JP2009063380A5 - - Google Patents
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- JP2009063380A5 JP2009063380A5 JP2007230657A JP2007230657A JP2009063380A5 JP 2009063380 A5 JP2009063380 A5 JP 2009063380A5 JP 2007230657 A JP2007230657 A JP 2007230657A JP 2007230657 A JP2007230657 A JP 2007230657A JP 2009063380 A5 JP2009063380 A5 JP 2009063380A5
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- electronic component
- temperature
- heat conducting
- evaporator
- conducting member
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- 238000007689 inspection Methods 0.000 claims 5
- 239000003507 refrigerant Substances 0.000 claims 4
- 238000001816 cooling Methods 0.000 claims 3
- 238000001704 evaporation Methods 0.000 claims 3
- 230000020169 heat generation Effects 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 3
- 238000000926 separation method Methods 0.000 claims 3
- 238000005259 measurement Methods 0.000 claims 2
Claims (16)
検査用ソケットに配置された電子部品を前記熱伝導部材の下面にて押圧して、該電子部品に当接した前記熱伝導部材の温度を、所定の目標温度と温度センサから取得した該電子部品の温度とに基づいて、前記蒸発器の接離位置と前記ヒータの発熱温度を調整し該熱伝導部材の温度を前記電子部品に伝達して該電子部品を前記目標温度にする電子部品の温度制御方法であって、
前記目標温度よりも前記電子部品の温度が低いことを検出したとき、前記蒸発器を前記熱伝導部材に接触させるピストンロッドの力を、前記蒸発器を前記熱伝導部材から離間させる力よりも弱くして、前記蒸発器と前記熱伝導部材とを離間させてから、前記ヒータへ電力を供給して前記電子部品を加熱することを特徴とする電子部品の温度制御方法。 An evaporator that is cooled by evaporation of the refrigerant disposed so as to be able to come into contact with and separate from the upper surface of the heat conducting member is provided, and a heater that is in contact with the heat conducting member and generates heat by electric power is provided,
The electronic component placed in the inspection socket is pressed on the lower surface of the heat conducting member, and the temperature of the heat conducting member in contact with the electronic component is acquired from a predetermined target temperature and a temperature sensor. The temperature of the electronic component that adjusts the contact / separation position of the evaporator and the heat generation temperature of the heater based on the temperature of the evaporator and transmits the temperature of the heat conducting member to the electronic component to make the electronic component the target temperature A control method,
When it is detected that the temperature of the electronic component is lower than the target temperature, the force of the piston rod that brings the evaporator into contact with the heat conducting member is weaker than the force that separates the evaporator from the heat conducting member. Then, after the evaporator and the heat conducting member are separated from each other, the electronic component is heated by supplying electric power to the heater.
検査用ソケットに配置された電子部品を前記熱伝導部材の下面にて押圧して、該電子部品に当接した前記熱伝導部材の温度を、所定の目標温度と温度センサから取得した該電子部品の温度とに基づいて、前記蒸発器の接離位置と前記ヒータの発熱温度を調整し該熱伝導部材の温度を前記電子部品に伝達して該電子部品を前記目標温度にする電子部品の温度制御方法であって、
前記目標温度よりも前記電子部品の温度が高いことを検出したとき、前記ヒータへの電力の供給を停止してから、前記蒸発器を前記熱伝導部材の上面に結合させるピストンロッドの力を、前記蒸発器を前記熱伝導部材と離間させる力よりも強くして、前記蒸発器を前記熱伝導部材に接触させて該電子部品を冷却することを特徴とする電子部品の温度制御方法。 An evaporator that is cooled by evaporation of the refrigerant disposed so as to be able to come into contact with and separate from the upper surface of the heat conducting member is provided, and a heater that is in contact with the heat conducting member and generates heat by electric power is provided,
The electronic component placed in the inspection socket is pressed on the lower surface of the heat conducting member, and the temperature of the heat conducting member in contact with the electronic component is acquired from a predetermined target temperature and a temperature sensor. The temperature of the electronic component that adjusts the contact / separation position of the evaporator and the heat generation temperature of the heater based on the temperature of the evaporator and transmits the temperature of the heat conducting member to the electronic component to bring the electronic component to the target temperature. A control method,
When detecting that the temperature of the electronic component is higher than the target temperature, after stopping the supply of power to the heater, the force of the piston rod that couples the evaporator to the upper surface of the heat conducting member, A temperature control method for an electronic component, wherein the electronic component is cooled by making the evaporator stronger than a force for separating the evaporator from the heat conductive member and bringing the evaporator into contact with the heat conductive member.
前記蒸発器を前記熱伝導部材に接触させる時には、前記蒸発器を前記冷媒により冷却しておくことを特徴とする電子部品の温度制御方法。 In the electronic component temperature control method according to claim 2,
An electronic component temperature control method, wherein when the evaporator is brought into contact with the heat conducting member, the evaporator is cooled by the refrigerant.
検査用ソケットに配置された電子部品を前記熱伝導部材の下面にて押圧して、該電子部品に当接した前記熱伝導部材の温度を、所定の目標温度と温度センサから取得した該電子部品の温度とに基づいて、前記蒸発器の接離位置と前記ヒータの発熱温度を調整し該熱伝導部材の温度を前記電子部品に伝達して該電子部品を前記目標温度にする電子部品の温度制御装置であって、
前記熱伝導部材と前記蒸発器との間にそれらを離間させる第１の空気圧を供給する第１の空気圧回路と、
前記蒸発器を前記熱伝導部材に対して接離可能に駆動するピストンロッドと、
前記ピストンロッドのキャップ側に該ピストンロッドにて前記蒸発器を第１の空気圧に抗して前記熱伝導部材と接触させる第２の空気圧を供給する第２の空気圧回路と、
を備えていることを特徴とする電子部品の温度制御装置。 An evaporator that is cooled by evaporation of the refrigerant disposed so as to be able to come into contact with and separate from the upper surface of the heat conducting member is provided, and a heater that is in contact with the heat conducting member and generates heat by electric power is provided,
The electronic component placed in the inspection socket is pressed on the lower surface of the heat conducting member, and the temperature of the heat conducting member in contact with the electronic component is acquired from a predetermined target temperature and a temperature sensor. The temperature of the electronic component that adjusts the contact / separation position of the evaporator and the heat generation temperature of the heater based on the temperature of the evaporator and transmits the temperature of the heat conducting member to the electronic component to bring the electronic component to the target temperature. A control device,
A first pneumatic circuit for supplying a first air pressure between the heat conducting member and the evaporator to separate them;
A piston rod that drives the evaporator to be in contact with and away from the heat conducting member;
A second pneumatic circuit for supplying a second air pressure to contact the heat conducting member against the first air pressure at the piston rod on the cap side of the piston rod;
An electronic component temperature control apparatus comprising:
前記蒸発器の周囲には、該蒸発器を外部から断熱するための断熱筒を備えたことを特徴とする電子部品の温度制御装置。 In the temperature control apparatus of the electronic component of Claim 4,
An electronic component temperature control device comprising a heat insulating cylinder for insulating the evaporator from the outside around the evaporator.
前記ヒータは、前記熱伝導部材の内部に配置されることを特徴とする電子部品の温度制御装置。 In the temperature control apparatus of the electronic component of Claim 4 or 5,
The temperature control device for an electronic component, wherein the heater is disposed inside the heat conducting member.
前記熱伝導部材は、前記蒸発器に対向する熱伝導ブロックと、前記電子部品に対向する対物ブロックとからなり、
前記ヒータは、前記熱伝導ブロックと前記対物ブロックとの間に配置されることを特徴とする電子部品の温度制御装置。 In the temperature control apparatus of the electronic component as described in any one of Claims 4-6,
The heat conducting member comprises a heat conducting block facing the evaporator and an objective block facing the electronic component,
The temperature control device for an electronic component, wherein the heater is disposed between the heat conduction block and the objective block.
前記蒸発器と前記熱伝導部材の間には、熱伝導維持部材を備えることを特徴とする電子部品の温度制御装置。 In the temperature control apparatus of the electronic component as described in any one of Claims 4-7,
A temperature control device for an electronic component, comprising a heat conduction maintaining member between the evaporator and the heat conduction member.
前記蒸発器を前記熱伝導部材の上面に接触させるために前記第２の空気圧に基づいて前記ピストンロッドが前記蒸発器を移動させる力は、前記第１の空気圧に基づいて前記蒸発器と前記熱伝導部材とが離間する力よりも強いことを特徴とする電子部品の温度制御装置。 In the temperature control apparatus of the electronic component as described in any one of Claims 4-8,
The force by which the piston rod moves the evaporator based on the second air pressure in order to bring the evaporator into contact with the upper surface of the heat conducting member is based on the first air pressure. An electronic component temperature control device characterized by being stronger than a force separating the conductive member.
前記ピストンロッドを駆動するための空気圧を受ける前記ピストンロッドの受圧面の面積と前記第２の空気圧との積は、前記蒸発器と前記熱伝導部材とを離間するための空気圧を受ける前記蒸発器の受圧面の面積と前記第１の空気圧との積よりも大きいことを特徴とする電子部品の温度制御装置。 In the temperature control apparatus of the electronic component of Claim 4-9,
The product of the area of the pressure receiving surface of the piston rod that receives the air pressure for driving the piston rod and the second air pressure is the evaporator that receives the air pressure for separating the evaporator and the heat conducting member. A temperature control device for an electronic component, wherein the temperature control device is larger than the product of the area of the pressure receiving surface and the first air pressure.
前記熱伝導部材は、
該熱伝導部材の下面に形成された凹部と、
前記凹部の内部に配設され、該凹部の開口部の方向から与えられた押圧に対する弾性力を与圧する弾性部材とを備え、
前記温度センサは、前記凹部の内側面には接しないとともに該凹部の深さよりも短い長
さを有し、該温度センサの先端部を該凹部から前記熱伝導部材の下面から突出するように前記弾性部材に支持されていて、前記熱伝導部材と前記電子部品との接触により該凹部内に格納されると前記弾性部材を押圧して、押圧に対抗する前記弾性部材の弾性力によって該電子部品へ押圧されることを特徴とする電子部品の温度制御装置。 In the temperature control apparatus of the electronic component of Claims 4-10,
The heat conducting member is
A recess formed in the lower surface of the heat conducting member;
An elastic member that is disposed inside the recess and pressurizes an elastic force against the pressure applied from the direction of the opening of the recess;
The temperature sensor is not in contact with the inner surface of the recess and has a length shorter than the depth of the recess, and the tip of the temperature sensor protrudes from the lower surface of the heat conducting member from the recess. The electronic component is supported by an elastic member and presses the elastic member when stored in the recess by contact between the heat conducting member and the electronic component. A temperature control device for electronic parts, wherein
前記第１の空気圧回路は、常に前記第１の空気圧を供給し、
前記電子部品の温度制御装置は、
前記電子部品の温度が前記目標温度よりも低いことを検出する低温検出手段と、
前記第２の空気圧回路からピストンロッドのキャップ側に大気圧を供給させることで前記第１の空気圧により前記蒸発器と前記熱伝導部材とを分離させてから、前記ヒータへ電力を供給して該電子部品を加熱する加熱用処理手段とを備え、
前記低温検出手段が前記電子部品の温度が前記目標温度よりも低いことを検出したとき、前記加熱用処理手段により該電子部品を加熱することを特徴とする電子部品の温度制御装置。 In the temperature control apparatus of the electronic component as described in any one of Claims 4-11,
The first pneumatic circuit always supplies the first pneumatic pressure;
The temperature control device for the electronic component is:
Low temperature detecting means for detecting that the temperature of the electronic component is lower than the target temperature;
The evaporator and the heat conducting member are separated by the first air pressure by supplying atmospheric pressure from the second pneumatic circuit to the cap side of the piston rod, and then the electric power is supplied to the heater to supply the heater. A heating processing means for heating the electronic component,
An electronic component temperature control device, wherein when the low temperature detecting means detects that the temperature of the electronic component is lower than the target temperature, the electronic component is heated by the heating processing means.
前記第１の空気圧回路は、常に前記第１の空気圧を供給し、
前記電子部品の温度制御装置は、
前記電子部品の温度が前記目標温度よりも高いことを検出する高温検出手段と、
前記ヒータへの電力の供給を停止してから、前記第２の空気圧回路からピストンロッドのキャップ側に第２の空気圧を供給させることで前記蒸発器と前記熱伝導部材とを接触させてから、該電子部品を冷却する冷却用処理手段とを備え、
前記高温検出手段が前記電子部品の温度が前記目標温度よりも高いことを検出したとき、前記冷却用処理手段により該電子部品を冷却することを特徴とする電子部品の温度制御装置。 In the temperature control apparatus of the electronic component as described in any one of Claims 4-12,
The first pneumatic circuit always supplies the first pneumatic pressure;
The temperature control device for the electronic component is:
High temperature detecting means for detecting that the temperature of the electronic component is higher than the target temperature;
After the supply of power to the heater is stopped, the second air pressure is supplied from the second air pressure circuit to the cap side of the piston rod to bring the evaporator and the heat conducting member into contact with each other. A cooling processing means for cooling the electronic component,
An electronic component temperature control device, wherein when the high temperature detecting means detects that the temperature of the electronic component is higher than the target temperature, the cooling processing means cools the electronic component.
前記測定ロボットの先端部に請求項４〜１３のいずれか１つに記載の電子部品の温度制御装置を備え、
前記温度制御装置にて前記電子部品を前記目標温度にすることを特徴とするＩＣハンドラ。 An IC handler that arranges an electronic component held by a measurement robot in an electronic component inspection apparatus and performs an electrical inspection of the electronic component while keeping the temperature of the electronic component at a predetermined target temperature,
The temperature control device for an electronic component according to any one of claims 4 to 13 is provided at a tip of the measurement robot,
An IC handler characterized in that the temperature control device sets the electronic component to the target temperature.
前記熱伝導部材に対して接離可能に配置された蒸発器と、 An evaporator disposed so as to be able to contact and separate from the heat conducting member;
前記熱伝導部材に当接されるヒータと、 A heater in contact with the heat conducting member;
前記電子部品の温度を検出し前記電子部品を所定の温度に制御する制御回路を有し、 A control circuit for detecting the temperature of the electronic component and controlling the electronic component at a predetermined temperature;
前記制御回路が前記所定の温度よりも前記電子部品の温度が低いことを検出したとき、前記蒸発器を前記熱伝導部材に接触させる力を、前記蒸発器を前記熱伝導部材から離間させる力よりも弱くして、前記蒸発器と前記熱伝導部材とを離間させてから、前記ヒータへ電力を供給して前記電子部品を加熱することを特徴とする電子部品の温度制御方法。 When the control circuit detects that the temperature of the electronic component is lower than the predetermined temperature, the force for bringing the evaporator into contact with the heat conducting member is greater than the force for separating the evaporator from the heat conducting member. A temperature control method for an electronic component, wherein the electronic component is heated by supplying electric power to the heater after the evaporator and the heat conducting member are separated from each other.
前記熱伝導部材に対して接離可能に配置された蒸発器と、 An evaporator disposed so as to be able to contact and separate from the heat conducting member;
前記熱伝導部材に当接されるヒータと、 A heater in contact with the heat conducting member;
前記電子部品の温度を検出し前記電子部品を所定の温度に制御する制御回路を有し、 A control circuit for detecting the temperature of the electronic component and controlling the electronic component at a predetermined temperature;
前記制御回路が前記所定の温度よりも前記電子部品の温度が高いことを検出したとき、前記ヒータへの電力の供給を停止してから、前記蒸発器を前記熱伝導部材に接触させる力 When the control circuit detects that the temperature of the electronic component is higher than the predetermined temperature, the power for stopping the supply of power to the heater and then bringing the evaporator into contact with the heat conducting member
を、前記蒸発器を前記熱伝導部材と離間させる力よりも強くして、前記蒸発器を前記熱伝導部材に接触させて前記電子部品を冷却することを特徴とする電子部品の温度制御方法。The temperature of the electronic component is cooled by making the evaporator stronger than the force that separates the evaporator from the heat conducting member, and bringing the evaporator into contact with the heat conducting member to cool the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007230657A JP5040538B2 (en) | 2007-09-05 | 2007-09-05 | Electronic component temperature control device, electronic component temperature control method, and IC handler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007230657A JP5040538B2 (en) | 2007-09-05 | 2007-09-05 | Electronic component temperature control device, electronic component temperature control method, and IC handler |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009063380A JP2009063380A (en) | 2009-03-26 |
| JP2009063380A5 true JP2009063380A5 (en) | 2010-10-21 |
| JP5040538B2 JP5040538B2 (en) | 2012-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007230657A Expired - Fee Related JP5040538B2 (en) | 2007-09-05 | 2007-09-05 | Electronic component temperature control device, electronic component temperature control method, and IC handler |
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| Country | Link |
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| JP (1) | JP5040538B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010013690A1 (en) | 2008-07-29 | 2010-02-04 | アルプス電気株式会社 | Magnetic detector |
| JP6351623B2 (en) * | 2013-12-03 | 2018-07-04 | 株式会社ハッピージャパン | Electronic device handler |
| JP2016102684A (en) * | 2014-11-27 | 2016-06-02 | セイコーエプソン株式会社 | Electronic component conveyance device, electronic component inspection device and electronic component pressing device |
| JP6507592B2 (en) * | 2014-11-27 | 2019-05-08 | セイコーエプソン株式会社 | Electronic component conveying apparatus, electronic component inspection apparatus and electronic component pressing apparatus |
| KR102433967B1 (en) * | 2014-11-28 | 2022-08-22 | (주)테크윙 | Handler for electric device test |
| CN111459211B (en) * | 2015-04-20 | 2022-07-15 | 深圳市大疆创新科技有限公司 | System and method for thermally regulating sensor operation |
| MY191597A (en) * | 2017-11-27 | 2022-06-30 | Mi Equipment M Sdn Bhd | Stencil concept and inspection |
| CN115235282B (en) * | 2022-09-22 | 2022-12-02 | 四川恩巨实业有限公司 | Aging system and control method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0337875U (en) * | 1989-08-23 | 1991-04-12 | ||
| JP3595150B2 (en) * | 1998-02-12 | 2004-12-02 | 株式会社小松製作所 | Temperature control device and temperature control method |
| JP3129417B2 (en) * | 1999-03-11 | 2001-01-29 | 三菱重工業株式会社 | Heating / cooling device and electrical characteristic evaluation device |
| JP2002043381A (en) * | 2000-07-19 | 2002-02-08 | Tokyo Electron Ltd | Water temperature controller |
| JP2005026296A (en) * | 2003-06-30 | 2005-01-27 | Kowa Dennetsu Keiki:Kk | Hot plate unit |
| JP4569343B2 (en) * | 2005-03-28 | 2010-10-27 | ヤマハ株式会社 | IC carrier and contactor |
| JP4645373B2 (en) * | 2005-09-07 | 2011-03-09 | セイコーエプソン株式会社 | Electronic component temperature control device and handler device |
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