JP2009103683A - Device and method for testing electrostatic charge - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrostatic charge testing device for clarifying the relation between the voltage value applied from the outside, and the amount of electrostatic charge. <P>SOLUTION: This electrotastic charge testing device includes an insulator 4, a metal plate 3 that is brought into contact with the insulator 4, a wiring 5 that is embedded into the insulator 4 so as to face the metal plate 3 and is extended out of the insulator 4, and an insulator socket 7 that is connected to one end of the wiring 5 and can connect an electronic device 6 measures the electrostatic charge testing device measures, via an insulator socket, the amount of charge guided to the wiring 5 facing the metal plate 3, by applying a predetermined voltage to the metal plate 3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor device and a test apparatus and a test method for measuring an electrostatic charge amount when an electronic device constituting a circuit by adding a resistor, a capacitor component, or the like to the semiconductor device is broken by electrostatic discharge.

  In an electronic device manufacturing process, an insulating material portion is charged in an electronic device test apparatus or a surrounding jig, and the wiring to which the electronic device is connected is inductively charged due to the influence. And when an electronic device contacts wiring, electrostatic discharge may generate | occur | produce by the dielectric charge of wiring, and an electronic device may be destroyed. For this reason, it is possible to take countermeasures against static electricity of an electronic device by measuring the electrostatic charge amount when the electronic device is destroyed by electrostatic discharge.

  In a conventional electrostatic charge test device, a dielectric is placed on a metal plate, an electronic device such as a semiconductor device is placed on the metal plate, charges are accumulated in the resin shell, and then discharged to the external lead terminal of the semiconductor device. The terminal for contact was made to contact, the voltage was applied to the metal plate, and the electrostatic destruction tolerance (breakdown voltage value) of the electronic device was measured (for example, refer patent document 1). However, the amount of electrostatic charge of the electronic device when the electronic device is destroyed due to electrostatic discharge caused by induction charging in the wiring in the manufacturing process is unknown. That is, an evaluation method for destruction of electronic equipment due to electrostatic discharge resulting from induction charging in wiring has not been established.

JP-A-6-58985 (pages 2 and 3, FIG. 1)

  In a conventional electrostatic charge test device, a DC voltage or the like is applied from the outside to measure the breakdown voltage value when the electronic device breaks down. However, depending on the size and structure of the electronic device, The amount of electrostatic charge due to induction charging of the connected wirings is different, the capacitance may change in the manufacturing process of the electronic device, and the breakdown voltage value when the electronic device breaks also changes greatly. For this reason, there has been a problem that an accurate electrostatic charge amount cannot be measured, and an electrostatic charge amount of the electronic device when the electronic device is broken cannot be obtained from a breakdown voltage value when the electronic device is broken.

  The present invention has been made to solve the above-described problems, and simulates an induction charging phenomenon in which an electronic device is destroyed due to electrostatic discharge caused by induction charging in wiring in the manufacturing process of the electronic device. Electrostatic charge test equipment that can measure the amount of electrostatic discharge (electrostatic charge amount) that an electronic device breaks, and clarify the relationship between the externally applied voltage value and the electrostatic charge amount Is what you get.

  An electrostatic charging test apparatus according to the present invention includes an insulator, a metal plate in contact with the insulator, wiring embedded in the insulator so as to face the metal plate, and extending outward from the insulator; wiring And an insulator socket to which an electronic device can be connected, and measuring the amount of charge induced in the wiring facing the metal plate by applying a predetermined voltage to the metal plate It is.

  An electrostatic charging test apparatus according to the present invention includes an insulator, a metal plate in contact with the insulator, wiring embedded in the insulator so as to face the metal plate, and extending outward from the insulator; wiring And an insulator socket that can be connected to an electronic device, and a predetermined voltage is applied to the metal plate to measure the amount of charge induced in the wiring facing the metal plate. The relationship between the voltage value and the electrostatic charge amount can be clarified, and the charge amount that causes destruction of the electronic device due to electrostatic discharge caused by induction charging in the wiring can be measured.

Embodiment 1 FIG.
FIG. 1 is a configuration diagram of an electrostatic charge test apparatus showing Embodiment 1 for carrying out the present invention. In FIG. 1, a metal plate 3 to which a DC voltage can be applied from a DC power source 2 using a relay (not shown) is installed on an insulator 4, and a wiring 5 is connected to the metal plate 3 in the insulator 4. It is embedded almost in parallel. The wiring 5 is drawn out of the insulator 4 and connected to the insulator socket 7. The insulator socket 7 is provided with a socket 8 into which a terminal of the electronic device 6 is inserted, and the electronic device 6 and the wiring 5 can be electrically connected.

By applying a constant voltage to the metal plate 3 using the DC power source 2, the wiring 5 installed in the insulator 4 is charged by electrostatic induction. When the voltage applied to the metal plate 3 exceeds a predetermined value, the electronic device 6 inserted into the insulator socket 7 connected to the wiring 5 is electrostatically destroyed by electrostatic discharge caused by induction charging in the wiring 5. The electrostatic charge test apparatus can measure the charge amount (charge amount) to the electronic device 6 at that time. The metal plate 3 may be of any material as long as it has conductivity, but aluminum, copper, SUS, etc. can be applied as an example. The insulator 4 is desirably one having a volume resistivity of 10 ¹² Ωcm or more, but is not particularly limited to this property. Examples of the material used for the insulator 4 include PTFE (polytetrafluoroethylene), vinyl chloride, and acrylic.

  In FIG. 1, the shape of the wiring 5 is shown as a straight line. However, if the positional relationship between the opposing metal plate 3 and the wiring 5 is fixed and induction charging occurs between the metal plate 3, the shape of the wiring 5. May be curved or meandering. The cross-sectional shape of the wiring 5 may be flat or tubular as long as induction charging occurs between the wiring 5 and the metal plate 3. Since the wiring 5 is opposed to the metal plate 3 with the dielectric material of the insulator 4 in between, the wiring 5 is inductively charged with a substantially constant relationship according to the DC voltage applied to the metal plate 3. In other words, a predetermined correlation can be obtained between the applied DC voltage and the charge amount of the wiring 5, and electrostatic induction is generated by determining the voltage applied to the metal plate 3. The charge amount can be controlled. The facing area between the metal plate 3 and the wiring 5 (the length of the wiring 5 in the insulator 4), the thickness of the wiring 5, the distance from the wiring 5 to the ground, the distance between the metal plate 3 and the wiring 5, etc. By previously setting these parameters, the charge amount of the wiring 5 can be controlled. Since the charge amount of the wiring 5 corresponds to the charge amount measurable at the socket 8 of the insulator socket 7, there is a difference between the applied DC voltage and the charge amount applied to the electronic device 6 inserted into the socket 8. A predetermined correlation can be obtained.

  The reason why a predetermined correlation can be obtained between the applied DC voltage and the amount of charge applied to the electronic device 6 will be described. In the conventional electrostatic charge test equipment, the terminal of the electronic device and the measurement terminal are opposed to the metal plate to which the voltage is applied. Therefore, depending on the size, shape, and shape of the electronic device, Each time the amount of charge varies greatly and the type of electronic device changes, the correlation between the applied DC voltage and the amount of charge applied to the electronic device changes. On the other hand, in the electrostatic charging test apparatus according to the first embodiment, since only the wiring 5 is opposed to the metal plate 3 to which the voltage is applied, the size, shape, and terminal shape of the electronic device 6 are used. Regardless, the relationship between the DC voltage applied to the metal plate 3 and the charge amount induced and charged by the wiring 5 is constant. For this reason, a predetermined correlation can be obtained between the applied DC voltage and the amount of charge applied to the electronic device 6.

  In the electrostatic charge test apparatus, it is important to grasp the relationship between the DC voltage applied to the metal plate 3 and the charge amount of the electronic device 6. The procedure for measuring this relationship is as follows. (1) A constant DC voltage is applied from the DC power source 2 to the metal plate 3 using a relay. (2) Since the charge from the wiring 5 charged by electrostatic induction is transmitted to the socket 8 of the insulator socket 7, the charge amount of the socket 8 is measured with a coulomb meter (not shown), and in that state, the socket 8 The electronic device 6 is inserted, and the electronic device 6 is connected to the insulator socket 7. (3) The electronic device 6 is removed, and the current-voltage characteristics of the electronic device 6 are measured using an electrical property evaluation apparatus (not shown) to check whether the electronic device 6 is broken. The operations (1) to (3) are repeated by changing the DC voltage applied to the metal plate 3. When the electronic device 6 breaks down after applying a predetermined DC voltage, the DC voltage at that time becomes a breakdown voltage value, and the charge amount measured by the coulometer at that time is determined by the electronic device 6. Destructive charge amount that causes electrostatic breakdown.

  FIG. 2 shows an example of the relationship between the DC voltage applied to the metal plate 3 and the charge amount of the electronic device 6 (charge amount of the socket 8). In FIG. 2, the horizontal axis represents the DC voltage applied to the metal plate 3, and the vertical axis represents the amount of charge of the socket 8 measured with a coulomb meter. The amount of charge flowing into the electronic device 6 (the amount of charge of the electronic device 6). is there. The white circles and black circles in the figure are plots of the charge amount of the socket 8 against the applied DC voltage, and the correlation between the DC voltage and the charge amount as shown in FIG. 2 by changing the DC voltage to increase the number of measurement points. You can get a relationship.

  In FIG. 2, from the measurement results of the current-voltage characteristics, white circles indicate a case where the electronic device 6 has not been destroyed, and black circles indicate a case where the electronic device 6 has been destroyed. In the example shown in FIG. 2, the electronic device 6 is destroyed at an applied voltage of 300V. It can also be seen that the amount of charge to the electronic device 6 at this time is about 55 nC. By using the correlation between the DC voltage and the charge amount as shown in FIG. 2 as a calibration curve, the charge amount applied to the electronic device 6 by electrostatic discharge corresponding to the applied voltage can be estimated. And the destructive charge amount of the electronic device 6 can be grasped.

  In addition to the method of measuring whether the electronic device 6 is destroyed while changing the DC voltage applied to the metal plate 3 to measure the charge amount of the socket 8, and measuring the destructive charge amount of the electronic device 6, The breakdown charge amount of the electronic device 6 may be measured by the following procedure. First, the relationship between the DC voltage applied to the metal plate 3 as shown in the graph of FIG. 2 and the charge amount measured by the insulator socket 7 is obtained in advance. (A) The electronic device 6 is inserted into the socket 8 of the insulator socket 7, and the electronic device 6 is connected to the insulator socket 7. (B) The electronic device 6 is removed from the socket 8, and the current-voltage characteristics of the electronic device 6 are measured using an electrical characteristic evaluation device (not shown) to check whether the electronic device 6 is broken. The operations (A) to (B) are repeated while changing the DC voltage applied to the metal plate 3. Then, when the electronic device 6 is destroyed after applying a predetermined DC voltage, the DC voltage at that time becomes a destruction voltage value, and the relationship between the previously obtained DC voltage and the charge amount of the electronic device 6 is obtained. The amount of destructive charge can also be measured. Since the relationship between the DC voltage applied to the metal plate 3 and the charge amount measured by the insulator socket 7 is known, the charge amount of the socket 8 and the amount of charge flowing into the electronic device 6 each time the DC voltage is changed. It is not necessary to measure (the charge amount of the electronic device 6) with a coulomb meter.

  As described above, the relationship between the DC voltage applied to the metal plate 3 and the charge amount induced and charged to the wiring 5 is constant regardless of the size, shape, and terminal shape of the electronic device 6. The relationship between the voltage value applied from the outside and the electrostatic charge amount can be clarified, and the charge amount that causes destruction of the electronic device 6 due to electrostatic discharge caused by induction charging in the wiring 5 can be measured. For this reason, since the countermeasure against static electricity of the electronic device 6 can be taken while grasping the destructive charge amount of the electronic device 6 at the production site, the quality of the electronic device 6 against electrostatic discharge can be improved. Furthermore, since the electronic device 6 can be prevented from being damaged by electrostatic discharge, the yield of the electronic device 6 during mass production can be improved.

Embodiment 2. FIG.
FIG. 3 is a configuration diagram of an electrostatic charge test apparatus showing Embodiment 2 for carrying out the present invention. This is different from the first embodiment in that the number of wirings and the length of each wiring are different. In FIG. 3, the same reference numerals as those in FIG. 1 denote the same or corresponding parts, and this is common throughout the entire specification. Moreover, the aspect of the component which appears in the whole specification is an illustration to the last, and is not limited to these description.

  In the electrostatic charging test apparatus according to this embodiment, as shown in FIG. 3, a metal plate 13 is installed on an insulator 14, and a plurality of wires 15 a to 15 d are opposed to the metal plate 13 in the insulator 14. So as to be embedded. The wirings 15 a to 15 d are drawn out of the insulator 14 and connected to the insulator socket 17. The insulator socket 17 is provided with sockets (not shown) into which the terminals of the electronic devices 16a to 16d are inserted so as to correspond to the wirings 15a to 15d, and the electronic devices 16a to 16d and the wirings 15a to 15d are connected to each other. Can be electrically connected.

  Each wiring 15a-15d is installed so that the length embedded in the insulator 14 may differ. By changing the length of each of the wirings 15a to 15d in the insulator 14, the amount of charge generated by induction charging in the wirings 15a to 15d can be changed. Different charge amounts can be obtained. Then, by inserting the electronic devices 16a to 16d into the respective sockets of the insulator socket 17, it is possible to efficiently measure the amount of charge that the plurality of electronic devices 16a to 16d breaks due to electrostatic discharge. In the present embodiment, the number of wirings is four, but the number of wirings may be two or more.

Embodiment 3 FIG.
FIG. 4 is a configuration diagram of an electrostatic charge test apparatus showing Embodiment 3 for carrying out the present invention. An electrical switch 22 is provided between the DC power source 2 and the metal plate 3, and the wiring 5 is different from the first embodiment in that the wiring 5 is connected to the electrical characteristic evaluation device 24 via the connector 23. The connector 23 is connected to the other end of the wiring 5 that is not connected to the insulator socket 7. In addition, a connector may be directly connected to the insulator socket 7, or the wiring 5 connected to the insulator socket 7 may be extended to connect the connector. In the first embodiment, each time the applied DC voltage is changed, the electronic device 6 is detached from the insulator socket 7 and the current-voltage characteristics of the electronic device 6 are measured using an electrical characteristic evaluation device. It was checked whether or not it was destroyed, and the electronic device 6 was connected to the insulator socket 7 again. In the present embodiment, it is not necessary to remove the electronic device 6 from the insulator socket 7 every time the current-voltage characteristic of the electronic device 6 is measured using the electrical characteristic evaluation device 24, and an electrostatic charging test can be performed.

  The procedure for measuring the relationship between the DC voltage applied to the metal plate 3 and the amount of charge to the electronic device 6 using the electrostatic charging test apparatus in this embodiment is as follows. (1) The switch 22 is turned on, and a certain DC voltage is applied from the DC power source 2 to the metal plate 3 using a relay (not shown). Since the charge from the wiring 5 charged by electrostatic induction is transmitted to the insulator socket 7, the electronic device 6 can be charged with a charge amount corresponding to the DC voltage. (2) Insert the electronic device 6 into the socket 8 and connect the electronic device 6 to the insulator socket 7. (3) The switch 22 is turned off, the current-voltage characteristics of the electronic device 6 are measured using the electrical characteristic evaluation device 24, and it is checked whether or not the electronic device 6 is broken. (4) Remove the electronic device 6 from the socket 8. The operations (1) to (4) are repeated by changing the DC voltage applied to the metal plate 3. When the electronic device 6 is destroyed after applying a predetermined DC voltage, the DC voltage at that time becomes a breakdown voltage value.

  As described above, since the wiring 5 is connected to the electrical property evaluation device 24 via the connector 23, the electronic device 6 is destroyed after the electrostatic charging is generated in the electronic device 6 by induction charging from the wiring 5. Whether or not can be immediately determined.

Embodiment 4 FIG.
FIG. 5 is a configuration diagram of an electrostatic charge test apparatus showing Embodiment 4 for carrying out the present invention. The difference from the first embodiment is that the discharge current flowing in the wiring is detected using a CT (Current Transformer). In FIG. 5, a metal plate 3 to which a DC voltage can be applied from a DC power source 2 using a relay (not shown) is installed on an insulator 4, and a wiring 5 is connected to the metal plate 3 in the insulator 4. It is embedded almost in parallel. The wiring 5 is drawn out of the insulator 4 and connected to the insulator socket 7. The insulator socket 7 is provided with a socket 8 into which a terminal of the electronic device 6 is inserted, and the electronic device 6 and the wiring 5 can be electrically connected. A probe portion of CT 25 for detecting a discharge current is arranged on the wiring 5 exposed between the insulator 4 and the insulator socket 7. The probe part of CT25 is ring-shaped, and the wiring 5 passes through the hole of the ring. The discharge current detected by the CT 25 is displayed by the oscilloscope 26. In FIG. 5, the CT 25 is installed between the insulator 4 and the insulator socket 7. However, as shown in FIG. 6, the ground wire connecting the terminal of the electronic device 6 and the ground (earth). 27 may be provided with CT25. Moreover, when the operation | work which grips the electronic device 6 using tweezers is accompanied, you may install CT25 in the earth wire which connected between tweezers and grounding.

By applying a constant voltage to the metal plate 3 using the DC power source 2, the wiring 5 installed in the insulator 4 is charged by electrostatic induction. The amount of charge induced in the wiring 5 can be measured by detecting the current value of the discharge current flowing in the wiring 5 when the electronic device 6 is connected to the insulator socket 7. When the voltage applied to the metal plate 3 exceeds a predetermined value, the electronic device 6 inserted into the insulator socket 7 connected to the wiring 5 is transferred from the socket 8 to the electronic device 6 due to induction charging in the wiring 5. Static electricity is destroyed by electrostatic discharge. That is, when the electronic device 6 is inserted into the insulator socket 7 in a state where the charge amount generated in the wiring 5 is equal to or greater than the predetermined charge amount, the electronic device 6 is electrostatically destroyed by electrostatic discharge. Since the discharge current flowing from the socket 8 to the electronic device 6 is also the discharge current flowing through the wiring 5, in the electrostatic charging test apparatus of the present embodiment, when the electronic device 6 is connected to the socket 8 of the insulator socket 7, By detecting the current value of the discharge current flowing through the wiring 5 with the CT 25, the discharge current flowing into the electronic device 6 can be measured when electrostatic breakdown occurs. The metal plate 3 may be of any material as long as it has conductivity, but aluminum, copper, SUS, etc. can be applied as an example. The insulator 4 is desirably one having a volume resistivity of 10 ¹² Ωcm or more, but is not particularly limited to this property. Examples of the material used for the insulator 4 include PTFE (polytetrafluoroethylene), vinyl chloride, and acrylic.

  In FIG. 5, the shape of the wiring 5 is shown as a straight line. However, if the positional relationship between the opposing metal plate 3 and the wiring 5 is fixed and induction charging occurs between the metal plate 3, the shape of the wiring 5 is shown. May be curved or meandering. The cross-sectional shape of the wiring 5 may be flat or tubular as long as induction charging occurs between the wiring 5 and the metal plate 3. Since the wiring 5 is opposed to the metal plate 3 with the dielectric material of the insulator 4 interposed therebetween, inductive charging is generated with a substantially constant relationship according to the DC voltage applied to the metal plate 3, and from the socket 8. A discharge current of electrostatic discharge flows to the electronic device 6. That is, a predetermined correlation can be obtained between the applied DC voltage and the discharge current flowing from the socket 8 to the electronic device 6, and electrostatic induction occurs by determining the applied voltage to the metal plate 3. The discharge current flowing from the socket 8 to the electronic device 6 can be controlled. The facing area between the metal plate 3 and the wiring 5 (the length of the wiring 5 in the insulator 4), the thickness of the wiring 5, the distance from the wiring 5 to the ground, the distance between the metal plate 3 and the wiring 5, etc. Is set in advance, the discharge current flowing from the socket 8 to the electronic device 6 can be controlled. Since the discharge current detected by the wiring 5 corresponds to the discharge current that flows to the electronic device 6 when the electronic device 6 is inserted into the socket 8 of the insulator socket 7, the applied DC voltage is inserted into the socket 8. A predetermined correlation can be obtained with the discharge current flowing to the electronic device 6.

  The reason why a predetermined correlation can be obtained between the DC voltage applied to the metal plate 3 and the discharge current when the electronic device 6 is inserted into the socket 8 will be described. In the conventional electrostatic charge test equipment, the terminal of the electronic device and the measurement terminal are opposed to the metal plate to which the voltage is applied. Therefore, depending on the size, shape, and shape of the electronic device, Each time the amount of electrification varies greatly and the type of electronic device changes, the correlation between the applied DC voltage and the discharge current flowing to the electronic device changes. On the other hand, in the electrostatic charging test apparatus according to the fourth embodiment, since only the wiring 5 is opposed to the metal plate 3 to which the voltage is applied, the size and shape of the electronic device 6 and the shape of the terminal Regardless, the relationship between the DC voltage applied to the metal plate 3 and the discharge current flowing from the wiring 5 to the electronic device 6 is constant. For this reason, a predetermined correlation can be obtained between the applied DC voltage and the discharge current when the electronic device 6 is inserted into the socket 8.

  In the electrostatic charging test apparatus shown in the first embodiment, the relationship between the voltage value applied from the outside and the electrostatic charge amount can be clarified, and the electronic device 6 is caused by electrostatic discharge caused by induction charging in the wiring 5. It is possible to measure the amount of charge that causes destruction. However, it is not possible to measure the discharge current of the electrostatic discharge generated due to induction charging in the work in the actual process. Further, it has not been possible to evaluate how much discharge current the electronic device breaks down. Therefore, the discharge current can be measured by arranging the CT 25 in the wiring 5 as in the present embodiment.

  FIG. 7 shows a time chart of the discharge current before and after the electronic device 6 is inserted into the socket 8. When an electrostatic discharge occurs between the socket 8 and the electronic device 6, a discharge current always flows. The discharge current caused by static electricity that destroys the electronic device 6 is generally a steep pulse waveform generated when the electronic device 6 is connected to the socket 8 as indicated by a thick solid line. Here, the current value of the discharge current is the maximum value (maximum current value) of this steep waveform, and is called ESD (Electrostatic Discharge). The amount of charge (charge amount) is obtained by integrating the measured current value with time. However, the discharge current due to electrostatic discharge may form not only a steep pulse waveform but also a current waveform as shown by a broken line. In this case, the maximum current value is small, but the electrostatic discharge continues for a longer time than the discharge current with a steep pulse waveform, so the charge amount (measured charge amount) obtained from the integrated value of the current and time is steep. May be larger than discharge current with pulse waveform. In addition, there is a high possibility that the electronic device will not be destroyed by such a current waveform indicated by a broken line, and the destruction of the electronic device 6 due to electrostatic discharge is likely to involve a discharge current with a steep pulse waveform. For this reason, by measuring the maximum current value of the discharge current, it is possible to grasp the relationship between the electrostatic charge amount and the discharge current at which the electrical equipment 6 is destroyed more accurately.

  In the electrostatic charging test apparatus, it is important to grasp the relationship between the DC voltage applied to the metal plate 3 and the discharge current when the electronic device 6 is inserted into the socket 8. The procedure for measuring this relationship is as follows. (1) A constant DC voltage is applied from the DC power source 2 to the metal plate 3 using a relay. (2) Since the charge from the wiring 5 charged by electrostatic induction is transmitted to the socket 8 of the insulator socket 7, the discharge current when the electronic device 6 is inserted into the socket 8 is detected by the CT 25 and displayed on the oscilloscope 26. . (3) The electronic device 6 is removed, and the current-voltage characteristics of the electronic device 6 are measured using an electrical property evaluation apparatus (not shown) to check whether the electronic device 6 is broken. The operations (1) to (3) are repeated by changing the DC voltage applied to the metal plate 3. When the electronic device 6 is destroyed after applying a predetermined DC voltage, the DC voltage at that time becomes a breakdown voltage value, and the current value of the discharge current measured at CT25 at that time is the electronic device. 6 is a breakdown discharge current value for electrostatic breakdown.

  FIG. 8 shows an example of the relationship between the DC voltage applied to the metal plate 3 and the current value of the discharge current when the electronic device 6 is inserted. In FIG. 8, the horizontal axis represents the DC voltage applied to the metal plate 3, and the vertical axis represents the current value (maximum current value) of the discharge current flowing through the wiring 5 detected by CT25. White circles and black circles in the figure are plots of the current value of the discharge current against the applied DC voltage, and the correlation between the DC voltage and the discharge current as shown in FIG. 8 is obtained by increasing the number of measurement points by changing the DC voltage. You can get a relationship.

  In FIG. 8, from the measurement results of the current-voltage characteristics, white circles indicate a case where the electronic device 6 is not broken, and black circles indicate a case where the electronic device 6 is broken. In the example shown in FIG. 8, the electronic device 6 is destroyed at an applied voltage of 300V. It can also be seen that the current value of the discharge current to the electronic device 6 at this time is about 5 mA. By using the correlation between the DC voltage and the current value of the discharge current as shown in FIG. 8 as a calibration curve, it is possible to estimate the current value of the discharge current flowing to the electronic device 6 due to electrostatic discharge corresponding to the applied voltage. it can. And the breakdown discharge current value of the electronic device 6 can be grasped.

  In addition to the method of measuring whether or not the electronic device 6 is destroyed by changing the DC voltage applied to the metal plate 3 and detecting the discharge current flowing through the wiring 5 to measure the destruction discharge current of the electronic device 6 The breakdown discharge current value of the electronic device 6 may be measured by the following procedure. First, the relationship between the DC voltage applied to the metal plate 3 as shown in the graph of FIG. 8 and the current value of the discharge current from the socket 8 to the electronic device 6 is obtained in advance. (A) The electronic device 6 is inserted into the socket 8 of the insulator socket 7, and the electronic device 6 is connected to the insulator socket 7. (B) The electronic device 6 is removed from the socket 8, and the current-voltage characteristics of the electronic device 6 are measured using an electrical characteristic evaluation device (not shown) to check whether the electronic device 6 is broken. The operations (A) to (B) are repeated while changing the DC voltage applied to the metal plate 3. When the electronic device 6 is destroyed after applying a predetermined DC voltage, the DC voltage at that time becomes a destruction voltage value, and the DC voltage obtained in advance and the current value of the discharge current flowing to the electronic device 6 are obtained. Therefore, the breakdown discharge current value can also be measured. Since the relationship between the DC voltage applied to the metal plate 3 and the current value of the discharge current flowing to the electronic device 6 is known, the discharge current flowing from the socket 8 to the electronic device 6 is measured with CT25 every time the DC voltage is changed. There is no need to do.

  As described above, regardless of the size, shape, and terminal shape of the electronic device 6, the DC voltage applied to the metal plate 3 and the discharge current when discharging from the socket 8 to the electronic device 6 through the wiring 5. Therefore, the relationship between the voltage value applied from the outside and the discharge current of the electrostatic discharge can be clarified, and the electronic device 6 is destroyed due to the electrostatic discharge caused by the induction charging in the wiring 5. The breakdown discharge current value can be measured. For this reason, since the countermeasure against static electricity of the electronic device 6 can be taken while grasping the breakdown discharge current value of the electronic device 6 at the production site, the quality of the electronic device 6 against electrostatic discharge can be improved. Furthermore, since the electronic device 6 can be prevented from being damaged by electrostatic discharge, the yield of the electronic device 6 during mass production can be improved.

Embodiment 5 FIG.
FIG. 9 is a configuration diagram of an electrostatic charge test apparatus showing a fifth embodiment for carrying out the present invention. This is different from the fourth embodiment in that the number of wires and the length of each wire are different. In the electrostatic charging test apparatus in this embodiment, as shown in FIG. 9, a metal plate 13 is installed on an insulator 14, and a plurality of wires 15 a to 15 d are opposed to the metal plate 13 in the insulator 14. So as to be embedded. The wirings 15 a to 15 d are drawn out of the insulator 14 and connected to the insulator socket 17. The insulator socket 17 is provided with sockets (not shown) into which the terminals of the electronic devices 16a to 16d are inserted so as to correspond to the wirings 15a to 15d, and the electronic devices 16a to 16d and the wirings 15a to 15d are connected to each other. Can be electrically connected. Moreover, CT25a-25d is installed in each wiring 15a-15d in order to detect a discharge current.

  Each wiring 15a-15d is installed so that the length embedded in the insulator 14 may differ. By changing the length of each of the wirings 15a to 15d in the insulator 14, the discharge current generated due to induction charging in the wirings 15a to 15d can be changed. The discharge current values can be different from each other at the same time. Then, by inserting the electronic devices 16a to 16d into the sockets of the insulator socket 17, it is possible to efficiently measure the breakdown discharge current value at which the plurality of electronic devices 16a to 16d are destroyed by electrostatic discharge. In the present embodiment, the number of wirings is four, but the number of wirings may be two or more.

Embodiment 6 FIG.
FIG. 10 is a block diagram of an electrostatic charge test apparatus showing Embodiment 6 for carrying out the present invention. The fourth embodiment is different from the fourth embodiment in that an electrical switch 22 is provided between the DC power source 2 and the metal plate 3 and the wiring 5 is connected to the electrical characteristic evaluation device 24 via the connector 23. The connector 23 is connected to the other end of the wiring 5 that is not connected to the insulator socket 7. In addition, a connector may be directly connected to the insulator socket 7, or the wiring 5 connected to the insulator socket 7 may be extended to connect the connector. In the fourth embodiment, every time the applied DC voltage is changed, the electronic device 6 is detached from the insulator socket 7 and the current-voltage characteristics of the electronic device 6 are measured using an electrical characteristic evaluation device. It was checked whether or not it was destroyed, and the electronic device 6 was connected to the insulator socket 7 again. In the present embodiment, it is not necessary to remove the electronic device 6 from the insulator socket 7 every time the current-voltage characteristic of the electronic device 6 is measured using the electrical characteristic evaluation device 24, and an electrostatic charging test can be performed.

  The procedure for measuring the relationship between the DC voltage applied to the metal plate 3 and the amount of charge to the electronic device 6 using the electrostatic charging test apparatus in this embodiment is as follows. (1) The switch 22 is turned on, and a certain DC voltage is applied from the DC power source 2 to the metal plate 3 using a relay (not shown). Since the charge from the wiring 5 charged by electrostatic induction is transmitted to the insulator socket 7, a discharge current corresponding to the DC voltage can be supplied to the electronic device 6. (2) Insert the electronic device 6 into the socket 8 and connect the electronic device 6 to the insulator socket 7. (3) The switch 22 is turned off, the current-voltage characteristics of the electronic device 6 are measured using the electrical characteristic evaluation device 24, and it is checked whether or not the electronic device 6 is broken. (4) Remove the electronic device 6 from the socket 8. The operations (1) to (4) are repeated by changing the DC voltage applied to the metal plate 3. When the electronic device 6 is destroyed after applying a predetermined DC voltage, the DC voltage at that time becomes a breakdown voltage value.

  As described above, since the wiring 5 is connected to the electrical property evaluation device 24 via the connector 23, the electronic device 6 is destroyed after the electrostatic charging is generated in the electronic device 6 by induction charging from the wiring 5. Whether or not can be immediately determined.

It is a block diagram of the electrostatic charging test apparatus in Embodiment 1 of this invention. It is a related figure of DC voltage applied to the metal plate in Embodiment 1 of this invention, and the charge amount of an electronic device. It is a block diagram of the electrostatic charging test apparatus in Embodiment 2 of this invention. It is a block diagram of the electrostatic charging test apparatus in Embodiment 3 of this invention. It is a block diagram of the electrostatic charging test apparatus in Embodiment 4 of this invention. It is a block diagram of another electrostatic charging test apparatus in Embodiment 4 of this invention. It is a time chart of the discharge current which flows into the electronic device in Embodiment 4 of this invention. It is a related figure of DC voltage applied to the metal plate in Embodiment 4 of this invention, and the discharge current of an electronic device. It is a block diagram of the electrostatic charging test apparatus in Embodiment 5 of this invention. It is a block diagram of the electrostatic charging test apparatus in Embodiment 6 of this invention.

Explanation of symbols

  2 DC power supply, 3,13 metal plate, 4,14 insulator, 5,15a-15d wiring, 6,16a-16d electronic equipment, 7,17 insulator socket, 8 socket, 22 switch, 23 connector, 24 electrical characteristics Evaluation device, 25, 25a-25d CT, 26 oscilloscope.

Claims (9)

An insulator, a metal plate in contact with the insulator, a wire embedded in the insulator so as to face the metal plate, and extended outward from the insulator; and connected to one end of the wire With an insulator socket that can be connected to electronic devices,
An electrostatic charge test apparatus for measuring a charge amount induced in a wiring facing the metal plate by applying a predetermined voltage to the metal plate. The electrostatic charging test apparatus according to claim 1, wherein a plurality of the wirings are provided, and each of the plurality of wirings has a different length embedded in the insulator. 3. The apparatus according to claim 1, further comprising: a connector connected to the wiring; and an electrical characteristic evaluation device that measures electrical characteristics of an electronic device connected to the connector and connected to the insulator socket. The electrostatic charge test apparatus described. The electrostatic charge test apparatus according to claim 1, wherein the charge amount is measured through the insulator socket. 4. The charge amount according to claim 1, wherein the charge amount is measured by detecting a current value of a discharge current flowing through the wiring when the electronic device is connected to the insulator socket. 5. The electrostatic charge test device described in 1. An electrostatic charge test method using the electrostatic charge test apparatus according to claim 4,
Applying a predetermined voltage to the metal plate, measuring the amount of charge induced in the wiring through the insulator socket, connecting an electronic device to the insulator socket, and when the electronic device is broken An electrostatic charge test method, wherein the charge amount is measured as a destructive charge amount at which the electronic device is electrostatically broken. An electrostatic charge test method using the electrostatic charge test apparatus according to claim 4,
The relationship between the voltage applied to the metal plate and the amount of charge induced in the wiring measured through the insulator socket was determined, the electronic device was connected to the insulator socket, and the electronic device was destroyed An electrostatic charge test method, comprising: measuring a destructive charge amount at which the electronic device is electrostatically destroyed from a voltage applied to the metal plate. An electrostatic charge test method using the electrostatic charge test apparatus according to claim 5,
A predetermined voltage is applied to the metal plate, and a current value of a discharge current flowing through the wiring when the electronic device is connected to the insulator socket is detected, and the current value when the electronic device is broken is An electrostatic charging test method characterized by measuring a breakdown discharge current value at which an electronic device is electrostatically destroyed. An electrostatic charge test method using the electrostatic charge test apparatus according to claim 5,
Obtaining a relationship between a voltage applied to the metal plate and a current value of a discharge current flowing through the wiring when the electronic device is connected to the insulator socket, connecting the electronic device to the insulator socket, and An electrostatic charging test method, wherein a breakdown discharge current value at which the electronic device is electrostatically broken is measured from a voltage applied to the metal plate when the device is broken.

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