JP2009010223A - Verification method for component library data - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To verify whether component library data, prepared using a component recognition camera of a high resolution, can be utilized in an electronic component mounting device loaded with a component recognition camera of lower resolution without problems, and to make the utilization sure. <P>SOLUTION: When the object model of the electronic component mounting device is selected by operating an input device 29, the microcomputer of a personal computer body 32 recognizes the object model from a correspondence table and determines whether the resolution of the photographed image by the component recognition camera 44 of high resolution is identical to that of the component recognition camera mounted on the object model. When it is determined that it is not identical, the photographed image is reduced so as have a resolution identical or similar to that of the object model; then the confirmation test, that is the recognition test, of the component library data is executed by utilizing the reduced image; the component library data is stored in the RAM of the electronic component mounting device, when it is appropriate; and then offline library teaching is finished. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a part library data verification method. Specifically, it is verified whether or not the component library data representing the characteristics of an electronic component created using a high-resolution component recognition camera can be used for an electronic component mounting apparatus equipped with a component recognition camera having a lower resolution. The present invention relates to a part library data verification method to be performed.

Although the electronic component mounting apparatus is disclosed in Patent Document 1 or the like, in general, a component recognition camera that captures an electronic component has become higher resolution year by year, and this high resolution component recognition camera is used. Component library data representing the characteristics of the electronic component is created.
JP 2005-136276 A

  However, the component library data created by using the latest high-resolution component recognition camera is directly used for the electronic component mounting device on which the latest component recognition camera is mounted, that is, the electronic component mounting device of a model introduced in the past. If it is adopted, there are cases where the recognition process of the electronic component does not work because the resolution is different.

  Therefore, the present invention verifies whether or not the component library data created by using the high-resolution component recognition camera can be used without any problem in an electronic component mounting apparatus equipped with a component recognition camera having a lower resolution. The purpose is to make sure.

For this reason, according to the first aspect of the invention, can the component library data representing the characteristics of the electronic component created using the high-resolution component recognition camera be used for an electronic component mounting apparatus equipped with a component recognition camera having a lower resolution? A method for verifying parts library data for verifying
Reduce the image captured by the high-resolution component recognition camera so that the resolution is the same as or approximate to the resolution of the component recognition camera with inferior resolution,
It is characterized in that a confirmation test of component library data is performed using the reduced image.

The second invention is a verification of whether or not component library data representing the characteristics of an electronic component created using a high-resolution component recognition camera can be used for an electronic component mounting apparatus equipped with a component recognition camera having a lower resolution. A method for verifying parts library data,
Select the target model of the electronic component mounting device, grasp the resolution of the component recognition camera mounted on the electronic component mounting device,
Determine whether the resolution of the component recognition camera of the grasped target model is the same as the resolution of the high-resolution component recognition camera used to create the component library data,
When it is determined that they are not the same, the image captured by the high-resolution component recognition camera is reduced so that the resolution is the same as or approximate to the component recognition camera of the target model,
It is characterized in that a confirmation test of component library data is performed using the reduced image.

  A third invention is characterized in that, in the first or second invention, the brightness of an image obtained by reducing the average of the brightness of a predetermined number of pixels of an image captured by the component recognition camera having a high resolution is used.

  According to a fourth invention, in the first or second invention, each brightness value is weighted by a distance ratio between the center of the pixel after reduction of the image captured by the high-resolution component recognition camera and the pixel in the vicinity thereof. The average value is the reduced image brightness.

  The present invention verifies whether component library data created using a high-resolution component recognition camera can be used without problems for an electronic component mounting apparatus equipped with a component recognition camera with a lower resolution than that, and ensures its use. Can be.

  1 is a plan view of an electronic component mounting apparatus, and an electronic component mounting apparatus main body 1 extends in the left-right direction to a machine base 2 and a central portion of the machine base 2. FIG. The existing conveyor unit 3, two sets of component mounting units 4, 4 and two sets of component supply units 5, 5 respectively disposed at the front part (lower side in the figure) and the rear part (upper side in the figure) of the machine base 2. And. The component supply unit 5 includes a plurality of component supply units 6, which are electronic component supply devices, which are detachably incorporated to form an electronic component mounting device.

  The conveyor unit 3 includes a central set table 8, a left supply conveyor 9, and a right discharge conveyor 10. The printed circuit board P is supplied from the supply conveyor 9 to the set table 8, and a plurality of backup pins (not shown) are provided on the upper surface of the set table 8 to support the lower surface of the printed circuit board P so as to be horizontal. When the printed circuit board P is supported, it is fixed and set to a predetermined height. And the board | substrate P by which mounting | wearing of the electronic component was completed is discharged | emitted to a downstream apparatus via the discharge conveyor 10 from the set table 8. FIG.

  Each component mounting unit 4 is provided with an XY stage 12 on which a head unit 13 is movably mounted, and a component recognition camera 14 and a nozzle stocker 15 having a lower resolution than a high-resolution component recognition camera 44 described later. It is installed. The head unit 13 is equipped with two mounting heads 16 and 16 for sucking and mounting electronic components, and one substrate recognition camera 17 for recognizing the position of the printed circuit board P. Normally, the XY stages 12 and 12 of both the component mounting parts 4 and 4 are alternately operated.

  In each XY stage 12, the beam 12A is moved in the Y direction by the Y axis drive motor 12Y, and the head unit 13 is moved in the X direction by the X axis drive motor 12X. As a result, the head unit 13 is moved in the XY direction. It becomes.

  Each component supply unit 5 includes a number of component supply units 6 on a unit base 19 that are detachable side by side. Each component supply unit 6 is equipped with a storage tape C in which a large number of electronic components are stored at regular intervals. By intermittently feeding the storage tape C from which the cover tape has been peeled off, the tip of the component supply unit 6 is provided. The electronic components are supplied to the component mounting unit 4 one by one.

  The operation of the electronic component mounting apparatus main body 1 based on mounting data stored in a RAM 21 (to be described later) is to first drive the XY stage 12 so that the head unit 13 faces the component supply unit 6 and then lowers the mounting head 16. A desired electronic component is picked up by the suction nozzle 18. Subsequently, after the mounting head 16 is raised, the XY stage 12 is driven to move the electronic component to the position directly above the component recognition camera 14, the electronic component is imaged, and recognition processing is performed by the recognition processing device 25. The positional deviation with respect to the suction nozzle 18 is recognized.

  Next, the mounting head 16 is moved to the position of the substrate P on the set table 8, the recognition mark attached to the printed circuit board P is imaged by the substrate recognition camera 17, and recognition processing is performed by the recognition processing device 25. , The X-axis drive motor 12X of the XY stage 12, the Y-axis drive motor 12Y, and the θ-axis drive motor of the suction nozzle 18 based on the recognition process result of the electronic component and the recognition process result of the printed circuit board P. 18A is driven and corrected, and the suction nozzle 18 is lowered by the vertical axis drive motor 18B to mount the electronic component on the substrate P.

  Next, a control block diagram of the electronic component mounting apparatus main body 1 of FIG. 2 will be described. Reference numeral 20 denotes a CPU (Central Processing Unit) as a control device that performs overall control of operations related to taking out and mounting of the electronic components of the electronic component mounting apparatus, 21 is a RAM (Random Access Memory) as a storage device, 22 Is a ROM (Read Only Memory), and the CPU 20 is an interface for operations related to taking out and mounting the electronic component of the electronic component mounting apparatus according to the program stored in the ROM 22 based on the data stored in the RAM 21. 23 and the drive circuit 24 are used to control each drive source.

  Reference numeral 25 denotes a recognition processing apparatus connected to the CPU 20 via the interface 23. The recognition processing of the image captured by the component recognition camera 14 and the image captured by the board recognition camera 17 and captured. The recognition processing device 25 performs the recognition process, and the processing result is sent to the CPU 20. That is, the CPU 20 outputs an instruction to the recognition processing device 25 to perform recognition processing (calculation of misalignment amount) on the image captured by the component recognition camera 14 or recognition processing of the image captured by the board recognition camera 17. In addition, the recognition processing result is received from the recognition processing device 25.

  That is, when the amount of displacement is grasped by the recognition processing of the recognition processing device 25, the result is sent to the CPU 20, and the CPU 20 drives the X-axis drive motor 12X and the Y-axis drive based on the result of the component recognition process and the board recognition process. By moving the suction nozzle 18 in the X and Y directions by driving the motor 12Y and by rotating the θ by the θ axis drive motor 18A, the rotational angle position around the X and Y directions and the vertical axis is not corrected, and the vertical axis drive motor The electronic component is lowered by 18B and mounted on the printed circuit board P.

  The image picked up by the component recognition camera 14 is displayed on a monitor 26 as a display device. The monitor 26 is provided with various touch panel switches 27, and various settings can be performed by an operator operating the touch panel switch 27.

  The RAM 21 stores mounting data relating to component mounting, and the X direction (indicated by X) and the Y direction (indicated by Y) within the printed circuit board are stored for each mounting order (step number). And angle (indicated by Z) information, arrangement number information of each component supply unit 3, and the like are stored. The RAM 21 stores component arrangement data, which stores the type (component ID) of each electronic component, the arrangement coordinates of the supply unit 3 and the like corresponding to the arrangement number of each component supply unit 3. Has been. Furthermore, component library data, which is a feature of the electronic component, is stored for each electronic component.

  In FIG. 3, 30 is an off-line library teaching device for teaching confirmation of component library data independently of the electronic component mounting apparatus main body 1, and internally includes an input device 29 such as a keyboard and a microcomputer as a control device. A personal computer (hereinafter referred to as a “personal computer”) 31 having a personal computer main body 32 and a monitor 33 as a notification device, a microcomputer provided with a power switch 35 and connected to the personal computer main body 32 via a USB cable 34, etc. A lighting control board 36 provided with a power supply, an AC adapter 38 connected to the lighting control board 36 via a power cable 37, and an installation stand connected to the personal computer body 32 via a USB cable 39. Illumination device 41 fixed to 40 , Composed of component mount 置高 level adjusting device 42 is capable mounted removably on the installation base 40A of the installation stand 40.

  Moreover, although an imaging device is comprised from the illuminating device 41 and the component mounting height level adjusting device 42, it demonstrates in full detail below. First, in a cylindrical device main body 43 of the illumination device 41, a reflection illumination main body including a component recognition camera 44, a lens barrel 46 provided with a lens 45, and a plurality of ring-shaped reflection illumination lamps 47 is provided. 48 is disposed.

  With the above configuration, an offline library teaching operation capable of performing offline component library data confirmation teaching even during operation of the electronic component mounting apparatus will be described based on the flowchart of FIG. First, the operator measures the thickness of the electronic component for which component library data is to be created, operates the input device 29 of the personal computer 31, inputs the component thickness displayed on the monitor 33, and teach Input conditions such as lighting method.

  Then, since the correspondence table of the component thickness and the number of steps of the adjusting table is stored in the internal memory (not shown) of the personal computer main body 32, the illumination is performed at a thickness of, for example, 15.0 mm based on the input thickness. When the method is reflected illumination, it is displayed on the monitor 33 that it is necessary to place two stages of the adjustment base 51 on the base 50, and when the thickness is 8.0 mm and the illumination method is transmitted illumination. Indicates that the adjustment table (not shown) needs to be placed on the base table 50 as a two-stage and an uppermost table.

  Therefore, in the case of the former electronic component, the operator places the basic table 50 and the two-stage adjustment table 51 on the installation table 40A, and then adjusts the electronic component for which the component library data is to be created at the uppermost level. Place on the table 51. Next, the electronic component itself or the base 50 and the adjustment platform 51 are moved so that the electronic component is positioned directly below the high-resolution component recognition camera 44.

  In this state, when the personal computer 31 and the AC adapter 38 are connected to a commercial power source, the power switch 35 of the lighting control board 36 is turned on, and the input device 29 is operated. The reflected illumination lamp 47 of the apparatus 41 is turned on, and a reflected image is captured by the component recognition camera 44 in a state where the electronic component D on the uppermost adjustment table 51 is irradiated. When the illumination method is transmission illumination, the illumination lamp for transmission disposed in the uppermost transmission adjustment base (not shown) is turned on so that the electronic components on the transmission adjustment base are turned on. As the irradiated state, a transmission image is captured by the component recognition camera 44.

  Then, the personal computer main body 32 serving as a recognition processing device of the personal computer 31 performs recognition processing on the captured image, and the personal computer main body 32 creates component library data of the electronic component D based on the recognition processing result. . That is, the part library data is created in accordance with a creation program stored in a ROM (Read Only Memory) constituting the microcomputer of the personal computer main body 32.

  As described above, the component library data of the electronic component D can be created. After the creation, the microcomputer (hereinafter referred to as “microcomputer”) in the personal computer main body 32 is stored in the internal memory, and the operator Is also stored in a storage medium, and stored in the RAM 21 of the electronic component mounting apparatus via this storage medium.

  Then, the operator operates the input device 29, and the component library data created using the high-resolution component recognition camera 44 has a problem with the electronic component mounting device on which the component recognition camera 14 having a lower resolution is mounted. Verify whether it can be used without any problems.

  First, the input device 29 is operated to select the target model (target actual machine) of the electronic component mounting apparatus. Then, the personal computer main body 32 grasps the resolution of the component recognition camera 14 mounted on the electronic component mounting apparatus from the correspondence table between the model of the electronic component mounting apparatus and the resolution of the captured image stored in the internal memory.

  Therefore, when the target model is selected, the microcomputer of the personal computer main body 32 grasps the target model from the correspondence table and determines whether or not the resolution of the captured image is the same as the resolution of the component recognition camera mounted on the target model. To do.

  When it is determined that they are not the same, after the image captured by the high-resolution component recognition camera 44 has been reduced so that the resolution is the same as or similar to that of the component recognition camera mounted on the target model, or when it is determined that they are the same Is not reduced, and a confirmation test such as confirmation of the dimensions of the component library data of the electronic component D, that is, a recognition test is performed using the image. If the component library data is appropriate, the component library data is stored in the RAM 21 of the electronic component mounting apparatus and the offline library teaching is terminated. If the component library data is not appropriate, a part of the component library data is corrected. After that, it is stored in the RAM 21 and the process is terminated. Further, the recognition test may be performed without being reduced, not only when it is determined that they are the same, but also when they are approximately the same.

  It should be noted that the part library data may be stored again in the RAM 21 if the part library data is checked again after the part library data is corrected.

  Next, it is determined whether or not the resolution of the captured image is the same as the resolution of the component recognition camera mounted on the target model (hereinafter referred to as “standard resolution”). Alternatively, an image captured by the high-resolution component recognition camera 44 is reduced so as to obtain an approximate resolution. The image reduction process will be described in detail below.

  First, the field of view size is usually set to be the same regardless of whether a standard-resolution or high-resolution component recognition camera is used. Therefore, the resolution of the high-resolution component recognition camera 44 is higher (size per pixel (mm / pixel)).

  Here, when the captured image is reduced, the reduction size is an integer multiple, for example, the case where the resolution of the standard resolution component recognition camera is 1/2 with respect to the resolution of the high resolution component recognition camera. The reduction process will be described. In this case, for example, the simple average of the brightness of each of the four pixels of the 8 × 8 pixel image at the lower left in FIG. 5 is reduced as the brightness of the 4 × 4 pixel reduced image adjacent to the right.

  That is, when the brightness of each of the four pixels surrounded by the circle A at the lower left in FIG. 5 is “16”, “36”, “8”, “16”, (16 + 36 + 8 + 16) / 4 = 19. The microcomputer of the personal computer main body 32 calculates the brightness of the pixels surrounded by the circle AA on the right side of FIG. 5 as the average value “19”. Next, similarly, the average value of the brightness of each of the four pixels adjacent to the circle A is calculated and set as the brightness of the pixel adjacent to the right of the circle AA on the right side of FIG. A simple average of the brightness of each of the four pixels of the 8 × 8 pixel image is set as the brightness of each pixel of the 4 × 4 pixel reduced image adjacent to the right.

  Next, when the reduction size is not an integral multiple, for example, the case of 2/3 will be described as an example of the image reduction processing. That is, for example, the 6 × 6 pixel image at the lower left in FIG. 6 is reduced as the brightness of the reduced image at 4 × 4 pixels in the lower right.

  That is, the area before the reduction (encircled by a circle BB) corresponds to which area before the reduction, and the brightness values (P1 to P4) of the four nearest pixels and those pixels are obtained. Brightness ratio of the pixel after reduction using the ratio of the distance to (dx, 1-dx, dy, 1-dy: normalized so that the distance between the pixel centers before reduction is 1) To make a reduced image. In this case, the brightness value of the pixel after reduction is determined as a weighted average value of the respective brightness values according to the distance ratio between the center of the pixel after reduction and the four pixels closest to the center.

  Accordingly, the brightness value of the pixels surrounded by the circle BB of the image obtained by reducing the pixels surrounded by the circle B is (1−dy) (p2 × (1−dx) + p1 × dx) + dy (p3 × (1 −dx) + p4 × dx), dx = 3/4, 1-dx = 1/4, dy = 1/4, 1-dy = 3/4, and the pixel brightness value is P1 = 16, P2. = 36, P3 = 16, P4 = 8, the brightness value of the reduced image is (1-1 / 4) (36 × (1-3 / 4) + 16 × 3/4) +1/4 (16 × (1-3 / 4) + 8 × 3/4) = 18.25, which is about 18.

  Next, for each pixel other than the circle B, the brightness value of the pixel after the reduction is sequentially changed in accordance with the distance ratio between the center of the pixel after the reduction and the four pixels closest to the center. It is determined as a weighted average value, and is used as the brightness of the reduced image.

  With the above configuration, the operation of sucking and mounting electronic components by the electronic component mounting apparatus will be described in detail below. First, the printed circuit board P is carried into the set table 8 from the upstream device via the supply conveyor 9, and the positioning operation is started by the positioning mechanism.

  Next, the CPU 20 generates suction sequence data from the mounting data stored in the RAM 21. That is, the CPU 20 first reads data from the mounting data, determines the suction procedure by the suction nozzle 18, and finally performs the final electronic component of chain suction (a maximum of two suctions per one mounting head 16). The component supply unit 6 for supplying the electronic component is determined, the arrangement coordinates of the final suction position are stored in the RAM 21, and the mounting coordinate position of the electronic component to be mounted first after the completion of the chain suction (the mounting data before the component suction displacement correction is performed Position) and the coordinates are stored in the RAM 21.

  Then, the electronic component suction operation is executed. That is, the suction nozzle 18 corresponding to the component type of the electronic component is mounted on the RAM 21 according to the mounting data in which the XY coordinate position where the printed circuit board P is to be mounted, the rotation angle position about the vertical axis, the arrangement number, and the like are specified. The electronic component to be removed is sucked out from a predetermined component supply unit 6.

  At this time, the Y-axis drive motor 12Y and the X-axis drive motor 12X are controlled by the CPU 20 so that the suction nozzle 18 of each mounting head 16 is located above the top electronic component of each component supply unit 6 that stores the electronic component to be mounted. The Y-axis drive motor 12Y is driven by the drive circuit 24 to move the beam 12A in the Y direction, and the X-axis drive motor 12X is driven to move the head unit 13 in the X direction. As a result, the head unit 13 is moved in the XY directions.

  Since each predetermined supply unit 6 has already been driven and components can be taken out at the component suction position, the vertical axis drive motor is based on the signal output from the CPU 20 via the interface 23 and the drive circuit 24. At 18B, the suction nozzle 18 is lowered to pick up and take out the electronic component, and the other suction nozzle 18 is also lifted up and picked up from the component supply unit 6 in the same manner as described above.

  Then, the head unit 13 is moved in the X and Y directions, and the positioning mark attached to the printed circuit board P is imaged by the substrate recognition camera 17 and the electronic component held by the suction nozzle 18 is imaged by the component recognition camera 14. Recognition processing is performed by the recognition processing device 25, and the mounting operation to the printed circuit board P is performed. In this case, the recognition processing device 25 performs recognition processing according to the component library data (confirmation test is performed) of the electronic component stored in the RAM 21.

  Then, the CPU 20 takes into consideration the recognition processing result from the recognition processing device 25 for the board recognition and component recognition so that the suction nozzle 18 moves to the mounting coordinate position on the printed board P positioned by the set table 8. The X-axis drive motor 12X and the Y-axis drive motor 12Y are controlled, and each beam 12A moves in the Y direction, and each head unit 13 moves in the X direction, and the θ-axis drive motor 18A of the suction nozzle 18 is driven to correct. The suction nozzle 18 is lowered by the vertical axis drive motor 18B and the electronic component is mounted on the substrate P.

  The electronic component mounting apparatus has been described by taking a so-called multi-function chip mounter as an example. However, the present invention is not limited to this and may be applied to a high-speed chip mounter such as a rotary table type.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a top view of an electronic component mounting apparatus. It is a control block diagram of an electronic component mounting apparatus. It is a figure which shows schematic structure of the offline library teaching apparatus which performs the confirmation teaching of parts library data. It is a figure which shows a flowchart. It is a figure for demonstrating reduction of the imaged image to 1/2. It is a figure for demonstrating reduction to 2/3 of the imaged image.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus main body 14 Component recognition camera 21 RAM
29 Input Device 30 Offline Library Teaching Device 31 Personal Computer 32 Personal Computer Body 33 Monitor 44 Component Recognition Camera

Claims (4)

Component library data for verifying whether component library data representing the characteristics of electronic components created using a high-resolution component recognition camera can be used for an electronic component mounting device equipped with a component recognition camera with a lower resolution. A verification method,
Reduce the image captured by the high-resolution component recognition camera so that the resolution is the same as or approximate to the resolution of the component recognition camera with inferior resolution,
A verification method of component library data, wherein a verification test of component library data is performed using the reduced image. Component library data for verifying whether component library data representing the characteristics of electronic components created using a high-resolution component recognition camera can be used for an electronic component mounting device equipped with a component recognition camera with a lower resolution. A verification method,
Select the target model of the electronic component mounting device, grasp the resolution of the component recognition camera mounted on the electronic component mounting device,
Determine whether the resolution of the component recognition camera of the grasped target model is the same as the resolution of the high-resolution component recognition camera used to create the component library data,
When it is determined that they are not the same, the image captured by the high-resolution component recognition camera is reduced so that the resolution is the same as or approximate to the component recognition camera of the target model,
A verification method of component library data, wherein a verification test of component library data is performed using the reduced image.   3. The method of verifying component library data according to claim 1 or 2, wherein the average brightness of a predetermined number of pixels captured by the component recognition camera having a high resolution is used as a reduced image brightness. .   The image brightness obtained by reducing the weighted average value of the respective brightness values according to the distance ratio between the pixel center after reduction of the image captured by the high-resolution component recognition camera and the pixel in the vicinity thereof is defined as the image brightness. The method for verifying a part library data according to claim 1 or 2.