JP2009094306A - Shield case and method of manufacturing shield case - Google Patents

Shield case and method of manufacturing shield case Download PDF

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JP2009094306A
JP2009094306A JP2007263893A JP2007263893A JP2009094306A JP 2009094306 A JP2009094306 A JP 2009094306A JP 2007263893 A JP2007263893 A JP 2007263893A JP 2007263893 A JP2007263893 A JP 2007263893A JP 2009094306 A JP2009094306 A JP 2009094306A
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shield case
raised
cut
hole
shield
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JP5403892B2 (en
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Shinya Tanaka
慎也 田中
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Yazaki Corp
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Yazaki Corp
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Priority to DE200810046534 priority patent/DE102008046534B4/en
Priority to PT10419408A priority patent/PT104194B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0049—Casings being metallic containers

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  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a shield case which contributes to both maintenance of shield effect and improvement in yield, and to provide a method of manufacturing the shield case. <P>SOLUTION: A position to be worked of a projection portion through hole 14 through which a projection portion 16 is inserted and a position to be worked of a bent pin portion 18 are set to the same position. The manufacturing method includes a step of setting the position of the projection portion through hole 14 through which the projection portion 16 is inserted and the position of the bent pin portion 18 to be inserted into a circuit board to be at the same position and working them when a metal plate 19 as a raw material of the shield case 11 is blanked. After the step, the bent pin portion 18 is raised in a predetermined state and the projection portion through hole 14 is completely opened. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、シールド対象部品を覆って電磁ノイズ対策を施すシールドケースに関する。詳しくは、切り起こしピン部及び凸部通し穴を有するシールドケースと、このシールドケースの製造方法とに関する。   The present invention relates to a shield case that covers electromagnetic shielding parts and covers electromagnetic noise countermeasures. Specifically, the present invention relates to a shield case having a cut and raised pin portion and a convex portion through-hole, and a method for manufacturing the shield case.

シールドケースは、導電性を有する金属板を打ち抜き・折り曲げ加工して例えば略箱状となるように形成されている。シールドケースは、シールド対象部品を覆って回路基板に固定される際に、シールドケースのグランドピンが半田付けによって回路基板に電気的に接続されるようになっている。   The shield case is formed to have a substantially box shape, for example, by punching and bending a conductive metal plate. When the shield case covers the part to be shielded and is fixed to the circuit board, the ground pin of the shield case is electrically connected to the circuit board by soldering.

下記特許文献１には、複数のグランドピンを有するシールドケースが開示されている。グランドピンは、シールドケースの縁部から真っ直ぐのびるように形成されている。また、グランドピンは、比較的長くのびるように形成されている。
特開２００５−２０９４２３号公報 Patent Document 1 below discloses a shield case having a plurality of ground pins. The ground pin is formed so as to extend straight from the edge of the shield case. The ground pin is formed so as to extend relatively long.
JP 2005-209423 A

図５（ａ）において、導電性を有する金属板１を打ち抜いてグランドピン２を形成する場合、金属板１の引用符号３で示す部分（網状のハッチング部分）が不要になってしまうことになる。そこで、歩留まりの悪さを解消するために、図５（ｂ）及び（ｃ）に示す如く、金属板４にグランドピン５を切り起こしによって形成することが考えられる。しかしながら、歩留まりが向上するもののシールド効果に影響を来す恐れのある開口６が生じてしまうことになる。   In FIG. 5A, when the ground pin 2 is formed by punching out the conductive metal plate 1, the portion indicated by reference numeral 3 (a net-like hatched portion) of the metal plate 1 becomes unnecessary. . Therefore, in order to eliminate the poor yield, it is conceivable to form the ground pin 5 by cutting and raising the metal plate 4 as shown in FIGS. However, although the yield is improved, an opening 6 that may affect the shielding effect is generated.

本発明は、上記した事情に鑑みてなされたもので、シールド効果の維持と歩留まり向上の両方に寄与するシールドケース及びシールドケースの製造方法を提供することを課題とする。   This invention is made | formed in view of an above-described situation, and makes it a subject to provide the manufacturing method of the shield case and shield case which contribute to both maintenance of a shield effect and a yield improvement.

上記課題を解決するためになされた請求項１記載の本発明のシールドケースは、導電性を有する金属板を打ち抜き・折り曲げ加工してなるシールドケースであって、シールド対象部品を覆って回路基板に固定される際に、切り起こしにより形成される一又は複数の切り起こしピン部が前記回路基板に差し込まれる構造のシールドケースにおいて、前記シールド対象部品の凸部を挿通するための凸部通し穴の加工位置と、前記切り起こしピン部の加工位置とを同じにし、該切り起こしピン部を所定の状態に起こすと前記凸部通し穴が完全に開口することを特徴としている。   The shield case of the present invention according to claim 1 made to solve the above-mentioned problem is a shield case formed by punching and bending a conductive metal plate, covering a shield target component on a circuit board. In a shield case having a structure in which one or a plurality of cut and raised pin portions formed by cutting and raising are inserted into the circuit board when fixed, a convex portion through-hole for inserting the convex portion of the shield target component When the machining position and the machining position of the cut-and-raised pin part are made the same, and the cut-and-raised pin part is raised to a predetermined state, the convex part through hole is completely opened.

請求項２記載の本発明のシールドケースは、請求項１に記載のシールドケースにおいて、前記切り起こしピン部はグランドピンとして形成され、前記回路基板に差し込まれて半田付けされることを特徴としている。   A shield case according to a second aspect of the present invention is the shield case according to the first aspect, wherein the cut-and-raised pin portion is formed as a ground pin and is inserted into the circuit board and soldered. .

上記課題を解決するためになされた請求項３記載の本発明のシールドケースの製造方法は、導電性を有しシールド対象部品を覆って回路基板に固定されるシールドケースの製造方法において、前記シールドケースの素材となる金属板を打ち抜く加工の際に、前記シールド対象部品の凸部を挿通するための凸部通し穴と、前記回路基板に差し込まれる切り起こしピン部とを同じ位置にして加工する工程を行い、この後に前記切り起こしピン部を所定の状態に起こして前記凸部通し穴を完全に開口させる工程を行うことを特徴としている。   The manufacturing method of the shield case of the present invention according to claim 3, which has been made to solve the above-described problem, is a method of manufacturing a shield case that has conductivity and covers a shield target component and is fixed to a circuit board. When punching out the metal plate that is the material of the case, the convex part through hole for inserting the convex part of the shielded component and the cut and raised pin part inserted into the circuit board are processed at the same position. It is characterized by performing a step, and thereafter performing a step of raising the cut-and-raised pin portion in a predetermined state to completely open the convex portion through-hole.

このような特徴を有する本発明によれば、凸部通し穴を形成する際に不要となる部分の一部が切り起こしピン部として活用される。凸部通し穴は、凸部を挿通するための必要性のある穴であることから、この凸部通し穴の加工位置に合わせて切り起こしピン部を形成すれば、シールド性能に影響を来すような開口の発生を極力避けることが可能になる。また、加工数を低減することも可能になる。   According to the present invention having such characteristics, a part of the portion that is unnecessary when forming the convex portion through hole is cut and raised and used as the pin portion. Since the convex through hole is a hole that needs to be inserted through the convex part, if the pin part is formed by cutting and raising in accordance with the processing position of the convex through hole, the shielding performance is affected. Such an opening can be avoided as much as possible. In addition, the number of processes can be reduced.

尚、切り起こしピン部は、シールドケースを回路基板に対し機械的に固定するための固定用のピンと、回路基板の回路パターンに半田付けされるグランドピンのいずれであっても良いものとする。   The cut-and-raised pin portion may be either a fixing pin for mechanically fixing the shield case to the circuit board or a ground pin soldered to the circuit pattern of the circuit board.

請求項１、２に記載された本発明によれば、シールド効果の維持と歩留まり向上の両方に寄与することができるという効果を奏する。また、請求項２に記載された本発明によれば、切り起こしピン部の対象をグランドピンとすることができるという効果を奏する。   According to the first and second aspects of the present invention, there is an effect that it is possible to contribute to both the maintenance of the shielding effect and the improvement of the yield. Moreover, according to the second aspect of the present invention, there is an effect that the object of the cut and raised pin portion can be a ground pin.

以下、図面を参照しながら説明する。図１は本発明のシールドケース及びシールドケースの製造方法の一実施の形態を示す図であり、（ａ）は切り起こしピン部を起こすとともにシールド対象部品の凸部を凸部通し穴に挿通した状態の斜視図、（ｂ）はシールドケースの素材となる金属板の要部の平面図である。   Hereinafter, description will be given with reference to the drawings. FIG. 1 is a diagram showing an embodiment of a shield case and a shield case manufacturing method according to the present invention. FIG. 1A shows a cut-and-raised pin part and a convex part of a shielded part inserted through a convex part through-hole. The perspective view of a state, (b) is a top view of the principal part of the metal plate used as the raw material of a shield case.

図１（ａ）において、シールドケース１１は、導電性を有しており、例えば略箱状となるように形成されている。シールドケース１１は、シールド対象部品１２を覆ってこのシールド対象部品１２に電磁ノイズ対策を施すために備えられている。シールドケース１１は、特に図示しないが、回路基板に対して機械的・電気的に接続固定されるようになっている。   In FIG. 1A, the shield case 11 has conductivity, and is formed, for example, in a substantially box shape. The shield case 11 is provided in order to cover the shield target component 12 and take measures against electromagnetic noise on the shield target component 12. Although not specifically shown, the shield case 11 is mechanically and electrically connected and fixed to the circuit board.

シールドケース１１の基板対向面１３には、凸部通し穴１４が開口形成されている（一又は複数形成されている）。この凸部通し穴１４には、シールド対象部品１２のケース１５外面に設けられる凸部１６が挿通されるようになっている。凸部通し穴１４は、凸部１６の形状に合わせて開口形成されている。凸部１６は、シールド対象部品１２の例えば脚部として形成されている。凸部１６の先端面又は先端部は、上記回路基板に当接又は挿通固定されるようになっている。   On the substrate facing surface 13 of the shield case 11, a protruding portion through hole 14 is formed (one or more are formed). A convex portion 16 provided on the outer surface of the case 15 of the shield target component 12 is inserted into the convex portion through hole 14. The convex portion through hole 14 is formed to have an opening according to the shape of the convex portion 16. The convex portion 16 is formed as, for example, a leg portion of the shield target component 12. The front end surface or the front end portion of the convex portion 16 is configured to contact or be inserted and fixed to the circuit board.

凸部通し穴１４の縁部１７には、切り起こしピン部１８が連成されている。切り起こしピン部１８は、上記回路基板に挿しこまれて半田付けされるグランドピンとして形成されている。切り起こしピン部１８は、切り起こしによって形成される部分であって、図示の如く所定の状態に起こすと、凸部通し穴１４が完全に開口するようになっている。切り起こしピン部１８は、凸部１６に対し、上記回路基板との接続固定に支障が出ないような間隔で配置形成されている。   A cut and raised pin portion 18 is coupled to the edge portion 17 of the convex portion through hole 14. The cut-and-raised pin portion 18 is formed as a ground pin that is inserted into the circuit board and soldered. The cut-and-raised pin portion 18 is a portion formed by the cut-and-raised, and when raised to a predetermined state as shown in the figure, the convex portion through hole 14 is completely opened. The cut-and-raised pin portions 18 are arranged and formed with respect to the convex portion 16 at intervals so as not to hinder the connection and fixation with the circuit board.

次に、シールドケース１１の製造に関し、特に、凸部通し穴１４及び切り起こしピン部１８についての説明をする。   Next, regarding the manufacture of the shield case 11, the convex portion through hole 14 and the cut and raised pin portion 18 will be described in particular.

図１（ａ）及び（ｂ）において、シールドケース１１は、導電性を有しシールドケース１１の素材となる金属板１９を打ち抜き・折り曲げ加工してなるものであって、金属板１９を打ち抜きする加工の際には、図示の如く、凸部通し穴１４と切り起こしピン部１８とを同じ位置で加工するようになっている。   1A and 1B, a shield case 11 is formed by punching and bending a metal plate 19 that is conductive and used as a material of the shield case 11, and punches the metal plate 19. At the time of processing, as shown in the figure, the protruding portion through hole 14 and the cut and raised pin portion 18 are processed at the same position.

凸部通し穴１４は、これを形成する際に、従来では略砲弾形状（ここでの説明では略砲弾形状であり、特に形状は限定されないものとする）の不要部分が生じてしまうが、本発明においては不要部分の一部が切り起こしピン部１８として活用されるようになっている。   When the convex portion through hole 14 is formed, an unnecessary portion having a substantially bullet shape (substantially a bullet shape in the description here, and the shape is not particularly limited) is conventionally generated. In the present invention, a part of the unnecessary portion is cut and raised and used as the pin portion 18.

以上、本発明によれば、凸部通し穴１４は凸部１６を挿通するための必要性のある穴であることから、この凸部通し穴１４の加工位置に合わせて切り起こしピン部１８を形成すれば、シールド性能に影響を来すような開口の発生を極力避けることができるという効果を奏する。従って、本発明は、シールド効果の維持と歩留まりの向上の両方に寄与することができるという効果を奏する。   As described above, according to the present invention, since the convex portion through hole 14 is a hole that is necessary for inserting the convex portion 16, the pin portion 18 is cut and raised in accordance with the processing position of the convex portion through hole 14. If formed, it is possible to avoid the occurrence of an opening that affects the shielding performance as much as possible. Therefore, the present invention has an effect that it can contribute to both the maintenance of the shielding effect and the improvement of the yield.

続いて、図２ないし図４を参照しながらシールドケースの具体的な一例を説明する。図２はシールドケースの素材となる金属板の平面図、図３はシールドケースの斜視図、図４はシールドケースでシールド対象部品を覆った状態の斜視図である。   Next, a specific example of the shield case will be described with reference to FIGS. FIG. 2 is a plan view of a metal plate as a material of the shield case, FIG. 3 is a perspective view of the shield case, and FIG. 4 is a perspective view of the shield target component covered with the shield case.

図２において、打ち抜き加工をした後の金属板２１には、凸部通し穴２２と切り起こしピン部２３とが同じ加工位置で形成されている（太線の円の内側に示されている）。打ち抜き加工をした後の金属板２１は平面的であって、この後に折り曲げ加工を施すと、図３に示す如くの略箱形状となるシールドケース２４の製造が完了する。切り起こしピン部２３は、図示の如く所定の状態に起こされている。これにより凸部通し穴２２は、完全に開口した状態になっている。   In FIG. 2, the projecting hole 22 and the cut-and-raised pin portion 23 are formed at the same processing position on the metal plate 21 after punching (shown inside the thick circle). The metal plate 21 after the punching process is planar, and when the bending process is performed thereafter, the manufacture of the shield case 24 having a substantially box shape as shown in FIG. 3 is completed. The cut-and-raised pin portion 23 is raised in a predetermined state as shown in the drawing. Thereby, the convex part through-hole 22 is in the state opened completely.

図４において、シールド対象部品２５を覆うようにしてシールドケース２４を組み付けると、シールド対象部品２５に対する電磁ノイズ対策が施された状態になる。この状態の時、凸部通し穴２２には、シールド対象部品２５の凸部２６が挿通されるようになっている。凸部２６は、切り起こしピン部２３とともに図示しない回路基板側に突出するようになっている。   In FIG. 4, when the shield case 24 is assembled so as to cover the shield target component 25, the electromagnetic noise countermeasure for the shield target component 25 is taken. In this state, the convex portion 26 of the shield target component 25 is inserted into the convex portion through hole 22. The convex part 26 protrudes to the circuit board side (not shown) together with the cut and raised pin part 23.

この他、本発明は本発明の主旨を変えない範囲で種々変更実施可能なことは勿論である。   In addition, the present invention can of course be modified in various ways within the scope not changing the gist of the present invention.

本発明のシールドケース及びシールドケースの製造方法の一実施の形態を示す図であり、（ａ）は切り起こすとともにピン部を起こしシールド対象部品の凸部を凸部通し穴に挿通した状態の斜視図、（ｂ）はシールドケースの素材となる金属板の要部の平面図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the shielding case of this invention, and the manufacturing method of a shielding case, (a) is a perspective view of the state which raised the pin part and inserted the convex part of the shield object component into the convex part through-hole. FIG. 4B is a plan view of a main part of a metal plate that is a material of the shield case. シールドケースの素材となる金属板の平面図である。It is a top view of the metal plate used as the raw material of a shield case. シールドケースの斜視図である。It is a perspective view of a shield case. シールドケースでシールド対象部品を覆った状態の斜視図である。It is a perspective view of the state where a shield object part was covered with a shield case. 従来のグランドピンの製造に係る説明図であり、（ａ）は歩留まりが生じる図、（ｂ）及び（ｃ）はシールド効果に影響を来す恐れのある開口が生じる図である。It is explanatory drawing which concerns on manufacture of the conventional ground pin, (a) is a figure with which a yield produces, (b) and (c) is a figure with which the opening which may affect a shield effect arises.

符号の説明Explanation of symbols

１１ シールドケース
１２ シールド対象部品
１３ 基板対向面
１４ 凸部通し穴
１５ ケース
１６ 凸部
１７ 縁部
１８ 切り起こしピン部
１９ 金属板
２１ 金属板
２２ 凸部通し穴
２３ 切り起こしピン部
２４ シールドケース
２５ シールド対象部品
２６ 凸部 DESCRIPTION OF SYMBOLS 11 Shield case 12 Shield target part 13 Board | substrate opposing surface 14 Convex part through hole 15 Case 16 Convex part 17 Edge part 18 Cut and raised pin part 19 Metal plate 21 Metal plate 22 Convex part through hole 23 Cut and raise pin part 24 Shield case 25 Shield Target part 26 Convex

Claims (3)

導電性を有する金属板を打ち抜き・折り曲げ加工してなるシールドケースであって、シールド対象部品を覆って回路基板に固定される際に、切り起こしにより形成される一又は複数の切り起こしピン部が前記回路基板に差し込まれる構造のシールドケースにおいて、
前記シールド対象部品の凸部を挿通するための凸部通し穴の加工位置と、前記切り起こしピン部の加工位置とを同じにし、該切り起こしピン部を所定の状態に起こすと前記凸部通し穴が完全に開口する
ことを特徴とするシールドケース。 A shield case formed by punching and bending a conductive metal plate, and one or more cut-and-raised pin portions formed by the cut-and-raised portion are formed when the shield target part is covered and fixed to the circuit board. In the shield case having a structure to be inserted into the circuit board,
If the machining position of the projection through-hole for inserting the projection of the shielded part is the same as the machining position of the cut-and-raised pin part, and the raised part is raised to a predetermined state, Shield case characterized by a completely open hole. 請求項１に記載のシールドケースにおいて、
前記切り起こしピン部はグランドピンとして形成され、前記回路基板に差し込まれて半田付けされる
ことを特徴とするシールドケース。 The shield case according to claim 1,
The cut-and-raised pin portion is formed as a ground pin, and is inserted into the circuit board and soldered. 導電性を有しシールド対象部品を覆って回路基板に固定されるシールドケースの製造方法において、
前記シールドケースの素材となる金属板を打ち抜く加工の際に、前記シールド対象部品の凸部を挿通するための凸部通し穴と、前記回路基板に差し込まれる切り起こしピン部とを同じ位置にして加工する工程を行い、この後に前記切り起こしピン部を所定の状態に起こして前記凸部通し穴を完全に開口させる工程を行う
ことを特徴とするシールドケースの製造方法。 In a method for manufacturing a shield case that has conductivity and covers a shield target component and is fixed to a circuit board,
In the process of punching out the metal plate that is the material of the shield case, the projecting portion through hole for inserting the projecting portion of the shielded component and the cut and raised pin portion to be inserted into the circuit board are placed at the same position. A method of manufacturing a shield case, comprising: performing a processing step, and thereafter performing a step of raising the cut-and-raised pin portion to a predetermined state and completely opening the convex portion through hole.
JP2007263893A 2007-10-10 2007-10-10 Shield case and method for manufacturing shield case Expired - Fee Related JP5403892B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007263893A JP5403892B2 (en) 2007-10-10 2007-10-10 Shield case and method for manufacturing shield case
DE200810046534 DE102008046534B4 (en) 2007-10-10 2008-09-10 Shielding housing and method for producing the shielding housing
PT10419408A PT104194B (en) 2007-10-10 2008-09-29 SHELF BOX AND PROCESS FOR PRODUCING THE SHIELD BOX

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN110769668A (en) * 2018-07-27 2020-02-07 广州方邦电子股份有限公司 Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film

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JP2012033535A (en) * 2010-07-28 2012-02-16 Mitsumi Electric Co Ltd High-frequency device and printed board holding structure
DE102015220473B4 (en) * 2015-10-21 2024-02-22 Bayerische Motoren Werke Aktiengesellschaft Method for producing a housing component with shielding against electromagnetic radiation and with an environmental sealing function

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JPS6099584U (en) * 1983-12-12 1985-07-06 アルプス電気株式会社 Small case for electronic equipment

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JP2005209423A (en) * 2004-01-21 2005-08-04 Auto Network Gijutsu Kenkyusho:Kk Shield connector for base board
JP5041721B2 (en) 2006-03-29 2012-10-03 中国電力株式会社 Plankton distribution research ship

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JPS6099584U (en) * 1983-12-12 1985-07-06 アルプス電気株式会社 Small case for electronic equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110769668A (en) * 2018-07-27 2020-02-07 广州方邦电子股份有限公司 Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film
CN110769668B (en) * 2018-07-27 2024-04-23 广州方邦电子股份有限公司 Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film

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JP5403892B2 (en) 2014-01-29
DE102008046534A1 (en) 2009-04-23

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