JP2009111642A5 - - Google Patents

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Publication number
JP2009111642A5
JP2009111642A5 JP2007280866A JP2007280866A JP2009111642A5 JP 2009111642 A5 JP2009111642 A5 JP 2009111642A5 JP 2007280866 A JP2007280866 A JP 2007280866A JP 2007280866 A JP2007280866 A JP 2007280866A JP 2009111642 A5 JP2009111642 A5 JP 2009111642A5
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JP
Japan
Prior art keywords
sidewall
etching
surface layer
aqueous solution
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007280866A
Other languages
English (en)
Japanese (ja)
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JP2009111642A (ja
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Publication date
Application filed filed Critical
Priority to JP2007280866A priority Critical patent/JP2009111642A/ja
Priority claimed from JP2007280866A external-priority patent/JP2009111642A/ja
Publication of JP2009111642A publication Critical patent/JP2009111642A/ja
Publication of JP2009111642A5 publication Critical patent/JP2009111642A5/ja
Pending legal-status Critical Current

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JP2007280866A 2007-10-29 2007-10-29 微細凹部形成方法およびコンデンサマイクロホンの製造方法 Pending JP2009111642A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007280866A JP2009111642A (ja) 2007-10-29 2007-10-29 微細凹部形成方法およびコンデンサマイクロホンの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007280866A JP2009111642A (ja) 2007-10-29 2007-10-29 微細凹部形成方法およびコンデンサマイクロホンの製造方法

Publications (2)

Publication Number Publication Date
JP2009111642A JP2009111642A (ja) 2009-05-21
JP2009111642A5 true JP2009111642A5 (enExample) 2010-09-02

Family

ID=40779669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007280866A Pending JP2009111642A (ja) 2007-10-29 2007-10-29 微細凹部形成方法およびコンデンサマイクロホンの製造方法

Country Status (1)

Country Link
JP (1) JP2009111642A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486069B (zh) * 2010-05-18 2015-05-21 Taiwan Carol Electronics Co Ltd Capacitive microphone process
CN102328899A (zh) * 2011-08-05 2012-01-25 上海先进半导体制造股份有限公司 不同深度腔体的制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3873630B2 (ja) * 2001-01-29 2007-01-24 セイコーエプソン株式会社 コンデンサマイクロホンの製造方法
JP2006062148A (ja) * 2004-08-25 2006-03-09 Fuji Xerox Co Ltd シリコン構造体製造方法、モールド金型製造方法、シリコン構造体、インクジェット記録ヘッド、画像形成装置、及び、半導体装置

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