JP2009093189A - Method for manufacturing display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a display device capable of preventing upsizing of a manufacture line and cost rise associated therewith without deteriorating quality by using a substrate which can be elongated or contracted. <P>SOLUTION: The method for manufacturing the display device 10 where an element layer 20 having an electrode 511 and an optical functional layer 510 is formed on a substrate 501, the substrate 501 composed of thermal contracting material that achieves contractibility by heat energy, and the element layer 20 composed of elastic material and having adhesive property to the substrate 501, includes an element layer forming stage for forming an element layer 20 on the substrate 501, and a contraction stage for contracting the substrate 501 by the heat energy after forming the element layer 20. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a display device in which an element layer having an electrode and an optical functional layer is formed on a substrate.

Conventionally, a color display device in which a light emitting layer and a hole injection layer of each pixel are formed by using a method of patterning a light emitting material by an ink jet method that discharges a functional liquid such as a light emitting material, particularly an organic light emitting material. An organic EL (Electro-Luminescence) display device using a light emitting material is known (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 10-12377

  This type of organic EL display device has an element layer (such as a switching element, an electrode, a hole injection / transport layer, and a light emitting layer) on a substrate having a target size, that is, a size finally used as a product. Is forming. Therefore, in recent years when an increase in the size of the display panel is required, an increase in the size of a manufacturing apparatus for manufacturing these organic EL display devices is unavoidable, and the high cost required for the manufacturing line has been a problem. In addition, since the inkjet system is adopted, when the substrate is enlarged, the time for discharging the functional liquid over the entire substrate also increases, resulting in drying of the discharge nozzle and uneven drying of the functional liquid that has landed on the substrate. There is also a problem that it is difficult to manufacture the organic EL display device.

  On the other hand, there is an increasing demand for improving the quality of organic EL display devices, for example, the uniformity of the thickness of the functional liquid is required in order to eliminate uneven light emission. Therefore, on the manufacturing apparatus side, it is necessary to control the discharge position and the discharge amount of the functional liquid with higher accuracy. However, this is a big problem because of the balance with the problem of enlargement of the substrate.

  In view of the above problems, the present invention provides a display device manufacturing method capable of preventing an increase in the size of a manufacturing line and an associated increase in cost without degrading quality by using a stretchable or shrinkable substrate. The purpose is to provide.

The display device manufacturing method of the present invention is a display device in which an element layer having an electrode and an optical functional layer is formed on a substrate, and the substrate is made of a heat-shrinkable material that exhibits shrinkage by thermal energy. In the method of manufacturing a display device, the element layer is made of a stretchable material and has adhesiveness to the substrate, and an element layer forming step for forming the element layer on the substrate; And a shrinking step of shrinking the substrate with thermal energy.
Another method for manufacturing a display device according to the present invention is a display device in which an element layer having an electrode and an optical functional layer is formed on a substrate, and the substrate is a light-shrinkable material that exhibits shrinkage by light energy. The element layer is made of a stretchable material, and in the manufacturing method of the display device having adhesiveness to the substrate, the element layer forming step of forming the element layer on the substrate; And a shrinking step of shrinking the substrate with light energy after forming the element layer.
Another display device manufacturing method of the present invention is a display device in which an element layer having an electrode and an optical functional layer is formed on a substrate, and the substrate and the element layer are both made of a stretchable material. In the method of manufacturing a display device having adhesion to the substrate, the element layer has a pre-stretching step for stretching the substrate prior to the formation of the element layer, and a device on the substrate after stretching the substrate. An element layer forming step for forming a layer and a contraction step for contracting the substrate so that the display device has a target size after the element layer is formed are provided.
In the display device manufacturing method described above, the substrate is made of a self-shrinkable elastic material, and in the pre-stretching step, the substrate is stretched by a stretching mechanism that stretches in the X-axis direction and / or the Y-axis direction. It is preferable that the extension mechanism is released in the contraction step.
In the display device manufacturing method described above, the substrate is made of a stretchable material that exhibits irreversibility by thermal energy, and in the shrinking step, the substrate is shrunk and thermal energy is applied to the substrate. Is preferred.
In the manufacturing method of the display device described above, it is preferable that a heat curing step of curing the substrate with thermal energy is further provided after the shrinking step.
The display device manufacturing method described above preferably further includes a photocuring step of curing the substrate with light energy after the shrinking step.
In the manufacturing method of the display device described above, a sealing layer that is configured of a thermosetting material that is cured by thermal energy or a photocurable material that is cured by light energy and that seals the substrate is used in the shrinking process. It is preferable to further include a sealing layer forming step formed in advance and a sealing layer curing step for curing the sealing layer after the shrinking step.
In the method for manufacturing a display device described above, it is preferable that any one of the electrode, the optical functional layer, and the sealing layer, or two or more are formed using an inkjet method.
The following configuration may be used.
The display device of the present invention is a display device in which an element layer having an electrode and an optical functional layer is formed on a substrate, the substrate is made of an irreversible stretchable material, It is composed of a stretchable material and has adhesiveness to the substrate.

  The display device manufacturing method of the present invention is a display device in which an element layer having an electrode and an optical functional layer is formed on a substrate, and the substrate is made of an irreversible stretchable material. The element layer is made of a stretchable material, and in the manufacturing method of the display device having adhesion to the substrate, an element layer forming step for forming the element layer on the substrate and the element layer are formed. And a stretching step of stretching the substrate so that the display device has a target size.

  According to these configurations, the substrate is made of an irreversible stretchable material, and the element layer formed on the substrate is made of a stretchable material and has adhesiveness to the substrate. Therefore, a display device having a size larger than that of the first substrate can be manufactured by extending the substrate after forming the element layer. Therefore, even when a large display device is manufactured, it is possible to prevent an increase in cost associated with this without increasing the size of the manufacturing line. In addition, since the element layer is formed in a state where the substrate is small, for example, when an ink jet method is used, application can be performed quickly on one substrate, and drying of the nozzle can be prevented.

  In the display device manufacturing method described above, the stretching step includes an X-axis stretching mechanism that stretches the substrate in the X-axis direction and a Y-axis stretching mechanism that stretches the substrate in the Y-axis direction. It is preferable to simultaneously stretch the substrate in the two-dimensional direction using a stretching mechanism in which the Y-axis stretching mechanism is connected to each other.

  According to this configuration, since the substrate is extended in the two-dimensional direction, a display device that is two-dimensionally larger than the first substrate can be obtained. The stretching mechanism for stretching the substrate includes an X-axis stretching mechanism and a Y-axis stretching mechanism, which are connected to each other, so that the substrate can be stretched simultaneously and smoothly in the two-dimensional direction.

  In the display device manufacturing method described above, the display device is a liquid crystal display device, and further includes a liquid crystal injection step of injecting liquid crystal between the element layers after the element layer forming step, and in the expansion step, the liquid crystal injection step Thereafter, the substrate is preferably stretched.

  According to this configuration, in the liquid crystal display, since the substrate is stretched after the liquid crystal is injected, the liquid crystal can be aligned in that direction according to the stretching direction. Therefore, a liquid crystal alignment process (such as a rubbing process) for aligning the liquid crystal can be omitted.

  In the manufacturing method of the display device described above, a sealing layer that is configured of a thermosetting material that is cured by thermal energy or a photocurable material that is cured by light energy and that seals the substrate is used in the shrinking process. It is preferable to further include a sealing layer forming step that is formed in advance, and a sealing layer curing step that cures the sealing layer after the stretching step.

  According to this configuration, the gas barrier property can be enhanced by forming the sealing layer. Further, since the sealing layer is cured after the substrate is stretched, the stretching is not hindered by the sealing layer.

  The display device described above is a display device in which an element layer having an electrode and an optical functional layer is formed on a substrate, and the substrate is a heat-shrinkable material that exhibits contractility by thermal energy, or light energy. The element layer is made of a stretchable material and has adhesiveness to the substrate.

  In addition, the method for manufacturing a display device described above is a display device in which an element layer having an electrode and an optical functional layer is formed on a substrate, and the substrate exhibits heat shrinkability that exhibits shrinkage due to thermal energy. The element layer is formed of a material, and the element layer is formed of a stretchable material, and in the method of manufacturing a display device having adhesion to the substrate, an element layer forming step of forming the element layer on the substrate; And a shrinking step of shrinking the substrate by thermal energy after forming the element layer.

  In addition, the method for manufacturing a display device described above is a display device in which an element layer having an electrode and an optical functional layer is formed on a substrate, and the substrate is light-shrinkable that exhibits shrinkage by light energy. The element layer is formed of a material, and the element layer is formed of a stretchable material, and in the method of manufacturing a display device having adhesion to the substrate, an element layer forming step of forming the element layer on the substrate; And a shrinking step of shrinking the substrate with light energy after forming the element layer.

  According to these configurations, the substrate is composed of a heat-shrinkable material that exhibits shrinkage by thermal energy, or a light-shrinkable material that exhibits shrinkage by light energy, and an element formed on the substrate. Since the layer is made of a stretchable material and has adhesiveness to the substrate, a display device having a size smaller than that of the first substrate can be manufactured by shrinking the substrate after forming the element layer. . Therefore, when the element layer is formed, a high-quality display device can be easily manufactured without increasing the accuracy of the manufacturing apparatus so much. For example, when an element layer is formed by an ink jet method, it is necessary to accurately discharge a predetermined amount (a predetermined number of times) of a functional liquid into a minute pixel area, but it is possible to discharge the functional liquid in a state where the pixel area is wide. Therefore, it is possible to cover the error of the discharge accuracy.

  The display device described above is a display device in which an element layer having an electrode and an optical functional layer is formed on a substrate, and the substrate and the element layer are both made of a stretchable material. Is characterized by having adhesiveness to the substrate.

  The display device manufacturing method described above is a display device in which an element layer having an electrode and an optical functional layer is formed on a substrate, and the substrate and the element layer are both made of a stretchable material. In the method of manufacturing a display device having adhesiveness to the substrate, the element layer includes a pre-stretching step of stretching the substrate prior to the formation of the element layer, and a device on the substrate after stretching the substrate. An element layer forming step for forming a layer and a contraction step for contracting the substrate so that the display device has a target size after the element layer is formed are provided.

  According to these configurations, the substrate and the element layer are both made of a stretchable material, and the element layer formed on the substrate has adhesiveness to the substrate. By expanding or contracting the substrate, a display device having a size larger or smaller than that of the first substrate can be manufactured. Therefore, it is possible to prevent an increase in the size of the production line and an associated increase in cost without degrading the quality of the display device.

  In the display device described above, the substrate is preferably made of a self-shrinkable elastic material.

  In the display device manufacturing method described above, the substrate is made of a self-shrinkable elastic material, and in the pre-stretching step, the substrate is stretched by a stretching mechanism that stretches in the X-axis direction and / or the Y-axis direction. It is preferable that the extension mechanism is released in the contraction step.

  According to these configurations, since the substrate is made of a self-shrinkable elastic material, the substrate is fixed in a state where the substrate is stretched in advance by the stretching mechanism that stretches in the X-axis direction and / or the Y-axis direction. If the layer is formed and then the extension mechanism is released, the original substrate size can be restored. That is, it is possible to manufacture a display device that does not require processing such as causing a chemical change in the substrate material and that does not require an increase in the size of the manufacturing line.

  In the display device described above, the substrate is preferably made of a stretchable material that exhibits irreversibility by thermal energy or light energy.

  In the display device manufacturing method described above, the substrate is made of a stretchable material that exhibits irreversibility by thermal energy. In the shrinking step, the substrate is contracted and thermal energy is applied to the substrate. It is preferable to do.

  In the method for manufacturing a display device described above, it is preferable that the method further includes a thermosetting step of curing the substrate with thermal energy after the shrinking step.

  The display device manufacturing method described above preferably further includes a photocuring step of curing the substrate with light energy after the shrinking step.

  According to these configurations, since the substrate is made of a stretchable material that exhibits irreversibility (hardens) by thermal energy or light energy, the substrate is finally stabilized by applying these energies. A state display device can be obtained.

  In the display device described above, the wiring connected to the electrode is preferably formed by dispersing fine metal particles in a conductive polymer.

  According to this configuration, since the wiring connected to the electrode is formed by dispersing the metal fine particles in the conductive polymer, disconnection due to expansion can be prevented while securing conductivity.

  According to another aspect of the invention, there is provided an electronic apparatus including the above-described display device and a drive control unit that controls the display device.

  According to this configuration, it is possible to provide an electronic device that does not require an increase in the size of the production line without degrading the quality of the display device.

  In the manufacturing method of the display device described above, a sealing layer that is configured of a thermosetting material that is cured by thermal energy or a photocurable material that is cured by light energy and that seals the substrate is used in the shrinking process. It is preferable to further include a sealing layer forming step formed in advance and a sealing layer curing step for curing the sealing layer after the shrinking step.

  According to this configuration, the gas barrier property can be enhanced by forming the sealing layer. Further, since the sealing layer is cured after the substrate is contracted, the contraction is not hindered by the sealing layer.

  In the method for manufacturing a display device described above, the display device is an active panel having an active element made of a stretchable material, and an active element forming step of forming the active element on the substrate is performed. Furthermore, it is preferable to provide.

  According to this configuration, since the active element is formed of a stretchable material, the substrate can be expanded or contracted even when an active panel is manufactured. Therefore, also in this case, it is possible to prevent an increase in cost due to an increase in the size of the production line without deteriorating the quality of the display device.

  In the manufacturing method of the display device described above, it is preferable that any one of the electrode, the optical functional layer, the sealing layer, and the active element, or two or more are formed using an inkjet method.

  According to this configuration, it is possible to configure the substrate with various materials by forming electrodes and the like using an ink jet method. In addition, a high-quality display device can be manufactured inexpensively and easily.

  Hereinafter, a method for manufacturing a display device of the present invention will be described with reference to the accompanying drawings. An inkjet head (functional droplet ejection head) of an inkjet printer (functional droplet ejection device) can eject minute ink droplets (functional droplets) in a dot-like manner with high accuracy. ), Special inks, light-emitting or photosensitive resins, and the like are expected to be applied in the field of manufacturing various parts. In the present embodiment, for example, in a so-called flat display manufacturing method such as an organic EL display device or a liquid crystal display device, a functional liquid such as a filter material or a light emitting material is ejected from a functional liquid droplet ejection head of a functional liquid droplet ejection device. (Inkjet method), formation of EL light emitting layer and hole injection layer of each pixel in the organic EL display device, and R.D. G. A case where the B filter element or the like is formed will be described as an example. Note that as the display device, a so-called active matrix type in which each pixel is arranged in a matrix and has active elements is illustrated.

  Further, the display device shown in the present embodiment is made of a material that can be stretched or shrunk all of the constituent elements thereof, so that a switching element and an element layer (electrode, Hole injection / transport layer, light emitting layer, etc.), or conversely, these can be formed on a substrate having a size larger than the target size. With this configuration, it is possible to prevent an increase in the size of the production line and an associated increase in cost, and to improve the quality of the display device.

  Therefore, in the first embodiment, a case where the element layer 20 is formed on a substrate having a size smaller than the target size, which is a method for manufacturing the organic EL display device 10, will be described. As shown in FIG. 1, the display device 10 of the present embodiment edits a data signal (video signal) input from the outside, and also includes a data side drive circuit 104 having a shift register, a level shifter, a video line, and an analog switch. A plurality of signal lines 102 connected to the data side driving circuit 104, a scanning side driving circuit 105 having a shift register and a level shifter, and connected to the scanning side driving circuit 105 and orthogonal to the signal line 102 A plurality of scanning lines 101 extending in the direction in which the signal lines 102 and the scanning lines 101 intersect with each other.

  Each pixel region A includes a switching thin film transistor 112, a storage capacitor cap (capacitor) 113 that holds a pixel signal supplied from the signal line 102 via the switching thin film transistor 112, and the storage capacitor cap 113. A driving thin film transistor 123 in which the held pixel signal is supplied to the gate electrode, and a pixel electrode 511 into which a driving current flows from the power supply line 103 when connected to the power supply line 103 via the driving thin film transistor 123; A cathode 503 serving as a counter electrode of the pixel electrode 511; and an optical functional layer 510 sandwiched between the pixel electrode 511 and the cathode 503. In addition, the display element 504 is configured by the pixel electrode 511, the cathode 503, and the optical functional layer 510, and the active element is configured by the thin film transistor 112 for switching, the storage capacitor cap (capacitor) 113, and the thin film transistor 123 for driving. .

  In the display device 10 having such a configuration, when the scanning line 101 is driven and the switching thin film transistor 112 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor cap 113 and held in the holding capacitor cap 113. The on / off state of the driving thin film transistor 123 is determined in accordance with the applied potential. Then, current flows from the power supply line 103 to the pixel electrode 511 through the channel of the driving thin film transistor 123, and current flows to the cathode 503 through the optical functional layer 510. That is, the light emitting layer 510b (see FIG. 2) continues to emit light while a current flows through the optical functional layer 510.

  Next, the device configuration of the display device 10 will be described with reference to FIG. 1A is a plan view of the display device 10 and FIG. 1B is a cross-sectional view of the display device 10. As shown in these drawings, the display device 10 includes a substrate 501 made of a transparent resin having a high gas barrier property, an element layer 20 having electrodes 503 and 511, an optical functional layer 510, and the like, and a sealing for sealing the substrate 501. The layer 30 is laminated.

  The substrate 501 is an extensible and irreversible transparent resin (PC resin, PET resin, PAR resin, PAN resin, PES resin, α-PO (norbornene-based) resin, PCTEEE other transparent fluororesin, and other PVA-based extruded products. Etc.) is formed in a film shape, and is divided into a display area 20a located in the center and a non-display area 20b surrounding the display area 20a.

  In this case, the display area 20a is formed by display elements 504 arranged in a matrix, and R (red), G (green), and B (blue) pixels are arranged according to a predetermined rule. In the drawing, a stripe arrangement in which pixels of the same color are arranged in a row (in a stripe shape) is shown, but other arrangement forms such as a mosaic arrangement in which pixels of the same color are arranged obliquely are possible. In addition, an inspection circuit 106 for inspecting the quality and defects of the display device 10 is arranged on the upper side of the display area 20a in FIG.

  On the other hand, in the non-display area 20b, a dummy display area 20d adjacent to the display area 20a is provided. In the dummy display area 20d, the above-described scanning side drive circuit 105 is disposed in the circuit element portion 502. Further, in the circuit element portion 502 of the non-display area 20b, the power supply line 103 (103R, 103G, 103B) described above is wired and the drive circuit control signal wiring 105a connected to the scanning side drive circuit 105, A drive circuit power supply wiring 105b is provided.

  As shown in FIG. 2B, the element layer 20 is roughly divided into a circuit element layer 502 and a display element layer 504. In the circuit element layer 502, a base protective film 502a made of a silicon oxide film is formed on a substrate 501, and a semiconductor film 502b made of polycrystalline silicon is further formed thereon. The circuit element layer 502 includes the above-described scanning line 101, signal line 102, storage capacitor cap 113, switching thin film transistor 112, driving thin film transistor 123, and the like. In addition, the display element layer 504 includes a light emitting element 140 including a pixel electrode 511 and an optical functional layer 510, and a cathode 503.

  One end of the cathode 503 is connected to the cathode wiring 503a formed on the substrate 501, and one end of the cathode wiring 503a is connected to the wiring 50a on the flexible substrate 50 (see FIG. 5A). . The wiring 50 a is connected to a driving IC (driving circuit) 51 that is also provided on the flexible substrate 50.

  The sealing layer 30 is made of a photocurable material (such as an ultraviolet curable resin) that is cured by light energy, prevents water or oxygen from entering, and oxidizes the light emitting layer 510b formed on the cathode 503 or the optical functional layer 510. To prevent. The sealing layer 30 is formed by an ink jet method, and after the substrate 501 is stretched, it is cured by light energy (ultraviolet lamp 98: see FIG. 4).

In addition, you may comprise the sealing layer 30 with the thermosetting material (thermosetting resin, such as an epoxy resin) hardened | cured with a thermal energy. In this case, the sealing layer 30 is cured by thermal energy (heating). If necessary, a thin film for a gas barrier may be formed below the sealing layer 30 (above the cathode 503). The thin film is preferably composed of an inorganic material such as SiO ₂ or SiN.

  Next, with reference to FIG. 3, the functional liquid droplet ejection apparatus 1 for forming the pixel electrode 511, the optical functional layer 510, and the like in addition to the sealing layer 30 described above by an inkjet method will be described. The functional liquid droplet ejection apparatus 1 of this embodiment includes an X-axis table 5 that is a moving mechanism 3 installed on a machine base, a Y-axis table 4 that is orthogonal thereto, and a main carriage that is movably attached to the Y-axis table 4. 6 and a head unit 7 mounted on the main carriage 6. A functional liquid droplet ejection head H in which two nozzle rows 15 a and 15 b are arranged is mounted on the head unit 7 via a sub-carriage 9. Further, the mother substrate W as a work is mounted on the X-axis table 5. On the mother substrate W, a plurality of substrates 501 (chips) are arranged (nine in the drawing), and one chip region corresponds to the display region 20 a of one display device 10. The arrangement of the plurality of chips is not limited to this form.

  Further, the functional liquid droplet ejection apparatus 1 incorporates a functional liquid supply mechanism 12 for supplying a functional liquid to the functional liquid droplet ejection head H, and controls driving of the moving mechanism 3 and the functional liquid droplet ejection head H. Control means 13 is incorporated. The control unit 13 is connected to a host computer 14 for generating drive waveform data and ejection pattern data of the functional droplet ejection head H.

  The control means 13 has a control unit 31 that performs overall control of the functional liquid droplet ejection apparatus 1 and is connected to the host computer 14, and controls the X-axis motor 19 to drive the X-axis table 5, and to drive the Y-axis. The Y-axis table 4 is driven by controlling the motor 17. In addition, a clock signal, an ejection signal, a latch signal, and a drive signal are input to the functional droplet ejection head H via the interface 32 to drive and control the functional droplet ejection head H.

  Further, although not shown in the drawing, the functional liquid droplet ejection apparatus 1 receives a flushing unit that receives periodic flushing of the functional liquid droplet ejection head H (removal of functional liquid from all ejection nozzles for function recovery). In addition, a wiping unit for wiping the nozzle surface of the functional liquid droplet ejection head H, a cleaning unit for sucking and storing the functional liquid of the functional liquid droplet ejection head H, and the like are incorporated.

  The Y-axis table 4 has a Y-axis slider 16 driven by a motor 17 constituting a drive system in the Y-axis direction, and the main carriage 6 is movably mounted thereon. Similarly, the X-axis table 5 includes an X-axis slider 18 driven by a motor 19 that is configured by a drive system in the X-axis direction, and a set table 21 composed of a suction table or the like is movably mounted thereon. ing. The mother substrate W is set on the set table 21 in a positioned state.

  In the functional liquid droplet ejection apparatus 1 of the present embodiment, each functional liquid droplet ejection head 10 is driven (selective ejection of functional liquid droplets) in synchronization with the movement of each functional liquid droplet ejection head 10 by the X-axis table 5. The so-called main scanning of the functional liquid droplet ejection head 10 is performed by the reciprocating motion of the X axis table 5 in the X axis direction. Correspondingly, so-called sub-scanning is performed by the forward movement of the mother substrate W in the Y-axis direction by the Y-axis table 4. Then, each functional droplet discharge head H in the scan is driven based on the drive waveform data and the discharge pattern data created by the host computer 14.

  On the other hand, the functional liquid supply mechanism 12 includes a sub tank 23 that supplies the functional liquid to the functional liquid droplet ejection head H (the nozzle rows 15a and 15b) and is omitted in the drawing, but a main tank connected to the sub tank 23, And a pressure liquid feeding device for feeding the functional liquid of the main tank to the sub tank 23. The functional liquid in the main tank is pressure-fed to the sub-tank, and the functional liquid that is pressure-cut in the sub-tank 23 is fed to the functional liquid droplet ejection head H by the pump action of the functional liquid droplet ejection head H. Although not shown in the drawing, the pressure feeding device is also controlled by the control means 13.

  The head unit 7 includes a sub-carriage 9 made of a thick plate such as stainless steel, and a functional liquid droplet ejection head H that is positioned and fixed with high precision on the sub-carriage 9. A pair of reference pins (marks) 26 and 26 are provided at the left and right intermediate positions of the sub-carriage 9 as the positioning reference for the head unit 7. In each functional liquid droplet ejection head H, 180 nozzles are arranged in a row, and two rows (15a, 15b) of the nozzle rows are arranged in parallel. The functional liquid droplet ejection head H is disposed in a state inclined at a predetermined angle with respect to the main scanning direction (X-axis direction), and the nozzle pitch corresponds to the pixel pitch by adjusting the inclination angle in the illustrated θ-axis direction. It can be made to.

  Next, with reference to FIG. 4 and FIG. 5, a stretching device 60 for stretching the mother substrate W (substrate 501) will be described. As shown in these drawings, the stretching device 60 is composed of a pair of X-axis stretching mechanisms 62a and 62b and a pair of Y-axis stretching mechanisms 63a and 63b, which are arranged so as to face each other on the base plate 61, respectively. . The central portion of the base plate 61 is a rectangular set stage 64 that the mother substrate W faces. Each X-axis extension mechanism 62a, 62b faces one of the opposite sides of the set stage 64, and each of the other opposite sides. Each Y-axis extension mechanism 63a, 63b faces. Since the X-axis extension mechanisms 62a and 62b and the Y-axis extension mechanisms 63a and 63b have exactly the same configuration, the X-axis extension mechanisms 62a and 62b will be mainly described here, and the Y-axis extension mechanism will be described. Description of the mechanisms 63a and 63b is omitted.

  Each of the X-axis extension mechanisms 62a and 62b includes a large number of chuck mechanisms 65 that grip one side of the mother substrate W, a pair of guide rails 67 that support the large number of chuck mechanisms 65 slidably in the Y-axis direction, and chucks A geared motor 68 for moving the chuck holder 66 holding the mechanism 65 forward and backward in the X-axis direction, and a ball screw (lead screw) 69 for converting the rotation of the geared motor 68 into forward and backward movement and transmitting it to the chuck holder 66 are provided. Yes. The large number of chuck mechanisms 65 are arranged side by side and at equal intervals so as to close the intervals.

  As shown in FIG. 5, each chuck mechanism 65 includes a base end block 71 held by the chuck holder 66, a lower grip piece 73 extending forward from the base end block 71, and the lower grip piece 73 while facing the lower grip piece 73. It has an upper gripping piece 72 that is rotatably attached to the piece 73, and a solenoid 74 that rotates the upper gripping piece 72 relative to the lower gripping piece 73. In addition, the base block 71 is provided with a total of four rollers 75 and 76 each of which is slidably contacted with the chuck holder 66 so as to be slidable.

  The upper gripping piece 72 and the lower gripping piece 73 that face each other have anti-slip portions 72 a and 73 a for gripping the mother substrate W at the tip half of the opposing surfaces. In addition, a pair of compression springs 82 are interposed in the proximal half of the opposing surface of the lower gripping piece 73. The upper gripping piece 72 is bent in an “L” shape, and an insertion opening 83 through which the lower gripping piece 73 is inserted is formed in the bent portion, and is pivotally supported by the lower gripping piece 73 at this portion. ing. A flanger 84 of a solenoid 74 attached to the proximal block 71 is connected to the lower end portion of the bent portion.

  When the solenoid 74 is energized, the upper gripping piece 72 rotates downward against the compression spring 82 and strongly grips the mother board W with the edge facing the anti-slip portion 73 a of the lower gripping piece 73. When the solenoid 74 is demagnetized from this state, the upper gripping piece 72 is rotated upward by the spring force of the compression spring 82 and the gripping state of the mother substrate W is released.

  The proximal block 71 is formed in a horizontal “T” shape by a flange portion 85 and a rib portion 86, and a pair of rollers 75 and 76 are rotatably attached to the upper and lower surfaces of the rib portion 86, respectively. . Each of the pair of upper and lower rollers 75 and 76 is configured to be rotatable about a vertical axis, and slides on the chuck holder 66 with an upper and lower guide piece 87 of the chuck holder 66 described later sandwiched between the inner surface of the flange portion 85. It is freely rolling and held.

  Reference numeral 88 in the drawing denotes a tension spring, and the multiple chuck mechanisms 65 are connected to each other by the tension spring 88 at each base block 71 portion. The two tension springs 88 extending outward from the two chuck mechanisms 65 located at the outermost ends are connected to the pair of Y-axis extension mechanisms 63a and 63b, respectively. That is, when the pair of Y-axis extension mechanisms 63a and 63b are retracted and the mother substrate W is extended in the Y-axis direction, each chuck mechanism 65 is moved to the outside by this, but at the same time, this pulling is performed. By being pulled by the spring 88, each chuck mechanism 65 smoothly slides in the Y-axis direction while being held by the chuck holder 66.

  The chuck holder 66 includes a holder main body 91 that slidably holds a large number of chuck mechanisms 65, a pair of slide portions 92 that are bent from both outer end portions of the holder main body 91 and extend outward, and an inner side of the pair of slide portions 92. And a U-shaped arm 93 extending outward from the holder main body 91 and a female screw block 94 provided at the center of the arm 93. The lower surfaces of the pair of slide portions 92 are slidably engaged with a pair of guide rails 90 extending in the X-axis direction on the base plate 61.

  The holder main body 91 is formed in a “C” cross section, and the rib portion of the proximal end block is inserted into the slit-shaped opening, and the upper and lower guide pieces 87 constituting the opening 96 are respectively connected to the holder main body 91. The flange portion 85 of the chuck mechanism 65 and the upper and lower rollers 75 and 76 are engaged so as to be sandwiched (see the phantom line in FIG. 5). As a result, each chuck mechanism 65 slides freely in the Y-axis direction while receiving a tensile force in the X-axis direction.

  The geared motor 68 is connected to a ball screw 69 through a coupling 97, and the ball screw 69 is screwed into a female screw block 94 of the chuck holder 66. When the ball screw 69 rotates forward and backward by forward and reverse rotation of the geared motor 68, the chuck holder 66 advances and retreats while being guided by the pair of guide rails 90 via the arm portion 93. That is, when the chuck holder 66 moves backward, the mother substrate W held by the multiple chuck mechanisms 65 is pulled outward and extended.

  On the other hand, the convex part 97 is formed in the set stage 64 in four divided by the cross-shaped partition. The four convex portions 97 are formed to be large so as to face almost the entire lower surface of the mother substrate W set on the set stage 64, and each convex portion 97 accommodates an ultraviolet lamp 98. The sealing layer 30 made of an ultraviolet curable resin can be cured by irradiating the ultraviolet lamp 98 with ultraviolet rays.

  6A shows the state of the mother substrate W stretched by the stretching device 60, and FIG. 6B shows the state of the display device 10 (chip) stretched thereby. As described above, the display device 10 is simultaneously extended in the X-axis direction and the Y-axis direction (two-dimensional direction) by the X-axis extension mechanisms 62a and 62b and the Y-axis extension mechanisms 63a and 63b. In this case, as shown in FIG. 6B, the scanning line 101, the signal line 102, the power supply line 103, the optical functional layer 510, the pixel electrode 511, and the like formed on the substrate 501 also maintain the same arrangement with the substrate 501. While being stretched. Therefore, it is possible to quickly obtain the display device 10 that is two-dimensionally larger than the size of the substrate 501 before processing, that is, enlarged at the same magnification in the vertical and horizontal directions.

  As described above, according to the stretching device 60 of the present embodiment, the stretching mechanism for stretching the mother substrate W includes the X-axis stretching mechanism and the Y-axis stretching mechanism, which are connected to each other. The display device 10 that is two-dimensionally larger than the first mother substrate W can be obtained quickly. Further, since the mother substrate W before cutting out each display device 10 is stretched, it is not necessary to provide each display device 10 with a gripping region for gripping with the chuck mechanism 65. In addition, since a plurality of display devices 10 can be expanded and contracted simultaneously, it is possible to save time and effort for performing the processing individually.

  Instead of simultaneously and smoothly extending the mother substrate W in the two-dimensional direction, it is possible to extend the mother substrate W only in the one-dimensional direction (X-axis direction or Y-axis direction) as shown in FIG. In this case, the tension springs 88 extending from the two chuck mechanisms 65 located at the outermost ends in the X-axis direction are not connected to the pair of Y-axis extension mechanisms 63a and 63b and are fixed to the chuck holder 66. Is preferred. Then, only one of the pair of X-axis direction extension mechanisms 62a and 62b or the pair of Y-axis direction extension mechanisms 63a and 63b may be used for extension.

  Further, as shown in FIG. 6, if the structure is one-dimensionally expanded in the X-axis direction and then two-dimensionally expanded in the Y-axis direction, the display is enlarged two-dimensionally as in the case shown in FIG. Device 10 can be obtained. As described above, the mother substrate W (substrate 501) can be easily and reliably stretched by stretching the mother substrate W in the one-dimensional direction and then stretching it in the two-dimensional direction (stretching in two stages). it can.

  In the above example, the mother substrate W before being cut out is stretched, but each cut-out substrate 501 (chip) may be stretched. According to this configuration, the yield can be improved without increasing the size of the expansion device 60.

  Further, it is possible to adopt a configuration in which the expansion device 60 is incorporated in the functional liquid droplet ejection device 1 shown in FIG. According to this configuration, it is not necessary to provide the extension device 60 separately, and it is possible to save the trouble of attaching and detaching the mother substrate W (substrate 501) to each device 1 and 60.

  Next, a method for manufacturing the organic EL display device 10 will be described with reference to FIGS. FIG. 8 is a flowchart showing a manufacturing method of the organic EL display device 10, and FIGS. 9 to 21 show a manufacturing process of the organic EL display device 10 and its structure. As described above, in the present embodiment, the element layer 20 is formed on the substrate 501 having a size smaller than the target size, and the substrate 501 is stretched after the element layer 20 is formed, whereby the organic EL display device 10 is formed. To manufacture. As shown in FIG. 8, the manufacturing process starts by first performing a surface treatment (plasma treatment) on the substrate 501 (S11). The substrate 501 is made of a transparent resin having extensibility and irreversibility.

  The surface treatment process is roughly divided into a preliminary heating process, an ink-philic process for processing the surface to have ink affinity, and a cooling process. First, in the preheating step, the substrate 501 is heated to a predetermined temperature. For example, heating is performed by attaching a heater to a stage on which the substrate 501 is placed, and heating the substrate 501 together with the stage. Specifically, the preheating temperature of the substrate 501 is preferably in the range of 70 to 80 ° C., for example.

Next, in the ink-philic process, plasma processing (O ₂ plasma processing) is performed using oxygen as a processing gas in an air atmosphere. By this O ₂ plasma treatment, a hydroxyl group is introduced to the surface of the substrate 501 to impart ink affinity. Next, in the cooling step, the substrate 501 heated for the plasma treatment is cooled to room temperature or a management temperature of the ink jet step (functional droplet discharge step). By cooling the substrate 501 after the plasma treatment to room temperature or a predetermined temperature (for example, a management temperature for performing the functional liquid droplet ejection step), the following steps can be performed at a constant temperature. As described above, by performing the surface treatment (plasma treatment), the adhesion between the substrate 501 and the element layer 20 described below can be improved.

  Next, the element layer 20 is formed (S12 to S17). The element layer 20 is entirely composed of a stretchable material that can be stretched / shrinked as the substrate 501 is stretched / shrinked. Therefore, first, the power supply line 103 and the signal line 102 are formed (S12). For these wirings, a functional liquid in which metal fine particles are dispersed in a conductive polymer (conductive polymer) is applied by an inkjet method. By using such a functional liquid, disconnection due to expansion can be prevented while securing conductivity. Subsequently, active elements (a switching thin film transistor 112, a holding capacitor cap (capacitor) 113, a driving thin film transistor 123, and the like) are formed. However, when the organic EL display device 10 is a passive panel, this step is unnecessary ( S13). The active element is also formed by ejecting (applying) a functional liquid using an inkjet method, that is, a functional liquid droplet ejecting apparatus (see FIG. 3).

  Subsequently, the pixel electrode 511 is formed (S14). Here, the pixel electrode 511 is formed by applying and drying a functional liquid in which ITO (Indium Tin Oxide) fine particles are dispersed by an evaporation method or the like. Subsequently, the bank 512 (see FIG. 9 and FIG. 10) is formed in the vicinity of the end of the substrate 501 or on the entire surface in accordance with the expansion ratio of the substrate 501 and the discharge accuracy of the functional liquid droplet discharge device 1 (S15: expansion). If the rate is high or the discharge accuracy is high, the bank portion need not be formed). In this case, the bank portion 512 is subjected to ink repellent processing. Further, surface treatment is performed as necessary.

  Further, an optical functional layer (hole injection / transport layer 510a and light emitting layer 510b) 510 is formed by an inkjet method (S16), and then a counter electrode (cathode) 503 is formed (S17: see FIG. 20 and the like). The counter electrode 503 is formed by stacking a plurality of materials. Note that, similarly to the pixel electrode 511, a functional liquid in which ITO fine particles are dispersed may be applied and dried by a vapor deposition method or the like. In this manner, the element layer 20 is formed on the substrate 501 by S12 to S17.

  Next, the sealing layer 30 is formed so as to cover the substrate 501 and the element layer 20 (S18). In this case, the sealing layer 30 is formed by applying an ultraviolet curable resin that is cured by light energy (ultraviolet light). Thereafter, the substrate 501 (organic EL display device 10) is stretched to a target size by the stretching device 60 (see FIGS. 4 and 5) (S19). After stretching, the sealing layer 30 is cured by irradiating the organic EL display device 10 with ultraviolet rays (S20). Thereafter, the mother substrate W is cut out (dicing), bonded, finished, and inspected for characteristics, thereby completing the organic EL display device 10.

  Hereinafter, it will be described in accordance with the above manufacturing process with reference to the structural drawings. 9 and 10 show a process of forming the bank portion 512 after the pixel electrode 511 is formed. In the bank portion forming step, an inorganic bank layer 512a and an organic bank layer 512b are stacked at predetermined positions on the circuit element layer 502 and the pixel electrode 511 formed in advance on the substrate 501, thereby providing a bank portion having an opening 512g. 512 is formed.

First, in the step of forming the inorganic bank layer 512a, as shown in FIG. 9, the inorganic bank layer 512a is formed on the second interlayer insulating film 544b and the pixel electrode 511 of the circuit element portion 502. In this case, the inorganic bank layer 512a is composed of an inorganic film such as SiO ₂ or TiO _{2 and} is formed by a CVD method, a coating method, a sputtering method, a vapor deposition method or the like.

  Next, this inorganic film is patterned by etching or the like to provide a lower opening 512c corresponding to the position where the electrode surface 511a of the electrode 511 is formed. At this time, it is necessary to form the inorganic bank layer 512 a so as to overlap with the peripheral edge of the electrode 511. In this manner, the light emitting region of the light emitting layer 510b can be controlled by forming the inorganic bank layer 512a so that the peripheral edge (part) of the electrode 511 and the inorganic bank layer 512a overlap.

  Next, in the step of forming the organic bank layer 512b, as shown in FIG. 10, the organic bank layer 512b is formed on the inorganic bank layer 512a. The organic bank layer 512b is etched by a photolithography method or the like to form an upper opening 512d of the organic bank layer 512b. The upper opening 512d is provided at a position corresponding to the electrode surface 511a and the lower opening 512c.

  As shown in FIG. 10, the upper opening 512d is preferably wider than the lower opening 512c and narrower than the electrode surface 511a. Accordingly, the first stacked portion 512e surrounding the lower opening portion 512c of the inorganic bank layer 512a is extended to the center side of the electrode 511 from the organic bank layer 512b. In this manner, the opening 512g penetrating the inorganic bank layer 512a and the organic bank layer 512b is formed by communicating the upper opening 512d and the lower opening 512c.

  If necessary, surface treatment may be performed. Here, as the surface treatment process, a preliminary heating process and an ink affinity process in which the upper surface (512f) of the bank 512, the wall surface of the opening 512g, and the electrode surface 511a of the pixel electrode 511 are processed to have ink affinity. And an ink repellent process for processing the upper surface 512f of the organic bank layer 512b and the wall surface of the upper opening 512d so as to have ink repellency, and a cooling process. Then, in the ink-philic step, as shown in FIG. 11, the electrode surface 511a of the pixel electrode 511, the wall surface of the first laminated portion 512e of the inorganic bank layer 512a, and the upper opening 512d of the organic bank layer 512b and the upper surface 512f are parent. Ink processed.

In the ink repellent step, plasma treatment (CF ₄ plasma treatment) using methane tetrafluoride as a treatment gas is performed in an air atmosphere. By the CF ₄ plasma treatment, as shown in FIG. 12, the wall surface of the upper opening 512d and the upper surface 512f of the organic bank layer are subjected to ink repellent treatment. By this ink repellent treatment, fluorine groups are introduced into each of these surfaces to impart ink repellency. In FIG. 12, a region showing ink repellency is indicated by a one-dot chain line. Note that the bank part forming step and the surface treatment step shown here may be omitted.

  Next, in the optical functional layer forming step, the hole injection / transport layer 510a and the light emitting layer 510b are formed on the pixel electrode 511 by an inkjet method. The light emitting element 140 is formed by the pixel electrode 511, the hole injection / transport layer 510a, and the light emitting layer 510b. The optical functional layer forming step includes four steps. That is, a first functional liquid droplet ejection step for ejecting the first composition for forming the hole injection / transport layer 510a onto each pixel electrode 511, and the ejected first composition to dry the pixel electrode 511. A hole injection / transport layer forming step for forming the hole injection / transport layer 510a thereon, and a second function for discharging the second composition for forming the light emitting layer 510b onto the hole injection / transport layer 510a A droplet discharging step and a light emitting layer forming step of drying the discharged second composition to form the light emitting layer 510b on the hole injection / transport layer 510a are included.

  First, in the first functional liquid droplet ejection step, a first composition containing a hole injection / transport layer forming material is ejected onto the electrode surface 511a by an inkjet method (functional liquid droplet ejection method).

  As shown in FIG. 13, the functional liquid droplet ejection head H is filled with the first composition containing the hole injection / transport layer forming material, and the ejection nozzle of the functional liquid droplet ejection head H is positioned in the lower opening 512c. The first composition droplet 510c, whose liquid amount per droplet is controlled, is ejected from the ejection nozzle onto the electrode surface 511a while facing the electrode surface 511a and relatively moving the functional droplet ejection head H and the substrate 501. . As the hole injection / transport layer forming material, the same material may be used for each of the R, G, and B light emitting layers 510b, or may be changed for each light emitting layer 510b.

  As shown in FIG. 13, the discharged first composition droplet 510c spreads on the electrode surface 511a and the first stacked portion 512e, and fills the lower and upper openings 512c and 512d. The amount of the first composition discharged onto the electrode surface 511a is the size of the lower and upper openings 512c and 512d, the thickness of the hole injection / transport layer 510a to be formed, the hole injection / It is determined by the concentration of the transport layer forming material. The first composition droplet 510c may be discharged not only once but also several times on the same electrode surface 511a.

  Next, in the hole injecting / transporting layer forming step, as shown in FIG. 14, the first composition after discharge is dried and heat-treated to evaporate the polar solvent contained in the first composition. A hole injection / transport layer 510a is formed on the surface 511a. When the drying process is performed, the evaporation of the polar solvent contained in the first composition droplet 510c mainly occurs near the inorganic bank layer 512a and the organic bank layer 512b, and the hole injection / transport layer is combined with the evaporation of the polar solvent. The forming material is concentrated and deposited.

  As a result, as shown in FIG. 14, evaporation of the polar solvent also occurs on the electrode surface 511a by the drying process, thereby forming a flat portion 510a made of a hole injection / transport layer forming material on the electrode surface 511a. Since the evaporation rate of the polar solvent is substantially uniform on the electrode surface 511a, the material for forming the hole injection / transport layer is uniformly concentrated on the electrode surface 511a, thereby forming a flat portion 510a having a uniform thickness. The

  Next, in the second functional liquid droplet ejection step, the second composition containing the light emitting layer forming material is ejected onto the hole injection / transport layer 510a by an ink jet method (functional liquid droplet ejection method). In the second functional liquid droplet ejection step, as a solvent for the second composition used for forming the light emitting layer, the hole injection / transport layer 510a is used as a solvent for the second composition to prevent re-dissolution of the hole injection / transport layer 510a. Insoluble and non-polar solvents are used.

  On the other hand, since the hole injection / transport layer 510a has a low affinity for the nonpolar solvent, the hole injection / transport layer 510a is injected even when the second composition containing the nonpolar solvent is discharged onto the hole injection / transport layer 510a. / There is a possibility that the transport layer 510a and the light emitting layer 510b cannot be adhered to each other or the light emitting layer 510b cannot be applied uniformly. Therefore, in order to increase the affinity of the surface of the hole injection / transport layer 510a for the nonpolar solvent and the light emitting layer forming material, it is preferable to perform a surface modification step before forming the light emitting layer 510b.

  Therefore, the surface modification step will be described. In the surface modification step, a surface modification solvent, which is the same solvent as the non-polar solvent of the first composition used in the formation of the light emitting layer or a similar solvent, is applied to the inkjet method (functional droplet discharge method), spin coating. This is carried out by applying the film on the hole injection / transport layer 510a by the method or the dipping method and then drying.

  For example, in the application by the ink jet method, as shown in FIG. 15, the functional liquid droplet ejection head H is filled with a surface modifying solvent, and the ejection nozzle of the functional liquid droplet ejection head H is used as the substrate 501 (that is, hole injection). The surface modification solvent 510d is ejected from the ejection nozzle onto the hole injection / transport layer 510a while the functional liquid droplet ejection head H and the substrate 501 are relatively moved to face each other / substrate on which the transport layer 510a is formed. To do. Then, as shown in FIG. 16, the surface modifying solvent 510d is dried.

  Next, in the second functional liquid droplet ejection step, the second composition containing the light emitting layer forming material is ejected onto the hole injection / transport layer 510a by an ink jet method (functional liquid droplet ejection method). As shown in FIG. 17, the functional liquid droplet ejection head H is filled with the second composition containing the blue (B) light emitting layer forming material, and the ejection nozzles of the functional liquid droplet ejection head H are arranged at the lower and upper openings 512c. The second composition in which the liquid amount per droplet is controlled from the ejection nozzle while moving the functional droplet ejection head H and the substrate 501 relative to the hole injection / transport layer 510a located in 512d. The second composition droplet 510e is discharged onto the hole injection / transport layer 510a. As the nonpolar solvent, a solvent that is insoluble in the hole injection / transport layer 510a is preferable. Thereby, the second composition can be applied without re-dissolving the hole injection / transport layer 510a.

  As shown in FIG. 17, the discharged second composition 510e spreads on the hole injection / transport layer 510a and fills the lower and upper openings 512c and 512d. The second composition 510e may be discharged not only once but also several times on the same hole injection / transport layer 510a. In this case, the amount of the second composition at each time may be the same, and the amount of the second composition may be changed at each time.

  Next, in the light emitting layer forming step, after the second composition is discharged, a drying process and a heat treatment are performed to form the light emitting layer 510b on the hole injection / transport layer 510a. In the drying process, the non-polar solvent contained in the second composition is evaporated by drying the discharged second composition to form a blue (B) light emitting layer 510b as shown in FIG.

  Subsequently, as shown in FIG. 19, the red (R) light emitting layer 510b is formed in the same manner as the blue (B) light emitting layer 510b, and finally the green (G) light emitting layer 510b is formed. Note that the order in which the light emitting layers 510b are formed is not limited to this order, and may be formed in any order.

  Next, in the counter electrode forming step, as shown in FIG. 20, a cathode (counter electrode) 503 is formed on the entire surface of the light emitting layer 510b and the organic bank layer 512b. Note that the cathode 503 may be coated with ITO, but may be formed by stacking a plurality of materials. For example, a material having a low work function is preferably formed on the side close to the light emitting layer 510b. For example, Ca, Ba, or the like can be used, and depending on the material, LiF (lithium fluoride) or the like is thinly formed in a lower layer. It may be better to form. Also, the upper side (sealing side) preferably has a higher work function than the lower side. These cathodes (cathode layers) 503 are preferably formed by, for example, an evaporation method, a sputtering method, a CVD method, or the like, and particularly preferably formed by an evaporation method from the viewpoint that damage to the light emitting layer 510b due to heat can be prevented.

Moreover, LiF may be formed only on the light emitting layer 510b, and may be formed only on the blue (B) light emitting layer 510b. In this case, the upper cathode layer 503b made of LiF is in contact with the other red (R) light emitting layer 510b and green (G) light emitting layer 510b. Further, an Al film, an Ag film, or the like formed by vapor deposition, sputtering, CVD, or the like is preferably used on the cathode 12. Further, a protective layer such as SiO ₂ or SiN may be provided on the cathode 503 to prevent oxidation.

  Finally, in the sealing layer forming step shown in FIG. 21, the sealing layer 30 made of an ultraviolet curable resin is laminated on the display element 504 in an inert gas atmosphere such as nitrogen, argon, or helium. The sealing step is preferably performed in an inert gas atmosphere such as nitrogen, argon, or helium. It is not preferable to perform in the atmosphere since defects such as pinholes are generated in the cathode 503 because water or oxygen may enter the cathode 503 from the defective portion and the cathode 503 may be oxidized.

  Finally, the cathode 503 is connected to the wiring of the flexible substrate 50, and the wiring of the circuit element unit 502 is connected to the driving IC 51. Thereafter, the mother substrate W is stretched by the stretching device 60, and the sealing layer 30 is cured by irradiating ultraviolet rays from the ultraviolet lamp 98, thereby obtaining the organic EL display device 10 of the present embodiment. Thus, gas barrier property can be improved by forming the sealing layer 30. In addition, since the sealing layer 30 is cured after the mother substrate W is contracted, the expansion of the substrate 501 is not hindered by the sealing layer 30.

  Note that the pixel electrode 511, the cathode (counter electrode) 503, and the bank portion 512 (inorganic bank layer 512a and organic bank layer 512b) may be formed by an inkjet method. That is, predetermined functional liquids are respectively introduced into the functional liquid droplet ejection heads H and ejected from the functional liquid droplet ejection heads H to form the pixel electrodes 511 and the like (including a drying step). Thus, by forming each layer by the ink jet method, it is not necessary to go through complicated steps as in the case of using a photolithography method, and the organic EL display device 10 can be efficiently formed without wasting materials. Can be manufactured.

  As the substrate 501, a stretchable material that exhibits irreversibility with light energy such as ultraviolet light, or a stretchable material that exhibits irreversibility with thermal energy may be used. In this case, it is preferable to apply light energy or heat energy after the mother substrate W is stretched.

  Moreover, instead of the ultraviolet curable resin, the sealing layer 30 may use a thermosetting resin (thermosetting film) that is cured by thermal energy. In this case, after the mother substrate W is stretched, the sealing layer 30 is heated with a heater or the like instead of the ultraviolet rays.

  In addition, although the pixel electrode 511 is made of ITO, it may be made of an elastic material mixed with 30% by volume or more of carbon nanotubes. According to this configuration, conductivity can be ensured and the electrode can also be used as a transparent electrode.

  As described above, according to this embodiment, the substrate 501 is made of an irreversible stretchable material, and the element layer 20 formed on the substrate 501 is made of a stretchable material. Since the substrate 501 has adhesiveness, the organic EL display device 10 having a size larger than that of the first substrate 501 can be manufactured by stretching the substrate 501 after the element layer 20 is formed. Therefore, even when the large organic EL display device 10 is manufactured, it is possible to prevent an increase in cost associated with this without increasing the size of the manufacturing line or the manufacturing device (functional droplet discharge device 1). In addition, since the element layer 20 is formed in a state where the substrate 501 is small, for example, when an ink jet method is used, application can be performed quickly on one substrate 501 and drying of the nozzle can be prevented. Furthermore, since the arrangement of the polymers constituting the optical functional layer 110 can be aligned by stretching, the mobility of electrons and holes can be improved.

  Next, a second embodiment of the present invention will be described with reference to FIGS. In the present embodiment, a method for manufacturing a liquid crystal display device (liquid crystal panel) 600, as in the first embodiment, the element layer 20 is formed on a substrate 501 having a size smaller than the target size, and this is performed. A case where a display device having a target size is manufactured by stretching will be described. In this embodiment, a transflective liquid crystal display device 600 that performs full-color display using a simple matrix method is illustrated. In the present embodiment, description of the manufacturing process and detailed structure of the display device 600 is omitted.

  FIG. 22 is a flowchart showing a manufacturing method of the liquid crystal display device 600, FIG. 23 is an exploded perspective view of the liquid crystal display device 600, and FIG. 24 is a cross-section of the liquid crystal display device 600 according to the line AB in FIG. The structure is shown. As shown in FIG. 22, the liquid crystal display device 600 is manufactured by forming a first panel 607a and a second panel 607b, and bonding them together. First, the first panel forming process will be described. In the first panel forming step, first, a substrate surface treatment (plasma treatment) of the mother substrate W for the first panel 607a made of an ultraviolet curable resin is performed (S31). Since the surface treatment is the same as that of the first embodiment, the description thereof is omitted. Next, a reflective film 612 is formed using a photolithography method or the like, and an insulating film 613 is formed using a well-known film forming method (S32). In the case of an active panel, an active element (using an ink jet method or the like) is formed. (Not shown) is formed (S33). Next, a first electrode and various wirings (lead wiring 614c and wirings 614e, 614f, etc.) are formed using a photolithography method or the like (S34), and an alignment film 616a is formed on the first electrode 614a by coating, printing, or the like. Form (S35).

  Next, for example, the sealing material 608 is formed in an annular shape by screen printing or the like (S36), and spherical spacers 119 are dispersed thereon (S37). Thus, the large-area first panel mother substrate W having a plurality of panel patterns on the first panel 607a of the liquid crystal panel 602 is formed.

  Next, the second panel 607b is formed. In the second panel forming step, first, a plurality of color filters 618 of the liquid crystal display device 600 are formed on the mother substrate W for the second panel 607b made of ultraviolet curable resin (S38). The color filter 618 forms each color filter element of R, G, and B by using the functional liquid droplet ejection device 1, and the forming method of the color filter 618 by the ink jet method uses a conventionally disclosed technique. Therefore, detailed description is omitted.

  Next, the second electrode 614b is formed by photolithography or the like (S39), and the alignment film 616b is formed by coating, printing, or the like (S40). Thus, the large-area second panel mother substrate W having a plurality of panel patterns on the second panel 607b of the liquid crystal panel 602 is formed. Note that the first panel and the second panel may be formed by simultaneous progression instead of the order shown here.

  After the mother substrates W for the first panel 607a and the second panel 607b having a large area are formed by the above steps, the mother substrates W are aligned, that is, aligned with the sealant 608 interposed therebetween. (S41). As a result, an empty panel structure including a plurality of liquid crystal panel portions and not yet filled with liquid crystal is formed.

  Next, a scribe groove, that is, a cutting groove is formed at a predetermined position of the completed empty panel structure, and further, the panel structure is broken, that is, cut with reference to the scribe groove (S42: primary break). As a result, a so-called strip-shaped empty panel structure in which the liquid crystal injection opening 110 (see FIG. 23) of the sealant 608 of each liquid crystal panel portion is exposed to the outside is formed.

  Thereafter, liquid crystal L is injected into each liquid crystal panel portion through the exposed liquid crystal injection opening 110, and each liquid crystal injection port 110 is sealed with resin or the like (S43). In the normal liquid crystal injection process, for example, liquid crystal is stored in a storage container, the storage container storing the liquid crystal and a strip-shaped empty panel are put into a chamber or the like, and the chamber or the like is evacuated and then the chamber This is performed by immersing a strip-shaped empty panel in the liquid crystal inside the chamber, and then opening the chamber to atmospheric pressure. At this time, since the interior of the empty panel is in a vacuum state, the liquid crystal pressurized by the atmospheric pressure is introduced into the panel through the liquid crystal injection opening. Since the liquid crystal adheres to the periphery of the liquid crystal panel structure after the liquid crystal is injected, the strip-shaped panel after the liquid crystal injection process is subjected to a cleaning process (S44).

  Thereafter, a scribe groove is formed again at a predetermined position with respect to the strip-shaped mother substrate W after the liquid crystal injection and cleaning is finished, and the strip-shaped panel is cut with reference to the scribe groove, whereby a plurality of panels are cut. The liquid crystal panels are cut out individually (S45: secondary break). Next, each manufactured liquid crystal panel 602 is expanded using the expansion device 60 (S46). By this stretching treatment, the initial alignment of the liquid crystal molecules is determined. Thereafter, the substrates 611a and 611b of the first panel 607a and the second panel 607b are cured by irradiating with ultraviolet rays (S47).

  Then, the liquid crystal driving ICs 603a and 603b are mounted on the liquid crystal panel 602 after the ultraviolet irradiation, the lighting device 606 is mounted as a backlight, and the FPC 604 is connected to complete the liquid crystal display device 600 (electronic device). To do.

  Next, the structure of the liquid crystal display device 600 manufactured by the above manufacturing process will be described. As shown in FIG. 23, in a liquid crystal display device 600, liquid crystal driving ICs 603a and 603b as semiconductor chips are mounted on a liquid crystal panel 602, and an FPC (Flexible Printed Circuit) 604 as a wiring connecting element is connected to the liquid crystal panel 602. Further, it is formed by providing a lighting device 606 as a backlight on the back side of the liquid crystal panel 602.

  Further, the liquid crystal panel 602 is formed by bonding the first panel 607a and the second panel 607b with a sealant 608. The sealing material 608 is formed by, for example, attaching an epoxy resin to the inner surface of the first panel 607a or the second panel 607b in an annular manner by screen printing or the like. Further, as shown in FIG. 24, the sealing material 608 includes a conductive material 609 formed in a spherical shape or a cylindrical shape with a conductive material in a dispersed state.

  The first panel 607a is made of an ultraviolet curable resin that is extensible and exhibits irreversibility by ultraviolet rays. A reflective film 612 is formed on the inner surface (the upper surface in FIG. 24) of the first panel 607a, and an insulating film 613 is laminated thereon. Further, the first electrode 614a is formed in a stripe shape (see FIG. 23) when viewed from the direction of the arrow C, and the alignment film 616a is formed thereon. A polarizing plate 617a is attached to the outer surface (the lower surface in FIG. 24) of the substrate 611a by sticking or the like.

  Note that in the first panel 607a, an element layer 641a is formed by the reflective film 612, the insulating film 613, the first electrode 614a, the alignment film 616a, the liquid crystal L, and the like, and the element layer 641a is sufficiently bonded to the substrate 611a. It has sex. In addition, all the constituent elements constituting the element layer 641a are made of a stretchable material, and are stretched while maintaining the same arrangement as the substrate 611a is stretched.

  Similar to the first panel 607a, the second panel 607b is made of an ultraviolet curable resin, and a color filter 618 is formed on the inner surface (the lower surface in FIG. 24) of the substrate 611b using the functional liquid droplet ejection device 1. Is done. Further, a second electrode 614b is formed in a stripe shape (see FIG. 23) in a direction orthogonal to the first electrode 614a and viewed from the arrow D direction, and an alignment film 616b is further formed thereon. A polarizing plate 617b is attached to the outer surface (the upper surface in FIG. 24) of the substrate 611b by sticking or the like.

  Note that in the second panel 607b, an element layer 641b is formed by the color filter 618, the second electrode 614b, the alignment film 616b, the liquid crystal L, and the like, and the element layer 641b has sufficient adhesion to the substrate 611b. ing. In addition, all the constituent elements constituting the element layer 641b are made of a stretchable material, and are stretched while maintaining the same arrangement as the substrate 611a is stretched.

  As shown in FIG. 24, liquid crystal, for example, STN (Super Twisted Nematic) liquid crystal L is sealed in a gap surrounded by the first panel 607a, the second panel 607b, and the sealing material 608, that is, a so-called cell gap. A large number of minute spherical spacers 619 (spherical resin beads having a diameter of about 3 microns) are dispersed on the inner surface of the first panel 607a or the second panel 607b, and the presence of these spacers 619 in the cell gap results in the cell. The gap thickness is kept uniform.

  The first electrode 614a and the second electrode 614b are arranged orthogonal to each other, and their intersections are arranged in a dot matrix as seen from the direction of the arrow C. Each intersection in the dot matrix form one pixel pixel. The color filter 618 is formed by arranging the R (red), G (green), and B (blue) color elements in a predetermined pattern, for example, a stripe arrangement, a delta arrangement, or the like when viewed from the direction of the arrow C. ing. The one pixel pixel described above corresponds to each of R, G, and B, and the three color pixel pixels of R, G, and B form one unit to constitute one pixel.

  Then, by selectively emitting light from a plurality of pixels arranged in a dot-matrix shape, images such as letters and numbers are displayed outside the second panel 607b of the liquid crystal panel 602. The area where the image is displayed in this way is the effective pixel area, and the planar rectangular area indicated by the arrow D is the effective display area.

  The reflective film 612 is formed of a light reflective material such as an APC alloy or Al (aluminum), and an opening 621 is formed at a position corresponding to each pixel pixel that is an intersection of the first electrode 614a and the second electrode 614b. . The openings 621 are arranged in the same dot matrix as the pixel pixels when viewed from the direction of the arrow C.

  The first electrode 614a and the second electrode 614b are formed of, for example, ITO that is a transparent conductive material. The alignment films 616a and 616b are formed by depositing a polyimide resin in the form of a film having a uniform thickness. In these alignment films 616a and 616b, the initial alignment of liquid crystal molecules on the surfaces of the first panel 607a and the second panel 607b is determined by the extension direction. Therefore, in the present embodiment, it is preferable not to simultaneously expand in the two-dimensional direction as shown in FIG. 6, but to extend only in the one-dimensional direction or in two stages as shown in FIG. According to this configuration, the liquid crystal molecules can be reliably aligned.

  The first panel 607a is formed in a larger area than the second panel 607b, and when these substrates are bonded together by the sealing material 608, the first panel 607a extends to the outside of the second panel 607b. 607c. The substrate overhanging portion 607c has a lead wire 614c extending from the first electrode 614a and a lead wire conducting to the second electrode 614b on the second panel 607b via a conductive material 609 present inside the seal material 608. Various wirings such as a wiring 614d connected to the input bump of the liquid crystal driving IC 603a, that is, the wiring 614e connected to the input terminal, and a wiring 614f connected to the input bump of the liquid crystal driving IC 603b are formed in an appropriate pattern. . Note that the lead-out wiring 614c, the wiring 614e, and the wiring 614f are formed by dispersing metal fine particles in a conductive polymer, so that disconnection due to expansion can be prevented while securing conductivity.

  The liquid crystal driving IC 603a and the liquid crystal driving IC 603b are mounted by being adhered to the surface of the substrate overhang portion 607c by an ACF (Anisotropic Conductive Film) 622. That is, the conductive particles contained in the ACF 622 electrically connect the input side bumps of the liquid crystal driving ICs 603a and 603b and the wirings 614e and 614f, and the output side bumps of the liquid crystal driving ICs 603a and 603b and the lead wirings 614c and 614d. Are electrically connected.

  The FPC 604 includes a stretchable resin film 623, a circuit 626 including a chip component 624, and a wiring terminal 627 (see FIG. 23). The circuit 626 is directly mounted on the surface of the resin film 623 by soldering or other conductive connection technique. The portion of the FPC 604 where the wiring terminal 627 is formed is connected by the ACF 622 to the portion of the first panel 607a where the wiring 614e and the wiring 614f are formed. The conductive particles contained in the ACF 622 conduct the wirings 614e and 614f on the substrate side and the wiring terminals 627 on the FPC side.

  An external connection terminal 631 is formed at the opposite end of the FPC 604, and the external connection terminal 631 is connected to an external circuit (not shown). Then, the liquid crystal driving ICs 603a and 603b are driven based on a signal transmitted from the external circuit, a scanning signal is supplied to one of the first electrode 614a and the second electrode 614b, and a data signal is supplied to the other. As a result, the voltage of the dot-matrix pixel pixels arranged in the effective display area V is controlled for each pixel, and as a result, the orientation of the liquid crystal L is controlled for each pixel.

  The lighting device 606 functions as a backlight, and includes a light guide 632 made of acrylic resin or the like, a diffusion sheet 633 provided on the light emission surface 632 b of the light guide 632, and light emission of the light guide 632. It has a reflection sheet 634 provided on the surface opposite to the surface 632b and an LED (Light Emitting Diode) 636 as a light emitting source.

  The LED 636 is supported by the LED substrate 637, and the LED substrate 637 is attached to a support portion (not shown) formed integrally with the light guide 632, for example. By mounting the LED substrate 637 at a predetermined position of the support portion, the LED 636 is placed at a position facing the light capturing surface 632 a that is the side end surface of the light guide 632. Reference numeral 638 denotes a buffer material for buffering an impact applied to the liquid crystal panel 602.

  When the LED 636 emits light, the light is captured from the light capturing surface 632a, guided to the inside of the light guide 632, and diffused from the light exit surface 632b while propagating while reflecting on the reflection sheet 634 and the wall surface of the light guide 632. The light is emitted to the outside through the sheet 633 as planar light.

  In the liquid crystal display device 600 of the present embodiment, when external light such as sunlight or room light is sufficiently bright, external light is taken into the liquid crystal panel 602 from the second panel 607b side by the above configuration, After the light passes through the liquid crystal L, it is reflected by the reflective film 612 and supplied to the liquid crystal L again. Thereby, a reflective display is performed. On the other hand, when a sufficient amount of external light cannot be obtained, the LED 636 emits light and planar light is emitted from the light emitting surface 632 b of the light guide 632, and the light passes through the opening 621 formed in the reflective film 612. Supplied to the liquid crystal L. Thereby, a transmissive display is performed.

  As described above, also in the liquid crystal display device 600, the first panel 607a and the second panel 607b are made of an irreversible extensible material (ultraviolet curable resin) and are formed on these substrates 611a and 611b. The element layers 641a and 641b are made of a stretchable material and have adhesiveness to the substrates 611a and 611b, respectively, so that they are bonded together after the first panel 607a and the second panel 607b are formed. Thus, the liquid crystal panel 602 having a size larger than that of the first substrates 611a and 611b can be manufactured. Therefore, even when a large liquid crystal panel 602 (liquid crystal display device 600) is manufactured, it is possible to prevent an increase in cost associated with this without increasing the size of the manufacturing line.

  Further, the first panel 607a and the second panel 607b after being cut into each chip are bonded together, and after the liquid crystal is injected, the display device 600 is stretched to align the liquid crystal molecules. Therefore, when the first panel 607a and the second panel 697b are formed, it is not necessary to perform individual rubbing treatment after forming the alignment films 616a and 616b, respectively, and the alignment can be performed together.

  Note that the first electrode 614a, the second electrode 614b, the lead-out wiring 614c, the wirings 614e and 614f, and the like may be formed by an inkjet method. That is, a predetermined functional liquid may be introduced into the functional liquid droplet ejection head H, and this may be ejected from the functional liquid droplet ejection head H to form the first electrodes 614a and the like (including a drying step).

  Next, a third embodiment of the present invention will be described. In the above embodiment, the element layers 20, 641a, 641b (hereinafter, only the reference numeral 20) are formed on the substrates 501, 611a, 611b (hereinafter, only the reference numeral 501) having a size smaller than the target size is formed. In the present embodiment, the case where the element layer 20 is formed on the substrate 501 having a size larger than the target size, that is, due to the contraction, the display device 10 having a size smaller than the original substrate 501 is described. The case of manufacturing 600 (hereinafter, only indicated by reference numeral 10) will be described. This embodiment is applicable to both the organic EL display device 10 and the liquid crystal display device 600.

  In this case, the substrate 501 is made of a heat-shrinkable material that exhibits shrinkage by thermal energy, or a photo-shrinkable material that exhibits shrinkage by light energy. The element layer 20 formed on the substrate 501 is made of a stretchable material and has sufficient adhesion to the substrate 501 as in the case of the above embodiment. Therefore, the display device 10 having a size smaller than that of the first substrate 501 can be manufactured by shrinking the substrate 501 after the element layer 20 is formed.

  FIG. 25 shows the contracted state of the display device 10, but as shown in FIG. A configuration that contracts only in a one-dimensional direction may be used, or a configuration that contracts in a two-dimensional direction in two stages. As described above, the substrate 501 is contracted after the element layer 20 is formed, so that when the element layer 20 is formed, a high-quality display device can be easily obtained without increasing the accuracy of the manufacturing apparatus (functional droplet discharge apparatus 1). 10 can be manufactured. That is, when forming a component (for example, the optical functional layer 510) in the element layer 20 by the ink jet method, it is necessary to accurately discharge a predetermined amount (predetermined number) of functional liquid into a minute pixel region. According to the present embodiment, since the functional liquid can be discharged in a state where the pixel area is wide, an error in the discharge position (discharge accuracy) can be covered.

  Next, a fourth embodiment of the present invention will be described. In the third embodiment, the case where the display device 10 having a size smaller than that of the original substrate 501 is manufactured by shrinkage has been described. However, in this embodiment, the substrate 501 can be made of an elastic material (urethane rubber, silicon rubber) that can self-shrink. The substrate 501 is temporarily stretched by a stretching mechanism (can be stretched in the X-axis direction and / or Y-axis direction: see the stretching device in FIG. 4) (pre-stretching step). The element layer 20 is formed. Then, after the element layer 20 is formed, the extension mechanism is released to return the substrate 501 to its original size. This embodiment is applicable to both the organic EL display device 10 and the liquid crystal display device 600. Also in the present embodiment, all the constituent elements constituting the element layer 20 are made of a stretchable material, and the element layer 20 has adhesiveness to the substrate 501.

  In this case, as the stretching mechanism, the stretching device shown in FIG. 4 incorporated in the functional liquid droplet ejection device shown in FIG. 3 can be used. For example, in the organic EL display device 10, the top of the mother substrate W or the substrate 501 and The lower part or the periphery is fixed to the set table 21 with clips or the like. Then, the element layer 20 is formed in a state where the mother substrate W or the substrate 501 is stationary, and further the sealing layer 30 made of an ultraviolet curable resin is formed thereon, and then the expansion mechanism is released and contracted. Finally, the sealing layer 30 is cured by irradiating with ultraviolet rays.

  In the case where the element layer 20 is formed by an ink jet method, it is preferable that the functional liquid is dried with the substrate 501 stretched and then contracted. According to this configuration, the functional liquid can be dried more quickly, and uneven drying can be prevented.

  Thus, according to this embodiment, the substrate 501 and the element layer 20 are both made of a stretchable material, and the element layer 20 formed on the substrate 501 has adhesiveness to the substrate 501. Therefore, the display device 10 having a size smaller than that of the first substrate 501 can be manufactured by shrinking the substrate 501 after the element layer 20 is formed. Therefore, for example, when the element layer 20 is formed by the ink jet method, the functional liquid can be discharged in a state where the pixel region is wide, and thus the display device 10 with high quality can be manufactured without increasing the accuracy of the manufacturing apparatus. . Further, since the substrate 501 is made of a self-shrinkable elastic material, the substrate 501 can be easily shrunk without requiring treatment such as causing a chemical change in the substrate 501 material.

  In this embodiment, the substrate 501 is made of a self-shrinkable elastic material, but instead of this, it can be shrunk by heat energy or light energy, and stretchability that exhibits irreversibility by these energies. The substrate 501 may be made of a material. According to this configuration, the display device 10 can be finally contracted by finally applying thermal energy or light energy, and finally the display device 10 in a stable state can be obtained. In particular, when the substrate 501 is made of a shrinkable ultraviolet curable resin similar to the sealing layer 30, both the substrate 501 and the sealing layer 30 can be simultaneously cured by finally irradiating with ultraviolet rays. Since it is possible, processing is easy. Moreover, you may comprise the board | substrate 501 and the sealing layer 30 with the thermosetting resin which shrink | contracts and hardens | cures with a thermal energy (heating). Also in this case, since both the substrate 501 and the sealing layer 30 can be simultaneously cured by heating, the processing is easy.

  In this case, a heat-shrinkable film or the like is preferably used as the stretchable material that exhibits irreversibility by thermal energy. In this case, it is preferable that the stretchable material shrinks at a relatively low temperature, has a high shrinkage rate, and has a small decrease in strength due to shrinkage or temperature. According to this configuration, it is possible to manufacture the display device 10 that is easier to manufacture and stable.

  Further, in this embodiment, instead of using a stretching device 60 (stretching mechanism) that can stretch the entire substrate 501 as shown in FIGS. 4 and 5, a stretching mechanism that can partially stretch the substrate 501 is used. Also good. In this case, for example, the active element portion is not expanded, but only the wiring portion is expanded, and the functional liquid corresponding to the wiring portion is used in the functional liquid droplet ejection device 1 according to the expansion (according to the deformation rate depending on the location). You may make it apply | coat.

  In this case, it is preferable to use an extension mechanism as shown in FIG. That is, the extension target region is expanded by engaging and winding the ends of the substrate 501 around rollers 701a and 701b each having one chuck groove 702a and 702b, and pulling the rollers 701a and 701b in the direction of the arrow. And wiring etc. are apply | coated by discharging a functional liquid from the functional liquid droplet discharge head H with respect to the flat part which is an expansion | extension object area | region. In this case, when unevenness occurs in the extension target region due to the locking and winding of the substrate 501, it is preferable to control the functional liquid discharge timing from the functional liquid droplet ejection head H in consideration of the unevenness. According to this configuration, since the substrate 501 can be partially extended, a high-quality display device 10 can be obtained without increasing the accuracy of the functional liquid droplet ejection device 1 and the size of the device can be reduced. be able to.

  As described above, according to the display device manufacturing method of the present invention, as described in the first embodiment to the fourth embodiment, the constituent elements of the display device 10 are all made of an extensible material. The element layer 20 (electrode, hole injection / transport layer 510a and light emitting layer 510b) can be formed on the substrate 501 having a size smaller than the size (first embodiment and second embodiment). With this configuration, it is possible to prevent an increase in the size of the production line and an associated increase in cost.

  In this case, since various wirings connected to the electrodes are made by dispersing metal fine particles in a conductive polymer, disconnection due to expansion can be prevented while securing conductivity.

  On the other hand, if all the constituent elements constituting the display device 10 are made of a shrinkable material, they can be formed on a substrate 501 having a size larger than the target size (third embodiment and second embodiment). 4 embodiment). With this configuration, for example, when the element layer 20 is formed by an ink jet method, the discharge position accuracy (landing accuracy) can be improved even if the accuracy of the manufacturing apparatus is not so high, and thus a high-quality display device 10 is manufactured. can do.

  In this case, when the functional liquid ejected by the ink jet method is dried, the functional liquid can be dried more quickly by leaving the substrate 501 in an expanded state (shrinking after drying). Can be prevented.

  Note that when the display device (the organic EL display device 10 and the liquid crystal display device 600) is an active panel, the active element is formed by an inkjet method, but the active element formed by a photolithography method or the like is pasted. (Mount). A method for attaching an active element is disclosed in JP-A-2001-51296 and the like.

  At this time, for example, when the active element for each pixel is separated, the substrate 501 can be attached before the expansion process or the contraction process. Further, even when active elements of a plurality of pixels are gathered, for example, when active elements of four pixels are gathered, if the active elements are arranged at the intersections of the partition lines separating the four pixels, the pasting is performed. Since the attached active element does not prevent expansion or contraction, it can be applied before the expansion process or the contraction process. However, in this case, the active element is preferably made of a stretchable material (organic thin film transistor) and wired with a stretchable conductive material. Further, in order to improve the adhesion to the substrate 501, it is preferable to adhere the active element to the substrate 501 with a stretchable adhesive. Note that it is naturally possible to attach the active element after the expansion process or the contraction process of the substrate 501. With this configuration, since it is not necessary to consider the stretchability of the active element, an active element that has been conventionally used can be used.

  In the above example, components formed by an inkjet method (for example, the optical functional layer 110 of the organic EL display device 10) may also be formed using photolithography or the like. That is, each constituent element may be formed by any method as long as a stretchable material can be used.

  In the first embodiment and the second embodiment, the display device 10 having a target size is manufactured by stretching the substrate 501. In this case, if the stretch ratio is high, an inorganic thin film (made of ITO is used). The pixel electrode 511, the Ca layer of the cathode 503, a thin film for gas barrier, etc.) may crack. For this reason, if there is a possibility that such a problem may occur, stretch the film before applying the inorganic thin film, or stretch it using a film made of a stretchable material, and then shrink it again. It is preferable to deposit this. These inorganic thin films may be replaced with organic thin films. According to this configuration, the above problems do not occur.

  In addition, the present invention is not limited to the organic EL display device 10 and the liquid crystal display device 600 described above, but can be used to manufacture various display devices such as a PDP (Plasma Display Panel) device, an electrophoretic display device, and an FED (Field Emission Display) device. Applicable to the method.

  As described above, according to the method for manufacturing a display device of the present invention, an element is formed on a substrate having a size smaller than a target size by making all the components constituting the display device a material that can be expanded or contracted. Layer 20 (electrode, hole injection / transport layer and light emitting layer) can be formed, or conversely, these can be formed on a substrate having a size larger than the target size. Thus, it is possible to prevent an increase in the size of the production line and the associated increase in cost without causing the failure.

It is a figure which shows the principal part of the display apparatus which concerns on one Embodiment of this invention. It is the top view and sectional drawing of the display apparatus which concern on embodiment. It is a top view schematic diagram of the functional droplet discharge device concerning an embodiment. It is a top view schematic diagram of the expansion | extension apparatus which concerns on embodiment. It is a perspective view of the chuck mechanism concerning an embodiment. It is a figure which shows an example of the expansion | extension state of the display apparatus which concerns on embodiment. It is a figure which shows an example of the expansion | extension state of the display apparatus different from FIG. It is a flowchart which shows the manufacturing method of the organic electroluminescence display which concerns on embodiment. It is sectional drawing of the bank part formation process (inorganic bank) in the manufacturing method of the organic electroluminescence display which concerns on embodiment. It is sectional drawing of the bank part formation process (organic substance bank) in the manufacturing method of the organic electroluminescence display which concerns on embodiment. It is sectional drawing of the plasma treatment process (hydrophilization treatment) in the manufacturing method of the organic electroluminescence display which concerns on embodiment. It is sectional drawing of the plasma treatment process (water-repellent treatment) in the manufacturing method of the organic EL display device according to the embodiment. It is sectional drawing of the positive hole injection layer formation process (functional droplet discharge) in the manufacturing method of the organic electroluminescence display which concerns on embodiment. It is sectional drawing of the positive hole injection layer formation process (drying) in the manufacturing method of the organic electroluminescence display which concerns on embodiment. It is sectional drawing of the surface modification process (functional droplet discharge) in the manufacturing method of the organic electroluminescence display which concerns on embodiment. It is sectional drawing of the surface modification process (drying) in the manufacturing method of the organic electroluminescence display which concerns on embodiment. It is sectional drawing of the B light emitting layer formation process (functional droplet discharge) in the manufacturing method of the organic electroluminescence display which concerns on embodiment. It is sectional drawing of the B light emitting layer formation process (drying) in the manufacturing method of the organic electroluminescence display which concerns on embodiment. It is sectional drawing of the R * G * B light emitting layer formation process in the manufacturing method of the organic electroluminescence display concerning an embodiment. It is sectional drawing of the counter electrode formation process in the manufacturing method of the organic electroluminescence display which concerns on embodiment. It is sectional drawing of the sealing process in the manufacturing method of the organic electroluminescence display which concerns on embodiment. It is a flowchart which shows the manufacturing method of the liquid crystal display device which concerns on 2nd Embodiment. It is a disassembled perspective view of the liquid crystal display device which concerns on 2nd Embodiment. It is sectional drawing of the liquid crystal display device which concerns on 2nd Embodiment. It is a figure which shows an example of the contracted state of the display apparatus which concerns on 3rd Embodiment. It is a figure which shows an example of the expansion | extension mechanism which concerns on 4th Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Functional droplet discharge device 3 ... Movement mechanism 4 ... Y-axis table 5 ... X-axis table 7 ... Head unit 9 ... Subcarriage 10 ... Organic EL display device 12 ... Functional liquid supply mechanism 20 ... Element layer 30 ... Sealing layer 60 ... stretching device 62a, b ... X-axis stretching mechanism 63a, b ... Y-axis stretching mechanism 65 ... chuck mechanism 110 ... optical functional layer 501 ... substrate 502 ... circuit element layer 503 ... cathode (counter electrode) 504 ... display element layer 510a ... Hole injection / transport layer 510b ... Light emitting layer 600 ... Liquid crystal display element position 611a, b ... Substrate 641a, b ... Element layer A ... Pixel area H ... Functional droplet discharge head L ... Liquid crystal W ... Mother substrate

Claims (9)

A display device in which an element layer having an electrode and an optical functional layer is formed on a substrate, wherein the substrate is made of a heat-shrinkable material that exhibits shrinkage by thermal energy,
In the method for manufacturing a display device, the element layer is made of a stretchable material and has adhesiveness to the substrate.
An element layer forming step of forming the element layer on the substrate;
And a shrinking step of shrinking the substrate by the thermal energy after forming the element layer. A display device in which an element layer having an electrode and an optical functional layer is formed on a substrate, wherein the substrate is made of a light-shrinkable material that exhibits shrinkage by light energy,
In the method for manufacturing a display device, the element layer is made of a stretchable material and has adhesiveness to the substrate.
An element layer forming step of forming the element layer on the substrate;
And a shrinking step of shrinking the substrate with the light energy after forming the element layer. A display device in which an element layer having an electrode and an optical functional layer is formed on a substrate, wherein the substrate and the element layer are both made of a stretchable material, and the element layer is In the manufacturing method of the display device having adhesiveness,
A pre-stretching step of stretching the substrate prior to the formation of the element layer;
An element layer forming step of forming the element layer on the substrate after stretching the substrate;
And a shrinking step of shrinking the substrate so that the display device has a target size after forming the element layer. The substrate is made of a self-shrinkable elastic material,
In the pre-stretching step, the substrate is fixed in a stretched state by a stretching mechanism that stretches in the X-axis direction and / or the Y-axis direction,
The method for manufacturing a display device according to claim 3, wherein in the contraction step, the extension mechanism is released. The substrate is made of a stretchable material that exhibits irreversibility by thermal energy,
The method for manufacturing a display device according to claim 3, wherein, in the contraction step, the substrate is contracted and the thermal energy is applied to the substrate.   The method for manufacturing a display device according to claim 3, further comprising a thermosetting step of curing the substrate with thermal energy after the shrinking step.   The method for manufacturing a display device according to claim 3, further comprising a photocuring step of curing the substrate with light energy after the shrinking step. Formation of a sealing layer that is formed of a thermosetting material that is cured by thermal energy or a photocurable material that is cured by light energy, and that forms a sealing layer that seals the substrate prior to the shrinking step Process,
The method for manufacturing a display device according to claim 1, further comprising a sealing layer curing step for curing the sealing layer after the shrinking step.   The method for manufacturing a display device according to claim 8, wherein any one or two or more of the electrode, the optical functional layer, and the sealing layer are formed using an inkjet method.

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