JP2009039829A - Diamond wheel - Google Patents

Diamond wheel Download PDF

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JP2009039829A
JP2009039829A JP2007208532A JP2007208532A JP2009039829A JP 2009039829 A JP2009039829 A JP 2009039829A JP 2007208532 A JP2007208532 A JP 2007208532A JP 2007208532 A JP2007208532 A JP 2007208532A JP 2009039829 A JP2009039829 A JP 2009039829A
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grinding
diamond wheel
bond
diamond
layer
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JP5540464B2 (en
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Kazuo Yamada
和男 山田
Kazuaki Bando
和明 坂東
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Bando Kiko Co Ltd
Nippon Sheet Glass Co Ltd
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Bando Kiko Co Ltd
Nippon Sheet Glass Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a diamond wheel capable of providing a grinding fluid carrying effect and rapid chip discharge, and also providing a sufficient cooling effect by increasing the amount of a grinding fluid reaching a grinding point, that is, the inside of a contact circular arc, even during high-speed grinding. <P>SOLUTION: In this diamond wheel 1, circumferentially-segmented abrasive grain layers 8 formed by sintering diamond abrasive grains and bond materials are arranged and formed around the periphery of a metal base 2 with clearances 6, bond layers 7A, 7B, 7C... formed by sintering the bond materials are filled into the clearances 6 between segments of the abrasive grain layers 8, and a successive grinding operative surface 4 is circumferentially formed in such a manner that the abrasive grain layers 8 and bond layers 7A, 7B, 7C... are alternately arranged. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、ダイヤモンドホイールの構造に関するものである。また、本発明は板ガラス、セラミックスなどの研削、研磨加工用として使用するダイヤモンドホイールである。さらに、自動車の窓ガラス用板ガラスの周縁エッヂの高速研削に使用するダイヤモンドホイールに係るものでもある。   The present invention relates to the structure of a diamond wheel. The present invention also relates to a diamond wheel used for grinding and polishing of glass sheets and ceramics. Further, the present invention relates to a diamond wheel used for high-speed grinding of a peripheral edge of a plate glass for automobile window glass.

特開２０００−２３３３７４号公報JP 2000-233374 A

ところで、自動車用板ガラスの高速研削においては、ホイール周速度と送り速度が大きく、重研削となり、非常に研削抵抗が大きい。従って、多量の研削熱が生じ、「研削焼け」など熱的損傷の発生頻度が多くなる。   By the way, in high-speed grinding of automotive glass sheets, wheel peripheral speed and feed speed are large, heavy grinding is performed, and grinding resistance is very large. Therefore, a large amount of grinding heat is generated, and the frequency of occurrence of thermal damage such as “grinding burn” increases.

よって、高速研削では、研削圏である接触円弧内をより効果的に冷却することが要求される。   Therefore, in high-speed grinding, it is required to cool the inside of the contact arc that is a grinding zone more effectively.

そこで、冷却効果を上げるひとつの方法として、接触円弧内に研削液を十分に到達させ、浸潤させるために、直角ノズル、フローティングノズル、導液シートなどいろいろな研削液用ノズルが考案されている。   Therefore, as one method for increasing the cooling effect, various grinding liquid nozzles such as a right angle nozzle, a floating nozzle, and a liquid guide sheet have been devised in order to sufficiently reach and infiltrate the grinding liquid into the contact arc.

しかし、金属や非鉄金属の研削と比較した場合に、自動車用板ガラスの高速研削では、研削除去速度が非常に高く、かつ、切屑がパウダー状であるので、上記研削液用ノズルを用いた冷却効果は低いものである。また、自動車用板ガラスの形状は、複雑な自由曲線からなり、上記の研削液用ノズルの配置が研削点よりも離れた位置にしか設置できず、十分な効果が得られない。故に、現状では、研削液の供給量を可能な限り大きく、ノズル口を研削作用点、つまり接触円弧を直接狙うことが有利とされている。また、接触円弧内での冷却効果を上げる一般的な方法として、高チップポケット率のダイヤモンドホイール、研削作用面に溝またはスリットが形成されたセグメントタイプのダイヤモンドホイールの使用が有効とされている。高速研削時の研削液のキャリィ効果や速やかな切屑排出に大きく影響を与える。しかしながら、上記セグメントタイプのダイヤモンドホイールは、ホイール外周部近傍の連れ回り空気層の流速が大きく、高いホイール周速度では、冷却効率が逆に悪化する。供給される研削液が空気層の流速により遮られ、接触円弧内に十分に到達し得ないからである。   However, compared with grinding of metals and non-ferrous metals, the grinding removal speed is very high and the chip is powdery in high-speed grinding of automotive sheet glass, so the cooling effect using the above grinding fluid nozzle Is low. Moreover, the shape of the glass sheet for automobiles is a complex free curve, and the above-described arrangement of the nozzles for the grinding liquid can be installed only at a position away from the grinding point, and a sufficient effect cannot be obtained. Therefore, at present, it is advantageous to increase the supply amount of the grinding fluid as much as possible and directly aim the nozzle port at the grinding action point, that is, the contact arc. As a general method for increasing the cooling effect in the contact arc, it is effective to use a diamond wheel having a high chip pocket ratio and a segment type diamond wheel in which grooves or slits are formed on the grinding surface. It greatly affects the carry effect of the grinding fluid during high-speed grinding and rapid chip discharge. However, the segment type diamond wheel has a large flow velocity of the accompanying air layer in the vicinity of the outer periphery of the wheel, and the cooling efficiency deteriorates at a high wheel peripheral speed. This is because the supplied grinding fluid is blocked by the flow velocity of the air layer and cannot sufficiently reach the contact arc.

そこで、本発明は、高速度研削においても、研削液のキャリィ効果や速やかな切屑排出が得られると共に、研削点つまり接触円弧内への研削液の到達量を多くして十分な冷却効果が得られるダイヤモンドホイールを提供することにある。   Therefore, the present invention provides a carry effect of the grinding fluid and quick chip discharge even in high-speed grinding, and a sufficient cooling effect can be obtained by increasing the amount of grinding fluid reaching the grinding point, that is, the contact arc. Is to provide a diamond wheel.

本発明のダイヤモンドホイールは、台金の外周に、ダイヤモンド砥粒とボンド材との焼結からなる砥粒層が周方向にセグメント状に隙間をもって配列形成され、これら砥粒層のセグメントとセグメントの間の上記の各隙間にボンド材の焼結からなるボンド層が充填されて、研削作用面が周方向において、砥粒層とボンドとが交互に配列して連続に形成したことを特徴とする。   In the diamond wheel of the present invention, on the outer periphery of the base metal, an abrasive grain layer formed by sintering diamond abrasive grains and a bond material is formed in the circumferential direction with a gap in the form of a segment. Each of the above gaps is filled with a bond layer made of sintered bond material, and the grinding surface is circumferentially formed, and the abrasive layer and the bond are alternately arranged to form continuously. .

上記ボンド材は特に限定されず、公知のメタルボンド、レジノイドボンド、ビトリファイドなどを使用することができる。また、ボンド層は耐磨耗の低い、すなわち削られ易い材質のものでもよい。さらに、上記ボンド層は、後述の本発明の作用効果、例えば、研削中にボンド層表面にポケットが生成されてゆくような作用を奏するなら、少々砥粒が入っていてよい。   The bond material is not particularly limited, and a known metal bond, resinoid bond, vitrified, or the like can be used. The bond layer may be made of a material having low wear resistance, that is, a material that can be easily cut. Furthermore, the above-mentioned bond layer may contain a little abrasive grains as long as the effect of the present invention described later, for example, the effect that pockets are generated on the surface of the bond layer during grinding.

セグメントを形成する砥粒層のボンド表面と上部ボンド層の表面は研削作業中、互いに同程度に削り落とされてゆき、各セグメントの砥粒層のポケット表面には砥粒の突出しが、各ボンド層の表面にはポケットが生成される。即ち、作用面の周方向において、砥粒層の各セグメントの間に、深く滑らかで、確実なポケットが形成される。これら各ポケットには供給された研削液の流れ込みを受けてキャリー効果を生成すると共に、切屑の速やかな排出作用を発揮する。この点従来のセグメントタイプホイールと同作用を奏するが、従来のセグメントタイプホイールに比べ、砥粒層を形成する各セグメント部と隣り合う各セグメント間の隙間に充填された各ボンド層とは周方向において連続した研削作用面を保つ。このためホイールの高速度回転においても、ホイール外周近傍の連れ回り空気層の流速は従来のコンティニュアスホイール（砥粒層が連続した研削作用面をもつホイール）と同程度に保たれ、ノズルから狙った研削点への供給の研削液は上記連れ回りの空気層に遮られることなく研削点、つまり接触円弧内へ十分に到達、浸潤させることができる。従って、自動車用板ガラスの高速研削においての研削作用面での多量の研削熱の発生があって、良好に冷却効果を発揮するものである。   The bond surface of the abrasive layer forming the segment and the surface of the upper bond layer are scraped off to the same extent during the grinding operation, and the protrusion of the abrasive grains protrudes from the pocket surface of the abrasive layer of each segment. Pockets are created on the surface of the layer. That is, a deep, smooth and reliable pocket is formed between the segments of the abrasive layer in the circumferential direction of the working surface. Each of these pockets receives a flow of the supplied grinding fluid to generate a carry effect and also exhibits a quick chip discharging action. In this respect, it has the same effect as the conventional segment type wheel, but in comparison with the conventional segment type wheel, each segment layer forming the abrasive grain layer and each bond layer filled in the gap between each adjacent segment are in the circumferential direction. Keeps the continuous grinding surface. For this reason, even at high-speed rotation of the wheel, the flow velocity of the accompanying air layer in the vicinity of the outer periphery of the wheel is maintained at the same level as that of a conventional continuous wheel (a wheel having a grinding surface with a continuous abrasive layer). The grinding fluid supplied to the target grinding point can sufficiently reach and infiltrate the grinding point, that is, the contact arc without being obstructed by the accompanying air layer. Therefore, a large amount of grinding heat is generated on the grinding surface during high-speed grinding of automotive glass sheets, and the cooling effect is satisfactorily exhibited.

以下、本発明の実施例を示し、本発明の効果を明らかにする。   Examples of the present invention will be shown below to clarify the effects of the present invention.

第1図から第３図は板ガラスのエッヂを研削（面取り研削ともいう）するストレートダイヤモンドホイール１（ペンシルエッヂホイール）が示してある。   FIGS. 1 to 3 show a straight diamond wheel 1 (pencil edge wheel) for grinding an edge of a sheet glass (also called chamfering grinding).

第１図は断面を示したものであり、第２図は外周面に形成の研削作用面を示したものである。さて、本ダイヤモンドホイール１は台金２の外周面３に溝形状の研削作用面４が周方向に形成してある。   FIG. 1 shows a cross section, and FIG. 2 shows a grinding action surface formed on the outer peripheral surface. The diamond wheel 1 has a groove-shaped grinding surface 4 formed in the circumferential direction on the outer peripheral surface 3 of the base metal 2.

この研削作用面４は、周方向において、砥粒層からなるセグメント５Ａ、５Ｂ、５Ｃ・・・と、これら隣り合うセグメント５Ａ、５Ｂ、５Ｃ・・・の間に形成した各隙間６に充填して形成されたボンド層７Ａ、７Ｂ、７Ｃ・・・とが交互に配列して構成され、連続した研削作用面を形成している。研削作用面は在来のコンティニュアスなダイヤモンドホイールと同形状である。上記の各セグメント５Ａ、５Ｂ、５Ｃ・・・はダイヤモンド砥粒とメタルボンド材との焼結からなる砥粒層８から形成されている。   The grinding surface 4 is filled in the gaps 6 formed between the segments 5A, 5B, 5C,... And the adjacent segments 5A, 5B, 5C,. The bond layers 7A, 7B, 7C,... Formed in this manner are alternately arranged to form a continuous grinding surface. The grinding surface has the same shape as a conventional continuous diamond wheel. Each of the segments 5A, 5B, 5C,... Is formed from an abrasive grain layer 8 formed by sintering diamond abrasive grains and a metal bond material.

上記の各ボンド層７Ａ、７Ｂ、７Ｃ・・・はメタルボンド材のみの焼結からなる。   Each of the above bond layers 7A, 7B, 7C,... Consists of sintering of a metal bond material only.

上記ボンド層７Ａ、７Ｂ、７Ｃ・・・のボンド層は、砥粒層８のボンド材と同じ材質を使用してもよく、また、耐磨耗の低い、すなわち削られ易い材質のものでもよい。   The bond layers of the bond layers 7A, 7B, 7C,... May be made of the same material as the bond material of the abrasive layer 8, or may be made of a material with low wear resistance, that is, easy to be cut. .

各セグメント５Ａ、５Ｂ、５Ｃ・・・の間に形成した隙間６、即ち、各ボンド層７Ａ、７Ｂ、７Ｃ・・・の周方向の幅寸法は、使用部分野に応じて適宜に定められる。   The gap 6 formed between the segments 5A, 5B, 5C..., That is, the width dimension in the circumferential direction of each bond layer 7A, 7B, 7C.

また、第３図には、自動車用板ガラス用として制作した実施例のダイヤモンドホイールの一例が示してある。上記のボンド層７Ａ、７Ｂ、７Ｃ・・・の幅寸法は、２ミリメートルである。そして、この本実施例のダイヤモンドホイール１Ｂと従来の板ガラス研削用のダイヤモンドホイールとの比較研削テストを行った結果が第４図に示されている。研削作用面つまり接触円弧内の有効冷却効果を有する範囲内での両ホイールの上限回転速度の計測である。   FIG. 3 shows an example of a diamond wheel according to an embodiment produced for an automotive glass sheet. The width dimension of said bond layer 7A, 7B, 7C ... is 2 millimeters. FIG. 4 shows the result of a comparative grinding test between the diamond wheel 1B of this example and a conventional diamond wheel for plate glass grinding. It is a measurement of the upper limit rotational speed of both wheels within a range having an effective cooling effect within the grinding working surface, that is, the contact arc.

第４図に示す結果によると、本発明実施例でのダイヤモンドホイールのほうが、在来の板ガラス研削ダイヤモンドホイールと比べ、より高速度域でも冷却効果を発揮することが判る。   According to the results shown in FIG. 4, it can be seen that the diamond wheel in the embodiment of the present invention exhibits a cooling effect even in a higher speed region than the conventional plate glass grinding diamond wheel.

第５図及び第６図には、本発明を実施したメタルボンドからなるカップタイプのダイヤモンドホイールが示されている。   FIGS. 5 and 6 show a cup-type diamond wheel made of a metal bond embodying the present invention.

また、本発明のダイヤモンドホイールはボンド材として公知のレジノイドボンド材を使用して、カップタイプのレシンダイヤホイールを実施化しても本発明の特有の効果を発揮する。   Further, the diamond wheel of the present invention exhibits the specific effects of the present invention even when a known resinoid bond material is used as a bond material and a cup type resin wheel is implemented.

本発明ダイヤモンドホイール１は、以上に説明したように、周方向において、砥粒層８からなるセグメント５Ａ、５Ｂ、５Ｃ・・・とこれらセグメント５Ａ、５Ｂ、５Ｃ・・・の隣り合う間に形成の隙間６Ａ、６Ｂ、６Ｃ・・・に充填したボンド材のボンド層７Ａ、７Ｂ、７Ｃ・・・との交互の配列により連続した研削作用面４が形成された構造を特徴とするものである。   As described above, the diamond wheel 1 of the present invention is formed in the circumferential direction between the segments 5A, 5B, 5C,... And the segments 5A, 5B, 5C,. The gaps 6A, 6B, 6C,... Are characterized by a structure in which continuous grinding surfaces 4 are formed by alternating arrangement of bond layers 7A, 7B, 7C,. .

この結果、研削中、セグメント５Ａ、５Ｂ、５Ｃ・・・を形成する砥粒層８のボンド部１０とボンド層７Ａ、７Ｂ、７Ｃ・・・とは研削作業中、互いに同程度、同径に削り落とされてゆき、各ボンド層７Ａ、７Ｂ、７Ｃ・・・にはポケット１１が生成される（第９図）。   As a result, during grinding, the bond portion 10 of the abrasive grain layer 8 forming the segments 5A, 5B, 5C,... And the bond layers 7A, 7B, 7C,. The pockets 11 are generated in the bond layers 7A, 7B, 7C... (FIG. 9).

即ち、砥粒層８からなる各セグメント５Ａ、５Ｂ、５Ｃ・・・どうしの間には、深く滑らかで、確実なポケット１１が形成される。これら各ポケット１１には供給された研削液の流れ込みを受けてキャリィー効果を生成すると共に、切屑を集め受け、ポケット８が研削圏を通りすぎると、外部へ放出する作用を発揮する。   That is, a deep, smooth and reliable pocket 11 is formed between the segments 5A, 5B, 5C,. Each of these pockets 11 receives the flow of the supplied grinding fluid to generate a carry effect, collects and receives chips, and exerts an action of discharging to the outside when the pocket 8 passes through the grinding zone.

さらに、砥粒層を形成する各セグメント５Ａ、５Ｂ、５Ｃ・・・部と隣り合う各セグメント間の隙間６に充填された各ボンド層７Ａ、７Ｂ、７Ｃ・・・とは周方向に連続した研削作用面４を保つ。このため、ホイールの高速度回転においても、ホイール外周近傍の連れ回り空気層の流速は従来のコンティニュアスホイール（砥粒層が連続した研削作用面をもつホイール）と同程度に保たれ、ノズルから狙った研削点への供給の研削液は、上記連れ回りの空気層に遮られることなく、研削点、つまり接触円弧内へ十分に到達、浸潤させることができる。従って、自動車用板ガラスの高速研削においての研削作用面での多量の研削熱の発生があって、良好に冷却効果を発揮するものである。   Further, each of the bond layers 7A, 7B, 7C,... Filled in the gaps 6 between the segments 5A, 5B, 5C,. The grinding surface 4 is maintained. For this reason, even at high-speed rotation of the wheel, the flow velocity of the accompanying air layer in the vicinity of the outer periphery of the wheel is maintained at the same level as that of a conventional continuous wheel (wheel having a grinding surface with a continuous abrasive layer), and the nozzle The grinding fluid supplied to the grinding point aimed at can sufficiently reach and infiltrate the grinding point, that is, the contact arc without being blocked by the accompanying air layer. Therefore, a large amount of grinding heat is generated on the grinding surface during high-speed grinding of automotive glass sheets, and the cooling effect is satisfactorily exhibited.

板ガラスの周縁エッヂを研削加工するストレートダイヤモンドホイールの断面図である。It is sectional drawing of the straight diamond wheel which grind-processes the peripheral edge of plate glass. 図１に示すストレートダイヤモンドホイールの正面図である。It is a front view of the straight diamond wheel shown in FIG. 自動車用板ガラスの研削テストに使用したストレートダイヤモンドホイールのセグメントの分割割合及びボンド層の幅寸法を示す説明図である。It is explanatory drawing which shows the division | segmentation ratio of the segment of the straight diamond wheel used for the grinding test of the plate glass for motor vehicles, and the width dimension of a bond layer. テスト結果を示す表図である。It is a table | surface figure which shows a test result. カップタイプダイヤモンドホイールの正面図である。It is a front view of a cup type diamond wheel. 図５に示すカップタイプダイヤモンドホイールの断面図である。It is sectional drawing of the cup type diamond wheel shown in FIG. 研削作業中において、ボンド層の表面に生成されるポケットの説明図である。It is explanatory drawing of the pocket produced | generated on the surface of a bond layer during grinding operation.

符号の説明Explanation of symbols

１ ダイヤモンドホイール
２ 台金
３ 外周面
４ 研削作用面
５ セグメント 1 Diamond wheel 2 Base metal 3 Outer peripheral surface 4 Grinding surface 5 Segment

Claims (7)

台金の外周に、ダイヤモンド砥粒とボンド材との焼結からなる砥粒層が周方向にセグメント状に隙間をもって配列形成され、これら砥粒層のセグメントとセグメントの間の上記各隙間にボンド材の焼結からなるボンド層が充填され、研削作用面が周方向において、砥粒層とボンド層とが交互に配列して、連続に形成されたダイヤモンドホイール。   On the outer periphery of the base metal, an abrasive grain layer formed by sintering diamond abrasive grains and a bonding material is formed in a circumferential array with gaps in segments, and bonded to the gaps between the segments of the abrasive grain layers. A diamond wheel filled with a bond layer made of sintered material, and continuously formed by alternately arranging an abrasive layer and a bond layer in the circumferential direction of the grinding surface. ボンド材がメタルボンド材からなる請求項１に記載のダイヤモンドホイール。   The diamond wheel according to claim 1, wherein the bond material is a metal bond material. ボンド材がレジンボンド材からなる請求項１に記載のダイヤモンドホイール。   The diamond wheel according to claim 1, wherein the bond material is a resin bond material. 台金がカップ状である請求項１から３のいずれか一項に記載のダイヤモンドホイール。   The diamond wheel according to any one of claims 1 to 3, wherein the base metal is cup-shaped. 台金の外周がペンシルエッジ状であって、ダイヤモンドホイールが面取り用である請求項１から３のいずれか一項に記載のダイヤモンドホイール。   The diamond wheel according to any one of claims 1 to 3, wherein the outer periphery of the base metal has a pencil edge shape and the diamond wheel is for chamfering. 台金が円盤状であって、ダイヤモンドホイールがカッティング用である請求項１から３のいずれか一項に記載のダイヤモンドホイール。   The diamond wheel according to any one of claims 1 to 3, wherein the base metal is a disc shape, and the diamond wheel is for cutting. 台金がストレート円盤状である請求項１から３のいずれか一項に記載のダイヤモンドホイール。   The diamond wheel according to any one of claims 1 to 3, wherein the base metal has a straight disk shape.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104044086A (en) * 2013-03-12 2014-09-17 株式会社迪思科 Grinding wheel
CN105538177A (en) * 2015-12-09 2016-05-04 河南广度超硬材料有限公司 Composite binder grinding wheel and manufacturing method thereof
CN112873070A (en) * 2021-01-21 2021-06-01 泉州众志新材料科技有限公司 Ceramic tile chamfering abrasive disc and production method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104308757B (en) * 2014-10-10 2016-10-19 马鞍山市金鹰超硬材料有限公司 A kind of superhard material metal combines base skeleton high speed heavy load emery wheel

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61297080A (en) * 1985-06-26 1986-12-27 Showa Denko Kk Manufacture of resinoid segment grindstone
JPS61297081A (en) * 1985-06-26 1986-12-27 Showa Denko Kk Manufacture of resinoid segment grindstone
JPH02311271A (en) * 1989-05-23 1990-12-26 Toyoda Mach Works Ltd Segment type grinding stone
JPH03277476A (en) * 1990-03-26 1991-12-09 Honda Motor Co Ltd Manufacture of grinding wheel
JPH0671569A (en) * 1990-12-25 1994-03-15 Osaka Diamond Ind Co Ltd Noise suppressing drum
JPH09508589A (en) * 1994-05-13 1997-09-02 ノートン カンパニー Improved super polishing tool
JPH10151571A (en) * 1996-11-22 1998-06-09 Noritake Diamond Ind Co Ltd Super abrasive grain grinding wheel
JPH10202533A (en) * 1997-01-21 1998-08-04 Noritake Diamond Ind Co Ltd Diamond cutting grinding wheel
JPH11188642A (en) * 1997-12-26 1999-07-13 Mitsui Kensaku Toishi Kk Disk-like grinding wheel
JP2003266314A (en) * 2002-03-11 2003-09-24 Mitsui Kensaku Toishi Kk Diamond pellet, its manufacturing method and surface plate for grinding machine
JP2004181575A (en) * 2002-12-03 2004-07-02 Noritake Co Ltd Manufacturing method of resinoid bonded super-abrasive grain grinding wheel
JP2006142455A (en) * 2004-11-24 2006-06-08 Toyoda Van Moppes Ltd Superabrasive grain grinding wheel and its manufacturing method

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61297080A (en) * 1985-06-26 1986-12-27 Showa Denko Kk Manufacture of resinoid segment grindstone
JPS61297081A (en) * 1985-06-26 1986-12-27 Showa Denko Kk Manufacture of resinoid segment grindstone
JPH02311271A (en) * 1989-05-23 1990-12-26 Toyoda Mach Works Ltd Segment type grinding stone
JPH03277476A (en) * 1990-03-26 1991-12-09 Honda Motor Co Ltd Manufacture of grinding wheel
JPH0671569A (en) * 1990-12-25 1994-03-15 Osaka Diamond Ind Co Ltd Noise suppressing drum
JPH09508589A (en) * 1994-05-13 1997-09-02 ノートン カンパニー Improved super polishing tool
JPH10151571A (en) * 1996-11-22 1998-06-09 Noritake Diamond Ind Co Ltd Super abrasive grain grinding wheel
JPH10202533A (en) * 1997-01-21 1998-08-04 Noritake Diamond Ind Co Ltd Diamond cutting grinding wheel
JPH11188642A (en) * 1997-12-26 1999-07-13 Mitsui Kensaku Toishi Kk Disk-like grinding wheel
JP2003266314A (en) * 2002-03-11 2003-09-24 Mitsui Kensaku Toishi Kk Diamond pellet, its manufacturing method and surface plate for grinding machine
JP2004181575A (en) * 2002-12-03 2004-07-02 Noritake Co Ltd Manufacturing method of resinoid bonded super-abrasive grain grinding wheel
JP2006142455A (en) * 2004-11-24 2006-06-08 Toyoda Van Moppes Ltd Superabrasive grain grinding wheel and its manufacturing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104044086A (en) * 2013-03-12 2014-09-17 株式会社迪思科 Grinding wheel
JP2014172146A (en) * 2013-03-12 2014-09-22 Disco Abrasive Syst Ltd Grinding wheel
CN105538177A (en) * 2015-12-09 2016-05-04 河南广度超硬材料有限公司 Composite binder grinding wheel and manufacturing method thereof
CN112873070A (en) * 2021-01-21 2021-06-01 泉州众志新材料科技有限公司 Ceramic tile chamfering abrasive disc and production method thereof
CN112873070B (en) * 2021-01-21 2022-07-05 泉州众志新材料科技有限公司 Ceramic tile chamfering abrasive disc and production method thereof

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