JP2009016392A - Manufacturing method of electrooptical display device, and flexible substrate - Google Patents

Manufacturing method of electrooptical display device, and flexible substrate Download PDF

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JP2009016392A
JP2009016392A JP2007173225A JP2007173225A JP2009016392A JP 2009016392 A JP2009016392 A JP 2009016392A JP 2007173225 A JP2007173225 A JP 2007173225A JP 2007173225 A JP2007173225 A JP 2007173225A JP 2009016392 A JP2009016392 A JP 2009016392A
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electrode portion
flexible substrate
flap piece
signal output
output electrode
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Shiro Kawaguchi
史郎 川口
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Kyocera Display Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To perform connection of a flexible substrate and coating with protection resin almost at the same time. <P>SOLUTION: When the flexible substrate 200 having a signal output electrode portion 230 formed on one end side of a base film 210 is electrically and mechanically connected, through a heat seal connection means 30, to a terminal portion 11a of a display panel 10 formed with a signal input electrode portion, a flap piece 211 formed by extending only the base film 210 from the signal output electrode portion 230 by a predetermined length along the depth of the terminal portion 11a is provided successively to the one end side of the flexible substrate 200, and a layer of protection resin 40 is formed on the flap piece 211, the flap piece 211 is heated and pressed together with the heat seal connection means 30 to cause the protection resin 40 to project from the flap piece 211, thereby coating the terminal portion 11a with the protection resin 40. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、電気光学的表示装置の製造方法および電気光学的表示装置の端子部に接続されるフレキシブル基板に関し、さらに詳しく言えば、フレキシブル基板の接続に伴って端子部上に保護樹脂を塗布する技術に関するものである。   The present invention relates to a method for manufacturing an electro-optical display device and a flexible substrate connected to a terminal portion of the electro-optical display device. More specifically, a protective resin is applied on the terminal portion as the flexible substrate is connected. It is about technology.

電気光学的表示装置には、液晶表示パネル,有機ELパネル,プラズマディスプレイパネルなどが含まれるが、いずれにしても表示要素を有する表示パネルに対してフレキシブル基板を接続し、フレキシブル基板を介して表示パネルに表示駆動信号を与えるようにしており、図3に液晶表示パネルにフレキシブル基板を接続した例を示す。   The electro-optical display device includes a liquid crystal display panel, an organic EL panel, a plasma display panel, etc. In any case, a flexible substrate is connected to a display panel having a display element, and display is performed via the flexible substrate. A display drive signal is given to the panel, and FIG. 3 shows an example in which a flexible substrate is connected to the liquid crystal display panel.

これについて説明すると、液晶表示パネル10は、それぞれ内面に図示しない透明電極が形成された一対の電極基板11,12を周辺シール材13を介して貼り合わせたセル基板を有し、このセル基板内には所定の液晶物質14が封入されている。   This will be described. The liquid crystal display panel 10 has a cell substrate in which a pair of electrode substrates 11 and 12 each having a transparent electrode (not shown) formed on the inner surface are bonded via a peripheral sealing material 13. Is filled with a predetermined liquid crystal substance 14.

この例では、一方の電極基板11側に端子部11aが側方に張り出すように連設されており、図示しないが、端子部11aには表示部内の透明電極に表示駆動信号を入力するための信号入力電極部が形成されている。   In this example, the terminal portion 11a is continuously provided on the one electrode substrate 11 side so as to protrude sideways. Although not shown, a display drive signal is input to the transparent electrode in the display portion in the terminal portion 11a. The signal input electrode portion is formed.

この場合、一方の電極基板11側の透明電極は、周辺シール材13を潜る引き回し配線を介して信号入力電極部と接続され、他方の電極基板11側の透明電極は、周辺シール材13内に設けられているトランスファ手段を介して信号入力電極部と接続されている。   In this case, the transparent electrode on the one electrode substrate 11 side is connected to the signal input electrode portion through the routing wiring that goes through the peripheral sealing material 13, and the transparent electrode on the other electrode substrate 11 side is in the peripheral sealing material 13. It is connected to the signal input electrode portion through the provided transfer means.

フレキシブル基板20は、その一端20a側に端子部11aの信号入力電極部に対応する図示しない信号出力電極を備え、その信号出力電極と信号入力電極部とがヒートシール接続手段30を介して電気的,機械的に接続される。   The flexible substrate 20 includes a signal output electrode (not shown) corresponding to the signal input electrode portion of the terminal portion 11 a on one end 20 a side, and the signal output electrode and the signal input electrode portion are electrically connected via the heat seal connection means 30. , Mechanically connected.

多くの場合、ヒートシール接続手段30には、異方性導電フィルム(ACF)や、熱可塑性樹脂内に微粒子状の銀を含むペーストなどが用いられる。   In many cases, the heat seal connecting means 30 is made of an anisotropic conductive film (ACF), a paste containing fine silver particles in a thermoplastic resin, or the like.

図示しないが、接続治具には、電気ヒータが内蔵されたヒーターバーが用いられ、ヒーターバーをフレキシブル基板20の上から押し付けることにより、信号出力電極と信号入力電極部とにそれぞれ含まれている多数のリード電極が一括して接続される。   Although not shown, the connection jig uses a heater bar with a built-in electric heater, and is included in the signal output electrode and the signal input electrode portion by pressing the heater bar from above the flexible substrate 20. Many lead electrodes are connected together.

フレキシブル基板20の他端側は、図示しない表示制御基板に接続され、その表示制御基板から出力される表示駆動信号がフレキシブル基板20を介して液晶表示パネル10に入力され、これにより液晶表示パネル10が所定に駆動される。   The other end side of the flexible substrate 20 is connected to a display control substrate (not shown), and a display drive signal output from the display control substrate is input to the liquid crystal display panel 10 via the flexible substrate 20, thereby the liquid crystal display panel 10. Are driven in a predetermined manner.

ところで、端子部11aの信号入力電極部に含まれている各リード電極は、通常、表示部内の透明電極と同じITO(Indium Tin Oxide)より形成されるが、ヒートシール接続手段30による接続部以外の部分が露出された状態であると、酸やアルカリによる腐蝕または電蝕にて消失して、極端な場合には断線することもある。   By the way, each lead electrode included in the signal input electrode portion of the terminal portion 11a is usually formed of the same ITO (Indium Tin Oxide) as the transparent electrode in the display portion, but other than the connection portion by the heat seal connection means 30. If this portion is exposed, it disappears due to corrosion or acid corrosion due to acid or alkali, and in extreme cases, it may be disconnected.

そこで、従来では、図3に示すように、防湿コート材として、シリコーン樹脂、エポキシ樹脂などの保護樹脂40を端子部11a上に塗布して、信号入力電極部に含まれている各リード電極を保護するようにしている(例えば、特許文献1,2参照)。   Therefore, conventionally, as shown in FIG. 3, a protective resin 40 such as a silicone resin or an epoxy resin is applied on the terminal portion 11a as a moisture-proof coating material, and each lead electrode included in the signal input electrode portion is applied. It is made to protect (for example, refer patent document 1, 2).

特開平6−289410号公報JP-A-6-289410 特開平9−33941号公報JP 9-33941 A

しかしながら、保護樹脂40の塗布はフレキシブル基板20の接続後に行われるため、その接続後で保護樹脂塗布するまでの間に、ゴミや人体分泌物なとの異物が端子部11aに付着することがあり、リークによる短絡、信頼性の低下などが懸念される。   However, since the application of the protective resin 40 is performed after the flexible substrate 20 is connected, foreign matter such as dust and human secretions may adhere to the terminal portion 11a after the connection and before the protective resin is applied. There is a concern about short circuit due to leakage, deterioration of reliability, and the like.

また、別の問題として、フレキシブル基板20の接続工程と、保護樹脂40の塗布工程とを分けて行っているため、生産性の面で好ましくない。   Another problem is that the connection process of the flexible substrate 20 and the application process of the protective resin 40 are performed separately, which is not preferable in terms of productivity.

したがって、本発明の課題は、フレキシブル基板の接続と保護樹脂の塗布とをほぼ同時に行えるようにすることにある。   Therefore, an object of the present invention is to enable connection of a flexible substrate and application of a protective resin almost simultaneously.

上記課題を解決するため、本発明は、請求項1に記載されているように、表示駆動の信号入力電極部が形成されている端子部を有する表示パネルと、ベースフィルムの一方の面の一端側に上記信号入力電極部に対応する信号出力電極部が形成されているフレキシブル基板とを含み、上記フレキシブル基板の一端側を上記端子部に重ね、上記信号入力電極部と上記信号出力電極部とをヒートシール接続手段を介して電気的,機械的に接続するとともに、その接続部以外の上記端子部上を保護樹脂にて被覆する電気光学的表示装置の製造方法において、上記フレキシブル基板の一端側に、上記信号出力電極部から上記ベースフィルムのみを上記端子部の奥行き方向に所定長さ分引き出してなるフラップ片を連設し、上記フラップ片の上記信号出力電極部側の面に上記保護樹脂層を形成し、上記ヒートシール接続手段とともに上記フラップ片を加熱加圧して、上記保護樹脂を上記フラップ片からはみ出させて、上記ヒートシール接続手段による接続部以外の上記端子部上を保護樹脂にて被覆することを特徴としている。   In order to solve the above-described problems, the present invention provides a display panel having a terminal portion on which a signal input electrode portion for display driving is formed, and one end of one surface of a base film. A flexible substrate on which a signal output electrode portion corresponding to the signal input electrode portion is formed, and one end side of the flexible substrate is overlaid on the terminal portion, and the signal input electrode portion, the signal output electrode portion, In the method of manufacturing an electro-optical display device in which the terminal portion other than the connection portion is covered with a protective resin, the one end side of the flexible substrate. In addition, a flap piece is formed by continuously connecting only the base film from the signal output electrode portion in the depth direction of the terminal portion by a predetermined length, and the signal output of the flap piece is provided. The protective resin layer is formed on the surface on the pole side, the flap piece is heated and pressurized together with the heat seal connecting means, and the protective resin is protruded from the flap piece, except for the connection portion by the heat seal connecting means. The terminal portion is covered with a protective resin.

請求項1の発明において、請求項2に記載されているように、上記保護樹脂として、電気絶縁性の熱可塑性樹脂が用いられることが好ましい。より好ましくは、請求項2に記載されているように、上記ヒートシール接続手段に含まれる熱可塑性樹脂と同一または同種の熱可塑性樹脂が用いられるとよい。   In the invention of claim 1, as described in claim 2, it is preferable that an electrically insulating thermoplastic resin is used as the protective resin. More preferably, as described in claim 2, a thermoplastic resin that is the same as or similar to the thermoplastic resin contained in the heat seal connecting means may be used.

また、請求項4に記載されているように、上記保護樹脂の層厚が、上記フラップ片の引出基部側から先端部側に行くにしたがって漸次厚くされることが好ましい。   In addition, as described in claim 4, it is preferable that the thickness of the protective resin is gradually increased from the draw base side to the tip side of the flap piece.

また、本発明には、請求項5に記載のフレキシブル基板も含まれる。すなわち、請求項5に記載のフレキシブル基板は、ベースフィルムの一方の面の一端側に信号出力電極部を備え、上記信号出力電極部が表示パネルの端子部に形成されている信号入力電極部にヒートシール接続手段を介して電気的,機械的に接続されるフレキシブル基板において、上記信号出力電極部から上記ベースフィルムのみを上記端子部の奥行き方向に所定長さ分引き出してなるフラップ片を備え、上記フラップ片の上記信号出力電極部側の面に上記端子部のための保護樹脂層が形成されていることを特徴としている。   The present invention also includes the flexible substrate according to claim 5. That is, the flexible substrate according to claim 5 includes a signal output electrode portion on one end side of one surface of the base film, and the signal output electrode portion is formed on a terminal portion of the display panel. In a flexible board that is electrically and mechanically connected through a heat seal connection means, a flap piece is formed by pulling out only the base film from the signal output electrode part by a predetermined length in the depth direction of the terminal part, A protective resin layer for the terminal portion is formed on a surface of the flap piece on the signal output electrode portion side.

請求項5の発明において、請求項6に記載されているように、上記保護樹脂の層厚が、上記フラップ片の引出基部側から先端部側に行くにしたがって漸次厚くされることが好ましい。   In the invention of claim 5, as described in claim 6, it is preferable that the layer thickness of the protective resin is gradually increased from the draw base side to the tip side of the flap piece.

本発明による電気光学的表示装置の製造方法によれば、表示パネルの信号入力電極部が形成されている端子部に、ベースフィルムの一方の面の一端側に上記信号入力電極部に対応する信号出力電極部が形成されているフレキシブル基板をヒートシール接続手段を介して電気的,機械的に接続するにあたって、上記フレキシブル基板の一端側に、上記信号出力電極部から上記ベースフィルムのみを上記端子部の奥行き方向に所定長さ分引き出してなるフラップ片を連設し、上記フラップ片の一方の面に保護樹脂層を形成し、上記ヒートシール接続手段とともに上記フラップ片を加熱加圧して、上記保護樹脂を上記フラップ片からはみ出させて、上記ヒートシール接続手段による接続部以外の上記端子部上を保護樹脂にて被覆するようにしたことにより、端子部に異物が付着する時間を与えることなく、フレキシブル基板の接続と保護樹脂の塗布とをほぼ同時に行うことができる。   According to the method of manufacturing an electro-optical display device according to the present invention, a signal corresponding to the signal input electrode portion on one end side of one surface of the base film is formed on the terminal portion where the signal input electrode portion of the display panel is formed. When the flexible substrate on which the output electrode portion is formed is electrically and mechanically connected through the heat seal connecting means, only the base film from the signal output electrode portion is connected to the terminal portion on one end side of the flexible substrate. A flap piece drawn out by a predetermined length in the depth direction is continuously provided, a protective resin layer is formed on one surface of the flap piece, and the flap piece is heated and pressurized together with the heat seal connecting means to thereby protect the protection piece. The resin protruded from the flap piece, and the terminal portion other than the connection portion by the heat seal connection means was covered with a protective resin. More, without giving time for foreign matter to adhere to the terminal portion, it is possible to perform a coating of protective resin and the flexible board connected substantially simultaneously.

この場合、保護樹脂の層厚をフラップ片の引出基部側から先端部側に行くにしたがって漸次厚くすることにより、フラップ片から保護樹脂をよりはみ出しやすくすることができる。   In this case, the protective resin can be more easily protruded from the flap piece by gradually increasing the thickness of the protective resin layer from the flap base to the tip side.

次に、図1および図2により、本発明の実施形態について説明する。図1(a)〜(c)は本発明の電気光学的表示装置の製造方法を工程順に説明するための模式的な断面図、図2(a)は本発明のプリント基板を示す断面図,図2(b)はその底面図(パネルの端子部側から見た図)である。   Next, an embodiment of the present invention will be described with reference to FIGS. 1A to 1C are schematic cross-sectional views for explaining the manufacturing method of the electro-optical display device of the present invention in the order of steps, and FIG. 2A is a cross-sectional view showing the printed circuit board of the present invention. FIG.2 (b) is the bottom view (figure seen from the terminal part side of the panel).

なお、この実施形態においても、先の図3で説明した従来例と同じく、電気光学表示装置は液晶表示パネル10としているが、図1(a)〜(c)には図3で図示省略としたパネル側の端子部11aに設けられる信号入力電極部を参照符号11cとして示している。この信号入力電極部11cは端子部11aの端縁11b側に配置されている。   In this embodiment as well, the electro-optical display device is the liquid crystal display panel 10 as in the conventional example described with reference to FIG. 3, but the illustration is omitted in FIGS. 1A to 1C in FIG. The signal input electrode portion provided in the terminal portion 11a on the panel side is indicated by reference numeral 11c. The signal input electrode portion 11c is arranged on the end edge 11b side of the terminal portion 11a.

図1(a)に示すように、液晶表示パネル10の端子部11aにフレキシブル基板200を接続するにあたって、本発明では、フレキシブル基板200に次のような構成を採用している。   As shown in FIG. 1A, in connecting the flexible substrate 200 to the terminal portion 11a of the liquid crystal display panel 10, in the present invention, the following configuration is adopted for the flexible substrate 200.

図2(a),(b)を参照して、フレキシブル基板200は、基本的な構成として、例えばポリイミド樹脂フィルム製で可撓性を有するベースフィルム210と、ベースフィルム210の一方の面に形成された多数本のリード配線221を含む配線層220と、配線層220の一端側に配置された信号出力電極部230と、配線層220上に形成された電気絶縁性のカバー層240とを備えている。   Referring to FIGS. 2A and 2B, the flexible substrate 200 is formed on one surface of the base film 210 as a basic configuration, for example, a base film 210 made of a polyimide resin film and having flexibility. A wiring layer 220 including a large number of lead wires 221, a signal output electrode portion 230 disposed on one end side of the wiring layer 220, and an electrically insulating cover layer 240 formed on the wiring layer 220. ing.

信号出力電極部230には、各リード配線221の端部がリード電極221aとして含まれている。信号出力電極部230上には、ヒートシール接着手段30が設けられ、信号出力電極部230は、ヒートシール接着手段30を介してパネル側の端子部11aに設けられる信号入力電極部11cと電気的,機械的に接続される。   The signal output electrode portion 230 includes an end portion of each lead wire 221 as a lead electrode 221a. Heat seal bonding means 30 is provided on the signal output electrode section 230, and the signal output electrode section 230 is electrically connected to the signal input electrode section 11 c provided on the panel side terminal section 11 a via the heat seal bonding means 30. , Mechanically connected.

ヒートシール接着手段30には、例えば異方性導電フィルム(ACF)や、熱可塑性樹脂内に微粒子状の銀を含むペーストなどが用いられてよい。   For the heat seal bonding means 30, for example, an anisotropic conductive film (ACF) or a paste containing fine silver particles in a thermoplastic resin may be used.

従来のフレキシブル基板においては、図3で説明したように、フレキシブル基板20の一端20a側に信号出力電極部が設けられ、そこで終端しているが、本発明のフレキシブル基板200では、信号出力電極部230からベースフィルム210のみを端子部11aの奥行き方向にさらに所定長さ分引き出してなるフラップ片211を備えている。   In the conventional flexible substrate, as described with reference to FIG. 3, the signal output electrode portion is provided on the one end 20a side of the flexible substrate 20 and terminates there. However, in the flexible substrate 200 of the present invention, the signal output electrode portion is provided. 230 is provided with a flap piece 211 that is formed by further pulling out only the base film 210 by a predetermined length in the depth direction of the terminal portion 11a.

なお、端子部11aの奥行き方向とは、端子部11aの端縁11bから周辺シール材13に向かう方向である。   The depth direction of the terminal portion 11a is a direction from the end edge 11b of the terminal portion 11a toward the peripheral sealing material 13.

本発明において、フラップ片211の端子部11aと対向する一方の面、好ましくは幅方向の全体には、保護する保護樹脂40の層が形成されている。この保護樹脂40は、上記従来例と同じく、信号入力電極部11cのうちの端子部11aに露出されているリード電極を被覆して異物から保護するためのものである。   In the present invention, a protective resin 40 layer for protection is formed on one surface of the flap piece 211 facing the terminal portion 11a, preferably in the entire width direction. This protective resin 40 is for covering the lead electrode exposed to the terminal portion 11a of the signal input electrode portion 11c and protecting it from foreign matter, as in the conventional example.

この保護樹脂40は、熱可塑性合成樹脂、とりわけヒートシール接着手段30に含まれている熱可塑性合成樹脂と同一または同種の熱可塑性合成樹脂(ホットメルト樹脂など)であることが、同一工程で形成できる、同一条件で加熱溶融できる点で好ましい。また、図2(a)に示すように、保護樹脂40は、その塗布厚がフラップ片211の引出基部側(信号出力電極部230側)から先端部側に行くにしたがって漸次厚くなるように、フラップ片211に塗布されることが好ましい。   The protective resin 40 is a thermoplastic synthetic resin, in particular, a thermoplastic synthetic resin (such as a hot melt resin) that is the same as or similar to the thermoplastic synthetic resin contained in the heat seal bonding means 30, and formed in the same process. It is preferable in that it can be heated and melted under the same conditions. Further, as shown in FIG. 2 (a), the protective resin 40 has a coating thickness that gradually increases from the lead base side (signal output electrode 230 side) of the flap piece 211 toward the tip side. It is preferable to apply to the flap piece 211.

フレキシブル基板200を端子部11aに接続するには、図1(b)に示すように、信号出力電極部230と信号入力電極部11cとを位置決めして重ね合わせるとともに、保護樹脂40付きのフラップ片211が端子部11a上に配置する。   To connect the flexible substrate 200 to the terminal portion 11a, as shown in FIG. 1B, the signal output electrode portion 230 and the signal input electrode portion 11c are positioned and overlapped, and a flap piece with a protective resin 40 is provided. 211 is arranged on the terminal portion 11a.

次に、図1(c)に示すように、ヒートシール接着手段30からフラップ片211の先端にかけての部分に図示しないヒーターバーを押し付けてフラップ片211がほぼ平らになるように圧着する。   Next, as shown in FIG. 1C, a heater bar (not shown) is pressed against the portion from the heat seal bonding means 30 to the tip of the flap piece 211, so that the flap piece 211 is pressure-bonded so as to be substantially flat.

これにより、信号出力電極部230と信号入力電極部11cとが電気的,機械的に接続されるとともに、保護樹脂40が溶融してフラップ片211からはみ出し、ヒートシール接着手段30による通電部以外の部分が保護樹脂40にて被覆される。   As a result, the signal output electrode portion 230 and the signal input electrode portion 11c are electrically and mechanically connected, and the protective resin 40 is melted and protrudes from the flap piece 211, except for the current-carrying portion by the heat seal bonding means 30. The portion is covered with a protective resin 40.

このように、本発明によれば、ヒートシール接着手段30による電気的,機械的な接続と、保護樹脂40の塗布を1工程で行うことができる。また、本発明によれば、フレキシブル基板200を端子部11aに接続した後、フラップ片211および保護樹脂40により、ヒートシール接着手段30が外気に晒されなくなるため、ヒートシール接着手段30の防湿効果も高められる。   Thus, according to the present invention, electrical and mechanical connection by the heat seal bonding means 30 and application of the protective resin 40 can be performed in one step. Further, according to the present invention, after the flexible substrate 200 is connected to the terminal portion 11a, the heat seal bonding means 30 is not exposed to the outside air by the flap piece 211 and the protective resin 40. Can also be enhanced.

また、保護樹脂40の層厚をフラップ片211の引出基部側から先端部側に行くにしたがって漸次厚くすることにより、保護樹脂40の通電部側への流れが防止されるとともに、保護樹脂40がフラップ片211の先端部側から押し出されやすくなるため、電極基板12の端縁12aの下側に庇状に存在する隙間にも保護樹脂40が充填されることになる。   In addition, by gradually increasing the thickness of the protective resin 40 from the leading base side to the leading end side of the flap piece 211, the protective resin 40 is prevented from flowing to the energizing portion side, and the protective resin 40 Since it becomes easy to be pushed out from the front end side of the flap piece 211, the protective resin 40 is also filled in a gap existing in a bowl shape below the end edge 12 a of the electrode substrate 12.

なお、端子部11aに液晶駆動用のチップ部品が実装されているCOG(Chip On Glass)機種の場合には、フラップ片211にチップ部品が嵌合される開口部を設ければよい。   In the case of a COG (Chip On Glass) model in which the liquid crystal driving chip component is mounted on the terminal portion 11a, an opening for fitting the chip component may be provided in the flap piece 211.

(a)〜(c)本発明の電気光学的表示装置の製造方法を工程順に説明するための模式的な断面図。(A)-(c) Typical sectional drawing for demonstrating the manufacturing method of the electro-optical display apparatus of this invention to process order. (a)は本発明のプリント基板を示す断面図,(b)はその底面図。(A) is sectional drawing which shows the printed circuit board of this invention, (b) is the bottom view. 従来例を示す模式的な断面図。Schematic sectional view showing a conventional example.

符号の説明Explanation of symbols

10 液晶表示パネル
11,12 電極基板
11a 端子部
11c 信号入力電極部
13 周辺シール材
14 液晶物質
30 ヒートシール接着手段
40 保護樹脂
200 フレキシブル基板
210 ベースフィルム
211 フラップ片
220 配線層
230 信号出力電極部
240 カバー層
DESCRIPTION OF SYMBOLS 10 Liquid crystal display panel 11,12 Electrode board | substrate 11a Terminal part 11c Signal input electrode part 13 Peripheral sealing material 14 Liquid crystal substance 30 Heat seal adhesion means 40 Protection resin 200 Flexible board 210 Base film 211 Flap piece 220 Wiring layer 230 Signal output electrode part 240 Cover layer

Claims (6)

表示駆動の信号入力電極部が形成されている端子部を有する表示パネルと、ベースフィルムの一方の面の一端側に上記信号入力電極部に対応する信号出力電極部が形成されているフレキシブル基板とを含み、上記フレキシブル基板の一端側を上記端子部に重ね、上記信号入力電極部と上記信号出力電極部とをヒートシール接続手段を介して電気的,機械的に接続するとともに、その接続部以外の上記端子部上を保護樹脂にて被覆する電気光学的表示装置の製造方法において、
上記フレキシブル基板の一端側に、上記信号出力電極部から上記ベースフィルムのみを上記端子部の奥行き方向に所定長さ分引き出してなるフラップ片を連設し、上記フラップ片の上記信号出力電極部側の面に上記保護樹脂層を形成し、上記ヒートシール接続手段とともに上記フラップ片を加熱加圧して、上記保護樹脂を上記フラップ片からはみ出させて、上記ヒートシール接続手段による接続部以外の上記端子部上を保護樹脂にて被覆することを特徴とする電気光学的表示装置の製造方法。
A display panel having a terminal portion on which a signal input electrode portion for display driving is formed; a flexible substrate having a signal output electrode portion corresponding to the signal input electrode portion formed on one end of one surface of the base film; One end side of the flexible substrate is overlaid on the terminal portion, and the signal input electrode portion and the signal output electrode portion are electrically and mechanically connected through a heat seal connecting means, and other than the connecting portion. In the method of manufacturing an electro-optical display device in which the terminal portion is covered with a protective resin,
A flap piece formed by pulling out only the base film from the signal output electrode portion by a predetermined length in the depth direction of the terminal portion is connected to one end side of the flexible substrate, and the flap piece is on the signal output electrode portion side. Forming the protective resin layer on the surface, heating and pressurizing the flap piece together with the heat seal connecting means, causing the protective resin to protrude from the flap piece, and the terminals other than the connection portion by the heat seal connecting means A method of manufacturing an electro-optical display device, wherein the part is coated with a protective resin.
上記保護樹脂として、電気絶縁性の熱可塑性樹脂が用いられることを特徴とする請求項1に記載の電気光学的表示装置の製造方法。   2. The method of manufacturing an electro-optical display device according to claim 1, wherein an electrically insulating thermoplastic resin is used as the protective resin. 上記保護樹脂として、上記ヒートシール接続手段に含まれる熱可塑性樹脂と同一または同種の熱可塑性樹脂が用いられることを特徴とする請求項2に記載の電気光学的表示装置の製造方法。   3. The method of manufacturing an electro-optical display device according to claim 2, wherein the protective resin is the same or the same type of thermoplastic resin as the thermoplastic resin contained in the heat seal connecting means. 上記保護樹脂の層厚が、上記フラップ片の引出基部側から先端部側に行くにしたがって漸次厚くされることを特徴とする請求項1ないし3のいずれか1項に記載の電気光学的表示装置の製造方法。   4. The electro-optical display device according to claim 1, wherein a thickness of the protective resin is gradually increased from a leading base side to a tip side of the flap piece. 5. Production method. ベースフィルムの一方の面の一端側に信号出力電極部を備え、上記信号出力電極部が表示パネルの端子部に形成されている信号入力電極部にヒートシール接続手段を介して電気的,機械的に接続されるフレキシブル基板において、
上記信号出力電極部から上記ベースフィルムのみを上記端子部の奥行き方向に所定長さ分引き出してなるフラップ片を備え、上記フラップ片の上記信号出力電極部側の面に上記端子部のための保護樹脂層が形成されていることを特徴とするフレキシブル基板。
A signal output electrode portion is provided on one end side of one surface of the base film, and the signal output electrode portion is electrically and mechanically connected to the signal input electrode portion formed on the terminal portion of the display panel via heat seal connection means. In the flexible substrate connected to
A flap piece is formed by drawing out only the base film from the signal output electrode portion by a predetermined length in the depth direction of the terminal portion, and the surface of the flap piece on the signal output electrode portion side is protected for the terminal portion. A flexible substrate, wherein a resin layer is formed.
上記保護樹脂の層厚が、上記フラップ片の引出基部側から先端部側に行くにしたがって漸次厚くされることを特徴とする請求項5に記載のフレキシブル基板。   6. The flexible substrate according to claim 5, wherein the thickness of the protective resin is gradually increased from the draw base side to the tip side of the flap piece.
JP2007173225A 2007-06-29 2007-06-29 Manufacturing method of electrooptical display device, and flexible substrate Pending JP2009016392A (en)

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Publication number Priority date Publication date Assignee Title
WO2020090026A1 (en) * 2018-10-31 2020-05-07 堺ディスプレイプロダクト株式会社 Display panel and method for manufacturing display panel

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