JP2009081012A - Field emission display element and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an FED provided with a reinforcing plate on a rear face of a cathode substrate, without increasing the number of baking times of the cathode substrate at a sealing process using a conventional sealing method excellent in mass productivity. <P>SOLUTION: For the field emission display element firmly fixing a reinforcing plate with a second sealing part on a rear face of the cathode substrate, at least either a length or a width of the reinforcing plate is to be shorter than a length or a width of an outer size of a first sealing part. In such a structure, after the cathode substrate and an anode substrate are positioned, the both are temporarily fixed with a clip member used in a conventional technology, and further, the cathode substrate and the anode substrate are temporarily fixed to the reinforcing plate with another clip member, finally to seal them. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a planar field emission display device using a cold cathode as an electron source and a method for manufacturing the field emission display device.

2. Description of the Related Art In recent years, thin display devices have been made in which a pair of glass substrates and the like are arranged to face each other to create a flat vacuum-tight space, and various display devices are installed in the space.
For example, an element serving as a display device includes a field emission display element (FED) including a fine cold cathode field emission cathode that emits electrons when an electric field is applied and a phosphor that emits light when the emitted electrons collide. There are a plasma display (PDP) or the like in which a large number of plasma discharge elements provided in a vacuum vessel are used as display pixels and each display pixel is driven to emit light in response to a video signal to display an image or the like.
Examples of FED are Spindt type using cone emitter, metal / insulating layer / metal type (MIM type), surface conduction type (SED), BSD type applying ballistic electron emission phenomenon, CNT type using carbon nanotubes Etc.

  In an FED, a high vacuum is applied between an anode substrate and a cathode substrate, and a spacer is generally provided between the substrates in order to withstand atmospheric pressure. However, in an FED with extremely high definition, the presence of the spacer hinders display, and thus the spacer may not be provided. In addition, there is a case where it is desired to reduce the number of use in one panel because the spacer processed with high precision to prevent charging is expensive.

  In such a case, it is conceivable to increase the thickness of the glass substrate used for the anode substrate and the cathode substrate. However, so-called thin film devices similar to semiconductor manufacturing are used for film formation and patterning for manufacturing the cathode substrate. If the thickness of the substrate is increased, it becomes difficult to control the temperature of the substrate during the process, resulting in deterioration of the quality of the film, and the mass of the substrate is increased, making it difficult to handle the substrate.

Therefore, a technique for manufacturing a display element by reducing the thickness of the cathode substrate as in the past and attaching a reinforcing plate to the back surface of the cathode substrate is known (Patent Document 1).
FIG. 6 shows a cross-sectional view of a display element using the electron-emitting device described in Patent Document 1. The display device includes a back plate (cathode substrate) 102 on which an electron-emitting device group 101 of surface conduction electron-emitting devices is mounted, a front plate (anode substrate) 104 disposed opposite to the back plate 102, a front plate 104, and a back plate. 102 and a support frame 105 that supports the periphery of the front plate 104 and the back plate 102 so as to surround the electron-emitting device group, and a joint between the front plate 104, the back plate 102, and the support frame 105 is a frit glass. It is fixed by 106. Further, a reinforcing plate 107 that reinforces the back plate 102 with a frit glass 106 is fixed to the back plate 102.

  7A to 7F show an example of a method for manufacturing a display element in Patent Document 1. FIG. First, the frit glass 106 is applied to the joint surface between the front plate 104 and the support frame 105 and assembled, and then fired at 410 ° C. in a furnace (FIG. 7A) to fix the support frame 105 to the front plate 104 ( FIG. 7B).

Next, after the frit glass 106 is applied to the joint surface between the support frame 105 and the back plate 102 and assembled, firing is performed in a furnace at 410 ° C. (FIG. 7C), and the back plate 102 is fixed to the support frame 105. (FIG. 7 (d)). Further, after the frit glass 106 is applied to the joint surface between the back plate 102 and the reinforcing plate 107 and assembled, firing is performed in a furnace at 410 ° C. (FIG. 7E), and the reinforcing plate 107 is fixed to the back plate 102 ( FIG. 7 (f)). Then, in order to make the inside of the element hermetically bonded in the above process into a vacuum state, a vacuum is drawn by an exhaust pipe (not shown) provided on a support frame or the like, and then the exhaust pipe is sealed to obtain a display element.
Japanese Patent Laid-Open No. 7-302559

The performance of the FED provided with the reinforcing plate has matters to be considered in view of the electron emission capability and the positional deviation between the anode substrate and the cathode substrate in relation to the sealing process. These will be described below.
First, regarding the electron emission capability, it is known that the cathode of the FED tends to deteriorate as the firing is repeated. In particular, in the case of Spindt type, MIM type, BSD type, etc., in which the electron emission source is a metal, there is a strong tendency that the metal surface of the electron emission source is altered by oxidation or the like and the electron emission capability is deteriorated by firing the cathode substrate. Therefore, it is desirable that the cathode substrate firing process is performed as much as possible once in the process until the display element is completed. (In Patent Document 1, fixing with the support frame and fixing with the reinforcing plate are performed twice.)

  Although not mentioned in Patent Document 1, the frit glass used for vacuum sealing is a powdery low melting point glass. When used for manufacturing a display element, it is dispersed in an organic solvent, a binder or the like to form a paste and then applied to a predetermined portion of the member. Then, the paste is heated and fired in the atmosphere to a melting point or higher to remove the solvent and binder to form a glass layer (hereinafter, this state is referred to as “low softening point glass layer”), and then the low softening point. A member provided with a glass layer is combined with other members and fired and melted to fix a plurality of members in an airtight manner.

  In order to perform the firing process during the sealing of the cathode substrate with the FED using the reinforcing plate once, it is necessary to provide the low softening point glass layer on the anode substrate and the reinforcing plate. It is desirable that the anode substrate, the reinforcing plate and the cathode substrate are stacked and sealed.

  Next, positional deviation will be described. In the sealing step, the substrate is loaded so that the low softening point glass layer is in close contact with the facing substrate. The load is often applied by placing a weight on a horizontally stacked substrate or sandwiching each stacked substrate with a clip member using a heat-resistant leaf spring. At this time, the positions of the two substrates may be relatively displaced while the low softening point glass layer is melted due to a poor load balance or variations in the height of the low softening point glass layer.

In the FED, the phosphor pattern on the anode substrate and the electron source on the cathode substrate correspond one-to-one. When the relative position of the two deviates from the predetermined position, electrons emitted from the electron source do not reach the predetermined position of the phosphor pattern, and the light emitting dots are missing, or red (R), green (G), blue In the case of the color type having the phosphor of (B), a fatal problem of causing a mixture of emission colors is caused.
For example, in a small FED, the pixel pitch is about 200 to 300 μm. If the anode substrate and the cathode substrate are relatively displaced from each other by about 30 μm, the above-described problem occurs.

  Here, when the anode substrate, the cathode substrate, and the reinforcing substrate are stacked and loaded and sealed, there are two low-softening point glass layers that melt during the sealing, so that the displacement between the anode substrate and the cathode substrate is promoted. There's a problem.

  Therefore, the present invention is based on the premise that the conventional sealing method with excellent mass productivity is not greatly changed, and without increasing the number of times the cathode substrate is baked in the sealing step, and increasing the positional deviation between the anode substrate and the cathode substrate. It is an object to provide an FED in which a reinforcing plate is provided on the back surface of a cathode substrate while suppressing the above, and to provide a manufacturing method thereof.

A field emission display device according to the present invention includes an anode substrate provided with an anode electrode coated with a phosphor, a cathode substrate provided with a plurality of cathode portions for emitting electrons, and the anode substrate and the cathode substrate. And a first seal portion that hermetically seals the outer peripheral edge of the display area to which the phosphor is applied, and an electric field that fixes the reinforcing plate to the back surface of the cathode substrate with the second seal portion. In an emission display element,
At least one of the length or width of the reinforcing plate is shorter than the length or width of the outer shape of the first seal, and from the outer end of the length or width of the first seal to the substrate end of the reinforcing plate. The distance is greater than or equal to the seal width of the first seal at both ends of the reinforcing plate.

A field emission display device according to the present invention includes an anode substrate provided with an anode electrode coated with a phosphor, a cathode substrate provided with a plurality of cathode portions for emitting electrons, and the anode substrate and the cathode substrate. And a first seal portion that hermetically seals the outer peripheral edge of the display area to which the phosphor is applied, and an electric field that fixes the reinforcing plate to the back surface of the cathode substrate with the second seal portion. In an emission display element,
At least one of the length or width of the reinforcing plate has at least a pair of notches shorter than the length or width of the outer shape of the first seal.

  In the field emission display device according to the present invention, the distance from the outer end of the length or width of the first seal to the substrate end of the reinforcing plate is 1 of the sealing width of the first seal at both ends of the reinforcing plate. It is characterized by being not less than 3 times and not more than 3 times.

  In the field emission display device according to the present invention, the distance from the outer end of the length or width of the first seal to the notch end of the reinforcing plate is equal to the seal width of the first seal at both ends of the reinforcing plate. 1 to 3 times or less.

  The field emission display device according to the present invention is characterized in that the second seal portion has a frame-like pattern provided on an outer peripheral edge of the reinforcing plate.

  The field emission display device according to the present invention is characterized in that the second seal portion is provided with a plurality of stripe patterns inside the frame pattern.

  The field emission display device according to the present invention is characterized in that the second seal portion includes a spacer that does not substantially soften at a sealing temperature of the field emission display device.

  The field emission display device manufacturing method according to the present invention includes a step of applying the first seal to the anode substrate and pre-baking, and a step of applying the second seal to the reinforcing substrate and pre-baking. A step of aligning the anode substrate and the cathode substrate and temporarily fixing them by elastic holding means; a step of temporarily fixing the anode substrate, the cathode substrate and the reinforcing substrate; and the anode substrate, the cathode substrate and the It has the process of sealing a reinforcement board | substrate collectively.

  According to the present invention, a conventional sealing method excellent in mass productivity is used to increase the number of times the cathode substrate is fired in the sealing step, and to suppress an increase in misalignment between the anode substrate and the cathode substrate. There is an effect that an FED having a reinforcing plate on the back surface of the substrate can be obtained.

Embodiments of the present invention will be described with reference to the drawings. 1A is a top view of the FED 1 according to the present invention, FIG. 1B is an end view of the XX section in the top view, and FIG. 1C is a bottom view of the FED 1. FIG. Is.
In this figure, a Spindt type electron-emitting device group 12 is formed on the surface of the cathode substrate 11. The electron-emitting device group 12 is a set of electron-emitting device units that are units of electron emission provided at intersections of gate electrodes and cathode electrodes (both not shown).

  An anode substrate 13 is provided for forming an airtight container facing the cathode substrate 11. An anode electrode 14 is provided on the surface of the anode substrate 13 facing the cathode substrate 11, and a phosphor pattern 15 is formed on the anode electrode 14. Since the phosphor pattern 15 emits light upon receiving electrons emitted from the electron-emitting device, the electron emission unit is provided corresponding to each phosphor pattern 15. Here, the phosphor pattern 15 is formed, and a region contributing to display is defined as a display region 16.

Between the cathode substrate 11 and the anode substrate 13, there is provided a first seal portion 19 that holds both substrates at a predetermined interval and hermetically seals the outer peripheral edge of the display region 16 (in the following, unless there is a risk of confusion) "Seal part 19"). Here, the provision of the seal portion on the outer peripheral edge of the display area is not only in the case where the inner periphery of the seal portion 19 is close to the display region 16 in FIG. This also means that the seal portion 19 is provided so that the inner periphery of the portion 19 has a predetermined distance from the display area 16.
In FIG. 1A, the outer portions of the seal portion 19 of the cathode substrate 11 and the anode substrate 13 constitute a gate electrode, a cathode electrode, and a terminal portion of the anode electrode 14 (not shown).

  Outside the display area 16 of the anode substrate 13, an exhaust hole 17 for exhausting gas in an airtight container composed of the cathode substrate 11, the anode substrate 13, and the seal portion 19 is provided. The exhaust hole 17 is airtight after the exhaust is completed. It is sealed with an exhaust lid 18 that is kept at a low level.

  A reinforcing plate 20 for supplementing the strength of the cathode substrate 11 is fixed to the back surface of the cathode substrate 11 on which the electron-emitting device group 12 is provided by a second seal portion 21. The reinforcing plate 20 is for preventing the cathode substrate 11 from being broken at atmospheric pressure after the cathode substrate 11 becomes a part of the hermetic container. Therefore, the shape of the reinforcing plate 20 is defined by the relationship with the first seal portion 19 that forms the side wall of the hermetic container.

  In FIG. 1, the outer shape of the reinforcing plate 20 has the same width as the outer shape of the seal portion 19 in the short side direction, and is smaller (shorter) than the outer shape of the seal portion 19 in the long side direction. Here, if the distance from the outer shape of the seal portion 19 in the long side direction to the end portion of the reinforcing plate 20 is the A dimension as the difference in length between the two, the A dimension is the both ends of the seal portion 19 at both ends in the long side direction. It is almost equal to the width.

Thus, by providing the area | region with predetermined A dimension, after aligning the cathode substrate 11 and the anode substrate 13, both can be temporarily fixed using a clip member similarly to a prior art. Furthermore, the cathode substrate 11, the anode substrate 13, and the reinforcing plate 20 can be sealed after being temporarily fixed by another clip member. Thus, it is possible to obtain a field emission display element in which a reinforcing plate is provided on the back surface of the cathode substrate while suppressing an increase in positional deviation between the anode substrate and the cathode substrate without increasing the number of times of firing the cathode substrate in the sealing step.
Here, since the reinforcing plate 20 is sealed in a state where two layers of the low softening point glass layers to be melted are sandwiched, there is a possibility that the deviation becomes large. However, even if the 300 μm reinforcing plate 20 which is 10 times larger than the 30 μm where the positional deviation between the anode substrate and the cathode substrate becomes a problem, the strength of the panel is not affected and there is no problem.

Considering the mechanical stability when the cathode substrate 11 and the anode substrate 13 are clamped by the clip member, the seal width is necessary when the panel is completed, and the longer one is more stable. For example, in the dimension A on the left side of FIG. 1B, this dimension is strictly the dimension from the end of the anode substrate, but when the FED is completed, the outline of the substrate end and the seal portion 19 are substantially the same. Therefore, the outer shape of the seal portion 19 is defined as a reference.
On the other hand, when this dimension is increased, the reinforcing plate is reduced and the pressure resistance of the FED is reduced. Strictly speaking, the pressure resistance is affected by the thickness of each substrate, the position at which the substrate is fixed, and the fixing strength of the seal portion, but when tested for a commonly used cathode substrate thickness of 0.7 mm to 1.8 mm, A There was no problem with the withstand voltage if the portion was in the range of 1 to 3 times the width of the seal portion 19. Therefore, it is preferable that the dimension A is 1 to 3 times the width of the seal portion 19.

The thickness of each substrate is the smallest in the cathode substrate 11, and increases in the order of the reinforcing plate 20 and the anode substrate 13. The total thickness of the cathode substrate 11 and the reinforcing plate 20 is equal to or greater than that of the anode substrate 13. The anode substrate, the cathode substrate and the reinforcing plate can be made of different materials, but the same material is preferable in consideration of thermal expansion.
In FIG. 1, the second seal portion 21 has a stripe shape and is provided in five locations in the long side direction in parallel with the short side of the reinforcing plate 20. The material of the second seal portion 21 is also a low softening point glass, and it is preferable to use the same material as the first seal portion 19.

In addition, you may make it the sealing part 19 be comprised from a support frame and low softening point glass similarly to a prior art. In this embodiment, the case where no spacer is provided in the display region 16 between the cathode substrate 11 and the anode substrate 13 is shown, but a spacer may be provided in this portion.
In this embodiment, the case where each substrate and the seal shape are rectangular is shown. However, even if each substrate and the seal shape are trapezoidal, parallelogram, etc., from the outer end of the seal portion 19 to the end of the reinforcing plate 20 Two portions having the dimension A may be provided symmetrically with respect to the center of the first seal portion 19.

  Next, in the manufacturing process of the field emission display element of the present invention, the sealing and exhausting process from the temporary fixing of the substrate will be described with reference to FIG. First, an anode electrode 14 and a phosphor pattern 15 were provided using a high strain point glass substrate having a width of 48 mm, a length of 105 mm, and a thickness of 2.4 mm as the anode substrate 13. The phosphor pattern 15 was a monocolor having a square of 240 μm and a pitch of 300 μm. On this substrate, 10 wt% of φ0.6 mm ceramic beads are mixed in a paste of low softening point glass (Nippon Denki Glass BF103) and applied in a rectangular shape, and air-fired at a peak temperature of 480 ° C. to form a rectangular frame. A low softening point glass layer 19 'was provided. The low softening point glass layer had a width of 2 mm and a height of 1 mm (FIG. 2A).

  Here, ceramic beads are used as spacers, but beads made of materials such as glass and zirconia may be used as long as they do not soften at the FED sealing temperature. The shape of the spacer is not limited to beads, and may be a cylinder or a prism. Further, when providing a spacer in the display area 16, it is not necessary to mix the spacer into the seal paste.

  The reinforcing plate 20 was a high strain point glass substrate having a width of 48 mm, a length of 88 mm, and a thickness of 1.8 mm. A paste of low softening point glass (BF103 manufactured by Nippon Electric Glass) was applied in a stripe shape on this substrate, and was subjected to atmospheric firing (temporary firing) at a peak temperature of 480 ° C. to provide a striped low softening point glass layer 21 ′. . The low softening point glass layer had a width of 4 mm, a length of 45 mm, and a height of 1 mm (FIG. 2B).

  The cathode substrate 11 was a low alkali glass substrate having a width of 56 mm, a length of 108 mm, and a thickness of 1.1 mm, and the electron-emitting device group 12 was provided on the substrate in correspondence with the phosphor pattern 15. Then, in a state where the anode substrate 13 and the cathode substrate 11 were precisely aligned, they were temporarily fixed using a clip member (elastic holding means) 30 using a heat-resistant leaf spring. The clip member 30 sandwiches a portion of the cathode substrate 11 that is not covered with the reinforcing plate 20 and a portion of the anode substrate 13 corresponding to the portion (FIG. 2C).

  In this state, the reinforcing plate 20 provided with the low softening point glass layer was placed on the cathode substrate 11 and temporarily fixed using the same clip member as described above. The clip member sandwiched the anode substrate 13 and the reinforcing plate 20. In FIG. 2C, the clip member is not shown, and the load applied by the clip member is indicated by an arrow. Instead of the clip member, the anode substrate 13, the cathode substrate 11, and the reinforcing plate 20 may be stacked and a weight may be put on and loaded. The elastic holding member may use a coil spring.

  What was temporarily fixed in this way was set in a vacuum chamber. The vacuum chamber has a heating means, and can heat the stored articles. First, the temperature in the chamber was raised to 450 ° C. in an inert gas atmosphere and held for 30 minutes. 450 ° C is the recommended operating temperature for frit glass. (Recommended working temperature and softening temperature differ depending on the components of the frit glass to be specified.) As a result, a low softening point glass layer was melted, a reinforcing plate was fixed, and an airtight container with a sealed portion was completed.

  Thereafter, the inside of the chamber was evacuated with a pump, and the inside of the envelope was evacuated. During this evacuation process, the inside of the chamber was kept heated at 350 ° C. After 90 minutes, the exhaust lid set at a distance from the airtight container in the chamber was heated by an independent heating means. A glass layer having a low softening point was previously formed on the exhaust lid and melted by this heating. In this state, the exhaust lid 18 was brought into contact with the anode substrate 13 so as to cover the exhaust hole 17. Then, it cooled and took out from the chamber and completed FED (FIG.2 (d)).

In a state where the FED is completed, the first seal portion composed of the low softening point glass layer provided on the anode substrate 13 has an outer width of 48 mm, a length of 100 mm, a seal width of 3 mm, and a height of 0.6 mm. It was. In the present embodiment, since the length of the reinforcing plate 20 is 88 mm, the dimension A is (100−88) / 2 = 6 mm.
In the present embodiment, the width of the second seal layer made of the low softening point glass layer provided on the reinforcing substrate 20 is 8 mm and the height is 0.3 mm.

  The example which changed the pattern shape of the 2nd seal | sticker part as an Example of this invention is shown. FIG. 3A shows a back view of the FED according to the first embodiment of the present invention. Except for the second seal portion 211, the embodiment is the same as the embodiment shown in FIG. 3A shows the anode substrate 13, the cathode substrate 11, the second seal portion 211, and the reinforcing plate 20, and the other illustrations are omitted.

  In the embodiment shown in FIG. 1C, the second seal portion 21 has five stripes, but in Example 1, the second seal portion 211 is a frame-like pattern provided on the outer peripheral edge of the reinforcing plate 20. It is said. The thickness of the second seal portion 211 and the width of the frame are the same as those of the second seal portion 21 in FIG. The space formed by the cathode substrate 11, the reinforcing plate 20, and the second seal portion 211 is airtight.

  In the embodiment shown in FIG. 1, atmospheric pressure is directly applied to the cathode substrate 11, but by configuring the second seal portion as shown in FIG. 3A, the inner side of the frame-like second seal portion 211 is arranged. No atmospheric pressure is applied to the cathode substrate 11, and the cathode substrate 11 and the reinforcing plate 20 are integrated to receive atmospheric pressure. Therefore, in Example 1, the effect of the reinforcing plate 20 is larger than that in the embodiment of FIG. 1, and the effect of increasing the pressure resistance of the field emission device is obtained.

  As an embodiment of the present invention, another example in which the pattern shape of the second seal portion is changed is shown. FIG. 3B is a back view of the FED according to the second embodiment of the present invention. Except for the second seal portion 212, the embodiment is the same as the embodiment shown in FIG. FIG. 3B shows the anode substrate 13, the cathode substrate 11, the second seal portion 212, and the reinforcing plate 20, and the other illustrations are omitted.

In the second embodiment, the second seal portion 212 has a combination of a frame-like pattern and a stripe-like pattern provided on the outer peripheral edge of the reinforcing plate. Since the fixing area of the cathode substrate 11 and the reinforcing plate 20 is larger than that of the first embodiment, the fixing of both is stabilized. Further, since the amount of the second seal portion 212 is smaller than the case where the entire surface is fixed, the gas emission during sealing is small.
The pattern shape of the second seal portion may be the shape shown in FIG.

  FIG. 4 shows an example in which a part of a rectangular reinforcing plate is cut out in a concave shape as an embodiment of the present invention. FIG. 4B shows a rear view of the FED, and FIG. 4A shows an end view (a cross-sectional view of the reinforcing plate 201) taken along the line Y-Y in FIG. 4B. In the embodiment of FIG. 1, the reinforcing plate 201 has the same dimensions as the outer shape of the first seal portion 19, and the cathode substrate 11 is cut out in a concave shape only at the portion where the clip member is actually sandwiched. Here, the dimension A is shown from the outer end of the seal portion 19 to the end face (notch end) of the concave notch. The width of the cutout may be a width that does not interfere with the clip member. With this configuration, the fixing area between the cathode substrate 11 and the reinforcing plate 20 can be increased, and the pressure resistance can be further improved.

In this case, as the shape of the second seal portion 214, a stripe shape, a frame shape along the outer peripheral edge of the reinforcing plate 201, a shape combining them, or the like can be used as in the above embodiment.
In FIG. 4, two concave cutouts are provided. However, this is not limited to two. If the anode substrate 13 and the cathode substrate 11 are large, they can be temporarily fixed with more elastic holding members 4. You may provide a place, six places, etc. The concave notch of the reinforcing plate 20 can be provided by laser cutting, cutting, or the like.

  FIG. 5 shows an example in which a spacer 22 that does not soften at the sealing temperature is mixed in the second seal portion as an embodiment of the present invention. In this embodiment, φ0.2 mm alumina beads were used as spacers. The second seal portion is formed by mixing 5 wt% alumina beads into the frit glass constituting the second seal portion.

  As a result, it is possible to prevent occurrence of defects such as the second seal portion being extremely crushed due to variations in the load of the clip member and the seal sticking out of the reinforcing plate 20. Here, ceramic beads are used as spacers, but beads made of materials such as glass and zirconia may be used as long as they do not soften at the FED sealing temperature. The shape of the spacer is not limited to beads, and may be a cylinder or a prism.

It is a figure for demonstrating the structure of embodiment of the field emission display element of this invention. It is a figure for demonstrating the manufacturing process of embodiment of the field emission display element of this invention. It is a figure for demonstrating the structure of Example 1, 2 of the field emission display element of this invention. It is a figure for demonstrating the structure of Example 3 of the field emission display element of this invention. It is a figure for demonstrating the structure of Example 4 of the field emission display element of this invention. It is a figure for demonstrating the structure of the conventional field emission display element. It is a figure for demonstrating the manufacturing process of the conventional field emission display element.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Field emission display element 11 Cathode substrate 12 Electron emission element group 13 Anode substrate 14 Anode electrode 15 Phosphor pattern 16 Display area 17 Exhaust hole 18 Exhaust lid 19 First seal part 20 Reinforcement plate 21 Second seal part 30 Clip member 101 Electron Emitting Element Group 102 Back Plate 103 Image Forming Member 104 Front Plate 105 Support Frame 106 Frit Glass

Claims (8)

An anode substrate provided with an anode electrode coated with a phosphor;
A cathode substrate provided with a plurality of cathode portions for emitting electrons;
A first sealing portion that holds the anode substrate and the cathode substrate at a predetermined interval and hermetically seals an outer peripheral edge of a display region to which the phosphor is deposited;
In a field emission display element in which a reinforcing plate is fixed to the back surface of the cathode substrate with a second seal portion,
At least one of the length or width of the reinforcing plate is shorter than the length or width of the outer shape of the first seal, and from the outer end of the length or width of the first seal to the substrate end of the reinforcing plate. A field emission display element, wherein a distance is equal to or greater than a seal width of the first seal at both ends of the reinforcing plate. An anode substrate provided with an anode electrode coated with a phosphor;
A cathode substrate provided with a plurality of cathode portions for emitting electrons;
A first sealing portion that holds the anode substrate and the cathode substrate at a predetermined interval and hermetically seals an outer peripheral edge of a display region to which the phosphor is deposited;
In a field emission display element in which a reinforcing plate is fixed to the back surface of the cathode substrate with a second seal portion,
A field emission display element comprising at least one pair of notches shorter than the length or width of the outer shape of the first seal in at least one of the length and width of the reinforcing plate.   The distance from the outer end of the length or width of the first seal to the substrate end of the reinforcing plate is 1 to 3 times the sealing width of the first seal at both ends of the reinforcing plate. The field emission display device according to claim 1.   The distance from the outer end of the length or width of the first seal to the cutout end of the reinforcing plate is 1 to 3 times the sealing width of the first seal at both ends of the reinforcing plate. The field emission display device according to claim 2, wherein   5. The field emission display device according to claim 1, wherein the fifth seal portion has a frame-shaped pattern provided on an outer peripheral edge of the reinforcing plate. 6.   6. The field emission display device according to claim 5, wherein the second seal portion is provided with a plurality of stripe patterns inside the frame pattern.   7. The field emission display device according to claim 1, wherein the second seal part includes a spacer that does not substantially soften at a sealing temperature of the field emission display device. A method for manufacturing a field emission display element, comprising:
Applying the first seal to the anode substrate and pre-baking;
Applying the second seal to the reinforcing substrate and pre-baking;
Aligning the anode substrate and the cathode substrate and temporarily fixing them by elastic holding means;
Temporarily fixing the anode substrate, the cathode substrate and the reinforcing substrate;
A method of manufacturing a field emission display device, comprising: sealing the anode substrate, the cathode substrate, and the reinforcing substrate together.

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