JP2009010090A - Semiconductor manufacturing apparatus and manufacturing method of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resist application apparatus which can prevent the occurrence of particles in a resist film and can form the uniform resist film in a manufacturing apparatus for forming a resist pattern. <P>SOLUTION: The resist application apparatus is provided with discharge pumps 21 and 22 pumping resist to a plurality of application nozzles 51 and 52 and pressure gauges 31 and 32 for measuring the internal pressure of the discharge pumps 21 and 22. A pressure waveform is acquired by an operation part 9, and the number of particles is predicted by an operation; or the voltage waveform of a shading sensor 6 is acquired by the operation part 9, the number of the particles is predicted by the operation and a monitoring system 10 uses only the nozzle that satisfies a reference which is previously set. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor manufacturing apparatus and a semiconductor device capable of preventing pattern formation defects by preventing generation of foreign matters and particles in a resist film formed by organic material discharge in an apparatus for applying an organic material. It relates to a manufacturing method.

  With the progress of miniaturization of semiconductor devices in recent years, a resist patterning technique having a narrow line width or a small hole diameter has been developed in the lithography process.

  However, in the resist film forming step before the exposure process, when particles such as bubbles and foreign matters are included in the applied organic material, the presence of the particles in the resist film formed after application causes a desired A resist pattern is not formed, resulting in processing failure.

  In addition, with the increase in the diameter of the semiconductor substrate, it is necessary to apply the resist film uniformly. However, when particles are present in the resist film, the resist film thickness becomes non-uniform and the depth of focus is reduced. Since the resist pattern dimensions vary from pattern to pattern because of differences in the plane, the dimensions after dry etching also vary, reducing the reliability of the product.

Therefore, in Patent Document 1, two pumps with different pumping pressures are installed in the resist discharge pipe, and a filter is installed between them to filter bubbles, thereby suppressing generation of particles in the resist film and preventing pattern defects. It has been proposed to do.
JP 2006-114906 A

  However, it is possible to remove bubbles and particles in the resist by installing a filter in the resist discharge pipe. However, since the resist is easily fixed, it may be fixed to the tip of the nozzle. When the fixed resist falls on the semiconductor substrate, pattern formation is defective as particles.

  In addition, foreign matter adheres to the tip of the nozzle and hinders resist discharge, so that the resist is not dripped normally and cannot be controlled to a desired film thickness, resulting in a non-uniform resist film. is there.

  Accordingly, the present invention provides a semiconductor manufacturing apparatus and a semiconductor device manufacturing method capable of detecting a foreign matter at the tip of a discharge nozzle to prevent the foreign matter or particles from falling on the semiconductor substrate and preventing pattern formation defects. The purpose is to do.

  In order to solve the above-described problems, a semiconductor substrate manufacturing apparatus according to the present invention includes a plurality of resist discharge nozzles, a pump for pumping resist, a pressure gauge for measuring the internal pressure, and pressure at the time of resist discharge. A calculation unit for acquiring data is provided, and only nozzles determined to be normal based on a preset reference are used. The setting criteria at this time is characterized in that the number of particles generated is predicted by calculating the discharge delay time and pressure change value of the organic material from the pressure waveform of the pump for discharging the resist by the calculation unit.

  In addition, even when the nozzles are used continuously, a fixed object is formed at the resist tip.Therefore, the number of particles is always predicted, the use of nozzles determined to be abnormal according to a preset standard is stopped, and other nozzles are used. You may switch. The setting criteria in this case is that the number of particles predicted by the calculation unit calculated from the pressure waveform of the pump at the time of resist discharge or the discharge state can be detected by being shielded by the resist discharged from the nozzle tip. In a manufacturing apparatus equipped with a light shielding sensor, the ejection time from the start of ejection until the sensor is actually ejected until the sensor is shielded is calculated from the voltage waveform of the sensor based on the difference to predict the number of particles generated It is said.

  In addition, the light shielding sensor may be installed in the nozzle storage box, and before discharging to the semiconductor substrate, the time until the sensor is shielded by discharging resist in the storage box may be calculated. It is characterized by suppressing the generation of particles by exchanging nozzles before processing.

  In addition, in semiconductor device manufacturing equipment that supplies organic solvent into the nozzle storage box to prevent resist sticking at the nozzle tip, the occurrence of particles is confirmed by the pump pressure waveform during resist discharge or a light-shielding sensor during continuous use. In this case, the concentration of the organic solvent in the nozzle storage box may be adjusted, and the fixed matter at the nozzle tip can be dissolved and reused.

  By using the semiconductor manufacturing apparatus of the present invention, it is possible to detect foreign matter at the tip of the resist nozzle, and not only can prevent particles from falling on the semiconductor substrate, but also the foreign matter inhibits resist discharge and is normal. It is possible to prevent the resist film thickness from becoming non-uniform without dropping the resist.

  Therefore, it is possible to prevent defective pattern formation during exposure and to improve the reliability of the semiconductor device or the yield, as well as to determine the replacement period of the nozzles that need to be replaced periodically. Can do. As a result, the use of the nozzle can be extended as much as possible, so that the cost can be reduced.

  Hereinafter, a semiconductor substrate manufacturing method and a manufacturing apparatus according to embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a schematic view of a semiconductor device manufacturing apparatus according to the present invention. The organic material is sucked from the resist tank 1 by the discharge pumps 21 and 22. At this time, the pressure in the pump is constantly measured by the pressure gauges 31 and 32, and the pressure waveform data is transmitted to the calculation unit 9. Further, the organic material is pushed out by increasing the internal pressure of the discharge pump, and is supplied onto the semiconductor wafer 7 from the coating nozzles 51 and 52 through the filters 41 and 42 installed in the discharge pipe. In addition, a light shielding sensor 6 is installed in the application cup 8, and the presence or absence of the discharge of the organic material is determined by the discharged organic material shielding the sensor. Further, the voltage waveform of the light shielding sensor 6 is transmitted to the calculation unit 9. The calculation unit 9 predicts the number of particles generated in each nozzle from the pressure waveform of the pump and the voltage waveform of the light shielding sensor 6, and stops the use of nozzles that do not reach the reference set in advance from the monitoring system 10. Control.

  By applying resist using this equipment, only nozzles that do not generate particles are used, so no particles are generated in the resist film, resist pattern formation failure, and resist film thickness non-uniformity. Can be prevented.

  When predicting the number of particles from the pressure waveforms of the discharge pumps 21 and 22 at this time, as shown in FIG. 2, the time from the start of discharge until the increase of the internal pressure of the discharge pump, or the maximum internal pressure at the time of discharge Is calculated by the calculation unit.

  When the number of particles is predicted from the voltage waveform of the light shielding sensor 6, as shown in FIG. 3, the time from the start of ejection until the organic material shields the sensor is calculated by the calculation unit.

  FIG. 4 shows a method for manufacturing the semiconductor device according to the first embodiment of the present invention. Even in the coating nozzles 51 and 52 that are continuously used within a preset standard, particles are always generated from the change in pressure waveform of the discharge pumps 21 and 22 (S401) or the voltage waveform of the light shielding sensor 6 (S402) in the calculation unit. The number is predicted (S403), and if it is within the standard, the process is continued as it is (S405). If it is out of the standard, the monitoring system immediately stops the use of the nozzle, and the particle May be prevented (S404).

(Embodiment 2)
The present invention can also be implemented in the configuration of the schematic diagram of the manufacturing apparatus shown in FIG. In FIG. 5, the members described in FIG.

  The light shielding sensor 6 may be installed in the resist nozzle storage box 11 and the number of particles generated may be predicted by discharging the resist in the storage box in advance before processing the semiconductor substrate.

  Even in this case, the number of particles generated is predicted by calculating the time until the resist is discharged from the pressure waveform of the pump or the voltage waveform of the light shielding sensor, and by stopping the use of nozzles that do not satisfy the preset criteria. Particle generation in the resist film can be prevented.

(Embodiment 3)
Further, the fixed matter at the tip of the nozzle may be dissolved by adjusting the concentration of the organic solvent supplied in the storage box for the nozzle determined to be abnormal according to a preset standard during use.

  Also in this case, the number of generated particles is predicted in the calculation unit from the change in internal pressure of the discharge pump (S601) or the discharge delay time (S602) by the light shielding sensor (S603), and if the set standard is reached, it is used again (S607).

  If the set standard is not satisfied, the concentration of the organic solvent may be adjusted repeatedly (S604) to dissolve the fixed matter at the tip of the nozzle. Similarly, the number of particles generated is predicted (S605). If it is within the range, it is used again (S607). However, if the setting criteria are not satisfied even if it is repeated a plurality of times, use of the nozzle is stopped from the monitoring system and the nozzle is replaced (S606).

  INDUSTRIAL APPLICABILITY The semiconductor manufacturing apparatus and semiconductor device manufacturing method according to the present invention can detect foreign matter at the tip of a resist nozzle and is useful when applied to an apparatus for applying an organic material.

1 is a configuration diagram of a semiconductor manufacturing apparatus according to Embodiment 1 of the present invention. The figure which shows the relationship between the particle which concerns on Embodiment 1 of this invention, and pump pressure. The figure which shows the time chart which concerns on Embodiment 1 of this invention. The flowchart which concerns on Embodiment 1 of this invention The block diagram of the semiconductor manufacturing apparatus which concerns on Embodiment 2 of this invention The flowchart which concerns on Embodiment 3 of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resist tank 21, 22 Discharge pump 31, 32 Pressure gauge 41, 42 Filter 51, 52 Coating nozzle 6 Shading sensor 7 Semiconductor wafer 8 Coating cup 9 Calculation part 10 Monitoring system 11 Nozzle storage box

Claims (7)

In semiconductor device manufacturing equipment that applies organic materials,
A semiconductor manufacturing apparatus comprising a mechanism for selecting a nozzle to be processed based on a preset reference from a plurality of nozzles for discharging the organic material.   2. The semiconductor manufacturing apparatus according to claim 1, wherein the preset reference is determined by calculation from a pressure waveform of a pump for pumping the organic material.   The semiconductor manufacturing apparatus according to claim 1, further comprising a mechanism for exchanging with another nozzle in the next semiconductor substrate processing when the predetermined reference value is exceeded during the processing of the semiconductor device.   3. The semiconductor manufacturing apparatus according to claim 1, wherein the preset reference is determined by calculation from a pressure waveform of a pump for pumping the organic material and a voltage waveform of a light shielding sensor for confirming discharge of the organic material. .   The semiconductor manufacturing apparatus according to claim 1, further comprising a mechanism that determines a nozzle state based on the preset reference in a discharge nozzle storage box before the organic material is applied onto the semiconductor substrate.   6. The semiconductor manufacturing apparatus according to claim 5, further comprising a mechanism for adjusting a concentration of an organic solvent such as a solvent in the discharge nozzle storage box when a nozzle state deteriorates in the discharge nozzle storage box. . In a manufacturing method used in a semiconductor device manufacturing apparatus for applying an organic material,
A method for manufacturing a semiconductor device, comprising: calculating and predicting the number of particles in an applied organic material film from a waveform of a pump for pumping the organic material by calculation.

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