JP2009027120A - 接合方法、接合体および配線基板 - Google Patents
接合方法、接合体および配線基板 Download PDFInfo
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- JP2009027120A JP2009027120A JP2007192705A JP2007192705A JP2009027120A JP 2009027120 A JP2009027120 A JP 2009027120A JP 2007192705 A JP2007192705 A JP 2007192705A JP 2007192705 A JP2007192705 A JP 2007192705A JP 2009027120 A JP2009027120 A JP 2009027120A
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- 229910052720 vanadium Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101067152B1 (ko) | 2009-11-12 | 2011-09-22 | 삼성전기주식회사 | 인쇄회로기판 제조용 캐리어와 그 제조방법 및 이를 이용한 인쇄회로기판의 제조방법 |
| DE102010044114A1 (de) | 2010-11-18 | 2012-05-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Verbinden von Substraten und damit erhältliche Verbundstruktur |
| KR101156776B1 (ko) * | 2010-12-21 | 2012-06-18 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
| JP2019220647A (ja) * | 2018-06-22 | 2019-12-26 | 株式会社アルバック | 表面処理方法、プリント配線板の製造方法、および、表面処理装置 |
| CN115103759A (zh) * | 2020-03-03 | 2022-09-23 | 东丽株式会社 | 树脂接合体的制造装置及树脂接合体的制造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637514A (ja) * | 1986-06-27 | 1988-01-13 | Tdk Corp | 磁気記録媒体 |
| JPH0766549A (ja) * | 1993-08-23 | 1995-03-10 | Matsushita Electric Works Ltd | 金属と有機物の接合方法および配線板の製造方法 |
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- 2007-07-24 JP JP2007192705A patent/JP2009027120A/ja not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637514A (ja) * | 1986-06-27 | 1988-01-13 | Tdk Corp | 磁気記録媒体 |
| JPH0766549A (ja) * | 1993-08-23 | 1995-03-10 | Matsushita Electric Works Ltd | 金属と有機物の接合方法および配線板の製造方法 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101067152B1 (ko) | 2009-11-12 | 2011-09-22 | 삼성전기주식회사 | 인쇄회로기판 제조용 캐리어와 그 제조방법 및 이를 이용한 인쇄회로기판의 제조방법 |
| DE102010044114A1 (de) | 2010-11-18 | 2012-05-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Verbinden von Substraten und damit erhältliche Verbundstruktur |
| WO2012066096A1 (de) | 2010-11-18 | 2012-05-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum verbinden von substraten und damit erhältliche verbundstruktur |
| US9259905B2 (en) | 2010-11-18 | 2016-02-16 | Fraunhofer-Gesellschaft zur Föderung der angewandten Forschung e.V. | Method for connecting substrates, and composite structure obtainable thereby |
| KR101156776B1 (ko) * | 2010-12-21 | 2012-06-18 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
| JP2019220647A (ja) * | 2018-06-22 | 2019-12-26 | 株式会社アルバック | 表面処理方法、プリント配線板の製造方法、および、表面処理装置 |
| CN115103759A (zh) * | 2020-03-03 | 2022-09-23 | 东丽株式会社 | 树脂接合体的制造装置及树脂接合体的制造方法 |
| CN115103759B (zh) * | 2020-03-03 | 2024-02-13 | 东丽株式会社 | 树脂接合体的制造装置及树脂接合体的制造方法 |
| US12151440B2 (en) | 2020-03-03 | 2024-11-26 | Toray Industries, Inc. | Apparatus for producing joined-resin product and method for producing joined-resin product |
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