JP2009105274A - 拡張基板装置、及び電子機器 - Google Patents
拡張基板装置、及び電子機器 Download PDFInfo
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- JP2009105274A JP2009105274A JP2007276568A JP2007276568A JP2009105274A JP 2009105274 A JP2009105274 A JP 2009105274A JP 2007276568 A JP2007276568 A JP 2007276568A JP 2007276568 A JP2007276568 A JP 2007276568A JP 2009105274 A JP2009105274 A JP 2009105274A
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
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- 125000006850 spacer group Chemical group 0.000 description 9
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
【解決手段】拡張基板装置2は、主基板3と、副基板4と、主基板3及び副基板4を固定する基板用固定具5と、から構成される。基板用固定具5は、長方形状の導電体の金属板からなり、金属板の長手方向の辺縁を直角に折り曲げて主基板用取付部54,55を形成し、主基板用取付部54,55を形成した辺縁の反対側の辺縁を、主基板用取付部54,55と対向するように直角に折り曲げて副基板用取付部53を形成する。拡張基板装置2は、主基板用取付部54,55と副基板用取付部53により、主基板3及び副基板4が並行で、且つ主基板3及び副基板4を挟むように、主基板3及び副基板4を取り付ける。
【選択図】図2
Description
株式会社アイ・オー・データ機器、"PCI接続ハードウェアDVエンコーダ搭載TVチューナ&DVキャプチャーボード GV−ADTV"、[online]、株式会社アイ・オー・データ機器、製品一覧、[平成19年10月16日検索]、<URL:http://www.iodata.jp/prod/multimedia/tv/2003/gv-adtv/index.htm>
Claims (5)
- 電子機器の特定の機能を実現するための第1の基板及び第2の基板と、
長方形状の金属性導電体の長手方向の第1の辺縁を直角に折り曲げて形成した第1の取付部と、前記第1の辺縁と反対側の長手方向に位置する第2の辺縁を前記第1の取付部に対向するように直角に折り曲げて形成した第2の取付部と、備える基板用固定具と、を備え、
前記第1の取付部及び第2の取付部に、前記第1の基板及び第2の基板の接地端子を取り付けたことを特徴とする電子機器に取り付け可能な拡張基板装置。 - 前記第1の取付部は、前記第1の辺縁付近に形成し、前記第2の取付部は、前記第2の辺縁付近に形成した請求項1に記載の拡張基板装置。
- 前記第1の取付部及び第2の取付部が、それぞれ複数個所ある請求項1又は請求項2に記載の拡張基板装置。
- 前記第1の基板のコネクタ及び前記第2の基板のコネクタは、ケーブルを介して電気的に接続される請求項1〜請求項3の何れか1項に記載の拡張基板装置。
- 請求項1〜4に記載の拡張基板装置を取り付ける拡張スロットを少なくとも1つ有する筺体を備え、
前記金属性導電体が接触する箇所が接地されている電子機器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007276568A JP5058747B2 (ja) | 2007-10-24 | 2007-10-24 | 拡張基板装置 |
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JP2007276568A JP5058747B2 (ja) | 2007-10-24 | 2007-10-24 | 拡張基板装置 |
Publications (2)
Publication Number | Publication Date |
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JP2009105274A true JP2009105274A (ja) | 2009-05-14 |
JP5058747B2 JP5058747B2 (ja) | 2012-10-24 |
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Application Number | Title | Priority Date | Filing Date |
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JP2007276568A Active JP5058747B2 (ja) | 2007-10-24 | 2007-10-24 | 拡張基板装置 |
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JP (1) | JP5058747B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014090543A (ja) * | 2012-10-29 | 2014-05-15 | Asmo Co Ltd | 制御回路付きモータ |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63110068U (ja) * | 1987-01-08 | 1988-07-15 | ||
JPH04288898A (ja) * | 1991-03-18 | 1992-10-13 | Sony Corp | 電子機器 |
JPH08203573A (ja) * | 1995-01-31 | 1996-08-09 | Tec Corp | 回路基板接地装置 |
JP2005327888A (ja) * | 2004-05-14 | 2005-11-24 | Nec Access Technica Ltd | 基板接続具及び基板接続具を用いた携帯型電子端末装置 |
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2007
- 2007-10-24 JP JP2007276568A patent/JP5058747B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63110068U (ja) * | 1987-01-08 | 1988-07-15 | ||
JPH04288898A (ja) * | 1991-03-18 | 1992-10-13 | Sony Corp | 電子機器 |
JPH08203573A (ja) * | 1995-01-31 | 1996-08-09 | Tec Corp | 回路基板接地装置 |
JP2005327888A (ja) * | 2004-05-14 | 2005-11-24 | Nec Access Technica Ltd | 基板接続具及び基板接続具を用いた携帯型電子端末装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014090543A (ja) * | 2012-10-29 | 2014-05-15 | Asmo Co Ltd | 制御回路付きモータ |
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