 4 is an exploded perspective view of an electronic component 1 ′ that is a comparative example. FIG. 5 is an equivalent circuit diagram of an electronic component 1 ′ as a comparative example. In the electronic component 1 ′ shown in FIGS. 4 and 5, the same components as those of the electronic component 1 are described by adding “′” to the same reference numerals.

  In the electronic component 1 ′ that is the comparative example shown in FIG. 4, the coil electrode 31′c, the coil electrode 31′a, the coil electrode 31′b, and the coil electrode 31′d are stacked in this order from the upper layer. In this order of lamination, they are electrically connected.

  In the electronic component 1, as shown in FIG. 3, the coil electrode 31c, the coil electrode 31a, the coil electrode 31b, and the coil electrode 31d are connected in series as a coil in this order. A parasitic capacitance C1 is formed between the coil electrode 31a and the coil electrode 31b adjacent to each other in the stacking direction, and a parasitic capacitance C2 is formed between the coil electrode 31b and the coil electrode 31c adjacent to each other in the stacking direction. A parasitic capacitance C3 is formed between the coil electrode 31c and the coil electrode 31d adjacent to each other in the stacking direction.

  On the other hand, in the electronic component 1 ′ as the comparative example, as shown in FIG. 5, the coil electrode 31′c, the coil electrode 31′a, the coil electrode 31′b, and the coil electrode 31′d are arranged in series as a coil in this order. Connected. A parasitic capacitance C′1 is formed between the coil electrode 31′c and the coil electrode 31′a that are adjacent to each other in the stacking direction, and the coil electrode 31′a and the coil electrode 31′b that are adjacent to each other in the stacking direction Is formed between the coil electrode 31′b and the coil electrode 31′d adjacent to each other in the stacking direction.

  As described above, in the electronic component 1, by changing the order of connecting the coil electrodes 31a, 31b, 31c, and 31d from the stacking order, the equivalent circuit of the electronic component 1 and the electronic component that is the comparative example is made different. be able to. More specifically, the parasitic capacitance formed in the electronic component 1 can be made larger than the parasitic capacitance formed in the electronic component 1 ′ that is the comparative example. As a result, the resonance frequency can be set in a wide range in the electronic component 1.

  In addition, according to the electronic component 1, since the laminated body portion 3 is formed on the substrate 2 formed of a magnetic material, for example, when the laminated body portion is formed on a nonmagnetic material (alumina) substrate. As compared with the above, the inductance of the coil L can be increased. That is, it is possible to change the resonance frequency of the electronic component 1 by changing the material of the substrate 2.

(Modification)
Below, the modification of the electronic component 1 is demonstrated, referring drawings. FIG. 6 is an exploded perspective view showing a modification of the electronic component 1. The same components as those of the electronic component 1 in FIGS. 1 and 2 are denoted by the same reference numerals.

  In the electronic component 1, the resistor R may be composed of two coil electrodes 41c and 41d as shown in FIG. As described above, the resistance value of the resistor R is made smaller by configuring with the two coil electrodes 41c and 41d than when the resistor R is configured with the four coil electrodes 41a, 41b, 41c and 41d. Can do. That is, by adjusting the number of coil electrodes constituting the resistor R, the resistance value of the resistor R can be adjusted. However, the upper limit of the number of coil electrodes constituting the resistor R is preferably the number of coil electrodes constituting the coil L.

  In the electronic component 1 shown in FIG. 6, the coil electrodes constituting the coil L are not stacked on top of the coil electrodes 41 c and 41 d constituting the resistor R so as to overlap. However, the coil electrode constituting the coil L may be laminated on the upper layer of the coil electrodes 41c and 41d constituting the resistor R.

(About manufacturing method)
Below, the manufacturing method of the electronic component 1 is demonstrated, referring drawings. 7 and 8 are process cross-sectional views when the electronic component 1 is manufactured. The electronic component 1 described below is the electronic component 1 shown in FIGS. 7 and 8 show the manufacturing process of one electronic component 1, but in actuality, a plurality of electronic components 1 are collectively manufactured in a state of being arranged in a matrix. Yes.

  A substrate made of a magnetic material is prepared as the substrate 2. Next, as shown in FIG. 7A, an insulating layer 30d made of polyimide resin is formed on the substrate 2 by photolithography. Next, as shown in FIG. 7B, a conductive layer 31dA made of a conductive material mainly composed of Ag or Pd is formed on the insulating layer 30d by a dry plating method such as sputtering or vapor deposition.

  Next, after applying and drying a photosensitive resist on the conductive layer 31dA, a desired film is exposed by applying a mask film to the photosensitive resist. Next, the photosensitive resist is developed to form a resist pattern 40 having a shape in which unnecessary portions of the conductive layer 31dA are exposed, as shown in FIG. 7C.

  Next, after removing the exposed conductive layer 31dA by etching and then removing the resist pattern 40, coil electrodes 31d and 41d are formed as shown in FIG.

  Next, as shown in FIG. 8B, an insulating layer 30c made of polyimide resin is formed on the insulating layer 30d and the coil electrodes 31d and 41d by photolithography. At this time, a via hole H is formed in the insulating layer 30c on the connecting portion 45d. FIG. 9 is a top view of the substrate 2 viewed from the stacking direction during the manufacturing process of the electronic component 1. In FIG. 9, a plurality of insulating layers 30c are formed in a matrix. As shown in FIG. 9, the insulating layer 30c is formed with a predetermined gap from the adjacent insulating layer 30c.

  Next, as shown in FIG. 8C, a conductive layer 31cA is formed on the insulating layer 30c by a dry plating method. At this time, the via hole H is filled with a conductive material, and the via hole conductor B is formed. Thereafter, the processing described with reference to FIGS. 7C to 8C is performed on the conductive layer 31cA. Thereby, the coil electrodes 31c and 41c and the insulating layer 30b are formed on the insulating layer 30c. Further, the processing described with reference to FIGS. 7C to 8C is repeated to form the coil electrodes 31a, 31b, 41a, and 41b. Thereafter, an insulating layer 30z made of polyimide resin is formed on the coil electrodes 31a and 41a and the insulating layer 30a.

  Thereafter, the substrate 2 is cut by a dicer and separated into individual electronic components 1. At this time, the substrate 2 is cut so that the dicer passes through the portions where the insulating layers 30a, 30b, and 30c are not formed, as shown by the dotted line in FIG. Further, a barrel is applied to the cut electronic component 1. Thereby, the corners of the substrate 2 are chamfered.

  Finally, external electrodes 4 and 5 are formed. Specifically, a conductive paste made of Ag and resin is applied and cured to form a silver electrode. Next, Ni plating and Sn plating are performed on the silver electrode to form the external electrodes 4 and 5. The electronic component 1 is completed through the above steps.

  As described above, the coil electrodes 31a, 31b, 31c, 31d, 41a, 41b, 41c, and 41d of the electronic component 1 are manufactured by photolithography. By using photolithography, coil electrodes 31a, 31b, 31c, 31d, 41a, 41b, 41c, and 41d having narrow line widths can be formed. As a result, the number of turns of the coil electrodes 31a, 31b, 31c, 31d, 41a, 41b, 41c, and 41d can be increased, and the number of stacked electronic components 1 can be suppressed.

  In addition, since the substrate 2 is barreled and the corners of the substrate 2 are chamfered, the external electrodes 4 and 5 are prevented from being peeled off at the corners of the substrate 2.

  The insulating layers 30a, 30b, 30c, 30d, and 30z are formed smaller than the substrate 2 when viewed from the stacking direction. Thereby, it can suppress effectively that the external electrodes 4 and 5 peel from the board | substrate 2. FIG. This will be described below with reference to FIGS. 9 and 10. FIG. 10 is an enlarged view of the vicinity of the corner of the substrate 2 of the electronic component 1.

  When the insulating layers 30a, 30b, 30c, 30d, and 30z are formed on the entire surface of the substrate 2 and cut with a dicer, polyimide whiskers are generated on the cut surfaces of the insulating layers 30a, 30b, 30c, 30d, and 30z. . When such a polyimide whiskers occur, it is difficult to form the external electrodes 4 and 5 with high accuracy.

  On the other hand, in the electronic component 1, as shown in FIGS. 9 and 10, the insulating layers 30a, 30b, 30c, 30d, and 30z are not formed in the portion through which the dicer passes. Therefore, when the electronic component 1 is carved, the polyimide beard as described above does not occur. Thereby, the external electrodes 4 and 5 can be formed with high accuracy. As a result, peeling of the external electrodes 4 and 5 in the electronic component 1 is suppressed.

  In the electronic component 1, the external electrodes 4 and 5 are formed using a conductive paste containing a resin. Since the external electrodes 4 and 5 are also formed on the insulating layers 30a, 30b, 30c, 30d, and 30z made of resin (polyimide), the adhesion to the insulating layers 30a, 30b, 30c, 30d, and 30z is good. Therefore, in the electronic component 1, the external electrodes 4 and 5 are suppressed from peeling off.

  In the electronic component 1, circuit elements such as coils L may be formed in an array.

  Further, in the electronic component 1 shown in FIG. 6, a further coil may be formed by forming a coil electrode on the insulating layers 30a and 30b.

1 is an external perspective view of an electronic component according to an embodiment of the present invention. It is a disassembled perspective view of the said electronic component. It is an equivalent circuit diagram of the electronic component. It is a disassembled perspective view of the electronic component which is a comparative example. It is an equivalent circuit schematic of the electronic component which is a comparative example. It is the disassembled perspective view which showed the modification of the electronic component which concerns on one Embodiment of this invention. It is process sectional drawing at the time of manufacture of the electronic component which concerns on one Embodiment of this invention. It is process sectional drawing at the time of manufacture of the electronic component which concerns on one Embodiment of this invention. It is the top view which looked at the board | substrate from the lamination direction at the time of the manufacturing process of the said electronic component. It is an enlarged view near the corner of the substrate of the electronic component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Board | substrate 3 Laminated body part 4, 5 External electrode 30a, 30b, 30c, 30d, 30z Insulating layer 31a, 31b, 31c, 31d, 41a, 41b, 41c, 41d Coil electrode 32a, 32b, 32c, 32d, 42a, 42b, 42c, 42d Coil part 33c, 43a Lead part 34a, 34b, 35a, 35b, 35c, 35d, 44b, 44c, 45a, 45b, 45c, 45d Connection part B Via-hole conductor C1, C2, C3 Parasitic capacitance H Via hole L Coil R Resistance

Claims (8)

A laminate formed by laminating a plurality of insulating layers;
A plurality of first coil electrodes that are laminated together with the plurality of insulating layers and that are electrically connected to form a coil; and
A coil electrode laminated on at least a part of the insulating layer on which the first coil electrode is laminated, each of which is electrically connected so as to cancel the magnetic flux generated thereby, A plurality of second coil electrodes constituting
Providing
Electronic parts characterized by The plurality of second coil electrodes are coil electrodes having a spiral shape, and a rotation direction of a current flowing through one second coil electrode of the two second coil electrodes connected to each other; Being electrically connected so that the direction of rotation of the current flowing through the other second coil electrode is opposite;
The electronic component according to claim 1. The first coil electrodes are electrically connected in an order different from the order of lamination;
The electronic component according to claim 1, wherein: The plurality of first coil electrodes overlapping when viewed from the stacking direction;
The electronic component according to any one of claims 1 to 3, wherein: The laminated body is provided on a substrate formed of a magnetic material;
The electronic component according to claim 1, wherein: The laminate is formed smaller than the substrate when viewed from the lamination direction;
The electronic component according to claim 5. The internal electrode is made by photolithography,
The electronic component according to claim 1, wherein: The coil and the resistor are electrically connected;
The electronic component according to claim 1, wherein:

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