JP2009059832A - Soldering jig - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering jig capable of heating the whole heat radiation plate nearly uniformly even when the heat radiation plate is curved large. <P>SOLUTION: An upper jig 22 of the soldering jig 1 is disposed further above the heat radiation plate 12 placed on a heating plate 11 to be used and has a through hole 23 for positioning in a plate surface of an electrically insulating board 14 to be soldered onto the heat radiation plate 12 and also has heat insulating materials 24 provided within ranges Q wherein ends P of the heat radiation plate P come into contact on a surface (reverse surface 22L) on a side opposed to the heat radiation plate 12 when the heat radiation plate 12 is curved in a downward convex shape. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a soldering jig used when soldering an insulating substrate or the like to a plate-like member such as a heat sink by lead-free solder. More specifically, the present invention relates to a soldering jig suitable when the plate-like member is curved.

  For example, when manufacturing an IGBT module for an HV inverter, an insulating substrate is soldered on a heat sink. As the soldering heating process, conventionally, as described in, for example, Patent Document 1, atmosphere heating in an atmospheric pressure is used using a reflow type heating furnace. However, when lead-free solder is used as the solder, voids are likely to occur in this method, and quality defects tend to occur. For this reason, when lead-free solder is used, it must be heated in a reduced-pressure soldering furnace. In general, it is necessary to perform heating by heat conduction or radiation by solid boundary contact with a heating plate or the like in a decompression type heating furnace.

  Therefore, for example, as shown in FIG. 6, a soldering jig 100 having a carbon lower jig 101 and an upper jig 102 is used. The lower jig 101 has a frame shape and is aligned with the outer periphery of the heating plate 11. The heat sink 12 is placed in the frame of the lower jig 101, and the upper jig 102 is placed thereon. The upper jig 102 is aligned and fixed with the lower jig 101. Several through-holes 103 are provided in the upper jig 102, and the solder 13 and the insulating substrate 14 are placed on top of each other. When heated by the heating plate 11 in this state, the solder 13 is heated and melted through the heat radiating plate 12, and the heat radiating plate 12 and the insulating substrate 14 are soldered.

Here, because of the necessity in the subsequent process, as shown in FIG. 6, a curved heat sink 12 may be used. When such a heat radiating plate 12 is placed on the flat heating plate 11, the heating state becomes non-uniform because it comes into contact with the heating plate 11 only in a narrow range at the center of the heat radiating plate 12. In addition, it may tilt in the left-right direction in the figure, making it difficult to stably dispose the heat sink 12. Therefore, as shown in the figure, a groove 11 a is provided in the center of the heating plate 11. As a result, in a state where only the heat radiating plate 12 is placed on the heating plate 11, heating can be performed almost uniformly. Further, since the heating plate 11 and the heat radiating plate 12 are in contact with each other at two points on the left and right in the drawing, a stable arrangement is possible.
Japanese Patent Laid-Open No. 10-215062

  However, there is some variation in the degree of curvature of the heat sink 12. Therefore, when the heat sink 12 having a large degree of curvature is placed on the conventional soldering jig 100 described above, both ends P of the heat sink 12 are in contact with the lower surface L of the upper jig 102 as shown in FIG. Resulting in. This is because it is desired that the space between the upper jig 102 and the heating plate 11 is not so large from the viewpoint of soldering efficiency and the like. When the heat radiating plate 12 and the upper jig 102 are in partial contact, the heat of the heat radiating plate 12 escapes from the contact portion to the upper jig 102. Since the upper jig 102 is made of carbon, the thermal conductivity is good. Therefore, there is a problem in that the temperature in the vicinity of both ends P of the heat radiating plate 12 is lowered, and the temperature is uneven.

  The present invention has been made to solve the problems of the conventional soldering jig described above. That is, an object of the present invention is to provide a soldering jig capable of heating the whole of a heat sink having a large degree of curvature almost uniformly.

  The soldering jig of the present invention, which has been made for the purpose of solving this problem, is used by being placed on a plate-like member placed on a heating plate and soldered on the plate-like member. A soldering jig in which a hole for positioning in a plane is formed, and the plate-like member when the plate-like member is curved downward convexly on the surface facing the plate-like member It has the heat insulation member provided in the range which the edge part contacts.

  The soldering jig of this invention is arrange | positioned further on the plate-shaped member placed on the heating plate. That is, the plate member is sandwiched between the heating plate and the soldering jig. When this plate-like member is convexly curved downward, the convex part comes into contact with the heating plate and the end part comes into contact with the soldering jig. In the soldering jig of the present invention, since the heat insulating member is provided in a range where the end of the plate member contacts, the heat of the plate member is prevented from escaping to the soldering jig. Therefore, even if the heat sink has a large degree of curvature, it is a soldering jig that can heat the entire body almost uniformly.

  Alternatively, the soldering jig of the present invention is used by being placed on a plate-like member placed on a heating plate and positioning a part to be soldered on the plate-like member in the plate surface. When the plate-like member is curved downwardly on the surface facing the plate-like member, the soldering jig is formed in a position corresponding to the concave portion on the upper surface. The downward convex part which contacts a member may be formed.

  If it is such, while the convex part of a plate-shaped member will contact a heating plate, the recessed part of the upper surface will contact the downward convex part of a soldering jig. Accordingly, heat is taken away from the part of the heat sink that is heated. Thereby, the whole heat sink can be heated almost uniformly.

  Alternatively, the soldering jig of the present invention is used by being placed on a plate-like member placed on a heating plate and positioning a part to be soldered on the plate-like member in the plate surface. In the soldering jig formed on the surface facing the plate-like member, when the plate-like member is convexly curved downward, the part A hole different from the hole for positioning may be formed. The hole may be inserted from above into another hole and may have a movable member whose tip contacts the plate member.

  If it does in this way, a movable member will contact a plate-shaped member reliably. Accordingly, heat is taken away from the part of the heat sink that is heated. Thereby, the whole heat sink can be heated almost uniformly.

  According to the soldering jig of the present invention, even a heat sink having a large degree of curvature can be heated almost uniformly.

"First form"
Hereinafter, a first embodiment of the present invention will be described in detail with reference to the accompanying drawings. In this embodiment, the present invention is applied to a soldering jig for soldering an insulating substrate of an IGBT module to a heat sink.

  The soldering jig 1 of this embodiment has a lower jig 21 and an upper jig 22 as shown in FIG. The lower jig 21 has a frame shape like the conventionally used lower jig 101. The lower jig 21 is used by being disposed on the heating plate 11. The heating plate 11 is the same as that conventionally used. On the upper surface of the heating plate 11 in the figure, a groove 11a is provided in the depth direction in the figure.

  In this embodiment, the insulating substrate 14 is positioned and soldered on the heat sink 12. In use, the heat radiating plate 12 is placed on the heating plate 11 in the frame of the lower jig 21. The upper jig 22 is used by being disposed on the lower jig 21 and on the heat sink 12. The upper jig 22 is provided with a plurality of through holes 23. By disposing the insulating substrate 14 in the through hole 23, the insulating substrates 14 are positioned in the plane of the heat radiating plate 12.

Here, in this embodiment, as the heat radiating plate 12, a curved plate as shown in FIG. 1 is used. The shape of the heat sink 12 used is known in advance. Here, the target is curved downward. For this reason, the portion of the lower surface 22L of the upper jig 22 where the heat sink 12 may come into contact is limited to a certain range. This range is referred to as a contact range Q. And in the upper jig | tool 22 of this form, the heat insulating material 24 is embedded in the range including the contact range Q among the lower surfaces 22L. As a result, there is a possibility that the heat radiating plate 12 is in contact with the upper jig 22 only in a portion where the heat insulating material 24 is disposed. The parts other than the heat insulating material 24 of the upper jig 22 and the lower jig 21 are both made of carbon. As the heat insulating material 24, for example, zirconia (ZrO ₂ ), macerite (trade name), ZRCO (trade name) or the like may be used.

  For example, in FIG. 1, the left and right end portions P of the heat radiating plate 12 are portions that protrude upward most. Both end portions P are linearly continuous in the depth direction in the figure. A portion of the lower surface 22L of the upper jig 22 corresponding to both end portions P is a contact range Q. Therefore, the heat insulating material 24 is arranged in a range including the contact range Q of the lower surface 22L. Here, the heat insulating material 24 is a plate-like member having a thickness of about 2 to 3 mm in the vertical direction and a width of about 10 mm in the horizontal direction in the drawing including the contact range Q. The lower surface 24L of the heat insulating material 24 is exposed on the outer surface of the upper jig 22. Here, the lower surface 22L of the upper jig 22 and the lower surface 24L of the heat insulating material 24 are illustrated in the same plane, but the lower surface 24L of the heat insulating material 24 is more than the lower surface 22L of the upper jig 22. It may be slightly recessed.

  Next, an example in which soldering is performed using the soldering jig 1 of this embodiment is shown in FIG. In this method, four insulating substrates 14 are soldered to one heat radiating plate 12. A plurality of elements 15 are attached to each insulating substrate 14 in advance. In this example, the heat radiating plate 12 is curved left and right in the figure, and both left and right ends P in the figure are in contact with the upper jig 22. The central portion T is recessed by about 150 to 250 μm as compared to both end portions P. Therefore, the upper jig 22 for the heat sink 12 is provided with a heat insulating material 24 so as to cover both end portions P of the heat sink 12 as indicated by broken lines in the drawing.

  When soldering using the soldering jig 1 of this embodiment, first, the lower jig 21 is placed on the heating plate 11. Then, the heat sink 12 is placed in the frame of the lower jig 21. At this time, since the central portion T of the heat radiating plate 12 is placed in the groove 11a, it can be stably arranged. Next, the upper jig 22 is arranged according to the lower jig 21, and the lower jig 21 and the upper jig 22 are fixed. By doing in this way, the both ends P of the heat sink 12 and the heat insulating material 24 may contact.

  Next, the foil-like solder 13 and the insulating substrate 14 are respectively inserted from the through holes 23 of the upper jig 22. The through holes 23 are formed in accordance with the shape of each insulating substrate 14. Accordingly, the insulating substrates 14 are aligned with each other by being inserted into the through holes 23. When the heating plate 11 is heated in this state, the heat radiating plate 12 is heated. At this time, the heat sink 12 having a large degree of curvature contacts the heat insulating material 24 in addition to the heating plate 11. The heat insulating material 24 prevents heat from escaping to the upper jig 22.

  Alternatively, the heat radiating plate 12 having a small degree of curvature only contacts the heating plate 11. Since the groove 11a is formed in the heating plate 11, the entire heat radiating plate 12 is heated almost uniformly. Therefore, the overall temperature of the heat sink 12 can be kept substantially uniform. The heat sink 12 and the insulating substrate 14 can be soldered by heating and melting the solder 13 via the heat sink 12.

  As described above in detail, according to the soldering jig 1 of this embodiment, the heat insulating material 24 is applied to the portion of the lower surface 22L of the upper jig 22 that includes the contact range Q that the heat sink 12 may contact. It is arranged. Therefore, heat is prevented from escaping from the heat sink 12 to the lower surface 22L of the upper jig 22, and the entire heat sink 12 can be maintained at a substantially uniform temperature. Therefore, even if the heat sink has a large degree of curvature, it is a soldering jig that can heat the entire body almost uniformly.

"Second form"
Hereinafter, a second embodiment of the present invention will be described in detail with reference to the accompanying drawings. The present embodiment is different from the first embodiment only in the configuration of the upper jig, and common portions are denoted by common reference numerals and description thereof is omitted.

  As shown in FIG. 3, the upper jig 31 of the soldering jig 2 of the present embodiment is provided with a convex portion 32 protruding downward in the figure. The upper jig 31 is entirely made of carbon and is not provided with a heat insulating material. The convex portion 32 is provided in accordance with a recessed portion (here, the central portion T) of the heat radiating plate 12. Here, it has a strip shape in the depth direction in the figure. Further, the lower surface 32L of the convex portion 32 protrudes downward in the figure by a width S as compared to the lower surface 31L of the upper jig 31. The width S is formed to be approximately the same as the distance between the highest position (both end portions P) and the lowest position (central portion T) of the heat radiating plate 12 serving as a workpiece. Here, it is set to 150 to 250 μm.

  When the heat radiating plate 12 is disposed between the lower jig 21 and the upper jig 31 of the soldering jig 2 of this embodiment, both end portions P of the heat radiating plate 12 are arranged on the lower surface 31L of the upper jig 31 as shown in FIG. In addition, the central portion T is in contact with the lower surface 32 </ b> L of the convex portion 32. That is, heat is taken away from both ends P and the center T to the upper jig 31. Therefore, the heating state of the both end portions P and the central portion T of the heat radiating plate 12 becomes substantially uniform, and the entire heat radiating plate 12 can be heated almost uniformly. Note that the upper jig 31 is not in contact with other members, and if it is heated as a whole, it is thermally saturated, so that it does not take away any more heat.

  As described in detail above, even with the soldering jig 2 of this embodiment, the heat sink having a large degree of curvature can be heated almost uniformly as in the first embodiment. It is a soldering jig. In the present embodiment, it is not preferable that only one of the both end portions P and the center portion T of the heat radiating plate 12 is in contact with the upper jig 31. Therefore, it is desirable that the distance between the upper surface of the heating plate 11 and the lower surface 31L of the upper jig 31 be slightly smaller than that in the first embodiment. This is because both the end portions P and the central portion T are surely in contact with each other even if the heat dissipation plate has a relatively small degree of curvature.

"Third form"
Hereinafter, a third embodiment of the present invention will be described in detail with reference to the accompanying drawings. The present embodiment is different from the first embodiment only in the configuration of the upper jig, and common portions are denoted by common reference numerals and description thereof is omitted.

  As shown in FIG. 4, the upper jig 41 of the soldering jig 3 of this embodiment is provided with a through hole 42 separately from the one on which the insulating substrate 14 is arranged. Further, a movable member 43 is inserted through the through hole 42 from above in the figure. The movable member 43 can move in the vertical direction in the drawing inside the through hole 42, and its lower end portion 43 </ b> L is in contact with the heat radiating plate 12 by its own weight. Further, a stopper portion 44 that is slightly larger in the radial direction is formed at the upper end portion of the movable member 43 in the drawing to prevent the movable member 43 from coming off. In this embodiment, the upper jig 41 and the movable member 43 are both made of carbon.

  The movable member 43 is disposed at a recessed portion (here, the central portion T) of the heat radiating plate 12 to be soldered and in the vicinity thereof. For example, as shown in FIG. 5, a plurality are arranged in one row along the center portion T and outside the insulating substrate 14. This arrangement is appropriately selected centering on a location that tends to be relatively hot without this, depending on the shape of the heat sink 12, the arrangement of the insulating substrate 14, and the like. Since the movable member 43 is lowered by its own weight, the movable member 43 reliably comes into contact with the heat radiating plate 12 regardless of variations such as the degree of curvature of the heat radiating plate 12.

  Here, the through hole 42 is a circular hole, and the movable member 43 is a cylindrical shape. Further, in order to facilitate the movement of the movable member 43 in the through hole 42 due to its own weight, the inner diameter of the through hole 42 is formed to be about 0.5 mm larger than the outer diameter of the movable member 43. Moreover, as shown in FIG. 5, the heat sink 12 of the location where the lower end part 43L of the movable member 43 contacts is curved. Therefore, in order to ensure contact between the lower end portion 43L and the heat radiating plate 12, it is desirable that the lower surface of the lower end portion 43L has a rounded shape.

  When the heat sink 12 is placed on the soldering jig 3, both end portions P are in contact with the lower surface 41 </ b> L of the upper jig 41, and the central portion T and the vicinity thereof are in contact with the lower end portion 43 </ b> L of the movable member 43. Therefore, since heat is taken away from the upper jig 41 from any place, the entire heat radiating plate 12 is maintained at a substantially uniform temperature.

  As described in detail above, even with the soldering jig 3 of the present embodiment, the entire heat-radiating plate having a large degree of curvature is heated almost uniformly as in the first and second embodiments. It is a soldering jig that can. In this embodiment as well, as in the second embodiment, it is desirable that the distance between the upper surface of the heating plate 11 and the lower surface 41L of the upper jig 41 be slightly smaller than that in the first embodiment.

In addition, this form is only a mere illustration and does not limit this invention at all. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof.
For example, the number and arrangement of through holes provided in the upper jig can be appropriately changed according to each workpiece. The lower jig may be integrated with the upper jig or the heating plate. Further, the shape of the heat insulating material 24 in the first embodiment, the shape of the lower surface 32L of the convex portion 32 in the second embodiment, and the like are not limited to planes, and may be curved surfaces. Further, the arrangement and shape of the movable member in the third embodiment are not limited to this, and may not be arranged at equal intervals. Further, the movable member is not limited to carbon. Moreover, the stopper part does not necessarily need to be provided in the perimeter.

It is sectional drawing which shows the jig for soldering which concerns on a 1st form. It is a top view which shows the jig | tool for soldering which concerns on a 1st form. It is sectional drawing which shows the jig | tool for soldering which concerns on a 2nd form. It is sectional drawing which shows the jig | tool for soldering which concerns on a 3rd form. It is a top view which shows the jig for soldering which concerns on a 3rd form. It is sectional drawing which shows the conventional jig for soldering.

Explanation of symbols

1, 2, 3 Soldering jig 11 Heating plate 12 Heat radiating plate 14 Insulating substrate 22, 31, 41 Upper jig 23 Through hole 24 Heat insulating material 32 Convex part 42 Through hole 43 Movable member

Claims (3)

In a soldering jig in which a hole for positioning in a plate surface of a component to be soldered is formed on a plate member placed on a heating plate and used on the plate member. ,
Among the surfaces facing the plate-like member, the plate-like member has a heat insulating member provided in a range in which the end of the plate-like member contacts when the plate-like member is curved downward and convex. Soldering jig. In a soldering jig in which a hole for positioning in a plate surface of a component to be soldered is formed on a plate member placed on a heating plate and used on the plate member. ,
On the surface facing the plate-like member, when the plate-like member is convexly curved downward, a downward convex portion that contacts the plate-like member is formed at a position corresponding to the concave portion on the upper surface. Soldering jig characterized by being made. In a soldering jig in which a hole for positioning in a plate surface of a component to be soldered is formed on a plate member placed on a heating plate and used on the plate member. ,
When the plate-like member is curved downwardly on the surface facing the plate-like member, a hole different from the hole for positioning the component is provided at a position corresponding to the concave portion on the upper surface. Formed,
A soldering jig having a movable member which is inserted into the another hole from above and whose tip contacts the plate-like member.

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