JP2009053280A - Optical module - Google Patents

Optical module Download PDF

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JP2009053280A
JP2009053280A JP2007217573A JP2007217573A JP2009053280A JP 2009053280 A JP2009053280 A JP 2009053280A JP 2007217573 A JP2007217573 A JP 2007217573A JP 2007217573 A JP2007217573 A JP 2007217573A JP 2009053280 A JP2009053280 A JP 2009053280A
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Japan
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optical
transmission body
optical element
upper structure
optical transmission
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JP2007217573A
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JP4850149B2 (en
Inventor
Masahiro Aoyanagi
昌宏 青柳
Hiroshi Nakagawa
博 仲川
Katsuya Kikuchi
克弥 菊地
Takashi Mikawa
孝 三川
Yoshikuni Okada
義邦 岡田
Yukio Hayashi
幸生 林
Takaaki Ishikawa
隆朗 石川
Atsushi Suzuki
敦 鈴木
Tasuke Nagao
太介 長尾
Sadaichi Suzuki
貞一 鈴木
Mitsuaki Tamura
充章 田村
Yoichi Hashimoto
陽一 橋本
Tomoyuki Hino
智之 樋野
Hiroshi Masuda
宏 増田
Shuji Suzuki
修司 鈴木
Yoshitsugu Wakazono
芳嗣 若園
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Ibiden Co Ltd
Fujikura Ltd
Hirose Electric Co Ltd
NEC Corp
National Institute of Advanced Industrial Science and Technology AIST
Sumitomo Electric Industries Ltd
Fujifilm Business Innovation Corp
Resonac Corp
Niterra Co Ltd
Original Assignee
Ibiden Co Ltd
Fujikura Ltd
Hirose Electric Co Ltd
Fuji Xerox Co Ltd
Hitachi Chemical Co Ltd
NGK Spark Plug Co Ltd
NEC Corp
National Institute of Advanced Industrial Science and Technology AIST
Sumitomo Electric Industries Ltd
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Application filed by Ibiden Co Ltd, Fujikura Ltd, Hirose Electric Co Ltd, Fuji Xerox Co Ltd, Hitachi Chemical Co Ltd, NGK Spark Plug Co Ltd, NEC Corp, National Institute of Advanced Industrial Science and Technology AIST, Sumitomo Electric Industries Ltd filed Critical Ibiden Co Ltd
Priority to JP2007217573A priority Critical patent/JP4850149B2/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical module in which optical axes at light incidence and light exiting are changed in an inexpensive configuration without using a lens or the like and further, and which is significantly reduced in height. <P>SOLUTION: The optical module is equipped with: an upper structure 5 having an optical transmission body 7 which has a structure bent into an arc and in which the optical axis on an external side and the optical axis on an optical element side are perpendicular to each other, and a holding member 6 holding the optical transmission body 7; and a lower structure 25 on which an optical element 40 is mounted, and in which the upper structure 5 is positioned and placed at an upper side so as to optically connect the optical transmission body 7 of the upper structure 5 to the optical element 40. When the upper structure 5 is placed on the lower structure 25, the end face 7a of the optical transmission body 7 is placed facing the optical element 40, and thus, the optical transmission body 7 and the optical element 40 are optically connected to each other. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、光モジュールに関するものである。   The present invention relates to an optical module.

光を情報伝送媒体とする光通信分野においては、光ファイバ等により伝送される光信号を受信または送信するため、光信号と電気信号とを相互に変換する光素子を備えた光モジュールが用いられている。電気信号から光信号への変換には、垂直共振器表面発光レーザ(Vertical cavity surface-emitting Laser:VCSEL)に代表される面発光素子が用いられ、光信号から電気信号への変換には、PINフォトダイオードに代表される面受光素子が用いられており、これらの光素子は基板に対して電気的に接続され、光ファイバ等は光素子に対して光学的に接続される。   In the field of optical communication using light as an information transmission medium, an optical module including an optical element that mutually converts an optical signal and an electrical signal is used to receive or transmit an optical signal transmitted through an optical fiber or the like. ing. A surface emitting element typified by a vertical cavity surface-emitting laser (VCSEL) is used for the conversion from an electrical signal to an optical signal, and a PIN is used for the conversion from an optical signal to an electrical signal. A surface light receiving element typified by a photodiode is used. These optical elements are electrically connected to the substrate, and optical fibers and the like are optically connected to the optical elements.

このような光モジュールは、配線基板(プリント配線板あるいはボード)上において光ファイバ等の光配線をする際の作業性や、保守交換の容易性などの点から、光ファイバ等の光伝送体がコネクタを介して着脱可能であることが望ましい。   Such an optical module has an optical transmission body such as an optical fiber from the viewpoint of workability when optical wiring such as an optical fiber is performed on a wiring board (printed wiring board or board), and ease of maintenance and replacement. It is desirable to be detachable via a connector.

また、光素子に光ファイバ等を着脱する場合、配線基板に対して水平方向に着脱する構造にすると、光素子を搭載した部品の周辺に光ファイバ等を着脱する作業用のスペースを設けざるを得ないことから、そのスペースには他の部品を実装できず、実装密度を上げられないという問題がある。したがって、光ファイバ等の着脱は配線基板に対して垂直方向に行うことができることが望ましい。   In addition, when an optical fiber or the like is attached to or detached from the optical element, a structure for attaching or detaching the optical fiber or the like around the component on which the optical element is mounted should be provided if it is configured to be attached to and detached from the wiring board in the horizontal direction. Since it cannot be obtained, there is a problem that other parts cannot be mounted in the space, and the mounting density cannot be increased. Therefore, it is desirable that attachment / detachment of an optical fiber or the like can be performed in a direction perpendicular to the wiring board.

従来、このような要求に対応するものとして、光素子をその受発光面が配線基板に対して水平になるように搭載すると共に、光ファイバ等の端面に反射ミラー等を設けて光軸を垂直に変換したコネクタを用いることで、光ファイバ等と光素子とを垂直方向へ着脱自在に光学的に接続する光モジュールが提案されている(特許文献1参照)。
特開2006−65358号公報
Conventionally, in order to meet such demands, an optical element is mounted so that its light emitting / receiving surface is horizontal with respect to the wiring board, and a reflection mirror is provided on the end face of an optical fiber or the like to vertically align the optical axis. There has been proposed an optical module that optically connects an optical fiber or the like and an optical element so as to be detachable in a vertical direction by using a connector converted into (see Patent Document 1).
JP 2006-65358 A

しかしながら、コネクタの光軸を垂直に変換するために反射ミラーを用いた場合、光モジュールのコストが高くなり、また、反射面で光のロスが生じるという問題があった。   However, when a reflection mirror is used to convert the optical axis of the connector to a vertical position, there are problems that the cost of the optical module is increased and light loss occurs on the reflection surface.

また、コネクタにより光伝送体を着脱する構造においては、光学的な位置合わせの精度と光結合効率を上げるために一般にレンズを配置しているが、レンズは高価であり、また、複数の配線基板を重ねて配置する場合などにはコネクタの上下方向の厚みを小さくして低背化することが望まれるが、レンズを用いた場合、コネクタの低背化が難しいという問題があった。   Further, in the structure in which the optical transmission body is attached / detached by the connector, a lens is generally arranged in order to increase the optical alignment accuracy and the optical coupling efficiency, but the lens is expensive, and a plurality of wiring boards For example, when the connectors are stacked, it is desired to reduce the height of the connector by reducing the thickness in the vertical direction. However, when a lens is used, there is a problem that it is difficult to reduce the height of the connector.

本発明は、以上の通りの事情に鑑みてなされたものであり、レンズ等を用いずに、低コストな構成で入出射の光軸を変換することができ、さらに、大幅に低背化された光モジュールを提供することを課題としている。   The present invention has been made in view of the circumstances as described above, and can convert the incident and outgoing optical axes with a low-cost configuration without using a lens or the like. The problem is to provide an optical module.

本発明は、上記の課題を解決するために、以下のことを特徴としている。   The present invention is characterized by the following in order to solve the above problems.

第1に、本発明の光モジュールは、光信号を伝送する光伝送体と、光信号を電気信号に変換し、または電気信号を光信号に変換する光素子とを光学的に接続する光モジュールであって、円弧状に曲げられた構造を有し、外部側の光軸と光素子側の光軸とが互いに垂直である光伝送体および当該光伝送体を保持する保持部材を備えた上部構造体と、光素子が搭載されており、光素子に対して上部構造体の光伝送体が光学的に接続されるように上部構造体が上側に位置決めされて配置される下部構造体とを備えており、上部構造体が下部構造体の上に配置されたときに、光伝送体の端面が光素子と対向して配置されることにより光伝送体と光素子とが光学的に接続されることを特徴とする。   1stly, the optical module of this invention optically connects the optical transmission body which transmits an optical signal, and the optical element which converts an optical signal into an electrical signal, or converts an electrical signal into an optical signal. An upper portion having a structure bent in an arc shape and having an optical transmission body in which an optical axis on the outer side and an optical axis on the optical element side are perpendicular to each other, and a holding member for holding the optical transmission body A structure and a lower structure on which the optical element is mounted and the upper structure is positioned and arranged so that the optical transmission body of the upper structure is optically connected to the optical element. When the upper structure is arranged on the lower structure, the end face of the optical transmission body is arranged to face the optical element, so that the optical transmission body and the optical element are optically connected. It is characterized by that.

第2に、上記第1の光モジュールにおいて、光伝送体の曲率半径が5mm以下であることを特徴とする。   Second, in the first optical module, the radius of curvature of the optical transmission body is 5 mm or less.

第3に、上記第1または第2の光モジュールにおいて、光伝送体が光ファイバであり、光ファイバの外周部が樹脂材で被覆されていることを特徴とする。   Third, in the first or second optical module, the optical transmission body is an optical fiber, and an outer peripheral portion of the optical fiber is covered with a resin material.

第4に、上記第1ないし第3のいずれかの光モジュールにおいて、光伝送体におけるコアとクラッドの屈折率比(コア屈折率/クラッド屈折率)が1.5%以上であることを特徴とする。   Fourth, in any one of the first to third optical modules, the refractive index ratio (core refractive index / cladding refractive index) of the core and the cladding in the optical transmission body is 1.5% or more. To do.

第5に、上記第1ないし第4のいずれかの光モジュールにおいて、下部構造体に搭載された光素子は、ボンディングワイヤによって外部に電気的に接続されており、上部構造体の光伝送体は、端面近傍における円弧内側が保持部材から露出しており、上部構造体には、当該露出した領域に沿って、上部構造体が下部構造体の上に配置されたときにボンディングワイヤの少なくとも一部が位置する空間であるボンディングワイヤの逃げ部が形成されていることを特徴とする。   Fifth, in any one of the first to fourth optical modules, the optical element mounted on the lower structure is electrically connected to the outside by a bonding wire, and the optical transmission body of the upper structure is The inner side of the arc in the vicinity of the end face is exposed from the holding member, and the upper structure has at least a part of the bonding wire when the upper structure is disposed on the lower structure along the exposed region. A relief portion of a bonding wire, which is a space in which is located, is formed.

上記第1の発明によれば、上部構造体において、光伝送体を円弧状に曲げた構造とすることで入出射の光軸を変換し、下部構造体の光素子に対して光伝送体の端面を対向させて光接続するようにしたので、低コストな構成で入出射の光軸を変換することができ、さらに、上部構造体を大幅に低背化することができるので、光モジュール全体として低背化を実現することができる。   According to the first aspect of the present invention, in the upper structure, the optical transmission body is bent in an arc shape to convert the incident / exit optical axis, so that the optical transmission element of the lower structure is changed with respect to the optical element of the lower structure. Since the optical connection is made with the end faces facing each other, the input and output optical axes can be converted with a low-cost configuration, and the height of the upper structure can be greatly reduced. As a result, a low profile can be realized.

上記第2の発明によれば、光伝送体の曲率半径を特定値以下としたので、上記第1の発明の効果に加え、上部構造体を大幅に低背化することができ、光モジュール全体として大幅な低背化を実現することができる。   According to the second aspect of the invention, since the radius of curvature of the optical transmission body is set to a specific value or less, in addition to the effect of the first aspect of the invention, the upper structure can be significantly reduced in height and the entire optical module can be reduced. As a result, a significant reduction in height can be realized.

上記第3の発明によれば、光ファイバの外周部が樹脂材で被覆されているので、上記第1または第2の発明の効果に加え、光ファイバの曲率半径を小さくするために細径の光ファイバを用いて当該ファイバをきつく曲げた場合であっても、光ファイバの強度を十分に確保することができる。   According to the third aspect of the invention, since the outer peripheral portion of the optical fiber is coated with the resin material, in addition to the effects of the first or second aspect of the invention, a small diameter is used to reduce the radius of curvature of the optical fiber. Even when an optical fiber is used and the fiber is bent tightly, the strength of the optical fiber can be sufficiently secured.

上記第4の発明によれば、光伝送体におけるコアとクラッドの屈折率比を特定値以上としたので、上記第1から第3の発明の効果に加え、光ファイバの曲率半径を小さくするために細径の光ファイバを用いて当該ファイバをきつく曲げた場合であっても、光伝送体からの信号光の漏れを十分に抑制することができる。   According to the fourth aspect of the invention, since the refractive index ratio between the core and the clad in the optical transmission body is set to a specific value or more, in addition to the effects of the first to third aspects, the radius of curvature of the optical fiber is reduced. Even when a thin optical fiber is used and the fiber is bent tightly, leakage of signal light from the optical transmission body can be sufficiently suppressed.

上記第5の発明によれば、光伝送体の端面近傍における円弧内側を保持部材から露出させることで、光素子搭載基板の光素子に接続されたボンディングワイヤの逃げ部を設けたので、上記第1から第4の発明の効果に加え、光接続をしたときに、上部構造体の下面とボンディングワイヤとが接触することを防止することができる。さらに、光伝送体の端面近傍における円弧内側のみを保持部材から露出させることで逃げ部を形成したので、光伝送体の位置決め精度が損なわれることもない。   According to the fifth aspect of the present invention, since the inside of the arc in the vicinity of the end face of the optical transmission body is exposed from the holding member, the relief portion of the bonding wire connected to the optical element of the optical element mounting substrate is provided. In addition to the effects of the first to fourth inventions, when the optical connection is made, it is possible to prevent the lower surface of the upper structure and the bonding wire from contacting each other. Furthermore, since the escape portion is formed by exposing only the inner side of the arc in the vicinity of the end face of the optical transmission body from the holding member, the positioning accuracy of the optical transmission body is not impaired.

本明細書において、「光伝送体」には、ガラス製、樹脂製等の光ファイバ、樹脂製等の光導波路などが含まれる。以下の実施形態では光ファイバを用いた例を説明するが、本発明において適用される光伝送体はこれに限定されるものではなく、光導波路等のように、光伝送路を構成する各種のものを適用することができる。   In this specification, the “optical transmission body” includes an optical fiber made of glass or resin, an optical waveguide made of resin, or the like. In the following embodiment, an example using an optical fiber will be described. However, the optical transmission body applied in the present invention is not limited to this, and various types of optical transmission lines such as an optical waveguide can be configured. Things can be applied.

以下、図面を参照しながら本発明の実施形態について説明する。図1および図2は、本発明の一実施形態における光モジュールを示す斜視図であり、図1は光接続および電気接続を切り離した状態、図2は光接続および電気接続をした状態を示している。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 are perspective views showing an optical module according to an embodiment of the present invention. FIG. 1 shows a state in which the optical connection and the electrical connection are disconnected, and FIG. 2 shows a state in which the optical connection and the electrical connection are made. Yes.

図1に示すように、本実施形態の光モジュール1は、光ファイバ7が保持部材6により保持された上部構造体5と、光素子40を搭載した光素子搭載基板30および異方導電性シート60からなる下部構造体25と、配線基板70(プリント配線板あるいはボード)上に固定された嵌合部材50とを備えている。   As shown in FIG. 1, the optical module 1 of this embodiment includes an upper structure 5 in which an optical fiber 7 is held by a holding member 6, an optical element mounting substrate 30 on which an optical element 40 is mounted, and an anisotropic conductive sheet. The lower structure 25 which consists of 60, and the fitting member 50 fixed on the wiring board 70 (printed wiring board or board) are provided.

この光モジュール1は、配線基板70上の嵌合部材50内の開口部51に異方導電性シート60を配置し、その上に光素子搭載基板30を配置し、さらにその上から上部構造体5を垂直に嵌めこんで図2に示すように装着することにより、上部構造体5の光ファイバ7と光素子搭載基板30の光素子40が光学的に接続し、光素子搭載基板30と配線基板70が異方導電性シート60を介して電気的に接続されるようになっている。図2に示す装着状態の光モジュール1は、全体として、たとえば幅10mm×10mm、厚さ6.4mmのコンパクトなサイズのモジュールを構成している。   In this optical module 1, an anisotropic conductive sheet 60 is disposed in an opening 51 in a fitting member 50 on a wiring substrate 70, an optical element mounting substrate 30 is disposed thereon, and an upper structure is further formed thereon. 2 is fitted vertically as shown in FIG. 2, and the optical fiber 7 of the upper structure 5 and the optical element 40 of the optical element mounting substrate 30 are optically connected, and the optical element mounting substrate 30 and the wiring are connected. The substrate 70 is electrically connected via the anisotropic conductive sheet 60. The mounted optical module 1 shown in FIG. 2 constitutes a compact module having a width of 10 mm × 10 mm and a thickness of 6.4 mm, for example.

図3(a)は上部構造体5の上面図、図3(b)は下面図、図3(c)は側面図である。上部構造体5は、樹脂製の保持部材6の背面から、複数本(本実施形態では12本)の光ファイバ7が並列したテープファイバ8が保持部材6内に水平に入り込み、保持部材6内で光ファイバ7が円弧状に曲げられて図3(b)に示すように光ファイバ7の端面7aが保持部材6の下面から垂直に露出した構造を有している。   3A is a top view of the upper structure 5, FIG. 3B is a bottom view, and FIG. 3C is a side view. In the upper structure 5, a tape fiber 8 in which a plurality of (in this embodiment, 12) optical fibers 7 are arranged in parallel enters the holding member 6 from the back surface of the resin-made holding member 6. Thus, the optical fiber 7 is bent into an arc shape, and the end surface 7a of the optical fiber 7 is vertically exposed from the lower surface of the holding member 6 as shown in FIG.

保持部材6の上面における光ファイバ7と平行な両側周縁部には、当該周縁部に沿ってテーパ面を成す一対の肩部12が設けられており、図1の嵌合部材50内に嵌め込んで装着したときに嵌合部材50の上部に設けられた一対の突条部52が保持部材6の肩部12に当接して下方に押圧するようになっている。   A pair of shoulder portions 12 forming a tapered surface along the peripheral edge portion are provided on both peripheral edge portions parallel to the optical fiber 7 on the upper surface of the holding member 6, and are fitted into the fitting member 50 of FIG. 1. The pair of protrusions 52 provided on the upper portion of the fitting member 50 abuts against the shoulder 12 of the holding member 6 and presses downward.

また、図3(b)に示すように、保持部材6の下面における前方側には、保持部材6の両側面側の対称位置に2つの位置決め穴11が設けられており、図1の嵌合部材50内に嵌め込んで装着したときに、光素子搭載基板30に立設された位置決めピン42が保持部材6の位置決め穴11に挿入されて上部構造体5と光素子搭載基板30とが水平方向に位置決めされるようになっている。   Further, as shown in FIG. 3B, two positioning holes 11 are provided on the front side of the lower surface of the holding member 6 at symmetrical positions on both side surfaces of the holding member 6. When the optical element mounting substrate 30 is fitted and fitted into the member 50, the positioning pins 42 erected on the optical element mounting substrate 30 are inserted into the positioning holes 11 of the holding member 6 so that the upper structure 5 and the optical element mounting substrate 30 are horizontal. It is positioned in the direction.

保持部材6は、図4(a)および図4(b)に示すように上側部材10と下側部材20とから構成されており、上側部材10と下側部材20によって光ファイバ7を挟み込んで保持するようになっている。図4(b)に示すように、上側部材10の下面側には光ファイバ7の円弧形状に対応した曲面上に、たとえば断面V字状などのガイド溝14が平行に設けられており、これらのガイド溝14のそれぞれに光ファイバ7が1本ずつ配置され案内されるようになっている。   The holding member 6 includes an upper member 10 and a lower member 20 as shown in FIGS. 4A and 4B, and the optical fiber 7 is sandwiched between the upper member 10 and the lower member 20. It comes to hold. As shown in FIG. 4B, guide grooves 14 having a V-shaped cross section, for example, are provided in parallel on the curved surface corresponding to the arc shape of the optical fiber 7 on the lower surface side of the upper member 10. One optical fiber 7 is arranged and guided in each of the guide grooves 14.

一方、図4(a)に示すように、下側部材20の上面側には光ファイバ7の円弧形状に対応した曲面を成す光ファイバ保持面22が設けられており、上側部材10と下側部材20によって光ファイバ7を挟み込むことにより、上側部材10のガイド溝14と下側部材20の光ファイバ保持面22との間で光ファイバ7を円弧状に曲げられた状態で保持するようになっている。   On the other hand, as shown in FIG. 4A, an optical fiber holding surface 22 having a curved surface corresponding to the arc shape of the optical fiber 7 is provided on the upper surface side of the lower member 20, and the upper member 10 and the lower side By sandwiching the optical fiber 7 by the member 20, the optical fiber 7 is held in a state of being bent in an arc shape between the guide groove 14 of the upper member 10 and the optical fiber holding surface 22 of the lower member 20. ing.

上部構造体5を組み立てる際には、上側部材10の両側面部に設けられた2つの係合穴13に下側部材20の両側面部に設けられた2つの係合爪21を係合させることにより上側部材10と下側部材20を互いに固定した後、光ファイバ7のテープファイバ8から露出して1本ずつに分かれた先端側部分を、上側部材10のガイド溝14に沿って挿入し、複数の光ファイバ7の端面7aを治具等を用いて揃え、接着剤により固定する。このようにして作製された上部構造体5の上側部材10、光ファイバ7、および下側部材20の配置状態を図5(a)および図5(b)に示す。   When assembling the upper structure 5, two engaging claws 21 provided on both side surfaces of the lower member 20 are engaged with two engaging holes 13 provided on both side surfaces of the upper member 10. After the upper member 10 and the lower member 20 are fixed to each other, the tip end portion exposed from the tape fiber 8 of the optical fiber 7 and separated into one piece is inserted along the guide groove 14 of the upper member 10. The end face 7a of the optical fiber 7 is aligned using a jig or the like and fixed with an adhesive. FIGS. 5A and 5B show the arrangement of the upper member 10, the optical fiber 7, and the lower member 20 of the upper structure 5 thus manufactured.

図5(b)に示すように、保持部材6に保持された光ファイバ7は、円弧状に曲げられることにより、水平な外部側光軸65aから下方へ向かう光素子側光軸65bへ光軸方向が変換されている。円弧部分の曲率半径Rは、好ましくは5mm以下、より好ましくは1〜3mmである。このように円弧部分の曲率半径Rは非常に小さく、上部構造体5の上下方向が低背化され、かつ、水平方向も小型化されている。なお、光ファイバ7の円弧状に曲げられた部分と端面7aとの間に、たとえば500μm以下の光ファイバ7の直線部分を設けるようにしてもよい。   As shown in FIG. 5 (b), the optical fiber 7 held by the holding member 6 is bent into an arc shape, so that the optical axis moves from the horizontal external optical axis 65a downward to the optical element side optical axis 65b. The direction has been changed. The radius of curvature R of the arc portion is preferably 5 mm or less, more preferably 1 to 3 mm. Thus, the radius of curvature R of the arc portion is very small, the vertical direction of the upper structure 5 is reduced in height, and the horizontal direction is also reduced in size. In addition, you may make it provide the linear part of the optical fiber 7 of 500 micrometers or less, for example between the part bent to the circular arc shape of the optical fiber 7, and the end surface 7a.

このように光ファイバ7の円弧部分の曲率半径Rを小さくするために、光ファイバ7として直径80μmのガラスファイバを用いている。一般的に多く用いられているガラスファイバの直径は125μmであるが、このガラスファイバはたとえば曲率半径15〜30mm程度に曲げると信号光が外部に漏れてしまう。しかし、上記のような細径のガラスファイバを用いることで、信号光の外部への漏れを抑制することができる。   Thus, in order to reduce the radius of curvature R of the arc portion of the optical fiber 7, a glass fiber having a diameter of 80 μm is used as the optical fiber 7. The diameter of a glass fiber that is generally used is 125 μm. However, if the glass fiber is bent to a radius of curvature of about 15 to 30 mm, for example, signal light leaks to the outside. However, leakage of signal light to the outside can be suppressed by using the thin glass fiber as described above.

光ファイバ7の外周部は樹脂材で被覆されており、これにより細径の光ファイバ7を補強するようにしている。この樹脂被覆は、厚さ22.5μmと薄くしており、これにより光ファイバ7の光学的な位置合わせの精度を確保するようにしている。   The outer peripheral portion of the optical fiber 7 is covered with a resin material, so that the thin optical fiber 7 is reinforced. This resin coating is as thin as 22.5 μm, thereby ensuring the accuracy of optical alignment of the optical fiber 7.

光ファイバ7におけるコアとクラッドの屈折率比(コア屈折率/クラッド屈折率)は、好ましくは1.5%以上として当該屈折率比を高くしている。このように高い屈折率比とすることで、信号光の外部への漏れをさらに抑制することができる。   The refractive index ratio between the core and the clad in the optical fiber 7 (core refractive index / cladding refractive index) is preferably 1.5% or higher to increase the refractive index ratio. By setting the refractive index ratio to be high in this way, leakage of signal light to the outside can be further suppressed.

図6は、光素子搭載基板30の上面側斜視図である。同図に示す光素子搭載基板30は、外周部に沿って壁部32が立設された箱状のセラミック基板31を備えており、セラミック基板31上の前方側の位置には光ファイバ7と同数の光素子40が並んで搭載されている。これらの複数の光素子40は、面発光素子のVCSELと面受光素子のPINフォトダイオードから構成されている。壁部32の上面32aは光学的基準面を構成しており、上部構造体5の下面に当接することにより、光ファイバ7の端面7aと光素子40とが垂直方向に位置決めされる。   FIG. 6 is a top perspective view of the optical element mounting substrate 30. The optical element mounting substrate 30 shown in the figure includes a box-shaped ceramic substrate 31 having a wall portion 32 erected along the outer periphery, and the optical fiber 7 and the optical fiber 7 are positioned on the front side of the ceramic substrate 31. The same number of optical elements 40 are mounted side by side. The plurality of optical elements 40 includes a VCSEL as a surface light emitting element and a PIN photodiode as a surface light receiving element. The upper surface 32a of the wall portion 32 forms an optical reference surface, and the end surface 7a of the optical fiber 7 and the optical element 40 are positioned in the vertical direction by contacting the lower surface of the upper structure 5.

セラミック基板31上における光素子40の後方には、光素子40のドライバ集積回路装置41が搭載されており、光素子40とドライバ集積回路装置41はボンディングワイヤによって接続されている。その他、セラミック基板31上には他の電子部品が搭載されていると共に、セラミック基板31上の電子部品は、プリント配線33等から、図示はしないが、セラミック基板31を貫通するスルーホールを介して、セラミック基板31の裏面に設けられたピッチ500μm、直径300〜350μm、高さ10μmのパッド電極に電気的に接続されている。   A driver integrated circuit device 41 of the optical element 40 is mounted behind the optical element 40 on the ceramic substrate 31, and the optical element 40 and the driver integrated circuit device 41 are connected by a bonding wire. In addition, other electronic components are mounted on the ceramic substrate 31, and the electronic components on the ceramic substrate 31 are connected to the printed wiring 33 and the like through a through hole that passes through the ceramic substrate 31 (not shown). The electrode is electrically connected to a pad electrode having a pitch of 500 μm, a diameter of 300 to 350 μm, and a height of 10 μm provided on the back surface of the ceramic substrate 31.

セラミック基板31上における光素子40の両側の位置には、突出高さ2mm、突出部分の直径0.7mmの一対の位置決めピン42が立設されており、これらの位置決めピン42が上部構造体5の位置決め穴11に挿入されることにより光素子搭載基板30と上部構造体5が水平方向に位置決めされるようになっている。   A pair of positioning pins 42 having a protruding height of 2 mm and a protruding portion diameter of 0.7 mm are erected at positions on both sides of the optical element 40 on the ceramic substrate 31, and these positioning pins 42 serve as the upper structure 5. The optical element mounting substrate 30 and the upper structure 5 are positioned in the horizontal direction by being inserted into the positioning holes 11.

光モジュール1を図1のように光接続および電気接続が切り離された状態から図2のように光接続および電気接続をした状態に組み立てる際には、まず、図1の配線基板70上に固定された嵌合部材50の開口部51内に異方導電性シート60を配置する。次いでその上に光素子搭載基板30を配置し、さらにその上から上部構造体5を嵌合部材50に垂直に嵌め込む。   When the optical module 1 is assembled from the state where the optical connection and the electrical connection are disconnected as shown in FIG. 1 to the state where the optical connection and the electrical connection are made as shown in FIG. 2, first, the optical module 1 is fixed on the wiring board 70 of FIG. The anisotropic conductive sheet 60 is disposed in the opening 51 of the fitting member 50 that has been made. Next, the optical element mounting substrate 30 is disposed thereon, and the upper structure 5 is vertically fitted into the fitting member 50 from above.

このとき、光素子搭載基板30の位置決めピン42が上部構造体5の位置決め穴11に挿入されて、光素子搭載基板30に対して上部構造体5が水平方向に所定の精度、たとえば3〜5μmの精度で位置決めされると共に、保持部材6の側面が嵌合部材50の側板部53に規制されて、光素子搭載基板30が配線基板70に対して間接的に水平方向に位置決めされる。配線基板70上には、ピッチ500μm、直径300〜350μmのはんだバンプが形成されており、これらのはんだバンプに対して、光素子搭載基板30の下面に設けられたピッチ500μm、直径300〜350μmの裏面電極が位置合わせされる。   At this time, the positioning pins 42 of the optical element mounting substrate 30 are inserted into the positioning holes 11 of the upper structure 5, and the upper structure 5 is in a horizontal direction with respect to the optical element mounting substrate 30 with a predetermined accuracy, for example 3 to 5 μm. In addition, the side surface of the holding member 6 is regulated by the side plate portion 53 of the fitting member 50, and the optical element mounting substrate 30 is indirectly positioned with respect to the wiring substrate 70 in the horizontal direction. Solder bumps having a pitch of 500 μm and a diameter of 300 to 350 μm are formed on the wiring substrate 70, and a pitch of 500 μm and a diameter of 300 to 350 μm provided on the lower surface of the optical element mounting substrate 30 with respect to these solder bumps. The back electrode is aligned.

そして、嵌合部材50の弾性により上部構造体5は下方に押圧され、これにより異方導電性シート60が加圧されて導通状態となる。これにより、異方導電性シート60を介して光素子搭載基板30の裏面電極と配線基板70上のはんだバンプとが電気的に接続される。   Then, the upper structure 5 is pressed downward by the elasticity of the fitting member 50, whereby the anisotropic conductive sheet 60 is pressurized and becomes conductive. Thereby, the back electrode of the optical element mounting substrate 30 and the solder bump on the wiring substrate 70 are electrically connected via the anisotropic conductive sheet 60.

また、光素子搭載基板30の位置決めピン42が上部構造体5の位置決め穴11に挿入されることにより、図7の断面図に示すように光ファイバ7の端面7aと、光素子40との水平方向の位置決めがされると共に、保持部材6の下面6aと光素子搭載基板30の壁部32の上面32aとが当接することにより、光ファイバ7の端面7aと、光素子40との垂直方向の位置決めがされて、これらが光学的に接続される。   Further, when the positioning pins 42 of the optical element mounting substrate 30 are inserted into the positioning holes 11 of the upper structure 5, the end surface 7 a of the optical fiber 7 and the optical element 40 are horizontally aligned as shown in the sectional view of FIG. 7. In addition to the positioning of the direction, the lower surface 6a of the holding member 6 and the upper surface 32a of the wall portion 32 of the optical element mounting substrate 30 come into contact with each other, whereby the end surface 7a of the optical fiber 7 and the optical element 40 are perpendicular to each other. Once positioned, they are optically connected.

このとき、図8に拡大して示したように、光素子搭載基板30上に並ぶそれぞれの光素子40はボンディングワイヤ34を介して外部と電気的に接続されているが、上部構造体5の下面の高さを光ファイバ7の端面7aと一致させると、光ファイバ7の端面7aと光素子40とを所定の距離まで近接させて光接続しようとしたときに、高さがたとえば70μm程度あるボンディングワイヤ34に上部構造体5の下面が接触してしまうことになる。   At this time, as shown in an enlarged view in FIG. 8, the optical elements 40 arranged on the optical element mounting substrate 30 are electrically connected to the outside via bonding wires 34. When the height of the lower surface is matched with the end surface 7a of the optical fiber 7, the height is, for example, about 70 μm when the end surface 7a of the optical fiber 7 and the optical element 40 are brought close to each other to be optically connected. The lower surface of the upper structure 5 comes into contact with the bonding wire 34.

そこで、光ファイバ7の端面7aの近傍における円弧内側を保持部材6から露出させて空間を設け、この空間をボンディングワイヤ34の逃げ部75としている。この逃げ部75は、たとえば、光ファイバ7の直径とのアスペクト比が1:1程度となるように光ファイバ7の端面7a近傍を露出させることで形成される。たとえば、樹脂被覆を合わせた直径が125μmの光ファイバ7を用いた場合、光ファイバ7の円弧内側における露出高さを100μm程度することが好ましい。逃げ部75の高さを大きくし過ぎると、光ファイバ7の位置決め精度が低下してしまう。   Therefore, a space is provided by exposing the inner side of the arc in the vicinity of the end face 7 a of the optical fiber 7 from the holding member 6, and this space is used as a relief portion 75 of the bonding wire 34. The escape portion 75 is formed, for example, by exposing the vicinity of the end face 7a of the optical fiber 7 so that the aspect ratio with the diameter of the optical fiber 7 is about 1: 1. For example, when the optical fiber 7 having a diameter of 125 μm combined with the resin coating is used, it is preferable that the exposure height inside the circular arc of the optical fiber 7 is about 100 μm. If the height of the escape portion 75 is excessively increased, the positioning accuracy of the optical fiber 7 is lowered.

以上のようにして、光モジュール1は図2に示す状態で垂直方向へ電気的および光学的に接続され、光ファイバ7を通じて外部との間で伝送される光信号の送受信が可能な状態とされる。   As described above, the optical module 1 is electrically and optically connected in the vertical direction in the state shown in FIG. 2 and is capable of transmitting and receiving optical signals transmitted to the outside through the optical fiber 7. The

そして、たとえば保守交換時などにおいては、上部構造体5を嵌合部材50から垂直に抜き出すことで光接続を容易に切り離すことができ、次いで光素子搭載基板30を異方導電性シート60上から垂直に取り出すことで電気接続を容易に切り離すことができる。   For example, during maintenance replacement, the optical connection can be easily disconnected by pulling out the upper structure 5 vertically from the fitting member 50, and then the optical element mounting substrate 30 is removed from the anisotropic conductive sheet 60. Electrical connection can be easily disconnected by taking out vertically.

以上に、実施形態に基づき本発明を説明したが、本発明は上記の実施形態に何ら限定されるものではなく、その要旨を逸脱しない範囲内において各種の変更が可能である。たとえば、上記の実施形態では、下部構造体25を光素子搭載基板30および異方導電性シート60から構成する例を示したが、その他、光素子搭載基板30を配線基板70にはんだ接続した構造など、各種の構造とすることができる。   The present invention has been described above based on the embodiments. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. For example, in the above-described embodiment, the example in which the lower structure 25 is configured by the optical element mounting substrate 30 and the anisotropic conductive sheet 60 has been described. However, in addition, the structure in which the optical element mounting substrate 30 is solder-connected to the wiring substrate 70. Various structures can be adopted.

上記の実施形態では、嵌合部材50を用いて上部構造体5を垂直方向へ着脱自在に装着し、光素子搭載基板30の光素子40に対して上部構造体5の光伝送路を光学的に接続するようにしたが、このような機能を有する装着体として、他の機構によるものを用いるようにしてもよい。   In the above embodiment, the upper structure 5 is detachably mounted in the vertical direction using the fitting member 50, and the optical transmission path of the upper structure 5 is optically connected to the optical element 40 of the optical element mounting substrate 30. However, as a mounting body having such a function, an attachment by another mechanism may be used.

光素子40として、レーザダイオードなどのVCSEL以外の面発光素子を用いてもよく、PINフォトダイオード以外の面受光素子を用いるようにしてもよい。   As the optical element 40, a surface light emitting element other than a VCSEL such as a laser diode may be used, or a surface light receiving element other than a PIN photodiode may be used.

図1は、本発明の一実施形態における光モジュールを示す斜視図であり、光接続および電気接続を切り離した状態を示す。FIG. 1 is a perspective view showing an optical module according to an embodiment of the present invention, and shows a state where an optical connection and an electrical connection are disconnected. 図2は、図1の光モジュールにおける光接続および電気接続をした状態を示す斜視図である。FIG. 2 is a perspective view showing a state where optical connection and electrical connection are made in the optical module of FIG. 図3は、上部構造体を示した図であり、(a)は上面図、(b)は下面図、(c)は側面図である。3A and 3B are views showing the upper structure, in which FIG. 3A is a top view, FIG. 3B is a bottom view, and FIG. 3C is a side view. 図4は、保持部材の上側部材および下側部材を示した図であり、(a)は上面側の斜視図、(b)は下面側の斜視図である。4A and 4B are diagrams showing an upper member and a lower member of the holding member, wherein FIG. 4A is a perspective view of the upper surface side, and FIG. 4B is a perspective view of the lower surface side. 図5は、上部構造体の上側部材、光ファイバ、および下側部材の配置状態を示した図であり、(a)は斜視図、(b)は断面図である。5A and 5B are views showing the arrangement of the upper member, the optical fiber, and the lower member of the upper structure, in which FIG. 5A is a perspective view and FIG. 5B is a cross-sectional view. 図6は、光素子搭載基板の斜視図である。FIG. 6 is a perspective view of the optical element mounting substrate. 図7は、上部構造体の光ファイバと光素子搭載基板の光素子とが光接続された状態を示す断面図である。FIG. 7 is a cross-sectional view showing a state where the optical fiber of the upper structure and the optical element of the optical element mounting substrate are optically connected. 図8は、上部構造体の光ファイバと光素子搭載基板の光素子とが光接続されたときの光接続部分の周囲を示した図である。FIG. 8 is a view showing the periphery of the optical connection portion when the optical fiber of the upper structure and the optical element of the optical element mounting substrate are optically connected.

符号の説明Explanation of symbols

1 光モジュール
5 上部構造体
6 保持部材
6a 下面
7 光ファイバ
7a 端面
8 テープファイバ
10 上側部材
11 位置決め穴
12 肩部
13 係合穴
14 ガイド溝
20 下側部材
21 係合爪
22 光ファイバ保持面
25 下部構造体
30 光素子搭載基板
31 セラミック基板
32 壁部
32a 上面
33 プリント配線
34 ボンディングワイヤ
40 光素子
41 ドライバ集積回路
42 位置決めピン
50 嵌合部材
51 開口部
52 突条部
53 側板部
60 異方導電性シート
65a 外部側光軸
65b 光素子側光軸
70 配線基板
75 逃げ部
DESCRIPTION OF SYMBOLS 1 Optical module 5 Upper structure 6 Holding member 6a Lower surface 7 Optical fiber 7a End surface 8 Tape fiber 10 Upper member 11 Positioning hole 12 Shoulder part 13 Engaging hole 14 Guide groove 20 Lower member 21 Engaging claw 22 Optical fiber holding surface 25 Lower structure 30 Optical element mounting substrate 31 Ceramic substrate 32 Wall 32a Upper surface 33 Printed wiring 34 Bonding wire 40 Optical element 41 Driver integrated circuit 42 Positioning pin 50 Fitting member 51 Opening 52 Projection 53 Side plate 60 Anisotropic conduction Sheet 65a External side optical axis 65b Optical element side optical axis 70 Wiring board 75 Relief part

Claims (5)

光信号を伝送する光伝送体と、光信号を電気信号に変換し、または電気信号を光信号に変換する光素子とを光学的に接続する光モジュールであって、円弧状に曲げられた構造を有し、外部側の光軸と光素子側の光軸とが互いに垂直である光伝送体および当該光伝送体を保持する保持部材を備えた上部構造体と、光素子が搭載されており、光素子に対して上部構造体の光伝送体が光学的に接続されるように上部構造体が上側に位置決めされて配置される下部構造体とを備えており、上部構造体が下部構造体の上に配置されたときに、光伝送体の端面が光素子と対向して配置されることにより光伝送体と光素子とが光学的に接続されることを特徴とする光モジュール。   An optical module that optically connects an optical transmission body that transmits an optical signal and an optical element that converts the optical signal into an electrical signal or converts the electrical signal into an optical signal, and is bent in an arc shape And an optical element mounted with an optical transmission body in which the optical axis on the external side and the optical axis on the optical element side are perpendicular to each other, and a holding member for holding the optical transmission body. The upper structure is positioned so that the optical transmission body of the upper structure is optically connected to the optical element, and the upper structure is disposed on the upper side. An optical module, wherein the optical transmission body and the optical element are optically connected by arranging the end face of the optical transmission body so as to face the optical element when arranged on the top. 光伝送体の曲率半径が5mm以下であることを特徴とする請求項1に記載の光モジュール。   The optical module according to claim 1, wherein a radius of curvature of the optical transmission body is 5 mm or less. 光伝送体が光ファイバであり、光ファイバの外周部が樹脂材で被覆されていることを特徴とする請求項1または2に記載の光モジュール。   The optical module according to claim 1, wherein the optical transmission body is an optical fiber, and an outer peripheral portion of the optical fiber is covered with a resin material. 光伝送体におけるコアとクラッドの屈折率比(コア屈折率/クラッド屈折率)が1.5%以上であることを特徴とする請求項1から3のいずれかに記載の光モジュール。   The optical module according to any one of claims 1 to 3, wherein a refractive index ratio (core refractive index / cladding refractive index) of the core and the clad in the optical transmission body is 1.5% or more. 下部構造体に搭載された光素子は、ボンディングワイヤによって外部に電気的に接続されており、上部構造体の光伝送体は、端面近傍における円弧内側が保持部材から露出しており、上部構造体には、当該露出した領域に沿って、上部構造体が下部構造体の上に配置されたときにボンディングワイヤの少なくとも一部が位置する空間であるボンディングワイヤの逃げ部が形成されていることを特徴とする請求項1から4のいずれかに記載の光モジュール。   The optical element mounted on the lower structure is electrically connected to the outside by a bonding wire, and the optical transmission body of the upper structure is exposed from the holding member at the inner side of the arc in the vicinity of the end surface. In this case, a bonding wire escape portion is formed along the exposed region, which is a space in which at least a part of the bonding wire is located when the upper structure is disposed on the lower structure. 5. The optical module according to claim 1, wherein the optical module is characterized in that:
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JP2009244612A (en) * 2008-03-31 2009-10-22 Furukawa Electric Co Ltd:The Optical waveguide attaching component, optical waveguide connector, and method for manufacturing optical waveguide connector
JP2012068535A (en) * 2010-09-24 2012-04-05 Fujitsu Ltd Multi-core optical connector
JP2018112582A (en) * 2017-01-06 2018-07-19 富士通株式会社 Optical module and electronic apparatus using the same
CN110023805A (en) * 2016-09-12 2019-07-16 优导股份有限公司 Bending-type optical module and the method for manufacturing the bending-type optical module

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* Cited by examiner, † Cited by third party
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JP2009244612A (en) * 2008-03-31 2009-10-22 Furukawa Electric Co Ltd:The Optical waveguide attaching component, optical waveguide connector, and method for manufacturing optical waveguide connector
JP2012068535A (en) * 2010-09-24 2012-04-05 Fujitsu Ltd Multi-core optical connector
CN110023805A (en) * 2016-09-12 2019-07-16 优导股份有限公司 Bending-type optical module and the method for manufacturing the bending-type optical module
JP2019530021A (en) * 2016-09-12 2019-10-17 ヨッターン インクYottahn, Inc. Bent optical module and method for manufacturing the same
CN110023805B (en) * 2016-09-12 2021-08-20 优导股份有限公司 Curved optical module and method of manufacturing the same
JP2018112582A (en) * 2017-01-06 2018-07-19 富士通株式会社 Optical module and electronic apparatus using the same

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