JP2005026296A - Hot plate unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a hot plate unit of a semiconductor manufacturing device which is reduced in size and thickness and improved in responsiveness and accuracy to a preset temperature. <P>SOLUTION: The hot plate unit is composed of a soaking board for heating or cooling a semiconductor wafer uniformly, a temperature sensor for detecting the temperature of the soaking board, a heating body for heating the soaking board, a pressing plate for pressing the heating body, a water jacket for cooling down the pressing plate so as to cool down the soaking board, and a driving means for vacuum contact or separating the water jacket to or from the pressing plate. For carrying out a heating or cooling operation efficiently, the water jacket is separated from the pressing plate by an air layer by the water jacket driving means when the soaking board is heated up by the heating plate, and the water jacket is vacuum-attracted to the pressing plate when the soaking board is cooled down, so that the hot plate unit can be reduced in size and thickness and improved in responsiveness to the preset temperature and the accuracy of the preset temperature. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a hot plate unit.
[0002]
[Prior art]
Japanese Laid-Open Patent Publication No. 5-29419 (Patent Document 1) is known regarding this type of hot plate unit. As shown in FIG. 6, the known hot plate unit includes a liquid 31a that is maintained at a constant temperature by a heating / cooling device 30 that raises and lowers the liquid to a set temperature, and a thin film 31b that encloses the liquid 31a. The heat block 31 is brought into contact with the IC 32 and the IC storage board 33. With the above configuration, the IC storage board 33 is heated and cooled at a constant temperature. Here, the same can be said for a semiconductor wafer instead of the IC storage board 33. In FIG. 6, reference numeral 34 denotes a lifting support machine.
[0003]
[Patent Document 1]
Japanese Patent Laid-Open No. 5-29419
[Problems to be solved by the invention]
However, in the known hot plate unit, the temperature of the liquid is raised and lowered to the set temperature and the apparatus becomes large, and there is a problem in the responsiveness and accuracy of the set temperature. Accordingly, it is an object of the present invention to reduce the size and thickness of the device and improve the responsiveness and accuracy of the set temperature.
[0005]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the water jacket of the present invention is separated from the pressure plate by an air layer so that the water jacket takes less heat and the heating element efficiently and uniformly heats the soaking plate and cools it. Sometimes, the water jacket is vacuum-adsorbed to the holding plate by the driving means to efficiently cool the soaking plate through the holding plate.
According to the present invention, it is possible to reduce the size and thickness of the apparatus for uniformly heating and cooling the semiconductor wafer by the heat equalizing plate, and to improve the accuracy and quick response to the temperature setting.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
A hot plate unit of a semiconductor manufacturing apparatus according to the present invention comprises a soaking plate for uniformly heating and cooling a semiconductor wafer, a temperature sensor for detecting the temperature of the soaking plate, and heating the soaking plate. A heating plate for holding the heating plate, a water jacket for cooling the pressing plate to cool the heat equalizing plate, and vacuum-adsorbing or separating the water jacket from the holding plate Drive means. For efficient heating and cooling, when the soaking plate is heated with a heating element, the water jacket is separated from the holding plate by an air layer by the water jacket driving means, and when cooling, the water jacket is vacuum-adsorbed to the holding plate. Therefore, the apparatus can be reduced in size and thickness, and the response to the set temperature can be made quickly and accurately.
[0007]
Further, by forming a part of the water jacket as a bellows structure or a contact structure between the water jacket and the holding plate as a seal structure such as an O-ring, the water jacket driving means can be simplified and made thinner and smaller.
The seal structure of the water jacket and the holding plate is made up and down and left and right so that the seal against the vertical movement of the water jacket is secured by the vertical seal material, and the temperature difference between the holding plate and the water jacket In order to secure a seal in the left-right direction even if there is a difference in thermal expansion due to, a seal material in the left-right direction is provided.
Further, a safety mechanism is provided so that air does not enter excessively when the water jacket is vacuum-adsorbed to the holding plate and then separated.
Further, since the terminals of the heat generating element are provided on the outer peripheral surface side, the heat generating elements can be arranged uniformly, the response to the set temperature can be made quickly and accurately, and the terminal is not on the lower surface, so that the thickness can be reduced.
[0008]
In addition, when the heating element is a flat plate heater such as an etching heater, the heating element can be formed thinly on the entire surface, the hot plate itself can be made thinner and the temperature can be made more uniform.
The temperature sensor can be taken out from the side of the heat equalizing plate, so that the heating elements can be evenly arranged, the response to the set temperature can be made quickly and accurately, and the removal is not on the lower surface, making it thinner. it can.
In addition, the drive means is air suction / feed-in, and the water jacket can be pressed against and separated from the holding plate with a large force with a slight movement of air, making it possible to reduce the thickness and size with a simple configuration. did.
Moreover, the response to a preset temperature can be made quick by making a water jacket support member into a structure where heat conduction is worse than a press plate.
[0009]
【Example】
Examples of the present invention will be described below.
[0010]
(Example 1)
1 is a front view of a hot plate unit of a semiconductor manufacturing apparatus according to Embodiment 1 of the present invention, FIG. 2 is a bottom view, and FIG. 3 is a side view.
[0011]
1 to 3, a heating element (a flat plate heater such as an etching heater in the first embodiment) 4 is held on a soaking plate 2 by a holding plate 5, and screwed with a screw 19 to be integrated. The presser plate 5 holds the water jacket 6 having water passages 17 and 18 inside with a leaf spring 15.
Further, the outer peripheral portion of the water jacket 6 and the outer peripheral portion of the lift pin 20 that lifts the semiconductor wafer 1 have a bellows structure 8 so that the water jacket 6 can move toward the holding plate 5. In the illustrated state, there is an air layer 16 of about 2 mm between the water jacket 6 and the presser plate 5, and the vertical direction of the bellows structure 8 is fixed to the presser plate 5 or the water jacket 6 with a seal material. The air is sucked or sent through the air suction / feed-in pipe joint 7. A safety mechanism 13 including a spring, a pin, and a sealing structure is provided in order to prevent air from being excessively fed and the leaf spring 15 from being destroyed.
Further, the terminal 14 of the heating element is provided on the outer peripheral surface side.
Further, a temperature sensor 3 takeout 3-1 is provided on the side surface of the soaking plate.
[0012]
Next, the operation and action will be described.
In the state shown in FIG. 1, it is assumed that the soaking plate 2 is heated by the heating element 4 in order to uniformly heat the semiconductor wafer and is in a temperature stable state. For example, if it is stable at 150 ° C., the water jacket 6 is separated from the holding plate 5 at this time, and the air layer 16 exists. Since the air layer 16 functions as a heat insulating material, heat loss during heating can be reduced. At this time, water may or may not flow through the water passages 17 and 18 of the water jacket 6. If the surface treatment of the water jacket 6 on the side of the holding plate 5 is mirror finished, heat transfer due to radiant heat can be reduced.
Next, when the soaking plate temperature is lowered from 150 ° C. to 100 ° C., the air in the air layer 16 is sucked through the air suction / feed-in pipe joint 7 to be in a vacuum state. The water jacket 6 is pressed against the holding plate 5 at atmospheric pressure. At this time, energization to the heating element 4 is stopped, cooling water is supplied from the water supply pipe joints 9 and 11, passed through the water passages 17 and 18, and then drained from the drain pipe joints 10 and 12. Thereby, the pressing plate 5 is rapidly cooled, and the soaking plate 2 is also rapidly cooled. The temperature sensor 3 detects that the temperature of the soaking plate 2 has reached around 100 ° C., starts energization of the heating element 4, and controls the air through the air suction / feed-in pipe joint 7 and the water. An air layer 16 is formed by feeding between the jackets 6. Around this time, by starting to energize the heating element 4, the temperature is quickly stabilized at 100 ° C.
In this embodiment, two water passages 17 and 18 are used, but one water passage or three or more water passages may be used.
[0013]
(Example 2)
FIG. 4 is a front view of the hot plate unit of the semiconductor manufacturing apparatus according to the second embodiment of the present invention.
[0014]
In FIG. 4, the same reference numerals as those in the first embodiment are the same. However, the seal material 21 is a seal material such as an O-ring in which the bellows structure 8 of the first embodiment and one end thereof are fixed with the seal material.
[0015]
Next, the operation and action will be described. Although it is almost the same as that of the first embodiment, the single seal material 21 serves as the seal material which fixes the bellows structure 8 and one end thereof. When the water jacket 6 moves, it moves while sliding on the seal material 21.
[0016]
(Example 3)
FIG. 5 is a front view of a hot plate unit of a semiconductor manufacturing apparatus according to Embodiment 3 of the present invention.
[0017]
In FIG. 5, the same numbers as those in the first embodiment are the same. The vertical seal material 21-1 and the horizontal seal material 22 are held by a seal substrate 23. Further, the water jacket support member 24 is formed by separating what is integrally formed by cutting or the like with the pressing plate 5 of the first embodiment, and has a groove 25.
[0018]
Next, the operation and action will be described. Although it is almost the same as in Example 2, the water jacket 6 at the time of temperature rise has a low temperature (about 10 ° C. to 40 ° C.), so there is almost no thermal expansion, and the holding plate 5 is at a high temperature (about 100 ° C. to 300 ° C.). Therefore, thermal expansion becomes large. In order to absorb this difference, the right-and-left seal material 22 is provided. At this time, the seal base material 23 is pressed in the direction of the water jacket 6 by the vertical seal material 21-1. Further, in order to reduce heat conduction from the pressing plate 5, the water jacket support member 24 is configured separately from the pressing plate, and the material thereof is composed of stainless steel or the like having a lower thermal conductivity than the pressing plate 5 made of aluminum. And the groove | channel 25 is provided and it is comprised so that heat conduction may become the minimum further.
[0019]
【The invention's effect】
As is apparent from the above description, according to the hot plate unit of the semiconductor manufacturing apparatus according to the first aspect of the present invention, the soaking plate for uniformly heating and cooling the semiconductor wafer, and the temperature of the soaking plate A temperature sensor for detecting heat, a heating element for heating the soaking plate, a pressing plate for pressing the heating element, and a water jacket for cooling the pressing plate to cool the soaking plate And a driving means for vacuum-adsorbing or separating the water jacket from the holding plate. When heating the soaking plate with a heating element for efficient heating and cooling, the water jacket is separated from the holding plate by an air layer by the water jacket driving means, and when cooling, the water jacket is cooled by vacuum adsorption to the holding plate. Therefore, there is an effect that the apparatus can be reduced in size and thickness, the response to the set temperature is quick, and the accuracy can be improved.
[0020]
According to the hot plate unit of the semiconductor manufacturing apparatus according to claim 2, a part of the water jacket has a bellows structure or the contact surface between the water jacket and the holding plate has a seal structure such as an O-ring. The water jacket driving means can be simplified to reduce the thickness and size.
According to the hot plate unit of the semiconductor manufacturing apparatus of the third aspect, the seal against the vertical movement of the water jacket is made up and down by setting the seal structure of the water jacket and the holding plate in the vertical direction and the horizontal direction. Even if there is a difference in thermal expansion due to the temperature difference between the holding plate and the water jacket, the seal in the left-right direction is secured by the seal material in the left-right direction.
Further, according to the hot plate unit of the semiconductor manufacturing apparatus according to the fourth aspect of the present invention, since the water jacket is vacuum-adsorbed to the holding plate and then provided with a safety mechanism so that air is not excessively introduced when the water jacket is separated. There is an effect that the device will not be broken even if excessive air is introduced.
Further, according to the hot plate unit of the semiconductor manufacturing apparatus according to claim 5, since the terminals of the heating element are provided on the outer peripheral surface side, the heating elements can be arranged uniformly, and the response to the set temperature is quick. In addition, there is an effect that accuracy can be improved and the terminal can be made thinner because there is no terminal on the lower surface.
According to the hot plate unit of the semiconductor manufacturing apparatus according to the sixth aspect, since the heating element is a flat plate heater such as an etching heater, the heating element can be formed thinly on the entire surface and can be thinned. There is an effect that it can be made more uniform.
Further, according to the hot plate unit of the semiconductor manufacturing apparatus according to the seventh aspect, since the temperature sensor is taken out on the side surface of the soaking plate, the heating elements can be arranged uniformly and the response to the set temperature can be obtained. There is an effect that the accuracy can be improved quickly and the thickness can be further reduced because the lower surface is not taken out.
Further, according to the hot plate unit of the semiconductor manufacturing apparatus according to the eighth aspect, since the driving means is configured to suck and feed air, the water jacket is pressed against and separated from the holding plate with a large force by moving a small amount of air. Therefore, it is possible to reduce the thickness and size with a simple configuration.
Further, according to the hot plate unit of the semiconductor manufacturing apparatus according to the ninth aspect, it is possible to speed up the response to the set temperature by setting the water jacket support member to have a structure having lower heat conduction than the press plate. There is.
[Brief description of the drawings]
1 is a front view of a hot plate unit of a semiconductor manufacturing apparatus according to a first embodiment of the present invention. FIG. 2 is a bottom view of the same. FIG. 3 is a side view of the semiconductor manufacturing apparatus. FIG. 5 is a front view of a hot plate unit of a semiconductor manufacturing apparatus according to a third embodiment of the present invention. FIG. 6 is a front view of a known hot plate unit of a semiconductor device. Explanation】
1 Semiconductor wafer 2 Soaking plate 3 Temperature sensor
3-1 Temperature sensor-takeout 4 Heating element 5 Holding plate 6 Water jacket 7 Air suction / feed-in pipe joint 8 Bellows structure 13 Safety mechanism 14 Heating element terminal 24 Water jacket support member

Claims (9)

A soaking plate for uniformly heating and cooling the semiconductor wafer, a temperature sensor for detecting the temperature of the soaking plate, a heating element for heating the soaking plate, and for holding down the heating element A hot plate unit comprising: a pressure plate; a water jacket for cooling the pressure plate to cool the heat equalizing plate; and a driving means for vacuum-adsorbing or separating the water jacket from the pressure plate. 2. The hot plate unit according to claim 1, wherein a part of the water jacket has a bellows structure, or the outer peripheral surface of the water jacket and the contact surface of the holding plate have a seal structure such as an O-ring. 3. The hot plate unit according to claim 2, wherein the seal structure of the water jacket and the holding plate is a vertical seal material and a horizontal seal material. 4. The hot plate unit according to claim 1, wherein a safety mechanism is provided so that air is not excessively introduced when the water jacket is vacuum-adsorbed on the holding plate and then separated. 5. A hot plate unit according to claim 1, wherein terminals of the heating element are provided on the outer peripheral surface side. 6. A hot plate unit according to claim 1, wherein the heating element is a flat plate heater such as an etching heater. 7. The hot plate unit according to claim 1, wherein the temperature sensor is taken out from the side surface of the soaking plate. The hot plate unit according to any one of claims 1 to 7, wherein the driving means is air suction and feeding. The hot plate unit according to any one of claims 1 to 8, wherein the water jacket supporting member has a structure having a lower thermal conductivity than the pressing plate.

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