JP2009090402A - Cutting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting device in which chips and cutting coolant are prevented from adhering to a moving means without installing a bellows mechanism covering the moving means for moving a chuck table in a cutting and feeding direction. <P>SOLUTION: This cutting device comprises a chuck table mechanism having the chuck table for holding a workpiece, a cutting means for cutting the workpiece held on the chuck table, and a cutting and feeding means for moving the chuck table in the cutting and feeding direction. The chuck table mechanism comprises a support table for supporting the chuck table and a moving base for cantilevering one side of the support table. The cutting and feeding means comprises a guide means for movably guiding the moving base in the cutting and feeding direction and the moving means for moving the moving base along the guide means. A chip storage container having a receiving opening arranged along the guide means and receiving chips and cutting coolant is installed under the support table. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a cutting apparatus for cutting a workpiece such as a semiconductor wafer.

  In the semiconductor device manufacturing process, circuits such as ICs and LSIs are formed in a large number of regions arranged in a lattice pattern on the surface of a substantially disc-shaped semiconductor wafer, and each region where the circuits are formed is defined on a predetermined street. Individual semiconductor chips are manufactured by dicing along a cutting line. The semiconductor chip thus divided is packaged and widely used in electric devices such as mobile phones and personal computers.

  Electric devices such as mobile phones and personal computers are required to be lighter and smaller, and a package technology that can reduce the size of a semiconductor chip package called a chip size package (CSP) has been developed. As one of the CSP technologies, a package technology called Quad Flat Non-Lead Package (QFN) has been put into practical use. The package technology called QFN is a method in which a plurality of semiconductor chips are formed on a metal plate such as a copper plate in which a plurality of connection terminals corresponding to the connection terminals of the semiconductor chip are formed and streets partitioned for each semiconductor chip are formed in a lattice shape. Are arranged in a matrix, and the CSP substrate is formed by integrating the metal plate and the semiconductor chip by a resin portion obtained by molding resin from the back side of the semiconductor chip. The CSP substrate is cut along the streets to divide into individually packaged chip size packages (CSP).

  The CSP substrate is generally cut by a precision cutting device called a dicing device. The cutting apparatus includes a chuck table that can be reciprocated, and a cutting unit that cuts a workpiece that is held on the chuck table. The cutting means is composed of a disk-shaped rotating blade containing diamond particles. Further, the cutting means is provided with processing water supply means for supplying processing water which may be pure water. When the chuck table moves forward and / or backward, a rotating cutting blade is applied to the CSP substrate on the chuck table, and the CSP substrate is cut. The moving means for moving the chuck table in the cutting feed direction includes a rotatable male screw rod extending in the moving direction and a female screw member screwed to the male screw rod. The chuck table is attached to the female screw member. It is installed. The male screw rod and the female screw member are precision machine elements, and it is necessary to prevent cutting waste and processing water from adhering to the precision machine element. Due to the rotating direction of the rotating blade, cutting waste and processed water are mainly generated when the cutting blade is rotated in the moving direction of the chuck table on one side, for example, the part acting on the CSP substrate as viewed in the moving direction of the chuck table. Is scattered on the downstream side when viewed in the moving direction of the chuck table. A part of the processed water becomes mist and scatters to the upstream side as seen in the moving direction of the chuck table. Therefore, a bellows mechanism is provided on at least one side, usually both sides, as viewed in the moving direction of the chuck table to cover precision mechanical elements such as male screw rods. When the chuck table moves forward or backward, the bellows mechanism disposed on the downstream side as viewed in the forward movement direction of the chuck table is contracted, and the bellows mechanism disposed on the upstream side is expanded. When the chuck table moves backward, the bellows mechanism arranged on the upstream side in the forward movement direction of the chuck table is contracted, and the bellows mechanism arranged on the downstream side is expanded.

  When the CSP substrate is cut by the above-described cutting apparatus, a so-called ear portion where no CSP is formed exists at the edge portion of the CSP substrate, and the ear portion is seen as a relatively large cutting waste in the moving direction of the chuck table. When the cutting blade is rotated in one direction, for example, the part acting on the CSP substrate moves in the direction in which the chuck table moves, the bellows mechanism is arranged on the downstream side as viewed in the direction in which the chuck table moves. It is scattered on the top. The relatively large cutting waste scattered on the bellows mechanism tends to inhibit smooth contraction and extension of the bellows mechanism. Since the bellows mechanism needs to be smoothly contracted and stretched, it is usually formed of a cloth or a similar sheet material. Therefore, there is a high possibility that damages such as holes are generated in the bellows means due to relatively large cutting waste scattered on the bellows mechanism.

In order to solve the above problem, a bellows mechanism provided with a bellows cover that covers the top surface of the bellows member is disclosed in Patent Document 1 below. The bellows cover is composed of a plurality of plate members respectively attached to a plurality of mountain portions of the bellows member.
JP 2004-186361 A

  Thus, the bellows cover that covers the upper surface of the bellows member is composed of a plurality of plate members respectively mounted on the plurality of peak portions of the bellows member, so that cutting waste is sandwiched between the plate members, and the plate member is damaged. There's a problem.

  The present invention has been made in view of the above-mentioned facts, and the main technical problem thereof is to provide cutting means and cutting chips on the moving means without providing a bellows mechanism that covers the moving means for moving the chuck table in the cutting feed direction. It is providing the cutting device which can prevent that water adheres.

In order to solve the main technical problem, according to the present invention, a chuck table mechanism including a chuck table for holding a workpiece, a cutting means for cutting the workpiece held on the chuck table, and the chuck In a cutting device comprising a cutting feed means for moving the table in the cutting feed direction,
The chuck table mechanism includes a support table that supports the chuck table, and a movable base that cantileverally supports one side of the support table,
The cutting feed means comprises guide means for guiding the movable base so as to be movable in the cutting feed direction, and moving means for moving the movable base along the guide means,
A cutting waste container having a receiving opening disposed along the guide means on the lower side of the support table and receiving cutting waste and cutting water;
A cutting device is provided.

The movable base includes a support portion that cantilever supports one side of the support table, and a supported portion that protrudes horizontally from the lower end of the support portion toward the other side. It is guided along the guide means.
Further, a discharge opening is provided in the bottom wall of the cutting waste container, and a cutting waste transporting means for transporting the cutting waste discharged from the discharge opening is disposed below the cutting waste storage container. Yes.
The chuck table mechanism includes a first chuck table mechanism and a second chuck table mechanism, and the cutting feed means is disposed in parallel in the same plane and includes the first chuck table mechanism and the second chuck table mechanism. The first cutting feed means and the second cutting feed means are respectively moved in the cutting feed direction, and a moving base constituting the first cutting feed means and a moving base constituting the second cutting feed means. Each of the stands supports the outside of the support table in a cantilevered manner, and the cutting waste container is disposed below the support table constituting the first cutting feed means and the support table constituting the first cutting feed means. Yes.

  In the cutting apparatus according to the present invention, since the cutting waste container supports the chuck table and one side is cantilevered on the movable base, the end scattered by the cutting process is disposed. The cutting waste and cutting water including the material surely fall into the cutting waste storage container. Therefore, cutting waste including cutting material and cutting water do not fall on the moving means constituting the cutting feed means for moving the moving base in the cutting feed direction. For this reason, it is not necessary to provide a bellows mechanism that covers the moving mechanism for reciprocating the chuck table as in the conventional cutting apparatus. Further, in the present invention, the moving base constituting the cutting feed means includes a support portion that cantileverally supports one side of the support table, and a supported surface that protrudes horizontally from the lower end of the support portion toward the other side. Therefore, the dimension in the direction orthogonal to the cutting feed direction of the chuck table mechanism does not increase.

  Hereinafter, a preferred embodiment of a cutting device configured according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 shows a perspective view of a main part of a cutting apparatus constructed according to the present invention. FIG. 2 shows a perspective view of the cutting apparatus shown in FIG. Has been.
The cutting apparatus shown in FIGS. 1 and 2 includes a stationary base 2. On the stationary base 2, a first chuck table mechanism 3a and a second chuck table mechanism 3b for holding a workpiece, and the first chuck table mechanism 3a and the second chuck table mechanism 3b are respectively provided. The first cutting feed means 4a and the second cutting feed means 4b are provided to reciprocate in the cutting feed direction indicated by the arrow X.

  In the illustrated embodiment, the first chuck table mechanism 3a and the second chuck table mechanism 3b include a first chuck table 31a and a second chuck table 31b for sucking and holding a workpiece, respectively, and the first chuck table. A first support table 32a and a second support table 32b for supporting the table 31a and the second chuck table 31b, respectively, and one side (outside) of the first support table 32a and the second support table 32b are respectively separated. A first moving base 33a and a second moving base 33b supported by holding are provided. The first chuck table 31a and the second chuck table 31b are connected to suction means (not shown), respectively, and are placed on the suction chucks 311a and 311b by selectively communicating with a suction source by a suction means (not shown). The workpiece to be placed is sucked and held. Further, the first chuck table 31a and the second chuck table 31b can be appropriately rotated by rotating means (not shown). The first chuck table 31a and the second chuck table 31b configured as described above are disposed on the first support table 32a and the second support table 32b, respectively.

  The first support table 32a and the second support table 32b are each formed by a rectangular plate-shaped member, and each one side (outer side) portion is separated by the first moving base 33a and the second moving base 33b. Has been supported. The first moving base 33a and the second moving base 33b include support portions 331 and 331 that cantilever support one side (outside) of the first support table 32a and the second support table 32b, It consists of supported portions 332 and 332 that protrude horizontally from the lower ends of the support portions 331 and 331 toward the other side (inner side). A pair of guided grooves 333, 333 and 333, 333 formed along the cutting feed direction X are formed in the supported portions 332 and 332, respectively.

  The first chuck table mechanism 3a and the second chuck table mechanism 3b configured as described above are moved in the cutting feed direction indicated by the arrow X by the first cutting feed means 4a and the second cutting feed means 4b, respectively. Supported as possible. The first cutting feed means 4a and the second cutting feed means 4b are arranged in parallel in the same plane, and are respectively a first moving base 33a and a second chuck that constitute the first chuck table mechanism 3a. First guide means 41a and second guide means 41b for supporting the second moving base 33b constituting the table mechanism 3b so as to be movable in the cutting feed direction indicated by the arrow X, and the first moving base 33a and The first moving means 42a and the second moving means 42b for moving the second moving base 33b along the first guiding means 41a and the second guiding means 41b, respectively. The first guide means 41a and the second guide means 41b are each a pair of first guide rails 411a and 411a and a first guide rail 411a and 411a arranged in parallel along the cutting feed direction indicated by the arrow X on the stationary base 2. It consists of two guide rails 411b and 411b. A pair of first guide rails 411a and 411a and a pair of second guide rails 411b and 411b formed on supported portions 332 and 332 of the first moving base 33a and the second moving base 33b. By fitting the guided grooves 333, 333 and 333, 333, the first moving base 33a and the second moving base 33b become the first guide rails 411a, 411a and the second guide rails 411b, 411b. It is supported so that it can move along.

  The first moving base 33a and the second moving base 33b supported by the first guide rails 411a and 411a and the second guide rails 411b and 411b are the first moving means 42a and the second moving base, respectively. The means 42b is moved along the first guide rails 411a and 411a and the second guide rails 411b and 411b. The first moving means 42a and the second moving means 42b are arranged in parallel between the first guide rails 411a and 411a and between the second guide rails 411b and 411b, respectively, and one end is arranged on the stationary base 2. The first male screw rod 421a and the second male screw rod 421b are rotatably supported by a formed bearing (not shown), and are connected to the other ends of the first male screw rod 421a and the second male screw rod 421b. The first male screw rod 421a and the second male screw rod 421b are composed of a first pulse motor 422a and a second pulse motor 422b that are normally or reversely driven. The first moving means 42a and the second moving means 42b configured as described above are configured so that the first male screw rod 421a and the second male screw rod 421b are the first moving base 33a and the second moving base, respectively. Screwed into female screws 334 and 334 formed on supported portions 332 and 332 of the base 33b. Accordingly, the first moving means 42a and the second moving means 42b drive the first pulse motor 422a and the second pulse motor 422b, respectively, to adjust the first male screw rod 421a and the second male screw rod 421b. The first moving base 33a and the second moving base 33b are indicated by arrows X along the first guide rails 411a and 411a and the second guide rails 411b and 411b, respectively, by rotating or reversely driving. It can move in the cutting feed direction. Note that the end walls 412 and 413 are connected between the front ends and the rear ends of the pair of first guide rails and the pair of second guide rails. Therefore, the accommodation chamber 414 is formed by the upper surface of the stationary base 2, the first guide rail 411 a, the second guide rail 411 b, and the end walls 412 and 413. A drain port 22 is provided in a region where the storage chamber 414 is formed in the stationary base 2.

  Continuing the description with reference to FIG. 2, the cutting device in the illustrated embodiment has the first guide rails 411 a and 411 a and the second guide below the first support table 32 a and the second support table 32 b. A common cutting waste container 5 is provided along the rails 411b and 411b. The cutting waste container 5 includes a right side wall 51 and a left side wall 52, a front end wall 53 and a rear end wall 54, a first bottom wall 55, and a second bottom wall 56, as shown in FIG. It is formed as a receiving opening 57 for receiving cutting waste. The first bottom wall 55 and the second bottom wall 56 are formed so as to be inclined downward toward the inside, and the inner end portions thereof are bent downward, and the discharge opening 58 is formed between both inner ends. Is provided. The discharge opening 58 is opened toward the storage chamber 414. Further, support legs 551 and 561 are respectively attached to the lower surfaces of the first bottom wall 55 and the second bottom wall 56 constituting the cutting waste container 5, and these support legs 551 and 561 are shown in FIG. Thus, the stationary base 2 is disposed inside the first guide rails 411a and 411a and the second guide rails 411b and 411b.

  As shown in FIG. 1, cutting waste transporting means 6 that transports the cutting waste that has fallen into the cutting waste storage container 5 and discharged from the discharge opening 58 is disposed below the cutting waste storage container 5 described above. . The cutting waste conveying means 6 is parallel to the driving roller 61 disposed on the rear end wall 54 side of the cutting waste container 5 and the driving roller 61 on the front end wall 53 side of the cutting waste container 5 as shown in FIG. A driven roller 62, a mesh-like conveying belt 63 wound around the driven roller 61, an electric motor 64 that rotationally drives the driving roller 61, and the driving roller 61 and the driven roller 62. Support brackets 65, 65 and 66, 66 that rotatably support the rotation shafts are provided, and the support brackets 65, 65, 66, 66 are mounted on the stationary base 2. The cutting waste conveying means 6 configured in this manner moves the conveying belt 63 in the direction indicated by the arrow 63a by energizing (ON) the electric motor 64 and rotating the driving roller 61 in the direction indicated by the arrow 61a. .

  1 and 2, the cutting device in the illustrated embodiment is a portal type that is disposed across the first guide rails 411a and 411a and the second guide rails 411b and 411b. The support frame 7 is provided. The gate-shaped support frame 7 includes a first pillar 71 disposed outside the first guide rails 411a and 411a and a second pillar disposed outside the second guide rails 411b and 411b. The support part 73 which connected the upper end of the pillar part 72, the 1st pillar part 71, and the 2nd pillar part 72, and was arrange | positioned along the index feed direction shown by the arrow Y orthogonal to the cutting feed direction shown by the arrow X. An opening 74 that allows the movement of the first chuck table mechanism 3a and the second chuck table mechanism 3b is provided in the central portion. The upper end portions of the first column portion 71 and the second column portion 72 are formed to be wide, and openings 711 and 721 that allow the movement of the spindle unit of the cutting means to be described later are provided on the upper end portions, respectively. ing. A pair of guide rails 731 and 731 are provided on one surface of the support portion 73 along the index feed direction indicated by the arrow Y, and the index feed shown by the arrow Y as shown in FIG. A pair of guide rails 732 and 732 are provided along the direction.

  The cutting apparatus in the illustrated embodiment includes a first alignment means 8a and a second alignment means that are movably disposed along a pair of guide rails 731 and 731 provided on a support portion 73 of the portal-type support frame 7. The alignment means 8b is provided. The first alignment means 8a and the second alignment means 8b include a moving block 81, moving means 82 and 82 for moving the moving block 81 along a pair of guide rails 731 and 731, and a moving block 81, respectively. Imaging means 83 and 83 mounted on the. The moving blocks 81 and 81 are respectively provided with guided grooves 811 and 811 that are fitted to the pair of guide rails 731 and 731, and the guided grooves 811 and 811 are fitted to the pair of guide rails 731 and 731. Accordingly, the moving blocks 81 and 81 are configured to be movable along the pair of guide rails 731 and 731.

  The moving means 82 and 82 include a male screw rod 821 disposed in parallel between the pair of guide rails 731 and 731, a bearing 822 that rotatably supports one end of the male screw rod 821, and the male screw rod 821, respectively. A pulse motor 823 is connected to the end and drives the male screw rod 821 to rotate forward or backward. In the moving means 82 and 82 configured as described above, the male screw rod 821 is screwed into the female screw 812 formed in the moving blocks 81 and 81, respectively. Accordingly, the moving means 82 and 82 drive the pulse motor 823 and drive the male screw rod 821 in the normal direction or the reverse direction, respectively, thereby moving the moving blocks 81 and 81 along the pair of guide rails 731 and 731 in FIGS. 2 can move in the index feed direction indicated by the arrow Y.

  The imaging units 83 and 83 mounted on the moving blocks 81 and 81 respectively have an imaging device (CCD), and send the captured image signal to a control unit (not shown).

  On the other surface (the surface opposite to the surface on which the first alignment means 8a and the second alignment means 8b are disposed) of the support portion 73 constituting the portal-shaped support frame 7 is the first surface. A cutting means 9a and a second cutting means 9b are provided. The 1st cutting means 9a and the 2nd cutting means 9b are demonstrated with reference to FIG. 5 and FIG. The first cutting means 9a and the second cutting means 9b include an indexing movement base 91, a cutting movement base 92, and a spindle unit 93, respectively. The indexing movement base 91 is provided with guided grooves 911 and 911 that fit with a pair of guide rails 732 and 732 provided on the other surface of the support portion 73 on one surface. By fitting 911 and 911 to a pair of guide rails 732 and 732, the indexing movement base 91 is configured to be movable along the pair of guide rails 732 and 732. Further, on the other surface of the indexing movement base 91, as shown in FIG. 5, the cutting feed direction indicated by the arrow Z (perpendicular to the mounting surfaces 311a and 311b of the first chuck table 31a and the second chuck table 31b). A pair of guide rails 912 and 912 (only one guide rail is shown in FIG. 5). In addition, on one surface of the index movement bases 91 and 91, relief grooves 913 and 913 that allow the insertion of a male screw rod of an index feeding means to be described later are provided with a step in the vertical direction.

  The incision moving base 92 includes a supported portion 921 extending in the vertical direction and a mounting portion 922 extending horizontally at a right angle from the lower end of the supported portion 921. As shown in FIG. 5, guided grooves 923 and 923 that fit with a pair of guide rails 912 and 912 provided on the other surface of the indexing movement base 91 are provided on the surface of the supported portion 921 on the mounting portion 922 side. (Only one guided groove is shown in FIG. 5), and the notched moving base 92 is provided by fitting the guided grooves 923, 923 to the pair of guide rails 912, 912. Is configured to be movable along the pair of guide rails 912 and 912 in the cutting feed direction indicated by the arrow Z. As shown in FIGS. 1 and 2, the cutting movement base 92 mounted on the index movement base 91 is mounted on the index movement base 91 of the support frame 7 having the mounting portion 922 as shown in FIGS. The first alignment means 8a and the second alignment means 8b are arranged so as to protrude from the other face side through the opening 94 to the one face side on which the first alignment means 8a and the second alignment means 8b are mounted.

  The spindle unit 93 is mounted on the lower surface of the mounting portion 922 that forms the cutting movement base 92 of the first cutting means 9a and the second cutting means 9b. As shown in FIG. 6, the spindle unit 93 includes a spindle housing 931, a rotary spindle 932 rotatably supported by the spindle housing 931, a cutting blade 933 attached to one end of the rotary spindle 932, A cutting water supply pipe 934 for supplying water and a servo motor (not shown) for rotationally driving the rotary spindle 932 are provided, and the axial direction of the rotary spindle 932 is arranged along the index feed direction indicated by the arrow Y. As shown in FIGS. 1 and 2, the spindle unit 93 mounted on the mounting portion 922 that forms the cutting movement base 92 in this manner is close to the first alignment unit 8a and the second alignment unit 8b. Will be placed. Further, the cutting blade 933 of the first cutting means 9a and the cutting blade 933 of the second cutting means 9b are arranged to face each other.

  As shown in FIG. 6, the first cutting means 9a and the second cutting means 9b in the embodiment shown in the figure show the index movement bases 91 and 91 as indicated by arrows Y along a pair of guide rails 732 and 732, respectively. Indexing feed means 94, 94 for moving in the feed direction are provided. The index feeding means 94, 94 includes a male screw rod 941 disposed in parallel between the pair of guide rails 732, 732, a bearing 942 that rotatably supports one end of the male screw rod 941, and a male screw rod 941. A pulse motor 943 is connected to the other end and drives the male screw rod 941 to rotate forward or backward. The male threaded rods 941 and 941 are disposed at height positions corresponding to the escape grooves 913 and 913 provided in the indexing movement bases 91 and 91, respectively. In the index feeding means 94 configured as described above, male screw rods 941 and 941 are screwed into female screws 914 and 914 formed on the index moving bases 91 and 91, respectively. Therefore, the index feeding means 94 and 94 drive the pulse motors 943 and 943 to drive the male screw rods 941 and 941 in the normal direction or the reverse direction, respectively, so that the index moving bases 91 and 91 are paired with the pair of guide rails 732 and 732. 1 and 2 in FIG. 1 and FIG. When the index movement bases 91 and 91 move, the male threaded rods 941 and 941 pass through the clearance grooves 913 and 913 provided in the index movement bases 91 and 91, so that the index movement bases 91 and 91 are The movement is allowed.

  Further, the first cutting means 9a and the second cutting means 9b in the illustrated embodiment are configured so that the cutting bases 92 and 92 are moved along a pair of guide rails 912 and 912 as shown in FIGS. Cutting feed means 95 and 95 for moving in the cutting feed direction indicated by arrow Z are provided. The incision feeding means 95 and 95 include a male screw rod 951 disposed in parallel with the pair of guide rails 912 and 912, a bearing 952 that rotatably supports one end of the male screw rod 951, and the other end of the male screw rod 951. And a pulse motor 953 that drives the male screw rod 951 to rotate forward or backward. In the cutting feed means 95 and 95 configured in this manner, the male screw rod 951 is screwed into a female screw 922 a formed on the supported portion 921 of the cutting moving base 92. Accordingly, the incision feeding means 95 and 95 drive the pulse motor 953 to drive the male screw rod 951 in the normal direction or the reverse direction, thereby moving the incision moving base 92 along the pair of guide rails 912 and 912 in FIG. In FIG. 2, it can move in the cutting feed direction indicated by the arrow Z.

  The cutting apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described mainly with reference to FIG.

  First, a CSP substrate W as a workpiece is transferred by a workpiece transfer means (not shown) onto the suction chuck 311a of the first chuck table 31a constituting the first chuck table mechanism 3a. At this time, the first chuck table 31a is positioned at the workpiece attaching / detaching position shown in FIG. The CSP substrate W has a plurality of rectangular areas formed by a plurality of division lines (streets) formed in a lattice pattern on the surface, and chip size packages (CSP) are respectively formed in the plurality of rectangular areas. Is formed. The CSP substrate W placed on the suction chuck 311a of the first chuck table 31a is sucked and held on the first chuck table 31a by operating a suction means (not shown) (first workpiece) Holding step).

  As described above, the first chuck table 31a that sucks and holds the CSP substrate W is moved to the first alignment region by the operation of the first moving means 42a constituting the first cutting feed means 4a. Next, the moving means 82 of the first alignment means 8a is operated to position the imaging means 83 of the first alignment means 8a directly above the first chuck table 31a. If the imaging unit 83 is positioned immediately above the first chuck table 31a, the imaging unit 83 images the surface of the CSP substrate W held on the suction chuck 311a of the first chuck table 31a, and the CSP substrate W is captured. One of the streets (scheduled cutting lines) that is a cutting area formed on the surface is detected. Then, the index feeding unit 94 of the first cutting unit 9 a is operated to perform alignment for aligning the cutting blade 933 and the street detected by the imaging unit 83. (First alignment step).

  While the first alignment process is being performed on the CSP substrate W held on the suction chuck 311a of the first chuck table 31a, the CSP substrate W as a workpiece is processed by a workpiece transfer means (not shown). Is conveyed onto the suction chuck 311b of the second chuck table 31b constituting the second chuck table mechanism 3b positioned at the workpiece attachment / detachment position shown in FIG. The CSP substrate W placed on the suction chuck 311b of the second chuck table 31b is sucked and held on the suction chuck 311b of the second chuck table 31b by operating a suction means (not shown) (second). Workpiece holding step).

  If the CSP substrate W is sucked and held on the suction chuck 311b of the second chuck table 31b, the second chuck table 31b is moved to the second position by the operation of the second moving means 42b constituting the second cutting feed means 4b. It is moved to the alignment area. Next, the moving means 82 of the second alignment means 8b is operated to position the imaging means 83 of the second alignment means 8b directly above the second chuck table 31b. Next, a second alignment step of detecting a region to be cut of the CSP substrate W held on the suction chuck 311b of the second chuck table 31b by the second alignment means 8b is performed. The second alignment process is performed in the same manner as the first alignment process described above.

  On the other hand, when the first alignment step is completed, the indexing feed means 94 of the first cutting means 9a is operated and the cutting blade 933 is held on the suction chuck 311a of the first chuck table 31a. Then, it is positioned at a position corresponding to the predetermined street formed in the above, and the cutting feed means 95 is further operated to lower the cutting blade 933 to be positioned at a predetermined cutting feed position. Then, while rotating the cutting blade 933, the first moving means 42a constituting the first cutting feed means 4a is operated to move the first chuck table 31a to the cutting area in the direction of arrow X which is the cutting feed direction. Thus, the CSP substrate W held on the suction chuck 311a of the first chuck table 31a is cut along the predetermined street by the action of the cutting blade 933 that rotates at high speed). In this cutting process, cutting water is supplied from the cutting water supply pipe 934 to the cutting portion.

  As described above, when the CSP substrate W held on the suction chuck 311a of the first chuck table 31a is cut along a predetermined street, the index feeding means 94 is operated to operate the spindle unit of the first cutting means 9a. 93 is moved in the index feed direction indicated by the arrow Y by the street interval (index feed process), and the first cutting process is performed. In this manner, the CSP substrate W is cut along all the streets formed in the predetermined direction by repeatedly performing the index feeding process and the first cutting process. When the CSP substrate W is cut along all the streets in the predetermined direction, the first chuck table 31a holding the CSP substrate W is rotated by 90 degrees. Then, by repeatedly performing the index feeding step and the first cutting step on the CSP substrate W held on the suction chuck 311a of the first chuck table 31a, the CSP substrate W is formed in all the streets formed in a lattice shape. And is divided into individual chip size packages (CSP).

  On the other hand, if the CSP substrate W is sucked and held on the suction chuck 311b of the second chuck table 31b and the second alignment step is performed as described above, the second cutting means 9b and the index feeding step and the second step are performed. 2 cutting process is implemented. Thus, in the cutting apparatus in the illustrated embodiment, the first alignment step, the index feeding step, and the first cutting step are performed on the CSP substrate W held on the suction chuck 311a of the first chuck table 31a. During this process, the CSP substrate W is held on the suction chuck 311b of the second chuck table 31b, and the second alignment alignment work, the index feeding process, and the second cutting process can be performed. Can be improved. The CSP substrate W held on the first chuck table 31a may be simultaneously cut by the first cutting means 9a and the second cutting means 9b.

  By carrying out the first cutting process and the second cutting process described above, the cutting waste and cutting water including the end material are scattered. The cutting waste and cutting water including the scattered end material enter the cutting waste storage container 5 from the receiving opening 57 of the cutting waste storage container 5, and are discharged along the inclination of the first bottom wall 55 and the second bottom wall 56. It moves to the opening 58 and is discharged from the discharge opening 58. The cutting waste and cutting water including the end material discharged from the discharge opening 58 fall on the conveying belt 63 of the cutting waste conveying means 6. The cutting water dropped on the conveyor belt 63 falls into the storage chamber 414 and is discharged from the drain port 22 because the conveyor belt 63 has a mesh shape. On the other hand, the cutting waste falling on the transport belt 63 is transported in a direction indicated by an arrow 63a in FIG. 3 and sent to a waste box (not shown). The cutting waste container 5 supports the first chuck table 31a and the second chuck table 31b, respectively, and one side (outer side) is cantilevered on the first moving base 33a and the second moving base 33b. Since the first guide rails 411a and 411a and the second guide rails 411b and 411b are disposed below the first support table 32a and the second support table 32b to be used, The cutting waste and cutting water including the end material scattered in the cutting step and the second cutting step surely fall into the cutting waste storage container 5. Therefore, the moving means of the first moving means 42a and the second cutting feed means 4b of the first cutting feed means 4a for moving the first moving base 33a and the second moving base 33b in the cutting feed direction X. The cutting waste and cutting water including the mill ends do not fall on 42b. For this reason, it is not necessary to provide a bellows mechanism that covers the moving mechanism for reciprocating the chuck table as in the conventional cutting apparatus. In the illustrated embodiment, the first support table 32a and the second support table 32b for supporting the first chuck table 31a and the second chuck table 31b, respectively, have a first moving base on one side (outside). Since the table 33a and the second moving base 33b are cantilevered, the cutting waste container 5 can be disposed below the first support table 32a and the second support table 32b. Therefore, in a so-called two-spindle type cutting machine in which the cutting blade 933 of the first cutting means 9a and the cutting blade 933 of the second cutting means 9b are arranged to face each other, an index feed orthogonal to the cutting feed direction X is performed. The cutting waste container 5 can be disposed without increasing the dimension of Y. In the illustrated embodiment, the first moving base 33a and the second moving base 33b cantilever support one side (outside) of the first support table 32a and the second support table 32b, respectively. Support portions 331 and 331 and supported portions 332 and 332 that horizontally protrude from the lower ends of the support portions 331 and 331 toward the other side (inner side), respectively, so that the first chuck table mechanism 3a And the dimension of the index feed Y that is orthogonal to the cutting feed direction X of the second chuck table mechanism 3b does not increase.

  As described above, the example in which the present invention is applied to a so-called two-spindle type cutting apparatus in which the cutting blade 933 of the first cutting means 9a and the cutting blade 933 of the second cutting means 9b are arranged to face each other has been shown. The present invention can be applied to a commonly used cutting apparatus including one chuck table and one cutting means.

The principal part perspective view of the cutting device comprised according to this invention. The perspective view which shows the state which removed the cutting waste container and the cutting waste conveyance means in the cutting apparatus shown in FIG. The perspective view of the cutting waste container and the cutting waste conveyance means which comprise the cutting apparatus shown in FIG. The principal part front view of the cutting device shown in FIG. FIG. 2 is a cross-sectional view taken along line AA in FIG. The perspective view which shows the cutting means of the cutting device shown in FIG.

Explanation of symbols

2: stationary base 3a: first chuck table mechanism 3b: second chuck table mechanism 31a: first chuck table 31b: second chuck table 32a: first support table 32b: second support table 33a : First moving base 34b: second moving base 4a: first cutting feed means 4b: second cutting feed means 41a: first guide means 41b: second guide means 42a: first Moving means 42b: Second moving means 5: Cutting waste container 6: Cutting waste conveying means 8a: First alignment means 8b: Second alignment means 9a: First cutting means 9b: Second cutting means

Claims (4)

A chuck table mechanism having a chuck table for holding a workpiece, a cutting means for cutting the workpiece held on the chuck table, and a cutting feed means for moving the chuck table in the cutting feed direction. In the cutting device to
The chuck table mechanism includes a support table that supports the chuck table, and a movable base that cantileverally supports one side of the support table,
The cutting feed means comprises guide means for guiding the movable base so as to be movable in the cutting feed direction, and moving means for moving the movable base along the guide means,
A cutting waste container having a receiving opening disposed along the guide means on the lower side of the support table and receiving cutting waste and cutting water;
The cutting device characterized by the above.   The movable base includes a support portion that cantileverally supports one side of the support table, and a supported portion that protrudes horizontally from the lower end of the support portion toward the other side. The cutting device according to claim 1, wherein the cutting device is guided along the guide means.   A discharge opening is provided in the bottom wall of the cutting waste container, and cutting waste transporting means for transporting the cutting waste discharged from the discharge opening is disposed below the cutting waste storage container. The cutting device according to claim 1 or 2.   The chuck table mechanism includes the first chuck table mechanism and the second chuck table mechanism, and the cutting feed means is arranged in parallel in the same plane and the first chuck table mechanism and the second chuck table mechanism. The chuck table mechanism includes a first cutting feed means and a second cutting feed means for moving the chuck table mechanism in the cutting feed direction, respectively. The moving base constituting the first cutting feed means and the second cutting feed Each of the movable bases constituting the feed means supports the outside of the support table in a cantilevered manner, and the cutting waste container includes the support table constituting the first cutting feed means and the first cutting feed means. The cutting device according to any one of claims 1 to 3, wherein the cutting device is disposed below the supporting table.

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