JP2009099877A - Solid electrolytic capacitor, and its manufacturing method - Google Patents

Solid electrolytic capacitor, and its manufacturing method Download PDF

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JP2009099877A
JP2009099877A JP2007271903A JP2007271903A JP2009099877A JP 2009099877 A JP2009099877 A JP 2009099877A JP 2007271903 A JP2007271903 A JP 2007271903A JP 2007271903 A JP2007271903 A JP 2007271903A JP 2009099877 A JP2009099877 A JP 2009099877A
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cathode
anode
lead frame
solid electrolytic
electrolytic capacitor
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JP5057926B2 (en
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Sanae Tanaka
里苗 田中
Nobuyuki Kobayashi
延幸 小林
Kozo Ishihara
宏三 石原
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Sanyo Electric Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid electrolytic capacitor excelling in an ESR characteristic, in a solid electrolytic capacitor with a plurality of capacitor elements arranged in parallel to one another therein. <P>SOLUTION: The solid electrolytic capacitor includes a plurality of capacitor elements each having a positive electrode part and a negative electrode part, and is structured such that the plurality of capacitors adjacent to one another are arranged in parallel to one another so that the positive electrode parts adjoin one another and the negative electrode parts adjoin one another; and the negative electrode parts are connected to a negative electrode lead frame. The solid electrolytic capacitor is characterized in that the negative electrode parts are connected to the negative electrode lead frame on at least three faces including a surface nearly vertical to a direction in which the positive electrode parts and the negative electrode parts continue, a surface of the negative electrode lead frame nearly vertical to the direction in which the positive electrode parts and the negative electrode parts continue has a filling part, and the filling part is filled with an armoring resin. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、複数のコンデンサ素子が陽極リードが同一方向にくるように並列に並べてなる固体電解コンデンサに関する。 The present invention relates to a solid electrolytic capacitor in which a plurality of capacitor elements are arranged in parallel so that anode leads are in the same direction.

従来のチップ型固体電解コンデンサとしては、弁作用金属からなる焼結体の表面に誘電体皮膜、陰極層、陰極引出層を順次形成してなるコンデンサ素子の陰極引出層の一部と陰極リードフレームを、前記焼結体に接続された陽極リードと陽極リードフレームを夫々電気的・機械的に接続した後、前記陽極リードフレームと前記陰極リードフレームの一部を残して前記コンデンサ素子を外装樹脂で被覆し、該外装樹脂で被覆されていない前記陽極リードフレームと前記陰極リードフレームを、前記外装樹脂に沿って折り曲げ加工したものが知られている。   Conventional chip-type solid electrolytic capacitors include a cathode lead frame and a part of a cathode lead layer of a capacitor element in which a dielectric film, a cathode layer, and a cathode lead layer are sequentially formed on the surface of a sintered body made of a valve metal. After electrically and mechanically connecting the anode lead connected to the sintered body and the anode lead frame, respectively, the capacitor element is made of an exterior resin while leaving a part of the anode lead frame and the cathode lead frame. It is known that the anode lead frame and the cathode lead frame that are coated and not coated with the exterior resin are bent along the exterior resin.

一方、近年の電子機器の高周波化に対応して固体電解コンデンサにおいても高周波性能の良好なものが望まれているが、上述のような焼結体を用いた固体電解コンデンサの場合、焼結体の強度を維持するために焼結体の厚みをある程度厚くする必要があり、このため良好な高周波特性を得ることができなかった。   On the other hand, a solid electrolytic capacitor having good high frequency performance is desired in response to the higher frequency of electronic equipment in recent years. In the case of a solid electrolytic capacitor using a sintered body as described above, a sintered body In order to maintain the strength of the sintered body, it is necessary to increase the thickness of the sintered body to some extent, and thus good high frequency characteristics could not be obtained.

上記の問題を解決するため、図12に示すように、複数のコンデンサ素子1を陽極リードが同一方向に向くように並列に隙間なく載置し、前記複数のコンデンサ素子1の陰極引出層と陰極リードフレーム3を、前記陽極リードと陽極リードフレーム2とを夫々接続してなる固体電解コンデンサの構造が提案された。(例えば特許文献1)
しかし、図12の構造では漏れ電流特性が良好でなく、漏れ電流特性の改善が求められた。この要求に応えるため、図13に示すように、複数のコンデンサ素子の陰極層を樹脂や導電ペースト等の固定層6を用いて固定する方法が提案されている。(例えば特許文献2)
特開平05−234829号公報。 特開2005−93994号公報。
In order to solve the above problem, as shown in FIG. 12, a plurality of capacitor elements 1 are placed in parallel so that the anode leads face in the same direction without gaps, and the cathode lead layers and cathodes of the plurality of capacitor elements 1 A structure of a solid electrolytic capacitor in which the lead frame 3 is connected to the anode lead frame 2 and the anode lead frame 2 has been proposed. (For example, Patent Document 1)
However, in the structure of FIG. 12, the leakage current characteristic is not good, and improvement of the leakage current characteristic has been demanded. In order to meet this requirement, as shown in FIG. 13, a method of fixing the cathode layers of a plurality of capacitor elements using a fixing layer 6 such as resin or conductive paste has been proposed. (For example, Patent Document 2)
Japanese Patent Application Laid-Open No. 05-234829. JP-A-2005-93994.

しかしながら図12および図13のような構造は、陰極層と陰極リードフレームとの接触面積が限られており、コンデンサのESR(等価直列抵抗)効果が十分でなかった。   However, the structures as shown in FIGS. 12 and 13 have a limited contact area between the cathode layer and the cathode lead frame, and the ESR (equivalent series resistance) effect of the capacitor is not sufficient.

陽極部と陰極部とを有するコンデンサ素子を複数具え、隣り合う該複数のコンデンサ素子が、前記陽極部同士及び前記陰極部同士が互いに隣接するよう並列に配置され、前記陰極部と陰極リードフレームが接続されている固体電解コンデンサにおいて、前記陰極部は、前記陽極部と前記陰極部が連なる方向に略垂直な面を含む少なくとも3つの面で前記陰極リードフレームと接続されており、前記陽極部と前記陰極部が連なる方向に略垂直な面において、前記陰極リードフレームは充填部を有し、該充填部には外装樹脂が充填されていることを特徴とする。 A plurality of capacitor elements having an anode part and a cathode part are provided, and the plurality of adjacent capacitor elements are arranged in parallel so that the anode parts and the cathode parts are adjacent to each other, and the cathode part and the cathode lead frame are In the connected solid electrolytic capacitor, the cathode portion is connected to the cathode lead frame on at least three surfaces including a surface substantially perpendicular to a direction in which the anode portion and the cathode portion are connected, and the anode portion and The cathode lead frame has a filling portion on a surface substantially perpendicular to a direction in which the cathode portions are continuous, and the filling portion is filled with an exterior resin.

上記の構造とすることにより、陰極リードフレームは、コンデンサ素子と多数の面に亘って接続することができ、コンデンサのESRを低減することができる。また、前記陰極リードフレームには充填部があり、該充填部には外装樹脂が充填されているので、コンデンサ素子と外装樹脂との密着性が向上する。   By adopting the above structure, the cathode lead frame can be connected to the capacitor element across a large number of surfaces, and the ESR of the capacitor can be reduced. Further, since the cathode lead frame has a filling portion, and the filling portion is filled with the exterior resin, the adhesion between the capacitor element and the exterior resin is improved.

また、本発明の固体電解コンデンサにおいて、前記陰極リードフレームは、前記陽極部と前記陰極部が連なる方向に略平行で、且つ前記陽極部と前記陰極部が連なる方向に略垂直な面に連なる面について、充填部を有し、該充填部には外装樹脂が充填されていてもよい。このような構造とすることで、固体電解コンデンサのESRを増大させることなく、コンデンサ素子と外装樹脂との密着性を向上させることができる。   Further, in the solid electrolytic capacitor of the present invention, the cathode lead frame is a surface that is substantially parallel to a direction in which the anode portion and the cathode portion are connected, and is connected to a surface that is substantially perpendicular to a direction in which the anode portion and the cathode portion are connected. About, it has a filling part and this exterior part may be filled with exterior resin. With such a structure, the adhesion between the capacitor element and the exterior resin can be improved without increasing the ESR of the solid electrolytic capacitor.

さらに、前記固体電解コンデンサにおいて、前記陰極部は、陽極体の周面に形成され、前記陽極部は、前記陽極体に植立している陽極リードからなり、前記陽極体の前記陽極リードが植立されている面において、前記陰極リードフレームと前記陰極部が接続されている面と前記陽極リードとの距離が、前記陰極リードフレームと前記陰極部が接続されていない面と前記陽極リードとの距離より小さいことが望ましい。陽極リードと陰極リードフレームとの距離が小さい方がコンデンサのESR低減効果が大きい。   Furthermore, in the solid electrolytic capacitor, the cathode portion is formed on a peripheral surface of the anode body, and the anode portion includes an anode lead planted on the anode body, and the anode lead of the anode body is implanted. The distance between the surface where the cathode lead frame and the cathode portion are connected and the anode lead is the distance between the surface where the cathode lead frame and the cathode portion are not connected and the anode lead. Desirably smaller than the distance. The smaller the distance between the anode lead and the cathode lead frame, the greater the ESR reduction effect of the capacitor.

上記構造の固体電解コンデンサの製造方法において、前記陰極リードフレームは平板状からなり、該平板状リードフレームに切り込みをいれ、該切り込みの内側に前記コンデンサ素子を載置し、前記切り込みの外側を前記陰極部の周面に沿って折り曲げて接続することを特徴とする。   In the method of manufacturing a solid electrolytic capacitor having the above structure, the cathode lead frame has a flat plate shape, a cut is made in the flat lead frame, the capacitor element is placed inside the cut, and the outside of the cut is outside the cut. The connection is made by bending along the peripheral surface of the cathode portion.

上述のようにして作製された固体電解コンデンサは、陰極リードフレームと陰極部との接触箇所が大きく、さらに、前記陰極リードフレームは、接合箇所のない一体物からなるため、導電性ペースト等を介して別の金属端子と接続する場合に比べ集電性がよく、著しいコンデンサのESR低減効果が期待できる。   The solid electrolytic capacitor manufactured as described above has a large contact portion between the cathode lead frame and the cathode portion, and further, the cathode lead frame is made of a single body having no joint portion, and therefore, through a conductive paste or the like. Compared with the case of connecting to another metal terminal, the current collecting property is better and a significant ESR reduction effect of the capacitor can be expected.

本発明の、別の形態の固体電解コンデンサは、陽極部と陰極部とを有するコンデンサ素子を複数具え、隣り合う該複数のコンデンサ素子が、前記陽極部同士及び前記陰極部同士が互いに隣接するように並列に配置され、前記陰極部と陰極リードフレームが接続されている固体電解コンデンサにおいて、前記陰極部は、前記陽極部と前記陰極部が連なる方向と略平行な面のうち少なくとも3つの面で、前記陰極リードフレームと接続されていることを特徴とする。   Another form of the solid electrolytic capacitor of the present invention includes a plurality of capacitor elements each having an anode part and a cathode part, and the plurality of adjacent capacitor elements are adjacent to each other between the anode part and the cathode part. In the solid electrolytic capacitor in which the cathode part and the cathode lead frame are connected in parallel, the cathode part is at least three of the faces substantially parallel to the direction in which the anode part and the cathode part are connected. The cathode lead frame is connected to the cathode lead frame.

上記のような構造とすることで、コンデンサ素子の表面の多数の面に亘って陰極リードフレームが接続されているので、固体電解コンデンサの低ESR化を図ることができる。   With the structure as described above, the cathode lead frame is connected over a large number of surfaces of the capacitor element, so that the ESR of the solid electrolytic capacitor can be reduced.

本発明の構造を採用することで、陰極部と陰極リードフレームとが、コンデンサ素子の多数の面に亘って接続されているので、固体電解コンデンサのESRを低減することができる。また、陰極リードフレームの少なくとも一部には充填部が具わっており、該充填部には樹脂が入り込んでいるため、コンデンサ素子と外装樹脂との密着性の向上を図ることができる。   By adopting the structure of the present invention, since the cathode portion and the cathode lead frame are connected over many surfaces of the capacitor element, the ESR of the solid electrolytic capacitor can be reduced. In addition, since at least a part of the cathode lead frame is provided with a filling portion, and resin is contained in the filling portion, the adhesion between the capacitor element and the exterior resin can be improved.

本発明を実施するための最良の形態について、図を用いて説明する。
(実施形態1)
図1は、本発明の第1実施形態の固体電解コンデンサの上面透視図であり、図2は、図1の固体電解コンデンサをX方向から見た透視図(a)及びY方向から見た透視図(b)であり、図3は、図1のコンデンサ素子と陰極リードフレームの配置関係をZ方向から見た図(a)及びX方向から見た図(b)である。
The best mode for carrying out the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 is a top perspective view of the solid electrolytic capacitor according to the first embodiment of the present invention. FIG. 2 is a perspective view of the solid electrolytic capacitor of FIG. 1 viewed from the X direction and a perspective view viewed from the Y direction. FIG. 3B is a diagram showing the positional relationship between the capacitor element and the cathode lead frame in FIG. 1 as viewed from the Z direction and FIG. 3B is a diagram as viewed from the X direction.

本発明の固体電解コンデンサは、陽極部1と陰極部2からなるコンデンサ素子と、陰極リードフレーム3及び陽極リードフレーム4を具えており、コンデンサ素子の周面が外装樹脂5にて被覆されている。該陰極リードフレーム3は、その上にコンデンサ素子を載置する下面部31と、該下面部31と略垂直な側面部32と、該側面部32と略垂直で前記下面部と略平行な上面部33を有し、下面部31、側面部32、上面部33は、コンデンサ素子の陰極部2の下面、側面、上面と各々接続されている。また、側面部32及び上面部33は、充填部32a、33aを夫々有しており、該充填部32a、33aには、外装樹脂5が充填されている。   The solid electrolytic capacitor of the present invention comprises a capacitor element composed of an anode part 1 and a cathode part 2, a cathode lead frame 3 and an anode lead frame 4, and the peripheral surface of the capacitor element is covered with an exterior resin 5. . The cathode lead frame 3 includes a lower surface portion 31 on which a capacitor element is placed, a side surface portion 32 substantially perpendicular to the lower surface portion 31, and an upper surface substantially perpendicular to the side surface portion 32 and substantially parallel to the lower surface portion. The lower surface portion 31, the side surface portion 32, and the upper surface portion 33 are respectively connected to the lower surface, the side surface, and the upper surface of the cathode portion 2 of the capacitor element. Further, the side surface portion 32 and the upper surface portion 33 have filling portions 32a and 33a, respectively, and the filling portions 32a and 33a are filled with the exterior resin 5.

前記陰極リードフレーム3は、側面部32から連なる端子部34を有し、該端子部34は外装樹脂5から露出し、該外装樹脂5に沿って折り曲げられている。   The cathode lead frame 3 has a terminal portion 34 that continues from the side surface portion 32, and the terminal portion 34 is exposed from the exterior resin 5 and is bent along the exterior resin 5.

図3(a)に示すように、陽極部1の中心から下面部31及び上面部33までの距離mは、陽極部1の中心から陰極リードフレーム3と接しない陰極部4の側面までの距離nよりも小さくなっている。
(実施形態2)
図4は、本発明の第2実施形態の固体電解コンデンサの上面透視図であり、図5は、図4の固体電解コンデンサをX方向から見た透視図(a)及びY方向から見た透視図(b)であり、図6は、図4のコンデンサ素子と陰極リードフレームの配置関係をZ方向から見た図(a)及びX方向から見た図(b)である。
As shown in FIG. 3A, the distance m from the center of the anode part 1 to the lower surface part 31 and the upper surface part 33 is the distance from the center of the anode part 1 to the side surface of the cathode part 4 not in contact with the cathode lead frame 3. It is smaller than n.
(Embodiment 2)
FIG. 4 is a top perspective view of the solid electrolytic capacitor according to the second embodiment of the present invention, and FIG. 5 is a perspective view of the solid electrolytic capacitor of FIG. 4 viewed from the X direction and a perspective viewed from the Y direction. FIG. 6B is a diagram in which the positional relationship between the capacitor element and the cathode lead frame in FIG. 4 is viewed from the Z direction and FIG. 6B is a diagram from the X direction.

実施形態2の固体電解コンデンサは、陽極部1と陰極部2からなるコンデンサ素子と、陰極リードフレーム3及び陽極リードフレーム4を具えており、コンデンサ素子の周面は、外装樹脂5で被覆されている。前記陰極リードフレーム3は、その上にコンデンサ素子を載置する下面部31と、該下面部31に略垂直な側面部32と、該側面部32に略垂直で下面部31と略平行な上面部33を有しており、下面部31、側面部32、上面部33は、コンデンサ素子の陰極部2の下面、側面、上面と各々接続されている。また、側面部32は、充填部32aを有しており、該充填部32aには外装樹脂5が充填されている。   The solid electrolytic capacitor according to the second embodiment includes a capacitor element including an anode part 1 and a cathode part 2, a cathode lead frame 3 and an anode lead frame 4, and the peripheral surface of the capacitor element is covered with an exterior resin 5. Yes. The cathode lead frame 3 includes a lower surface portion 31 on which a capacitor element is placed, a side surface portion 32 substantially perpendicular to the lower surface portion 31, and an upper surface substantially perpendicular to the side surface portion 32 and substantially parallel to the lower surface portion 31. The lower surface portion 31, the side surface portion 32, and the upper surface portion 33 are respectively connected to the lower surface, the side surface, and the upper surface of the cathode portion 2 of the capacitor element. The side surface portion 32 has a filling portion 32a, and the filling portion 32a is filled with the exterior resin 5.

この固体電解コンデンサにおいて、コンデンサ素子の陽極部1の中心と、陰極リードフレーム3の下面部31及び上面部33との距離mは、陽極部1の中心と陰極リードフレーム3と接触していない陰極部2の側面との距離nよりも小さくなっている。   In this solid electrolytic capacitor, the distance m between the center of the anode portion 1 of the capacitor element and the lower surface portion 31 and the upper surface portion 33 of the cathode lead frame 3 is a cathode that is not in contact with the center of the anode portion 1 and the cathode lead frame 3. It is smaller than the distance n with the side surface of the part 2.

次に、実施形態2の固体電解コンデンサの製造方法について説明する。   Next, the manufacturing method of the solid electrolytic capacitor of Embodiment 2 is demonstrated.

従来周知の方法で形成した陽極部1及び陰極部2からなるコンデンサ素子を、図7に示すリードフレームの陽極リードフレーム4上に陽極部1、陰極リードフレーム3上に陰極部2がくるように陽極部1と陽極リードフレーム4、陰極部2と陰極リードフレーム3を夫々既知の手法で接続する。この際、前記陰極部2は、前記陰極リードフレーム3の下面部31上に載置する。また、コンデンサ素子の陽極部1の中心と陰極リードフレーム3と陰極部2が接続される面との距離が、前記陽極部1の中心と陰極リードフレーム3と接続されていない前記陰極部の面との距離よりも小さくなるように、コンデンサ素子をリードフレーム上に配置する。   A capacitor element comprising an anode portion 1 and a cathode portion 2 formed by a conventionally known method is arranged such that the anode portion 1 is on the anode lead frame 4 and the cathode portion 2 is on the cathode lead frame 3 of the lead frame shown in FIG. The anode part 1 and the anode lead frame 4, and the cathode part 2 and the cathode lead frame 3 are connected by a known method. At this time, the cathode portion 2 is placed on the lower surface portion 31 of the cathode lead frame 3. Further, the distance between the center of the anode portion 1 of the capacitor element and the surface to which the cathode lead frame 3 and the cathode portion 2 are connected is such that the center of the anode portion 1 and the surface of the cathode portion not connected to the cathode lead frame 3. The capacitor element is disposed on the lead frame so as to be smaller than the distance between the lead frame and the capacitor.

ここで、陰極リードフレーム3は、図7に示すように一部に切り込みを有しており、該切り込みの内側が下面部31、外側が側面部32となっている。該側面部32に連なり陽極リードフレーム4に対向する側に上面部33を有している。前記下面部31を残して側面部32及び上面部33を立ち上げ、さらに上面部33のみ折り曲げて、側面部32と陰極部2の側面、及び上面部33と陰極部2の上面を夫々周知の方法により接続する。また、この陰極リードフレーム3の切り込み部を上面部33側まで延在させると、上述の実施形態1に用いられる陰極リードフレーム3になり、実施形態1の場合も同様な手法でコンデンサ素子と陽極リードフレーム4及び陰極リードフレーム3を接続することができる。   Here, as shown in FIG. 7, the cathode lead frame 3 has a cut in part, and the inner side of the cut is a lower surface portion 31 and the outer side is a side surface portion 32. An upper surface portion 33 is provided on the side facing the side surface portion 32 and facing the anode lead frame 4. The side surface portion 32 and the upper surface portion 33 are raised while leaving the lower surface portion 31, and only the upper surface portion 33 is bent, and the side surface portion 32 and the side surface of the cathode portion 2 and the upper surface portion 33 and the upper surface of the cathode portion 2 are well known. Connect by method. Further, when the cut portion of the cathode lead frame 3 is extended to the upper surface portion 33 side, the cathode lead frame 3 used in the above-described first embodiment is obtained. The lead frame 4 and the cathode lead frame 3 can be connected.

上記のようにして陽極リードフレーム4及び陰極リードフレーム3とコンデンサ素子を接続した後、コンデンサ素子の周面を従来公知の技術を用いて外装樹脂5で被覆して固体電解コンデンサを作製する。
(実施形態3)
図8は、本発明の別の実施形態の上面透視図であり、図9は、図8の固体電解コンデンサをX方向からみた透視図(a)及びY方向から見た透視図(b)であり、図10は、図8のコンデンサ素子と陰極リードフレームの配置関係を図8のZ方向(a)及びX方向(b)から見た図である。
After the anode lead frame 4 and the cathode lead frame 3 and the capacitor element are connected as described above, the peripheral surface of the capacitor element is covered with the exterior resin 5 using a conventionally known technique to produce a solid electrolytic capacitor.
(Embodiment 3)
FIG. 8 is a top perspective view of another embodiment of the present invention, and FIG. 9 is a perspective view (a) of the solid electrolytic capacitor of FIG. 8 viewed from the X direction and a perspective view (b) viewed from the Y direction. FIG. 10 is a view of the positional relationship between the capacitor element and the cathode lead frame in FIG. 8 as viewed from the Z direction (a) and the X direction (b) in FIG.

実施形態3の固体電解コンデンサは、陽極部1及び陰極部2からなるコンデンサ素子を複数個と、陽極リードフレーム4及び陰極リードフレーム3を具え、コンデンサ素子の周囲は外装樹脂5で覆われている。ここで、陰極リードフレーム3は、図11に示すように側板35と端子部34を備えており、側板35間の距離は、コンデンサ素子の幅と略同等になるよう配置されている。該端子部34の下面及び陽極リードフレーム4の下面は、外装樹脂5から露出している。前記側板35の両端は、端子部34と略同一平面であり、該端子部34に連なっているものを略垂直に立ち上げたものであるが、元々立ち上がっている形状のものを用いることも可能である。   The solid electrolytic capacitor of Embodiment 3 includes a plurality of capacitor elements each including an anode portion 1 and a cathode portion 2, an anode lead frame 4 and a cathode lead frame 3, and the periphery of the capacitor element is covered with an exterior resin 5. . Here, the cathode lead frame 3 includes a side plate 35 and a terminal portion 34 as shown in FIG. 11, and the distance between the side plates 35 is arranged to be substantially equal to the width of the capacitor element. The lower surface of the terminal portion 34 and the lower surface of the anode lead frame 4 are exposed from the exterior resin 5. Both ends of the side plate 35 are substantially flush with the terminal portion 34 and are connected to the terminal portion 34 so as to rise substantially vertically. However, it is also possible to use a shape that is originally raised. It is.

上記固体電解コンデンサにおいて、コンデンサ素子の陽極部1の中心と側板35との距離は、陽極部1の中心と端子部34との距離より小さくなっている。   In the solid electrolytic capacitor, the distance between the center of the anode part 1 of the capacitor element and the side plate 35 is smaller than the distance between the center of the anode part 1 and the terminal part 34.

実施形態3の固体電解コンデンサについて、以下に製造方法を示す。   A manufacturing method for the solid electrolytic capacitor of Embodiment 3 will be described below.

従来既知の方法によって作製された陽極部1及び陰極部2を具えたコンデンサ素子を陽極リードフレーム4及び陰極リードフレーム3とを接続する。陰極リードフレーム3として、図11に示すような陰極リードフレーム3を用いる。具体的には、コンデンサ素子の陽極部1が陽極リードフレーム4上に、陰極部2が陰極リードフレーム4の側板35間端子部34上にくるように、公知の方法で接続する。ここで、コンデンサ素子の陰極部2と陰極リードフレーム3の端子部34を先に接続した後、コンデンサ素子の幅に合わせて側板35を立ち上げ、接続してもよい。前記側板35と前記陰極部2とは、導電性ペースト等を介して接続される。   A capacitor element having an anode portion 1 and a cathode portion 2 manufactured by a conventionally known method is connected to an anode lead frame 4 and a cathode lead frame 3. As the cathode lead frame 3, a cathode lead frame 3 as shown in FIG. Specifically, the capacitor element is connected by a known method such that the anode part 1 is on the anode lead frame 4 and the cathode part 2 is on the terminal part 34 between the side plates 35 of the cathode lead frame 4. Here, after the cathode part 2 of the capacitor element and the terminal part 34 of the cathode lead frame 3 are connected first, the side plate 35 may be raised and connected in accordance with the width of the capacitor element. The side plate 35 and the cathode part 2 are connected via a conductive paste or the like.

上記のようにしてコンデンサ素子と陽極リードフレーム4及び陰極リードフレーム3を接続した後、陽極リードフレーム4の下面及び陰極リードフレーム3の下面を残して外装樹脂5で被覆して固体電解コンデンサが完成する。
上記実施の形態は、本発明を説明するためのものに過ぎず、特許請求の範囲に記載の発明を限定する様に解すべきでない。本発明は、特許請求の範囲内及び均等の意味の範囲内で自由に変更することができる。例えば実施形態2において、陽極リードフレーム4を平板状とし、導電性部材を介してコンデンサ素子の陽極1と陽極リードフレーム4を接続することも可能である。また、すべての実施形態において、コンデンサ素子が箔状のものか成っていてもよし、コンデンサ素子の数は複数であれば特に限定されず、必ずしも2つである必要はない。
After connecting the capacitor element to the anode lead frame 4 and the cathode lead frame 3 as described above, the lower surface of the anode lead frame 4 and the lower surface of the cathode lead frame 3 are left and covered with the exterior resin 5 to complete the solid electrolytic capacitor. To do.
The above embodiments are merely for explaining the present invention, and should not be construed as limiting the invention described in the claims. The present invention can be freely modified within the scope of the claims and the scope of equivalent meanings. For example, in the second embodiment, the anode lead frame 4 may have a flat plate shape, and the anode 1 of the capacitor element and the anode lead frame 4 may be connected via a conductive member. Further, in all the embodiments, the capacitor element may be a foil-like element, and the number of capacitor elements is not particularly limited as long as it is plural, and need not necessarily be two.

本発明の実施形態1の固体電解コンデンサの上面透視図である。It is an upper surface perspective view of the solid electrolytic capacitor of Embodiment 1 of the present invention. 図1の固体電解コンデンサをX及びY方向から見たときの透視図である。It is a perspective view when the solid electrolytic capacitor of FIG. 1 is seen from the X and Y directions. 図1のコンデンサ素子と陰極リードフレームとの配置関係をZ及びX方向から見たときの図である。FIG. 2 is a diagram when the positional relationship between the capacitor element and the cathode lead frame in FIG. 1 is viewed from the Z and X directions. 本発明の実施形態2の固体電解コンデンサの上面透視図である。It is a top perspective view of the solid electrolytic capacitor of Embodiment 2 of the present invention. 図4の固体電解コンデンサをX及びY方向から見たときの透視図である。It is a perspective view when the solid electrolytic capacitor of FIG. 4 is seen from the X and Y directions. 図4のコンデンサ素子と陰極リードフレームとの配置関係をZ及びX方向から見たときの透視図である。FIG. 5 is a perspective view when the positional relationship between the capacitor element and the cathode lead frame in FIG. 4 is viewed from the Z and X directions. 図4の固体電解コンデンサに用いられるリードフレームの平面図である。It is a top view of the lead frame used for the solid electrolytic capacitor of FIG. 本発明の実施形態3の固体電解コンデンサの上面透視図である。It is a top perspective view of the solid electrolytic capacitor of Embodiment 3 of the present invention. 図8の固体電解コンデンサをX及びY方向から見たときの透視図である。It is a perspective view when the solid electrolytic capacitor of FIG. 8 is seen from the X and Y directions. 図8のコンデンサ素子と陰極リードフレームとの配置関係をZ及びX方向から見たときの図である。It is a figure when the arrangement | positioning relationship between the capacitor | condenser element of FIG. 8 and a cathode lead frame is seen from the Z and X directions. 図8の固体電解コンデンサに用いられる陰極リードフレームの斜視図である。It is a perspective view of the cathode lead frame used for the solid electrolytic capacitor of FIG. 従来の固体電解コンデンサの斜視透視図である。It is a perspective perspective view of the conventional solid electrolytic capacitor. 従来の別の固体電解コンデンサの斜視透視図である。It is a perspective perspective view of another conventional solid electrolytic capacitor.

符号の説明Explanation of symbols

・ 陽極部
・ 陰極部
・ 陰極リードフレーム
・ 陽極リードフレーム
・ 外装樹脂
・ 固定層
・ Anode part ・ Cathode part ・ Cathode lead frame ・ Anode lead frame ・ Exterior resin ・ Fixed layer

Claims (6)

陽極部と陰極部とを有するコンデンサ素子を複数具え、隣り合う該複数のコンデンサ素子が、前記陽極部同士及び前記陰極部同士が互いに隣接するよう並列に配置され、前記陰極部と陰極リードフレームが接続されている固体電解コンデンサにおいて、
前記陰極部は、前記陽極部と前記陰極部が連なる方向に略垂直な面を含む少なくとも3つの面で前記陰極リードフレームと接続されており、
前記陽極部と前記陰極部が連なる方向に略垂直な面において、
前記陰極リードフレームは充填部を有し、該充填部には外装樹脂が充填されていることを特徴とする固体電解コンデンサ。
A plurality of capacitor elements each having an anode part and a cathode part are provided, and a plurality of adjacent capacitor elements are arranged in parallel so that the anode parts and the cathode parts are adjacent to each other, and the cathode part and the cathode lead frame are In the connected solid electrolytic capacitor,
The cathode portion is connected to the cathode lead frame on at least three surfaces including a surface substantially perpendicular to a direction in which the anode portion and the cathode portion are continuous.
In a plane substantially perpendicular to the direction in which the anode part and the cathode part are connected,
The cathode lead frame has a filling portion, and the filling portion is filled with an exterior resin.
前記陰極リードフレームは、前記陽極部と前記陰極部が連なる方向に略平行で、且つ前記陽極部と前記陰極部が連なる方向に略垂直な面に連なる面を有し、該略垂直な面に連なる面において、
前記陰極リードフレームは充填部を有し、該充填部には外装樹脂が充填されていることを特徴とする請求項1に記載の固体電解コンデンサ。
The cathode lead frame has a surface that is substantially parallel to a direction in which the anode portion and the cathode portion are connected and is connected to a surface that is substantially perpendicular to a direction in which the anode portion and the cathode portion are connected. In a continuous aspect,
The solid electrolytic capacitor according to claim 1, wherein the cathode lead frame has a filling portion, and the filling portion is filled with an exterior resin.
前記陰極部は、陽極体の周面に形成され、前記陽極部は、前記陽極体に植立している陽極リードからなる固体電解コンデンサにおいて、
前記陽極体の前記陽極リードが植立されている面において、前記陰極リードフレームと前記陰極部が接続されている面と前記陽極リードとの距離が、前記陰極リードフレームと前記陰極部が接続されていない面と前記陽極リードとの距離より小さいことを特徴とする請求項1または2に記載の固体電解コンデンサ。
The cathode part is formed on a peripheral surface of an anode body, and the anode part is a solid electrolytic capacitor including an anode lead planted on the anode body.
On the surface of the anode body where the anode lead is planted, the distance between the surface where the cathode lead frame and the cathode portion are connected and the anode lead is the same as the distance between the cathode lead frame and the cathode portion. 3. The solid electrolytic capacitor according to claim 1, wherein the solid electrolytic capacitor is smaller than a distance between a non-surface and the anode lead.
陽極部と陰極部とを有するコンデンサ素子を複数具え、隣り合う該複数のコンデンサ素子が、前記陽極部及び前記陰極部が互いに同一方向に位置するように並列に配置され、前記陰極部と陰極リードフレームが接続されている固体電解コンデンサにおいて、
前記陰極部は、前記陽極部と前記陰極部が連なる方向と略平行な面のうち少なくとも3つの面で、前記陰極リードフレームと接続されていることを特徴とする固体電解コンデンサ。
A plurality of capacitor elements having an anode part and a cathode part are provided, and the plurality of adjacent capacitor elements are arranged in parallel so that the anode part and the cathode part are located in the same direction, and the cathode part and the cathode lead In the solid electrolytic capacitor to which the frame is connected,
The solid electrolytic capacitor, wherein the cathode portion is connected to the cathode lead frame on at least three surfaces among surfaces substantially parallel to a direction in which the anode portion and the cathode portion are continuous.
前記陰極部は、陽極体の周面に形成され、前記陽極部は、前記陽極体に植立している陽極リードからなる固体電解コンデンサにおいて、
前記陽極体の前記陽極リードが植立されている面において、前記陰極部の、対向する双方の面が互いに前記陰極部が接続されている面と前記陽極リードとの距離が、前記陰極リードフレームと前記陰極部が接続されていない面と前記陽極リードとの距離より小さいことを特徴とする請求項4に記載の固体電解コンデンサ。
The cathode part is formed on a peripheral surface of an anode body, and the anode part is a solid electrolytic capacitor including an anode lead planted on the anode body.
In the surface of the anode body on which the anode lead is planted, the distance between the surface where the cathode portion is connected to the opposite surface of the cathode portion and the anode lead is the cathode lead frame. 5. The solid electrolytic capacitor according to claim 4, wherein the distance is smaller than the distance between the surface where the cathode part is not connected to the anode lead.
請求項1乃至3のいずれかに記載の固体電解コンデンサの製造方法において、
前記陰極リードフレームは平板状からなり、該平板状リードフレームに矩形の切り込みをいれ、該切り込みの内側に前記コンデンサ素子を載置し、前記切り込みの外側を前記陰極部の周面に沿って折り曲げて接続することを特徴とする固体電解コンデンサの製造方法。
In the manufacturing method of the solid electrolytic capacitor in any one of Claims 1 thru | or 3,
The cathode lead frame has a flat plate shape, a rectangular cut is made in the flat lead frame, the capacitor element is placed inside the cut, and the outside of the cut is bent along the peripheral surface of the cathode portion. And a solid electrolytic capacitor manufacturing method.
JP2007271903A 2007-10-19 2007-10-19 Solid electrolytic capacitor and manufacturing method thereof Expired - Fee Related JP5057926B2 (en)

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JP2019153631A (en) * 2018-03-01 2019-09-12 パナソニックIpマネジメント株式会社 Electrolytic capacitor
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