JP2010027900A - Stacked solid electrolytic capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stacked solid electrolytic capacitor which can reduce influences caused by an electromagnetic wave to be radiated to the outside and the electromagnetic wave coming from the outside. <P>SOLUTION: This capacitor comprises: a stacked body obtained by stacking a plurality of capacitor elements C1 to C4 which comprise anode parts P1 to P4 on one side and cathode parts N1 to N4 on the other side so that the positions of the cathode parts are aligned and the protruding directions of the anode parts are alternately inversed; a cathode lead frame connected to one side face of a cathode body comprising a plurality of cathode parts; an anode lead frame 8 on one side connected to the anode part protruding to one side of the cathode body; and an anode lead frame 8' on the other side connected to the anode part protruding to the other side of the cathode body. This capacitor further comprises a conductive shield member 12 which is connected to the cathode lead frame and covers at least a part of the side face of the cathode body. At least each part of the cathode lead frame, the anode lead frame on one side, and the anode lead frame on the other side is exposed, and a remaining portion of each lead frame, the stacked body, and the shield member are sealed by an insulating sealer 13. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a multilayer solid electrolytic capacitor, and more particularly to a multilayer solid electrolytic capacitor having a multi-terminal structure having anode terminals on both sides of a cathode terminal.

  Conventionally, as a solid electrolytic capacitor, in addition to a normal two-terminal structure, there has been proposed a multi-terminal structure in which the lead-out directions of the anode terminal and the cathode terminal are orthogonal to each other (for example, Patent Document 1). To 3).

  In general, a solid electrolytic capacitor has a valve action metal such as aluminum or tantalum as an anode, an oxide film layer formed thereon as a dielectric, and a solid electrolyte layer formed thereon to form a cathode. Is often used. As this solid electrolyte, in addition to manganese dioxide, a TCNQ complex, a conductive polymer, and the like are known (for example, see Patent Document 4).

  In recent years, electronic devices have been reduced in size and frequency, and capacitors have been required to have low impedance in the high-frequency region. Solid electrolytic capacitors using high-conductivity conductive polymers as solid electrolytes have been developed. It has been commercialized. Since this solid electrolytic capacitor uses a high-conductivity conductive polymer for the solid electrolyte, various improvements have been made since lower ESR can be achieved compared to solid electrolytic capacitors using manganese dioxide. (For example, see Patent Document 5).

  In addition, since the current flowing through the capacitor is dramatically increased as the voltage and speed of the CPU of the computer are reduced, if the ESR of the capacitor is high, the amount of heat generated is large, causing a failure of the capacitor. Therefore, it is becoming an essential condition that each capacitor has a low ESR.

As one method for realizing the low ESR, there is a method in which a capacitor element is formed in a multilayer structure, and the number of stacked layers is increased.
The multilayer structure of the multilayer solid electrolytic capacitor includes a single plate capacitor element having an anode part and a cathode part made of a solid electrolyte layer, with the anode part overlapping the anode part and the cathode part overlapping each other. A structure in which a plurality of layers are stacked and a potential extracting lead frame (terminal plate) is connected to each electrode is known (see, for example, Patent Document 6).
In addition, the applicant of the present application alternately stacked the single-plate capacitor elements so that the anode portions face each other with the cathode portion as the center, and branched out the anode portion and the cathode portion to draw out the magnetic field. A structure for lowering was proposed (see, for example, Patent Document 7).

Japanese Unexamined Patent Publication No. 63-155607 Japanese Utility Model Publication No. 63-188937 Japanese Patent Laid-Open No. 06-120088 Japanese Patent No. 2996992 JP 2003-45753 A JP 2000-68158 A JP 2007-180327 A

  In recent years, with the use of electronic devices in a high-frequency region, a high-frequency current of several MHz to several GHz flows through a multi-terminal stacked solid electrolytic capacitor used in a high-frequency circuit. For this reason, the influence of noise on the equipment due to electromagnetic waves generated from the multilayer solid electrolytic capacitor main body and radiated to the outside and electromagnetic waves flying from the outside to the multilayer solid electrolytic capacitor is a problem.

  However, in the techniques described in Patent Documents 1 to 7, sufficient consideration is given to the influence of electromagnetic waves radiated from the multilayer solid electrolytic capacitor to the outside and electromagnetic waves flying from the outside to the multilayer solid electrolytic capacitor. There is a risk that the device may malfunction due to the influence of these electromagnetic noises.

  The present invention has been made in view of the above problems, and an object thereof is to provide a multilayer solid electrolytic capacitor capable of reducing the influence of electromagnetic waves radiated to the outside and electromagnetic waves flying from the outside. To do.

  In order to achieve the above object, the present invention provides a plurality of plate-like capacitor elements each having an anode portion on one side and a cathode portion on the other side, aligning the position of the cathode portion, and the protruding direction of the anode portion is Laminated bodies stacked alternately and oppositely, a cathode lead frame electrically connected to one side of the cathode body composed of the plurality of cathode sections, and the anode section protruding to one side of the cathode body A cathode lead frame which is electrically connected to the cathode lead frame and arranged on the same plane while being spaced apart from the cathode lead frame; and the anode lead protruding to the other side of the cathode body; A laminated solid electrolytic capacitor having an anode lead frame on the other side disposed on the same plane while being separated from the frame, the cathode solid being electrically connected to the cathode lead frame; A conductive shield member covering at least a part of the side surface, and exposing at least a part of each of the cathode lead frame, the one-side anode lead frame, and the other-side anode lead frame; The portion, the laminate, and the conductive shield member are sealed with an insulating sealing material.

  The shield member includes a shield plate having a U-shaped cross section that covers all of the side surface of the cathode body except the one side surface to which the cathode lead frame is connected and the protruding surface of the anode portion. This is a feature of a laminated solid electrolytic capacitor.

In the invention thus configured, the multilayer solid electrolytic capacitor includes a cathode lead frame electrically connected to one side surface of a cathode body composed of a plurality of cathode sections, and an anode section protruding to one side of the cathode body. Is electrically connected to the anode lead frame disposed on the same plane while being separated from the cathode lead frame, and the anode portion protruding to the other side of the cathode body, and is separated from the cathode lead frame. And the other-side anode lead frame arranged on the same plane. At least a part of the side surface of the cathode body is covered with a conductive shield member electrically connected to the cathode lead frame.
For this reason, not only the electromagnetic waves flying from the outside to the cathode body but also the electromagnetic waves radiated from the cathode body to the outside can be shielded, and the influence of these electromagnetic waves can be reduced.
In addition, while exposing at least a part of each of the cathode lead frame, the one-side anode lead frame, and the other-side anode lead frame, the remaining portion of each lead frame, the laminate, and the conductive shield member are covered with an insulating sealing material. It is sealed. That is, the shield member is embedded in the insulating sealing material. For this reason, it is possible to reduce the influence of electromagnetic waves while reducing the volume of the entire capacitor as compared with the case where the outside of the insulating sealing material is covered with a shield member.

Here, when the cathode body is configured to have a U-shaped shield plate that covers all of the side face except the one side face to which the cathode lead frame is connected and the protruding face of the anode section, Therefore, it is possible to reliably shield the electromagnetic wave flying from the outside and the electromagnetic wave radiated from the cathode body to the outside, and the influence of noise on the device can be effectively suppressed.
Furthermore, the mechanical strength of the capacitor body can be increased by covering the laminate (cathode body) with a U-shaped shield plate.

  Further, when the U-shaped shield plate is configured to have a collar portion that covers at least a part of the anode portion, not only the cathode body but also the anode lead frame and the other side anode lead frame opposite to the anode portion. The buttocks shield electromagnetic waves radiated from the outside to the outside and incoming electromagnetic waves. Thereby, the electromagnetic wave tolerance with respect to a laminated body can be improved, and the radiation | emission of the electromagnetic wave from a laminated body can be suppressed.

  Further, when the U-shaped shield plate is configured to cover the anode part so as to sandwich the anode part in the direction orthogonal to the protruding direction of the anode part, the electromagnetic wave resistance to the laminate and the radiation suppression performance of the electromagnetic wave from the laminate Can be further enhanced. Further, the mechanical strength of the capacitor body can be further improved.

  The U-shaped shield plate is preferably a copper plate. Thereby, the heat dissipation effect from a laminated body can be heightened, ensuring the shielding property with respect to above-mentioned electromagnetic waves, and mechanical strength.

  ADVANTAGE OF THE INVENTION According to this invention, in a multilayer solid electrolytic capacitor, the influence by the electromagnetic waves radiated | emitted outside and the electromagnetic waves which fly from the outside can be reduced. In addition, the shielding property against electromagnetic waves can be improved while reducing the volume of the entire capacitor.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a top view for explaining the configuration of one capacitor element constituting a multilayer solid electrolytic capacitor according to one embodiment of the present invention, and FIG. 2 is taken along the line AA ′ of FIG. It is an expanded sectional view.
Referring to FIG. 2, the capacitor element C includes a valve action metal plate 1 made of a thin plate roughened with aluminum, tantalum or the like. An oxide film layer 2 serving as a dielectric is formed on the entire surface of the valve action metal plate 1. One side of the valve metal plate 1 constitutes an anode part P, the other side of the valve metal plate 1 has a solid electrolyte layer 3 on the oxide film layer 2, a carbon layer 4 on it, and a carbon layer 4 thereon. The silver layer 5 is sequentially formed to constitute the cathode portion N. The solid electrolyte layer 3 is a layer in which an electrolyte containing a conductive polymer such as polyethylenedioxythiophene (PEDT) is formed by chemical polymerization or electrolytic polymerization.

  In this embodiment, from a functional point of view, the entire valve action metal plate 1 is an anode, while the portion composed of the solid electrolyte layer 3, the carbon layer 4, and the silver layer 5 is collectively referred to as a cathode portion N, A portion where the cathode portion N of the valve metal plate 1 is not formed, that is, a portion protruding to the left in FIG. 2 (anode exposed portion) is referred to as an anode portion P for convenience.

  An insulating masking member 6 is provided on the surface of the oxide film layer 2 of the valve action metal plate 1 at an appropriate position between the anode part P and the cathode part N in the valve action metal plate 1. P and the cathode part N are completely insulated and isolated.

Next, a method for manufacturing a capacitor element will be described below with reference to a manufacturing example in which aluminum is used as a valve metal plate.
A long aluminum foil having a thickness of 0.1 mm whose surface has been electrochemically roughened is anodized for about 60 minutes while applying a voltage of 10 V in an aqueous solution of ammonium adipate to form a dielectric on the surface. An oxide film layer is formed. As shown in FIG. 1, the aluminum foil on which the oxide film layer is formed is cut into a plane size having a width (w) of 10 mm and a length (l) of 15 mm.
Next, as shown in FIG. 2, a masking member 6 such as an insulating resin is applied in an appropriate position in the circumferential direction, so that the left and right regions (anode portion P and cathode portion N) are separated.
Thereafter, the side portion of the valve metal plate 1 exposed by the above-described cutting is oxidized for about 30 minutes while applying a voltage of 7 V again in the aqueous solution of ammonium adipate. An oxide film layer is formed. Thereafter, the solid electrolyte layer 3, the carbon layer 4, and the silver layer 5 are provided on the right side of the masking member 6 to form the cathode portion N, and the capacitor element C is manufactured.

  Next, a method for producing a multilayer solid electrolytic capacitor in which the flat capacitor elements are laminated will be described.

3 and 4 are a top view and a side view, respectively, of a laminate in which four flat capacitor elements C1, C2, C3, and C4 manufactured by the above-described method are stacked.
As shown in FIGS. 3 and 4, the positions of the cathode portions N1, N2, N3, and N4 are aligned, and the protruding directions of the anode portions P1, P2, P3, and P4 are centered on the stacked body of the cathode portions N1 to N4. Capacitor elements C1 to C4 are sequentially stacked so as to be alternately reversed. Further, the cathode portions N1 to N4 are closely and electrically joined via the conductive adhesive 7. The entire cathode part formed by the stacked cathode parts N1 to N4 is referred to as a cathode body.
Here, the internal structures of the cathode portions N1 to N4 (solid electrolyte layer 3, carbon layer 4, and silver layer 5) are the same as those shown in FIG.

FIG. 5 shows anode lead frames 8 and 8 ′ and cathodes serving as terminal members arranged on the lower side of the laminated body of anode parts P1 to P4 and cathode parts N1 to N4 of the laminated body of capacitor elements C1 to C4, respectively. FIG. 6 is a side view showing a state where the lead frame 9 is connected.
As shown in FIG. 5, anode parts P1 and P3 projecting to one side (left side) of the cathode body and anode parts P2 and P4 projecting to the other side (right side) are separated from the cathode lead frame 9, respectively. However, they are electrically connected to the two anode lead frames 8 and 8 ′ arranged on the same plane, that is, the one-side anode lead frame 8 and the other-side anode lead frame 8 ′. More specifically, these anode lead frames 8 and 8 'are provided on the left and right sides of the cathode lead frame 9, and anode portions P1 and P3 are provided on one side anode lead frame 8, and anode portions P2 and P4 are provided on the other side anode lead frame. It is electrically connected to 8 'by resistance welding or the like. Further, the cathode part N1 located at the lowermost part and the cathode lead frame 9 arranged on the lower surface thereof are closely electrically connected via the conductive adhesive 7.
Then, at least a part of each of the anode lead frames 8, 8 ′ and the cathode lead frame 9 is exposed, the remaining portions of the lead frames 8, 8 ′, 9, the laminate, and a copper plate 12 (conductive shield described later). The member is sealed (packaged) with an insulating sealing material (insulating resin) to produce a multi-terminal stacked solid electrolytic capacitor. In addition, it is preferable to use a copper-based alloy as the anode lead frames 8 and 8 'and the cathode lead frame 9, but any one of gold, silver, copper, niobium, tantalum, aluminum and a conductive polymer, or You may use what combined it.

  6, 7, 8, and 9 are examples in which the anode lead frames 8 and 8 ′ are bridged and connected by a bridging member 10 made of the same material as the lead frame, and are laminated flat plate capacitors. The anode parts P1 and P3 on both the left and right sides of the elements C1 to C4 and the anode parts P2 and P4 are electrically connected to the anode lead frames 8 and 8 'by resistance welding or the like, respectively, and the cathode part located at the bottom N1 is electrically connected to the cathode lead frames 9 and 9 ′ by the conductive adhesive 7, and is a view showing a state in which the laminated body of the capacitor elements C1 to C4 is mounted on the lead frame (insulating sealing material) Is omitted).

In addition, in order to connect anode part P1-P4 with the shortest distance, as shown in FIG. 6, H which arrange | positioned the bridging member 10 in the space | gap part g between the cathode lead frames 9 and 9 'divided into two. A lead frame was used.
FIG. 8 is a cross-sectional view taken along the line BB ′ of FIG. As shown in FIG. 8, the cross sections of the anode lead frames 8 and 8 ′ are thick in the vicinity of both sides, and the bridging member 10 is thin.
FIG. 9 is a cross-sectional view taken along the line CC ′ of FIG.
In order to prevent the bridging member 10 of the anode lead frame from coming into contact with the surface of the cathode part N1 of the capacitor element, a masking member 11 such as an insulating resin is previously placed on the lower surface side of the cathode part N1 and the width of the bridging member 10 It is applied so that it is more widely applied or wound around the bridging member 10.

  Next, examples of the present invention will be described.

Example 1
FIG. 10 shows a copper plate 12 (shield member) having a U-shaped cross-section with a thickness of 0.3 mm, electrically connected to the cathode lead frames 9 and 9 ′ via the conductive adhesive 7, and capacitor elements C1 to C4. It is sectional drawing which shows the state formed so that the whole cathode body of the laminated body of this might be covered, and FIG. 11 is sectional drawing along CC 'line of FIG. The copper plate 12 is formed so as to cover all the side surfaces of the cathode body except for one side surface to which the cathode lead frames 9 and 9 ′ are connected and the protruding surfaces of the anode portions P1 to P4. The product size of this multilayer solid electrolytic capacitor is 16.7 mm × 12.1 mm × 2.5 mm. As shown in FIG. 10 and FIG. 11, the copper plate 12 is electrically conductive at the end portions of the cathode lead frames 9, 9 ′, separated from the cathode body of the laminate by 0.2 mm so as not to contact the cathode body of the laminate. Connected through the adhesive 7.
12 and 13 respectively show the laminate, the remaining portion of the anode lead frames 8, 8 ', the cathode lead, while exposing at least a part of each of the anode lead frames 8, 8' and the cathode lead frames 9, 9 '. FIG. 4 is a cross-sectional view and a perspective view of a multilayer solid electrolytic capacitor produced by packaging the remaining portions of the frames 9 and 9 ′ and the copper plate 12 with an insulating sealing material 13.

(Example 2)
FIG. 14 shows a copper plate having a U-shaped cross section having a U-shaped cross section with a thickness of 0.3 mm, electrically connected to the cathode lead frames 9 and 9 ′ via the conductive adhesive 7, and having a collar portion covering the upper portion of the anode portion. 14 (shield member) is a cross-sectional view showing a state in which the cathode body of the laminated body of capacitor elements C1 to C4 and a part of the anode portions P1 to P4 are formed, and FIG. It is sectional drawing along line -C '. The flange provided on the copper plate 14 is disposed on the opposite side of the anode lead P8 with respect to the one-side anode lead frame 8, and the anodes P2, P4 with respect to the other-side anode lead frame 8 ′. Is disposed on the opposite side, and the anode parts P1 to P4 are covered from above. The product dimensions of this multilayer solid electrolytic capacitor were 16.7 mm × 12.1 mm × 2.5 mm. The copper plate 14 is separated from the cathode body of the multilayer body by 0.2 mm so as not to contact the cathode portions N1 to N4 of the multilayer body, and the conductive adhesive 7 is interposed at the end portions of the cathode lead frames 9 and 9 ′. Connected.
FIGS. 16 and 17 respectively show the laminate, the remaining portion of the anode lead frames 8 and 8 ′, the cathode lead frame 8 and 8 ′, exposing at least a part of each of the anode lead frames 8 and 8 ′ and the cathode lead frames 9 and 9 ′. FIG. 6 is a cross-sectional view and a perspective view of a multilayer solid electrolytic capacitor produced by packaging the remaining portion ′ of the frames 9 and 9 and the copper plate 14 with an insulating sealing material 13.

(Conventional example)
A multilayer solid electrolytic capacitor was produced in the same manner as in Examples 1 and 2, except that the cathode portions N1 to N4 and the anode portions P1 to P4 were not covered with the copper plates 12 and 14, respectively. The product dimensions were set to 16.7 mm × 12.1 mm × 2.5 mm as in Example 1 and Example 2.

  The shielding effects against electromagnetic waves of the multilayer solid electrolytic capacitors of Example 1 and Example 2 of the present invention and the multilayer solid electrolytic capacitor of the conventional example were compared. Table 1 shows the results of comparison of transmission noise levels of electromagnetic waves generated when a 100 MHz alternating current is passed through a single component mounted on a substrate for each example.

As can be seen from Table 1, the multilayer solid electrolytic capacitors of Example 1 and Example 2 have a lower transmission noise level (higher shielding effect) than the conventional example. Since at least a part of the laminate is covered with a conductive shield member connected to the cathode lead frame in the packaging, the laminate type has a shielding effect larger than that of the conventional example without increasing the product size. A solid electrolytic capacitor was realized.
As can be seen from Table 1, the effect of the present invention increases as the area covered with the shield member increases.

Thus, the shielding effect is increased because the electromagnetic noise generated from the multilayer solid electrolytic capacitor body is absorbed by the copper plate covering the periphery of the cathode body, and the ground of the circuit board from the cathode frame of the multilayer solid electrolytic capacitor. It is because it is escaped by.
In Example 1 and Example 2, the case where the cathode body of the laminated body was entirely covered with a copper plate was described. However, even if the covering range is reduced, the shielding effect is slightly reduced, but a sufficient shield compared to the conventional example. An effect is obtained.
Moreover, in Example 1 and Example 2, although the thickness of the copper plate was 0.3 mm, as long as it is within the product dimensions, the copper plate can be thicker or thinner than the conventional example. A shielding effect is obtained.
Furthermore, in Example 1 and Example 2, a clearance of 0.2 mm was taken so that the copper plate did not contact the laminate, but within the product dimensions, the gap was widened so that the copper plate did not contact the laminate, Or even if it is narrow, a sufficient shielding effect can be obtained as compared with the conventional example.

  In Example 2, the copper plate (shield member) has a flange portion that covers the upper portion of the anode portion, but the copper plate (shield member) further has an anode so as to sandwich the anode portion in a direction orthogonal to the protruding direction of the anode portion. You may comprise so that it may have a collar part which covers a part. In this case, a higher shielding effect can be obtained as compared with the second embodiment.

  The multilayer solid electrolytic capacitor according to the present invention has a high mechanical strength and a sufficient heat dissipation effect due to the copper plate covering the periphery of the cathode portion.

  In the above-described embodiment, the case where aluminum is used as the valve metal has been described. However, the same effect can be obtained by using tantalum, niobium foil, or a sintered body thereof.

  Furthermore, in the above-described embodiments, copper is described as an example of the shield member that covers the laminated body. However, even if a conductive material such as gold, silver, niobium, tantalum, aluminum, or a conductive polymer is used, the same applies. The effect is obtained.

  And although the board | plate material was used as a shape of a shield member, the same effect is acquired also as a punching metal or mesh shape.

  Furthermore, in the above-described embodiments, the case of the conductive polymer as the solid electrolyte has been described, but the same effect can be obtained with manganese dioxide.

  Finally, in the embodiment, four layers are stacked, but the same effect can be obtained even if the number of stacked layers is increased. Although the number of terminals is three, the same effect can be obtained by increasing the number of terminals.

It is a top view for demonstrating the structure of one capacitor | condenser element. It is an expanded sectional view along the A-A 'line of FIG. It is a top view of the laminated body which laminated | stacked four capacitor | condenser elements. It is a side view of the laminated body which laminated | stacked four capacitor | condenser elements. It is a side view which shows the state which connected the anode part and the cathode part to the lead frame. It is a top view which shows the structure of a lead frame. It is a top view which shows the state which connected the anode part and the cathode part to the lead frame. FIG. 8 is a cross-sectional view taken along line B-B ′ of FIG. 7. FIG. 8 is a cross-sectional view taken along line C-C ′ of FIG. 7. It is sectional drawing which shows the copper plate in Example 1 of this invention. It is sectional drawing along line C-C 'of FIG. It is sectional drawing of the multilayer type solid electrolytic capacitor of Example 1 of this invention. 1 is a perspective view of a multilayer solid electrolytic capacitor according to Example 1 of the present invention. It is sectional drawing which shows the copper plate in Example 2 of this invention. FIG. 15 is a cross-sectional view taken along line C-C ′ of FIG. 14. It is sectional drawing of the multilayer type solid electrolytic capacitor of Example 2 of this invention. It is a perspective view of the multilayer solid electrolytic capacitor of Example 2 of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Valve action metal plate 2 Oxide film layer 3 Solid electrolyte layer 4 Carbon layer 5 Silver layer 6 Masking member 7 Conductive adhesive 8, 8 'Anode lead frame 9, 9' Cathode lead frame 10 Bridging member 11 Masking member 12 Copper plate ( Shield member)
13 Insulating sealing material 14 Copper plate (shield member)
C Capacitor elements C1 to C4 Capacitor element g Gap part N Cathode part N1 to N4 Cathode part P Anode part P1 to P4 Anode part (anode exposed part)

Claims (5)

A laminated body in which a plurality of plate-like capacitor elements each having an anode part on one side and a cathode part on the other side are stacked so that the positions of the cathode parts are aligned and the protruding directions of the anode parts are alternately reversed When,
A cathode lead frame electrically connected to one side surface of the cathode body composed of the plurality of cathode portions;
One side anode lead frame that is electrically connected to the anode part protruding to one side of the cathode body and is arranged in the same plane while being separated from the cathode lead frame;
In the multilayer solid electrolytic capacitor comprising the other-side anode lead frame electrically connected to the anode portion protruding to the other side of the cathode body and disposed on the same plane while being separated from the cathode lead frame,
A conductive shield member that is electrically connected to the cathode lead frame and covers at least a part of a side surface of the cathode body;
While exposing at least a part of each of the cathode lead frame, the one-side anode lead frame, and the other-side anode lead frame, the remaining portion of each lead frame, the laminate, and the conductive shield member are insulatively sealed. A multilayer solid electrolytic capacitor characterized by being sealed with a stopper.   The shield member includes a shield plate having a U-shaped cross section that covers all of one side surface of the cathode body except the one side surface to which the cathode lead frame is connected and the protruding surface of the anode portion. The multilayer solid electrolytic capacitor according to claim 1.   The U-shaped shield plate is disposed on the opposite side of the anode portion with respect to the one-side anode lead frame and the other-side anode lead frame, and has a flange portion that covers at least a part of the anode portion. The multilayer solid electrolytic capacitor according to claim 2.   The multilayer solid electrolytic capacitor according to claim 3, wherein the U-shaped shield plate covers the anode part so as to sandwich the anode part in a direction orthogonal to a protruding direction of the anode part.   5. The multilayer solid electrolytic capacitor according to claim 2, wherein the U-shaped shield plate is made of a copper plate.

Images