JP2009055283A5 - - Google Patents

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Publication number
JP2009055283A5
JP2009055283A5 JP2007219477A JP2007219477A JP2009055283A5 JP 2009055283 A5 JP2009055283 A5 JP 2009055283A5 JP 2007219477 A JP2007219477 A JP 2007219477A JP 2007219477 A JP2007219477 A JP 2007219477A JP 2009055283 A5 JP2009055283 A5 JP 2009055283A5
Authority
JP
Japan
Prior art keywords
base
heating
lid
ausn alloy
brazing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007219477A
Other languages
English (en)
Japanese (ja)
Other versions
JP5131438B2 (ja
JP2009055283A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007219477A priority Critical patent/JP5131438B2/ja
Priority claimed from JP2007219477A external-priority patent/JP5131438B2/ja
Publication of JP2009055283A publication Critical patent/JP2009055283A/ja
Publication of JP2009055283A5 publication Critical patent/JP2009055283A5/ja
Application granted granted Critical
Publication of JP5131438B2 publication Critical patent/JP5131438B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007219477A 2007-08-27 2007-08-27 圧電デバイスの製造方法 Expired - Fee Related JP5131438B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007219477A JP5131438B2 (ja) 2007-08-27 2007-08-27 圧電デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007219477A JP5131438B2 (ja) 2007-08-27 2007-08-27 圧電デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2009055283A JP2009055283A (ja) 2009-03-12
JP2009055283A5 true JP2009055283A5 (cg-RX-API-DMAC7.html) 2010-10-07
JP5131438B2 JP5131438B2 (ja) 2013-01-30

Family

ID=40505953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007219477A Expired - Fee Related JP5131438B2 (ja) 2007-08-27 2007-08-27 圧電デバイスの製造方法

Country Status (1)

Country Link
JP (1) JP5131438B2 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249424A (ja) * 2010-05-24 2011-12-08 Daishinku Corp 電子部品パッケージの封止部材、電子部品パッケージ、及び電子部品パッケージの封止部材の製造方法
CN103392229B (zh) * 2011-03-18 2016-06-22 株式会社大真空 电子器件封装体、电子器件、及电子器件封装体的制造方法
JP2015079866A (ja) * 2013-10-17 2015-04-23 住友金属鉱山株式会社 ろう材付きパッケージ封止用蓋とその製造方法、及びそれを用いたパッケージ型電子部品の封止方法、並びにパッケージ型電子部品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3718380B2 (ja) * 1999-08-18 2005-11-24 株式会社日立製作所 はんだ接続構造を有する回路装置およびその製造方法
JP4514400B2 (ja) * 2001-09-27 2010-07-28 古河電気工業株式会社 部材の接合方法、その方法で得られた接合部材
JP3994980B2 (ja) * 2004-03-29 2007-10-24 株式会社日立製作所 素子搭載用基板及びその製造方法並びに半導体素子実装方法
JP4513513B2 (ja) * 2004-11-09 2010-07-28 株式会社村田製作所 電子部品の製造方法
WO2007094284A1 (ja) * 2006-02-15 2007-08-23 Neomax Materials Co., Ltd. 気密封止用キャップ、電子部品収納用パッケージおよび気密封止用キャップの製造方法

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