JP2009037914A - Burning chamber, and sealing device - Google Patents

Burning chamber, and sealing device Download PDF

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JP2009037914A
JP2009037914A JP2007201995A JP2007201995A JP2009037914A JP 2009037914 A JP2009037914 A JP 2009037914A JP 2007201995 A JP2007201995 A JP 2007201995A JP 2007201995 A JP2007201995 A JP 2007201995A JP 2009037914 A JP2009037914 A JP 2009037914A
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chamber
gas
flow rate
pressure
oxygen
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JP4920521B2 (en
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Kazuya Uchida
一也 内田
Noriyuki Awaji
則之 淡路
Hiroshi Kajiyama
博司 梶山
Tsutae Shinoda
傳 篠田
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Hiroshima University NUC
Ulvac Inc
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Hiroshima University NUC
Ulvac Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique for burning sealing material in a vacuum atmosphere. <P>SOLUTION: A first and a second panels are disposed in a vacuum tank 31 with a ring of sealing material (a subject item to be sealed 60) held between them. The subject item to be sealed 60 is heated while the inside of the vacuum tank 31 is evacuated by an evacuation system 50 for burning the sealing material, where oxygen gas and diluent gas are introduced into the vacuum tank 31 from a gas introducing system 40. During the burning, total pressure inside the vacuum tank 31 is measured by a pressure measuring device 39. Oxygen gas pressure is determined by a control device based on above result and measurements of gas flow meters 45 and 55. Oxygen gas flow and diluent gas flow are controlled by gas flow controllers 42 and 52 in such a way as not to be lower than the lower limit pressure while keeping the inside of the vacuum tank 31 at lower pressure than 1 barometric pressure. Organic binder in the sealing material is burnt by oxygen, and the sealing material is discharged as carbon dioxide or water. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明はガラスパネルを封止する技術に関し、特に、封着材料を焼成する技術に関する。   The present invention relates to a technique for sealing a glass panel, and more particularly to a technique for firing a sealing material.

プラズマディスプレイやフィールドエミッションディスプレイ等の表示装置では、フロント側のガラス基板とリア側のガラス基板の間の外周付近にペースト状のガラス粉末(フリット)から成る封着材料がリング状に配置され、リアパネル上に封着材料が配置された状態で焼成され、有機バインダーが除去された後、焼成された封着材料上にフロントパネルが乗せられ、加熱によって封着されると、リアパネルとフロントパネルが貼り合わされる。
ガラス基板の間の空間は封着材料によって気密に封止されており、内部に導入された放電ガスのプラズマが発光し、表示がされるようになっている。
In a display device such as a plasma display or a field emission display, a sealing material made of paste-like glass powder (frit) is arranged in a ring shape near the outer periphery between a glass substrate on the front side and a glass substrate on the rear side. After firing with the sealing material placed on top and removing the organic binder, the front panel is placed on the fired sealing material and sealed by heating. Combined.
The space between the glass substrates is hermetically sealed with a sealing material, and the plasma of the discharge gas introduced into the interior emits light for display.

従来では、封着材料の焼成は大気中で行なわれていたが、焼成の際に発生するガスを除去するために、焼成を真空雰囲気中で行ないたいという要望がある。
しかし真空雰囲気中で焼成して封着材料を固化させると、封着材料中の有機成分の除去が不十分となり、その結果、焼成後の封着処理の際に有機ガスが発生してフロントパネルやリアパネルを汚染したり、封着後の封着材料の接着強度が強度不足となるという問題がある。
特開2005−142139号公報 特開2001−319572号公報 特開2007−128824号公報
Conventionally, firing of the sealing material has been performed in the air, but there is a demand for firing in a vacuum atmosphere in order to remove the gas generated during firing.
However, if the sealing material is solidified by firing in a vacuum atmosphere, the organic components in the sealing material are not sufficiently removed. As a result, organic gas is generated during the sealing process after firing, and the front panel There is a problem that the rear panel is contaminated and the adhesive strength of the sealing material after sealing becomes insufficient.
JP 2005-142139 A JP 2001-319572 A JP 2007-128824 A

本発明は、真空雰囲気中で封着材料を焼成できる技術を提供することにある。   An object of the present invention is to provide a technique capable of firing a sealing material in a vacuum atmosphere.

本発明の発明者等は、封着材料を真空雰囲気中で焼成した場合に有機成分の除去が不十分であるのは、真空雰囲気中では酸素不足のため、有機バインダーが酸素と結合できないからであると推測した。   The inventors of the present invention do not sufficiently remove the organic component when the sealing material is baked in a vacuum atmosphere because the organic binder cannot bind to oxygen due to insufficient oxygen in the vacuum atmosphere. I guessed there was.

即ち、有機バインダーの主な構成元素である炭素や水素は、酸素と反応することで二酸化炭素や水となって雰囲気中に放出されるため、大気中での焼成であれば、有機バインダーを除去しやすいのに対し、真空雰囲気中では酸素が不十分となり、有機バインダー中の炭素やその化合物が気体となって放出されにくいのである。そこで、焼成雰囲気中に酸素を導入したところ、封着材料が容易に固化し、接着強度が高くなることが確認された。   That is, carbon and hydrogen, which are the main constituent elements of the organic binder, react with oxygen and are released into the atmosphere as carbon dioxide and water, so the organic binder is removed if firing in the air. On the other hand, oxygen is insufficient in a vacuum atmosphere, and carbon and its compounds in the organic binder are hardly released as gases. Therefore, when oxygen was introduced into the firing atmosphere, it was confirmed that the sealing material was easily solidified and the adhesive strength was increased.

本発明は、上記知見に基づいて創作されたものであり、真空槽と、前記真空槽内を真空排気する真空排気系と、前記真空槽とガス源とを接続し、入力された制御信号に応じた流量で酸素ガスと希釈ガスとをそれぞれ前記真空槽内に導入させるガス導入系と、前記ガス導入系に前記制御信号を出力し、前記酸素ガスの流量と前記希釈ガスの流量を制御する制御装置と、封着対象物を加熱する加熱装置とを有する封着装置であって、前記真空槽には、前記真空槽の圧力を測定し、測定結果を前記制御装置に出力する圧力測定装置が設けられ、前記制御装置には、前記酸素ガスの流量と前記希釈ガスの流量の流量比と、最低酸素圧力とが記憶され、前記制御装置は前記ガス導入系を制御し、前記酸素ガスと前記希釈ガスを前記流量比で前記真空槽内に導入させるとともに、前記圧力測定装置の前記測定結果から前記真空槽内の酸素圧力を算出し、算出結果が前記最低酸素圧力を下回ったときには、前記ガス導入系を制御し、前記酸素流量を増加させる焼成室である。
また、本発明は、前記圧力測定装置の前記測定結果が1気圧以上を示すときには、前記制御装置は前記ガス導入系を制御し、前記希釈ガス流量を減少させ、前記真空槽内の圧力を低下させる焼成室である。
また、本発明は、真空排気装置が接続された処理室が前記焼成室に接続され、前記封着対象物を真空雰囲気に置いたまま、前記処理室と前記焼成室の間で前記封着対象物を移動できるように構成された封着装置である。
The present invention was created based on the above knowledge, and connects a vacuum chamber, an evacuation system that evacuates the vacuum chamber, the vacuum chamber and a gas source, and receives an input control signal. A gas introduction system for introducing oxygen gas and dilution gas into the vacuum chamber at respective flow rates, and the control signal is output to the gas introduction system to control the flow rate of the oxygen gas and the flow rate of the dilution gas. A sealing device having a control device and a heating device for heating an object to be sealed, wherein the vacuum chamber measures the pressure of the vacuum chamber and outputs a measurement result to the control device. The flow rate ratio between the flow rate of the oxygen gas and the flow rate of the dilution gas and the minimum oxygen pressure are stored in the control device, the control device controls the gas introduction system, and the oxygen gas and The dilution gas in the vacuum chamber at the flow rate ratio In addition, the oxygen pressure in the vacuum chamber is calculated from the measurement result of the pressure measuring device, and when the calculation result falls below the minimum oxygen pressure, the gas introduction system is controlled to increase the oxygen flow rate. It is a firing chamber.
Further, according to the present invention, when the measurement result of the pressure measuring device indicates 1 atm or more, the control device controls the gas introduction system, reduces the dilution gas flow rate, and reduces the pressure in the vacuum chamber. It is a firing chamber.
Further, the present invention provides a sealing chamber between the processing chamber and the baking chamber while a processing chamber to which a vacuum exhaust device is connected is connected to the baking chamber and the sealing target is left in a vacuum atmosphere. This is a sealing device configured to be able to move an object.

封着材料を焼成するための最適な酸素ガスと希釈ガスの圧力比を維持しながら、酸素ガス圧力を一定範囲に制御することができるので、封着材料を確実に固化させることができる。   The oxygen gas pressure can be controlled within a certain range while maintaining the optimum pressure ratio between the oxygen gas and the dilution gas for firing the sealing material, so that the sealing material can be solidified reliably.

図1の符号1は、本発明の封着装置を示している。
この封着装置1は、搬入室11と、脱気室20と、焼成室30と、封着室15と、搬出室19とを有している。搬入室11と、脱気室20と、焼成室30と、封着室15と、搬出室19は、ゲートバルブ13を介してこの順序で接続されている。
Reference numeral 1 in FIG. 1 indicates a sealing device of the present invention.
The sealing device 1 includes a carry-in chamber 11, a deaeration chamber 20, a baking chamber 30, a sealing chamber 15, and a carry-out chamber 19. The carry-in chamber 11, the deaeration chamber 20, the baking chamber 30, the sealing chamber 15, and the carry-out chamber 19 are connected in this order via the gate valve 13.

各室11、20、30、15、19には、真空排気系が接続されており、ゲートバルブ13を閉じた状態で、予め脱気室20と焼成室30の内部を真空雰囲気にしておき、搬入室11内に封着対象物を搬入し、搬入室11内部を真空雰囲気にした後、搬入室11と脱気室20の内部を接続し、封着対象物を脱気室20内に搬入し、脱気室20と搬入室11との間のゲートバルブ13を閉じ、脱気室20の内部を搬入室11の内部から切り離す。   Each chamber 11, 20, 30, 15, 19 is connected to an evacuation system, and with the gate valve 13 closed, the inside of the deaeration chamber 20 and the firing chamber 30 is set in a vacuum atmosphere in advance. The object to be sealed is carried into the carry-in chamber 11, the inside of the carry-in chamber 11 is evacuated, the inside of the carry-in chamber 11 and the inside of the deaeration chamber 20 is connected, and the object to be sealed is carried into the deaeration chamber 20. Then, the gate valve 13 between the deaeration chamber 20 and the carry-in chamber 11 is closed, and the inside of the deaeration chamber 20 is separated from the inside of the carry-in chamber 11.

図2(a)は、封着対象物60の平面図、同図(b)は、A−A線截断断面図である。この封着対象物60は、第一、第二のパネル61、62とリング状の封着材料65とを有している。   2A is a plan view of the sealing object 60, and FIG. 2B is a cross-sectional view taken along line AA. The sealing object 60 includes first and second panels 61 and 62 and a ring-shaped sealing material 65.

第一、第二のパネル61、62は、ガラス基板上に透明導電膜や薄膜トランジスタ等が形成された表示装置の部品であり、第一、第二のパネル61、62は位置合わせがされた状態で、封着材料65を間に挟んで重ね合わされている。封着材料65は、第一、第二のパネル61、62の外周付近の表面と接触されている。封着材料65は、粉末ガラスが有機バインダー中に分散されたペースト状である。
脱気室20には加熱装置が設けられており、脱気室20内部を真空排気しながら、加熱装置を動作させ、封着対象物60を加熱する。
The first and second panels 61 and 62 are parts of a display device in which a transparent conductive film, a thin film transistor, and the like are formed on a glass substrate, and the first and second panels 61 and 62 are aligned. Thus, the sealing material 65 is overlapped with the sealing material 65 interposed therebetween. The sealing material 65 is in contact with the surfaces near the outer periphery of the first and second panels 61 and 62. The sealing material 65 is a paste in which powder glass is dispersed in an organic binder.
A heating device is provided in the deaeration chamber 20, and the sealing object 60 is heated by operating the heating device while evacuating the inside of the deaeration chamber 20.

これにより、封着材料65が加熱され、昇温し、封着材料65中に含有されている溶剤が蒸発し、封着材料65が第一、第二のパネル61、62に接触した状態で脱気される。
この工程を脱気工程と呼んでおり、所定時間加熱し、溶剤が蒸発して脱気処理が終了したところで加熱を停止する。
Thereby, the sealing material 65 is heated, heated up, the solvent contained in the sealing material 65 is evaporated, and the sealing material 65 is in contact with the first and second panels 61 and 62. Degassed.
This process is called a deaeration process, which is heated for a predetermined time, and when the solvent is evaporated and the deaeration process is completed, the heating is stopped.

脱気室20が所定圧力に低下したところで、焼成室30との間のゲートバルブ13を開け、脱気室20と焼成室30とを接続し、封着対象物60を脱気室20から焼成室30に移動させる。焼成室30は、予め真空雰囲気にされいており、封着対象物60は、真空雰囲気に置かれたまま、脱気室20から焼成室30に移動される。   When the deaeration chamber 20 is lowered to a predetermined pressure, the gate valve 13 between the deaeration chamber 20 and the baking chamber 30 is opened, the deaeration chamber 20 and the baking chamber 30 are connected, and the sealing object 60 is fired from the deaeration chamber 20. Move to chamber 30. The firing chamber 30 is previously in a vacuum atmosphere, and the sealing object 60 is moved from the deaeration chamber 20 to the firing chamber 30 while being placed in the vacuum atmosphere.

図3は、焼成室30の内部を説明するための図面である。
焼成室30は、真空槽31を有しており、真空槽31の内部には、抵抗発熱体33が配置されている。
真空槽31には、真空排気系50とガス導入系40が接続されている。
ガス導入系40は、酸素ボンベ等の酸素ガス源41と、窒素ガスボンベ等の希釈ガス源51を有している。
FIG. 3 is a view for explaining the inside of the baking chamber 30.
The firing chamber 30 has a vacuum chamber 31, and a resistance heating element 33 is disposed inside the vacuum chamber 31.
A vacuum exhaust system 50 and a gas introduction system 40 are connected to the vacuum chamber 31.
The gas introduction system 40 includes an oxygen gas source 41 such as an oxygen cylinder and a dilution gas source 51 such as a nitrogen gas cylinder.

酸素ガス源41は、酸素ガス流量コントローラ42と、酸素ガス流量計45と、酸素ガス用開閉バルブ46とを介して真空槽31に接続されており、希釈ガス源51は、希釈ガス流量コントローラ52と、希釈ガス流量計55と、希釈ガス用開閉バルブ56を介して真空槽31に接続されている。
酸素ガス源41と希釈ガス源51には、酸素ガスと希釈ガス(窒素ガスやアルゴンガス等の不活性ガス)がそれぞれ一気圧よりも大きい圧力で充填されている。
The oxygen gas source 41 is connected to the vacuum chamber 31 via an oxygen gas flow rate controller 42, an oxygen gas flow meter 45, and an oxygen gas opening / closing valve 46, and the dilution gas source 51 is a dilution gas flow rate controller 52. Are connected to the vacuum chamber 31 via a dilution gas flow meter 55 and a dilution gas opening / closing valve 56.
The oxygen gas source 41 and the dilution gas source 51 are filled with an oxygen gas and a dilution gas (inert gas such as nitrogen gas or argon gas) at a pressure higher than one atmospheric pressure.

酸素ガス流量コントローラ42と希釈ガス流量コントローラ52は、制御装置35に接続されている。制御装置35は、後述する手順に従って酸素ガス流量と希釈ガス流量とを算出し、制御信号を酸素ガス流量コントローラ42と希釈ガス流量コントローラ52に出力するように構成されており、真空排気系50によって真空槽31の内部を真空排気しながら、酸素ガス用開閉バルブ46と希釈ガス用開閉バルブ56を開け、制御装置35と酸素ガス流量コントローラ42と希釈ガス流量コントローラ52を動作させると、酸素ガス源41と希釈ガス源51から真空槽31の内部に、制御装置35から出力された制御信号に応じた流量の酸素ガスと希釈ガスがそれぞれ供給される。これにより、真空槽31の内部は、酸素ガスと希釈ガスの混合ガス雰囲気になる。   The oxygen gas flow rate controller 42 and the dilution gas flow rate controller 52 are connected to the control device 35. The control device 35 is configured to calculate an oxygen gas flow rate and a dilution gas flow rate according to a procedure described later, and to output a control signal to the oxygen gas flow rate controller 42 and the dilution gas flow rate controller 52. While the inside of the vacuum chamber 31 is evacuated, the oxygen gas on / off valve 46 and the dilution gas on / off valve 56 are opened to operate the control device 35, the oxygen gas flow rate controller 42, and the dilution gas flow rate controller 52. 41 and the dilution gas source 51 are supplied to the inside of the vacuum chamber 31 with oxygen gas and dilution gas at a flow rate corresponding to the control signal output from the control device 35, respectively. Thereby, the inside of the vacuum chamber 31 becomes a mixed gas atmosphere of oxygen gas and dilution gas.

酸素ガス源41から真空槽31に供給される酸素ガスの流量と、希釈ガス源51から真空槽31に供給される希釈ガスの流量は、酸素ガス流量計45と希釈ガス流量計55によってそれぞれ測定されている。   The flow rate of oxygen gas supplied from the oxygen gas source 41 to the vacuum chamber 31 and the flow rate of dilution gas supplied from the dilution gas source 51 to the vacuum chamber 31 are measured by the oxygen gas flow meter 45 and the dilution gas flow meter 55, respectively. Has been.

酸素ガス流量計45と希釈ガス流量計55は、制御装置35に接続されており、測定された酸素ガス流量と希釈ガス流量は制御装置35に入力されており、酸素ガス流量コントローラ42と希釈ガス流量コントローラ52は、真空槽31内に供給される酸素ガスと希釈ガスの流量が制御装置35の算出した流量になるように制御される。   The oxygen gas flow meter 45 and the dilution gas flow meter 55 are connected to the control device 35, and the measured oxygen gas flow rate and dilution gas flow rate are input to the control device 35, and the oxygen gas flow rate controller 42 and the dilution gas flow rate are inputted. The flow rate controller 52 is controlled so that the flow rates of the oxygen gas and the dilution gas supplied into the vacuum chamber 31 become the flow rates calculated by the control device 35.

制御装置35には記憶装置37が設けられており、記憶装置37内には、酸素ガス流量と希釈ガス流量の流量比が記憶されている。
ここでは流量比は一定値であり、制御装置35は、酸素ガス流量と希釈ガス流量が、記憶された比率を維持するように、酸素ガス流量コントローラ42と希釈ガス流量コントローラ52を動作させる。
The control device 35 is provided with a storage device 37, and the storage device 37 stores a flow rate ratio between the oxygen gas flow rate and the dilution gas flow rate.
Here, the flow rate ratio is a constant value, and the control device 35 operates the oxygen gas flow rate controller 42 and the dilution gas flow rate controller 52 so that the oxygen gas flow rate and the dilution gas flow rate maintain the stored ratio.

また、真空槽31には圧力測定装置39が接続されており、真空槽の内部圧力(全圧)も測定されている。圧力測定装置39も制御装置35に接続されており、制御装置35には測定された圧力値が入力されている。   Further, a pressure measuring device 39 is connected to the vacuum chamber 31, and the internal pressure (total pressure) of the vacuum chamber is also measured. The pressure measuring device 39 is also connected to the control device 35, and the measured pressure value is input to the control device 35.

真空槽31内が低圧力に真空排気された後、記憶装置37に記憶された流量比で酸素ガスと希釈ガスが導入されている場合は、圧力値と流量比から、酸素ガス圧力を算出することができる。   After the inside of the vacuum chamber 31 is evacuated to a low pressure, when the oxygen gas and the dilution gas are introduced at the flow rate ratio stored in the storage device 37, the oxygen gas pressure is calculated from the pressure value and the flow rate ratio. be able to.

記憶装置37には、酸素ガス圧力の下限値が記憶されており、算出された酸素ガス圧力が下限値を下回る値になった場合、記憶された流量比を維持しながら酸素ガス流量と希釈ガス流量を増加させる。   The storage device 37 stores a lower limit value of the oxygen gas pressure. When the calculated oxygen gas pressure falls below the lower limit value, the oxygen gas flow rate and the dilution gas are maintained while maintaining the stored flow rate ratio. Increase the flow rate.

また、記憶装置37には、真空槽31内部の全圧の上限値が記憶されており、圧力測定装置39が測定する真空槽31の圧力が上限値以上になった場合は、流量比を維持しながら酸素ガス流量と希釈ガス流量を減少させる。
酸素ガスと希釈ガスの流量比は1:4、全圧の上限値は一気圧に設定されており、真空槽31内部は一気圧よりも低い圧力が維持されている。
The storage device 37 stores an upper limit value of the total pressure inside the vacuum chamber 31. When the pressure in the vacuum chamber 31 measured by the pressure measuring device 39 exceeds the upper limit value, the flow rate ratio is maintained. While decreasing the oxygen gas flow rate and the dilution gas flow rate.
The flow rate ratio of oxygen gas and dilution gas is set to 1: 4, the upper limit of the total pressure is set to 1 atm, and the pressure inside the vacuum chamber 31 is maintained at a pressure lower than 1 atm.

真空槽31の内部には、抵抗発熱体33が配置されており、搬入された封着対象物60は抵抗発熱体33が配置された領域の内部に配置される。
焼成室30の内部は封着室15とは遮断されており、脱気室20との間のゲートバルブ13を閉じ、焼成室30と脱気室20の内部を遮断し、焼成室30の真空槽31の内部を真空排気しながら、加熱用電源36を起動して抵抗発熱体33に通電し、発熱させる。
The resistance heating element 33 is disposed inside the vacuum chamber 31, and the carried sealing object 60 is disposed inside the region where the resistance heating element 33 is disposed.
The inside of the firing chamber 30 is shut off from the sealing chamber 15, the gate valve 13 between the deaeration chamber 20 is closed, the inside of the firing chamber 30 and the deaeration chamber 20 is shut off, and the vacuum in the firing chamber 30 is closed. While the inside of the tank 31 is evacuated, the heating power source 36 is activated to energize the resistance heating element 33 to generate heat.

このとき、制御装置35で制御しながら真空槽31内に酸素ガスと希釈ガスを導入し、酸素ガス圧力が下限値よりも高く、全圧が一気圧よりも低圧の状態を維持しながら、封着材料65を加熱すると、有機バインダーは酸素と結合し、即ち燃焼し、二酸化炭素やその他のガスとなって除去される。
第一、第二のパネル61、62は、焼成された封着材料65によって仮固定される。
At this time, the oxygen gas and the dilution gas are introduced into the vacuum chamber 31 while being controlled by the control device 35, the oxygen gas pressure is higher than the lower limit value, and the total pressure is maintained at a pressure lower than 1 atm. When the dressing material 65 is heated, the organic binder combines with oxygen, that is, burns and is removed as carbon dioxide and other gases.
The first and second panels 61 and 62 are temporarily fixed by the fired sealing material 65.

第一又は第二のパネル61、62の封着材料65で囲まれた部分にはガス抜き孔が設けられており、焼成の間第一、第二のパネル61、62の間に放出された二酸化炭素等の封着材料65からの放出ガスは、ガス抜き孔から真空槽31内に放出され、真空排気系50によって酸素ガスや希釈ガスと一緒に真空排気される。   A portion of the first or second panel 61, 62 surrounded by the sealing material 65 is provided with a vent hole, and is discharged between the first and second panels 61, 62 during firing. The release gas from the sealing material 65 such as carbon dioxide is released from the vent hole into the vacuum chamber 31 and evacuated together with oxygen gas and dilution gas by the evacuation system 50.

この間、制御装置35によって、酸素ガスと希釈ガスは記憶装置37に記憶された流量比で導入されており、制御装置35は圧力値と流量比から酸素ガス圧力を算出し、算出した酸素ガス圧力が記憶装置37に記憶された下限値よりも低下すると、流量比を維持しながら酸素ガスと希釈ガスの流量を増加させる。
また、真空槽31内の全圧が一気圧以上になると、制御装置35は、流量比を維持しながら、酸素ガスと希釈ガスの流量を低下させる。
During this time, the control device 35 introduces the oxygen gas and the dilution gas at a flow rate ratio stored in the storage device 37, and the control device 35 calculates the oxygen gas pressure from the pressure value and the flow rate ratio, and calculates the calculated oxygen gas pressure. Decreases below the lower limit value stored in the storage device 37, the flow rate of oxygen gas and dilution gas is increased while maintaining the flow rate ratio.
Moreover, when the total pressure in the vacuum chamber 31 becomes 1 atmosphere or more, the control device 35 reduces the flow rates of the oxygen gas and the dilution gas while maintaining the flow rate ratio.

このように、酸素ガス圧力が一定の範囲内で焼成が進行するので、有機バインダーが酸素によって燃焼して除去され、封着材料65中のガラス粉末が溶融し、ガラス粉末同士が接着し、封着材料65は固化する。   As described above, since the firing proceeds within a certain range of the oxygen gas pressure, the organic binder is burned and removed by oxygen, the glass powder in the sealing material 65 is melted, the glass powders are bonded, and the sealing is performed. The dressing material 65 is solidified.

焼成が終了すると、酸素ガスの導入と希釈ガスの導入を停止し、第一、第二のパネル61、62の間のリング状の封着材料65で囲まれた空間の内部の気体をガス抜き孔から排気する。   When firing is completed, the introduction of oxygen gas and the introduction of dilution gas are stopped, and the gas inside the space surrounded by the ring-shaped sealing material 65 between the first and second panels 61 and 62 is vented. Exhaust from the hole.

第一、第二のパネル61、62の間の真空排気が終了した後、封着対象物60を封着室15に移動させ、封着室15内で加熱し、ガラス粉末を溶融させると、第一、第二のパネル61、62と封着材料65の間は密着し、第一、第二のパネル61、2は封着材料65によって固定される。   After the evacuation between the first and second panels 61 and 62 is completed, the sealing object 60 is moved to the sealing chamber 15 and heated in the sealing chamber 15 to melt the glass powder. The first and second panels 61 and 62 and the sealing material 65 are in close contact with each other, and the first and second panels 61 and 2 are fixed by the sealing material 65.

このとき、封着室15内を真空排気することで、第一、第二のパネル61、62の間に放出されたガスをガス抜き孔から排気し、第一、第二のパネル61、62の加熱が終了し、温度が低下した後、封着室15内に放電ガスを導入すると、放電ガスはガス抜き孔から第一、第二のパネル61、62の間に導入される。
この状態でガス抜き孔を閉塞すると、第一、第二のパネル61、62と、リング状の封着材料65で囲まれた空間は、その外部の空間から気密に分離される。
At this time, by evacuating the inside of the sealing chamber 15, the gas released between the first and second panels 61 and 62 is exhausted from the vent holes, and the first and second panels 61 and 62 are exhausted. When the discharge gas is introduced into the sealing chamber 15 after the heating is completed and the temperature is lowered, the discharge gas is introduced between the first and second panels 61 and 62 through the vent holes.
When the gas vent hole is closed in this state, the space surrounded by the first and second panels 61 and 62 and the ring-shaped sealing material 65 is hermetically separated from the external space.

以上は、第一、第二のパネル61、62の間に封着材料65を配置して焼成する場合を説明したが、本発明はそれに限定されるものではない。   The above describes the case where the sealing material 65 is disposed between the first and second panels 61 and 62 and fired, but the present invention is not limited thereto.

図4に示した封着装置2は、第一、第二の搬入室11、41と、焼成室30と、アライン・封着室42と、封止室43と、搬出室19とを有している。
第一の搬入室11と、焼成室30と、アライン・封着室42と、封止室43と、搬出室19は、この順番で接続されており、第二の搬入室41は、アライン・封着室42に接続されている。焼成室30と、アライン・封着室42と、封止室43は、予め真空排気されている。
The sealing device 2 shown in FIG. 4 includes first and second carry-in chambers 11 and 41, a baking chamber 30, an alignment / sealing chamber 42, a sealing chamber 43, and a carry-out chamber 19. ing.
The first carry-in chamber 11, the firing chamber 30, the align / sealing chamber 42, the sealing chamber 43, and the carry-out chamber 19 are connected in this order, and the second carry-in chamber 41 is aligned / It is connected to the sealing chamber 42. The firing chamber 30, the alignment / sealing chamber 42, and the sealing chamber 43 are evacuated in advance.

図5は、第一のパネル61上にリング状の封着材料65が配置された封着対象物66を示している。
この封着材料65は脱気がされており、搬入室11内に配置される。
搬入室11内を真空排気し、搬入室11内が真空雰囲気にされた後、搬入室11と焼成室30の間のバルブ13を開け、封着対象物66を焼成室30内に搬入する。
FIG. 5 shows a sealing object 66 in which a ring-shaped sealing material 65 is arranged on the first panel 61.
The sealing material 65 is deaerated and is placed in the carry-in chamber 11.
After the inside of the carry-in chamber 11 is evacuated and the inside of the carry-in chamber 11 is made into a vacuum atmosphere, the valve 13 between the carry-in chamber 11 and the firing chamber 30 is opened, and the sealing object 66 is carried into the firing chamber 30.

焼成室30の構成は上記実施例で説明した焼成室30と同じ構成であり、図6に示すように、搬入された封着対象物66を抵抗発熱体33の間に配置し、抵抗発熱体33に通電して発熱させ、上記実施例と同じ手順で焼成室30内に酸素ガスと希釈ガスを導入すると、封着材料65中の有機バインダーが燃焼される。燃焼によって生じたガスは、真空排気によって除去される。   The structure of the baking chamber 30 is the same as that of the baking chamber 30 described in the above embodiment. As shown in FIG. 6, the carried sealing object 66 is arranged between the resistance heating elements 33, and the resistance heating element is arranged. When 33 is energized to generate heat and oxygen gas and dilution gas are introduced into the baking chamber 30 in the same procedure as in the above embodiment, the organic binder in the sealing material 65 is burned. The gas generated by the combustion is removed by evacuation.

焼成室30内での焼成処理が終了すると、焼成室30内への酸素ガスと希釈ガスの導入は停止され、焼成室30内が所定圧力に低下した後、焼成室30とアライン・封着室42の間のバルブ13を開け、処理対象物66を大気に曝さずにアライン・封着室42内に搬入する。   When the firing process in the firing chamber 30 is completed, the introduction of oxygen gas and dilution gas into the firing chamber 30 is stopped, and after the interior of the firing chamber 30 has dropped to a predetermined pressure, the firing chamber 30 and the alignment / sealing chamber The valve 13 between the two is opened, and the processing object 66 is carried into the align / seal chamber 42 without being exposed to the atmosphere.

このとき、第二の搬入室41内には、第二のパネル62が配置されており、第二の搬入室41内が真空排気された後、第二の搬入室41とアライン・封着室42の間のバルブ13が開けられ、第二のパネル62は、アライン・封着室42内に搬入される。   At this time, the second panel 62 is arranged in the second carry-in chamber 41, and after the second carry-in chamber 41 is evacuated, the second carry-in chamber 41 and the alignment / sealing chamber are arranged. The valve 13 between 42 is opened, and the second panel 62 is carried into the align / sealing chamber 42.

アライン・封着室42内には位置合わせ装置が設けられており、焼成された封着材料65が配置された第一のパネル61と、搬入された第二のパネル62とが相対的に位置合わせされた後、封着材料65上に第二のパネル62が配置される。
バルブ13を閉じ、アライン・封着室42を焼成室30や第二の搬入室41から遮断し、封着材料65を加熱し、粉末ガラスを溶融、固化させ、第一、第二のパネル61、62を封着する。
An alignment device is provided in the align / sealing chamber 42, and the first panel 61 on which the fired sealing material 65 is disposed and the second panel 62 carried in are relatively positioned. After being combined, the second panel 62 is placed on the sealing material 65.
The valve 13 is closed, the alignment / sealing chamber 42 is shut off from the firing chamber 30 and the second carry-in chamber 41, the sealing material 65 is heated, the powdered glass is melted and solidified, and the first and second panels 61 , 62 is sealed.

次いで、封着された第一、第二のパネル61、62をアライン・封着室42から封止室43に移動させ、ガス抜き孔を閉塞すると、第一、第二のパネル61、62は封止され、第一、第二のパネル61、62とリング状の封着材料65で囲まれた空間は外部雰囲気から気密に分離される。
封止された第一、第二のパネル61、62は、搬出室19から大気雰囲気に取り出される。
Next, when the sealed first and second panels 61 and 62 are moved from the align / sealing chamber 42 to the sealing chamber 43 and the vent holes are closed, the first and second panels 61 and 62 are The sealed space surrounded by the first and second panels 61 and 62 and the ring-shaped sealing material 65 is airtightly separated from the external atmosphere.
The sealed first and second panels 61 and 62 are taken out from the carry-out chamber 19 to the atmosphere.

なお、以上は、酸素ガスと希釈ガスの流量を制御することで、焼成室30内の酸素ガス圧力を一定範囲内に維持していたが、酸素ガスと希釈ガスの流量を一定にし、制御装置35が真空排気系50の排気速度を変化させて、焼成室30内の酸素ガス圧力を一定範囲にしてもよい。   In the above, the oxygen gas pressure in the firing chamber 30 is maintained within a certain range by controlling the flow rates of the oxygen gas and the dilution gas. 35 may change the exhaust speed of the vacuum exhaust system 50 so that the oxygen gas pressure in the firing chamber 30 is within a certain range.

また、上記実施例では、全圧と流量比から酸素ガス圧力を算出したが、質量分析装置等によって焼成室30内の酸素ガス圧力を測定し、流量比を維持しながら、酸素ガス圧力を一定範囲に制御することができる。   In the above embodiment, the oxygen gas pressure is calculated from the total pressure and the flow rate ratio. However, the oxygen gas pressure in the firing chamber 30 is measured by a mass spectrometer or the like, and the oxygen gas pressure is kept constant while maintaining the flow rate ratio. The range can be controlled.

本発明の第一例の封着装置を説明するための図The figure for demonstrating the sealing apparatus of the 1st example of this invention (a):封着対象物の平面図 (b):そのA−A線截断断面図(a): Plan view of the object to be sealed (b): Cross section taken along line AA 焼成室を説明するための図Diagram for explaining the firing chamber 本発明の第二例の封着装置を説明するための図The figure for demonstrating the sealing apparatus of the 2nd example of this invention 第一のパネル上に封着材料が配置された封着対象物Sealing object in which sealing material is placed on the first panel 第二例の封着装置の焼成室内を説明するための図The figure for demonstrating the baking chamber of the sealing apparatus of a 2nd example

符号の説明Explanation of symbols

1、2……封着装置 20……脱気室 30……焼成室 31……真空槽 40……ガス導入系 35……制御装置 39……圧力測定装置   1, 2 ... Sealing device 20 ... Deaeration chamber 30 ... Firing chamber 31 ... Vacuum chamber 40 ... Gas introduction system 35 ... Control device 39 ... Pressure measuring device

Claims (3)

真空槽と、
前記真空槽内を真空排気する真空排気系と、
前記真空槽とガス源とを接続し、入力された制御信号に応じた流量で酸素ガスと希釈ガスとをそれぞれ前記真空槽内に導入させるガス導入系と、
前記ガス導入系に前記制御信号を出力し、前記酸素ガスの流量と前記希釈ガスの流量を制御する制御装置と、
封着対象物を加熱する加熱装置とを有する封着装置であって、
前記真空槽には、前記真空槽の圧力を測定し、測定結果を前記制御装置に出力する圧力測定装置が設けられ、
前記制御装置には、前記酸素ガスの流量と前記希釈ガスの流量の流量比と、最低酸素圧力とが記憶され、
前記制御装置は前記ガス導入系を制御し、前記酸素ガスと前記希釈ガスを前記流量比で前記真空槽内に導入させるとともに、前記圧力測定装置の前記測定結果から前記真空槽内の酸素圧力を算出し、算出結果が前記最低酸素圧力を下回ったときには、前記ガス導入系を制御し、前記酸素流量を増加させる焼成室。
A vacuum chamber;
An evacuation system for evacuating the vacuum chamber;
A gas introduction system for connecting the vacuum chamber and a gas source, and introducing oxygen gas and dilution gas into the vacuum chamber at a flow rate according to an input control signal;
A control device that outputs the control signal to the gas introduction system and controls the flow rate of the oxygen gas and the flow rate of the dilution gas;
A sealing device having a heating device for heating a sealing object,
The vacuum chamber is provided with a pressure measuring device that measures the pressure of the vacuum chamber and outputs a measurement result to the control device,
The control device stores a flow rate ratio between the flow rate of the oxygen gas and the flow rate of the dilution gas, and a minimum oxygen pressure,
The control device controls the gas introduction system, introduces the oxygen gas and the dilution gas into the vacuum chamber at the flow rate ratio, and determines the oxygen pressure in the vacuum chamber from the measurement result of the pressure measurement device. A calcining chamber that calculates and, when the calculation result falls below the minimum oxygen pressure, controls the gas introduction system to increase the oxygen flow rate.
前記圧力測定装置の前記測定結果が1気圧以上を示すときには、前記制御装置は前記ガス導入系を制御し、前記希釈ガス流量を減少させ、前記真空槽内の圧力を低下させる請求項1記載の焼成室。   The said control apparatus controls the said gas introduction system, when the said measurement result of the said pressure measuring device shows 1 atmosphere or more, The said dilution gas flow rate is decreased, The pressure in the said vacuum chamber is reduced. Firing chamber. 真空排気装置が接続された処理室が前記焼成室に接続され、前記封着対象物を真空雰囲気に置いたまま、前記処理室と前記焼成室の間で前記封着対象物を移動できるように構成された封着装置。   A processing chamber to which a vacuum exhaust device is connected is connected to the baking chamber so that the sealing object can be moved between the processing chamber and the baking chamber while the sealing object is placed in a vacuum atmosphere. Constructed sealing device.
JP2007201995A 2007-08-02 2007-08-02 Sealing device Expired - Fee Related JP4920521B2 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001057152A (en) * 1999-08-20 2001-02-27 Nec Kansai Ltd Manufacture of color pdp
JP2002033052A (en) * 2000-03-31 2002-01-31 Matsushita Electric Ind Co Ltd Method of manufacturing plasma display panel
JP2002245941A (en) * 2001-02-13 2002-08-30 Nec Corp Manufacturing method of plasma display panel
JP2005175475A (en) * 2004-12-06 2005-06-30 Hitachi Ltd Method of sealing up module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001057152A (en) * 1999-08-20 2001-02-27 Nec Kansai Ltd Manufacture of color pdp
JP2002033052A (en) * 2000-03-31 2002-01-31 Matsushita Electric Ind Co Ltd Method of manufacturing plasma display panel
JP2002245941A (en) * 2001-02-13 2002-08-30 Nec Corp Manufacturing method of plasma display panel
JP2005175475A (en) * 2004-12-06 2005-06-30 Hitachi Ltd Method of sealing up module

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