JP2009004664A - Manufacturing method for board with built-in components - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a board with built-in components that achieves the low profile size and improves the reliability. <P>SOLUTION: In a manufacturing method for a board with built-in components, step (d) places a component mounting board 1 with components mounted on its both sides at a center, and arranges to stack first and second support substrates 2a, 2b having the thermal expansion coefficient equal to or almost close to that of the component mounting board 1, while arranging insulating layers 3a, 3b in a pre-curing state between the component mounting board 1 and the first and second support substrates 2a, 2b, step (e) heats and presses the first and second support substrates 2a, 2b in a stack direction to cure the insulating layers 3a, 3b for integration, and step (f) leaves pattern electrodes 103c, 103d and removes the first and second support substrates 2a, 2b to expose the pattern electrodes 103c, 103d. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a component-embedded substrate.

  With the demand for downsizing, high functionality, high density, and low cost of electronic devices, further improvement in mounting density and reduction in the height of the substrate are required. As an example of high-density mounting, a component-embedded substrate in which active components and passive components that are existing components are embedded in a mixture of an inorganic filler and a thermosetting resin has been proposed.

  In Patent Document 1, as shown in FIGS. 17 (a), (b), and (c), high-density mounting in which a component-embedded substrate is realized using a mixture of an inorganic filler and a thermosetting resin after surface mounting on a multilayer circuit board. The technology is described.

  17A and 17B, 401a and 401b are multilayer circuit boards having a semiconductor element 404a and an electronic component 406a mounted on the surface on one side. A composite sheet 407 is disposed between the two multilayer circuit boards 401a and 401b, and this is heated and pressed by a hot press to produce a board with built-in components.

  The composite sheet 407 is an insulating member for a circuit board in which ceramic powder such as silica is blended in a resin such as epoxy, and the conductive paste 403 is filled at the position of the pattern electrode 402 to connect the multilayer circuit boards 401a and 401b. A space 405 into which parts are placed is formed in advance.

After hot pressing, the component-embedded substrate is completed by mounting the semiconductor element 404b and the electronic component 406b on the surface as shown in FIG.
Patent Document 2 describes a component-embedded substrate that has been made by the steps shown in FIGS.

In FIG. 18A, an electronic component 32 is mounted on a pattern electrode 31 of a metal support layer 30 with a conductive bonding material 33 to create a component mounting board.
18B, a prepreg 34 (which may be the composite sheet described above) is provided between the component mounting board created in FIG. 18A and the metal support layer 35 on which the pattern electrode 36 is formed. It arrange | positions and this is heat-pressed with a hot press. Next, by peeling off the support layers 30 and 35, a component-embedded substrate with a reduced height can be obtained as shown in FIG.

In FIG. 18D, a via 37 is formed for connecting the upper and lower pattern electrodes 31 and 36.
In FIG. 18E, the electronic component 39 is mounted on the pattern electrode 31 with the conductive bonding material 40.
Thereafter, as shown in FIGS. 18 (f) to 18 (h), the process is repeated in the same manner using the pattern electrode 43 and the prepreg 41 formed on the metal support layer 42. The multistage component-embedded substrate shown can be produced.
JP2003-197849A (page 12, FIG. 7) WO 2005/004567 (12 pages, FIG. 4)

  However, in the configuration of Patent Document 1, since a plurality of multilayer circuit boards are used, it is a problem to reduce the height of the component built-in board. In Patent Document 2, although a reduction in height is possible, there is a problem in that the connection via 44 is inclined and positional displacement occurs as shown in FIG. The cause will be briefly described below.

  In FIG. 18 (f), the metal (SUS, copper, etc.) used for the support layer 42 generally has a higher thermal expansion coefficient than the prepreg 41. The prepreg 41 at the time of hot pressing is in an uncured state and has fluidity. Therefore, the support layer 42 extends more than the prepreg 41 by receiving heat from the press. At that time, the support layer 42 side of the via 44 for interlayer connection spreads with the extension of the support layer 42. As described above, the position of the via 44 is shifted, which becomes one factor of deterioration of reliability.

  The present invention solves the above-described conventional problems, and an object thereof is to provide a method for manufacturing a component-embedded board that has a reduced height and improved reliability.

  According to a first aspect of the present invention, there is provided a method of manufacturing a component-embedded substrate, wherein a component mounting substrate having components mounted on both sides is centered, and a pattern electrode is provided on a surface facing the component mounting substrate, and the thermal expansion coefficient is The first and second support substrates that are the same as or substantially the same as the mounting substrate are stacked and disposed between the component mounting substrate and the first and second supporting substrates, with vias for interlayer connection and the component mounting substrate. An insulating layer in a pre-curing state in which a space is formed corresponding to the position of the mounted component is disposed, and the insulating layer is cured by heating and pressing the first and second support substrates in the stacking direction. After the integration, the pattern electrode is exposed by peeling the first and second support substrates while leaving the pattern electrode.

  The component-embedded substrate manufacturing method according to claim 2 of the present invention is characterized in that, in claim 1, the prepreg sheet of the component mounting substrate is composed of a mixture containing a thermosetting resin and an inorganic filler.

According to a third aspect of the present invention, there is provided a component-embedded substrate manufacturing method according to the first aspect, wherein the component mounting substrate is formed of a ceramic multilayer substrate.
According to a fourth aspect of the present invention, there is provided a method of manufacturing a component-embedded substrate, wherein a mounting surface of the component mounting substrate on which the component is mounted has a pattern electrode on the surface facing the component mounting substrate, and the coefficient of thermal expansion is the component mounting. A first support substrate that is the same as or almost the same as the substrate is stacked and disposed between the component mounting substrate and the first support substrate, and vias for interlayer connection and positions of the components mounted on the component mounting substrate An insulating layer in a pre-curing state in which a space is formed corresponding to the above is disposed, and the first supporting substrate is heated and pressed in the laminating direction to cure and integrate the insulating layer, and after the integration, The pattern electrode is exposed by peeling the component mounting substrate and the first support substrate while leaving the pattern electrode on the mounting surface of the component mounting substrate and the pattern electrode of the first support substrate.

  In the method of manufacturing a component-embedded board according to claim 5 of the present invention, the first and second component mounting boards having the same or almost the same thermal expansion coefficient as each other are arranged so that the mounting surfaces on which the components are mounted face each other. In addition to the stacked arrangement, a space is formed between the first and second component mounting boards corresponding to the positions of the vias for interlayer connection and the components mounted on the first and second component mounting boards. The pre-curing insulating layer is disposed, and the first and second component mounting boards are heated and pressed in the laminating direction to cure and integrate the insulating layer. The pattern electrode is exposed by peeling the first and second component mounting boards while leaving the pattern electrodes on the mounting surface of the two component mounting boards.

  According to a sixth aspect of the present invention, there is provided a method of manufacturing a component-embedded substrate, wherein the component-embedded substrate according to claim 4 or 5 is used as an interior substrate, and the interior substrate is centered on a surface facing the interior substrate. A third and fourth component mounting boards having a pattern electrode and having a thermal expansion coefficient the same as or substantially the same as that of the interior board are stacked and disposed between the interior board and the third and fourth component mount boards. In addition, an insulating layer in a pre-curing state in which a space is formed corresponding to the position of the vias for interlayer connection and the parts mounted on the third and fourth component mounting boards is disposed, and the third and fourth components are arranged. The mounting substrate is heated and pressed in the stacking direction to cure and integrate the insulating layer. After the integration, the third and fourth pattern electrodes on the mounting surface of the third and fourth component mounting substrates are left. The component mounting board is peeled off to expose the pattern electrode.

  According to a seventh aspect of the present invention, there is provided a method of manufacturing a component-embedded substrate having a multilayer circuit board having interlayer connection vias and pattern electrodes as a center, and having a pattern electrode on a surface facing the multilayer circuit board, and thermal expansion. The third and fourth component mounting boards having the same or substantially the same coefficient as the multilayer circuit board are stacked and disposed between the multilayer circuit board and the third and fourth component mounting boards. An insulating layer in a pre-curing state in which a space is formed corresponding to the position of the component mounted on the via and the third and fourth component mounting boards is disposed, and the third and fourth component mounting boards are arranged in the stacking direction. After the integration, the third and fourth component mounting boards are peeled off, leaving the pattern electrodes on the mounting surfaces of the third and fourth component mounting boards. Then, the pattern electrode is exposed.

  According to an eighth aspect of the present invention, there is provided the component built-in board manufacturing method according to the seventh aspect, wherein the multilayer circuit board is formed of a ceramic multilayer board.

  In the configuration of claims 1 and 4, the thermal expansion coefficients of the central component mounting board and the outer first and second support boards when they are integrated by heating and pressurization are the same or nearly similar. Even if this occurs, the positional displacement of the via for interlayer connection between the component mounting board and the first and second support boards does not occur.

  According to the fifth aspect of the present invention, since the thermal expansion coefficients of the first and second support substrates when they are integrated by heating and pressurizing are the same or nearly similar, even if thermal expansion occurs, , Misalignment of the via for interlayer connection with the second support substrate does not occur.

  According to the sixth aspect of the present invention, since the thermal expansion coefficients of the interior board and the third and fourth component mounting boards when integrated by heating and pressurization are the same or nearly similar, the interior board even if thermal expansion occurs. Misalignment of interlayer connection vias between the first and third support substrates does not occur.

  According to the seventh aspect of the present invention, since the thermal expansion coefficients of the multilayer circuit board and the third and fourth component mounting boards when they are integrated by heating and pressurizing are the same or nearly similar, even if thermal expansion occurs, the multilayer circuit board There is no misalignment of the vias for interlayer connection between the circuit board and the third and fourth support boards.

Hereinafter, a method for manufacturing a component-embedded substrate according to the present invention will be described based on specific embodiments.
(Embodiment 1)
1 to 4 show Embodiment 1 of the present invention.

FIG. 1 shows the finished shape of the component-embedded substrate.
Resistors 104a and 104b and semiconductors 105a and 105b are mounted on the pattern electrodes 103a and 103b formed on the upper and lower surfaces of the prepreg 101a. The resistor 104a and the semiconductor 105a mounted on the upper surface of the prepreg 101a are embedded in the insulating layer 3a. The resistor 104b and the semiconductor 105b mounted on the lower surface of the prepreg 101a are embedded in the insulating layer 3b. A resistor 104c and a semiconductor 105c are mounted as components on the pattern electrode 103c exposed on the upper surface of the insulating layer 3a. A resistor 104d and a semiconductor 105d are mounted as components on the pattern electrode 103d exposed on the lower surface of the insulating layer 3b. Vias 10 for interlayer connection are formed in the prepreg 101a and the insulating layers 3a and 3b.

This component-embedded substrate is manufactured in the steps of FIGS. 2A to 2C, FIGS. 3D to 3F, and FIGS. 4G and 4H.
First, in FIG. 2A, a copper-clad laminate is prepared.

  In order to form the via 10 in the prepreg 101a, a hole for interlayer connection (hole diameter: 180 μm) is processed by a punching machine, and after filling with a conductive paste, 9 μm copper foils 102a, 102b are hot-pressed. Heat and press to bond. One-side roughened copper foil was used for the copper foils 102a and 102b, and the roughened surface was disposed on the side facing the prepreg 101a.

In FIG. 2B, the copper foils 102a and 102b of the copper-clad laminate are processed by an etching method to form pattern electrodes 103a and 103b.
In FIG. 2C, resistors 104a and 104b and semiconductors 105a and 105b are mounted on the pattern electrodes 103a and 103b, and the component mounting board 1 is created.

  In the component built-in process in FIG. 3D, first, the component mounting board 1 in FIG. 2C is set at the center, and the first support substrate 2a is disposed on the upper side via the uncured insulating layer 3a. The second support substrate 2b is disposed below the component mounting substrate 1 via the insulating layer 3b.

  In the first and second support substrates 2a and 2b, copper foil is heated and pressed on the prepregs 101b and 101c in a pressing process, and the copper foil on one side is processed by an etching method to form pattern electrodes 103c and 103d. . All the other copper foil was removed. The copper foil used here was a 9 μm single-side roughened copper foil, and the surface in contact with the prepregs 101b and 101c was the gloss side.

  The prepreg 101b of the component mounting board 1 and the prepregs 101b and 101c of the first and second support boards 2a and 2b are made of the same material. Here, GEA-67BE (glass cloth thickness 80 μm) manufactured by Hitachi Chemical Co., Ltd. is used. A 9 μm copper foil was integrated at a temperature of 180 ° C. and a pressure of 10 MPa. In this embodiment, GEA-67BE having good thermal conductivity is used. However, an inexpensive and general glass epoxy substrate may be used.

  The insulating layers 3a and 3b are made of composite sheets 107a and 107b, each of which is a mixture of a thermosetting epoxy resin and silica, and the amount of silica added is 80 Wt%. First, in one composite sheet 107a, a space 108 into which a part enters is formed with a punching die. Thereafter, another composite sheet 107b is overlaid on the composite sheet 107a, and a hole for the via 10 is processed by a punching machine, and the hole is filled with a conductive paste.

In FIG.3 (e), it integrated by the hot press and incorporated components. The press conditions for the component built-in process were a temperature of 200 ° C., a pressure of 3 MPa, a time of 2 hours, and a vacuum atmosphere.
In FIG. 3F, the pattern electrodes 103c and 103d are exposed by peeling off the first and second support substrates 2a and 2b while leaving the pattern electrode 103c of the first support substrate 2a and the pattern electrode 103d of the substrate 2b. To build a component-embedded board.

  In the state shown in FIG. 4G with the prepreg 101b disposed above and below being peeled off, the resin component 109 of the prepreg of the first and second support substrates 2a and 2b has adhered to the surface. The component 109 is removed by polishing to expose the pattern electrodes 103c and 103d as shown in FIG.

  Furthermore, as shown in FIG. 4I, surface mounting of the resistors 104c and 104d and the semiconductors 105c and 105d as components is performed on the upper and lower pattern electrodes 103c and 103d as necessary.

  Thus, the prepreg 101a of the component mounting board 1 and the prepregs 101b and 101c of the first and second support boards 2a and 2b are made of the same material, and the component mounting board 1 and the first and second support boards 2a. , 2b have the same coefficient of thermal expansion, and in the process of FIG. 3D, the insulating layers 3a, 3b are cured and integrated by hot pressing the insulating layers 3a, 3b before curing. Since the component mounting board 1 and the first and second support boards 2a and 2b have substantially the same amount of extension, the via 10 does not tilt as in the prior art, and a highly reliable interlayer connection can be expected.

The prepreg 101a of the component mounting board 1 and the prepregs 101b and 101c of the first and second support boards 2a and 2b are made of the same material. However, when the thermal expansion coefficients are substantially the same, the materials are different. Also good. Specifically, if the difference in thermal expansion coefficient from room temperature (20 ° C.) to hot press temperature (200 ° C.) is a certain value or less, it can be used even if the material is different. In the case of a three-dimensional mounting module in which the system function is completed using a built-in technology for passive components such as capacitors and active components such as semiconductors, the land and via are usually designed to have a via diameter of about +100 μm. In other words, 50 μm is a standard for conformity between vias and lands, and assuming a 100 mm size three-dimensional mounting module, the difference in thermal expansion coefficient is ideally 2.7 × 10 ⁻⁶ / ° C. or less, maximum However, it should be 5.4 × 10 ⁻⁶ / ° C. or less, and the difference in thermal expansion coefficient is preferably about 6.0 × 10 ⁻⁶ / ° C. or less, and more preferably about 3.0 × 10 ⁻⁶ / ° C. or less. When a ceramic substrate is employed as the component mounting substrate 1, GEA-67BE or a glass epoxy substrate can be used as the first and second support substrates 2a and 2b.

In FIG. 2A and FIG. 3D, the punching machine is used for the hole processing for interlayer connection, but other processing methods such as a laser processing machine may be used.
In FIG. 3D, the space 108 of the composite sheet 107a uses a punching die, but other methods may be used.

In FIG. 3D, the copper foils on one side of the first and second support substrates 2a and 2b are all removed, but it is not necessary to remove them.
Moreover, in FIG.3 (d), it is not necessary to arrange | position copper foil on both sides of prepreg 101b, 101c, and you may peel after hot press using a release sheet on one side.

Moreover, although the single side | surface roughening copper foil was used in FIG.3 (d), a double-sided glossy electrolytic copper foil or a rolled copper foil may be sufficient.
The surfaces of the pattern electrodes 103a and 103b of the component mounting substrate 1 and the pattern electrodes 103c and 103d of the first and second support substrates 2a and 2b may be plated with a metal such as gold.

(Embodiment 2)
5 to 8 show a second embodiment of the present invention.
In the first embodiment shown in FIG. 1, the prepreg 101a of the component mounting board 1 remains on the component built-in board. In the second embodiment shown in FIG. 5, the prepreg 101a of the component mounting board 1 remains on the component built-in board. Not.

FIG. 5 shows the finished shape of the component-embedded substrate.
The pattern electrode 103a is exposed on the lower surface of the insulating layer 3a, and the pattern electrode 103c is exposed on the upper surface of the insulating layer 3a. A resistor 104a and a semiconductor 105a as components mounted on the pattern electrode 103a are embedded in the insulating layer 3a. Vias 10 for interlayer connection are formed in the insulating layer 3a.

This component-embedded substrate is manufactured by the steps of FIGS. 6A to 6C, FIGS. 7D to 7F, and FIGS. 8G and 8H.
First, in FIG. 6 (a), a copper-clad laminate in which 9 μm copper foils 102a and 102b are bonded to the prepreg 101a by heating and pressing with a hot press is prepared. A single-side roughened copper foil was used as the copper foil 102a, and a glossy surface was disposed on the side facing the prepreg 101a.

Next, as shown in FIG. 6B, the surface copper foil 102a is processed by an etching method to form a pattern electrode 103a. The other copper foil 102b was all removed.
Next, as shown in FIG. 6C, a resistor 104a and a semiconductor 105a as components are mounted on the pattern electrode 103 to produce a component mounting board 1.

In the component built-in process of FIG. 7D, the first support substrate 2a is disposed above the component mounting substrate 1 created in FIG. 6C via the insulating layer 3a.
In the first support substrate substrate 2a, a copper foil is heated and pressed on the prepreg 101b in a pressing step, and the copper foil on one side is processed by an etching method to form the pattern electrode 103c. All the other copper foil was removed. The copper foil at this time was a 9 μm single-side roughened copper foil, and the surface in contact with the prepreg 101b was the gloss side.

  The prepreg 101b of the component mounting board 1 and the prepreg 101b of the first support board board 2a are made of the same material, here, GEA-67BE (glass cloth thickness 80 μm) manufactured by Hitachi Chemical Co., Ltd. is used, and a 9 μm copper foil is used as the temperature. They were integrated at 180 ° C. and a pressure of 10 MPa. In this embodiment, GEA-67BE having good thermal conductivity is used. However, an inexpensive and general glass epoxy substrate may be used.

  The insulating layer 3a is made of a composite sheet 107a, 107b made of a mixture of a thermosetting epoxy resin and silica, and an added amount of silica of 80 Wt%. First, in one composite sheet 107a, a space 108 into which a part enters is formed with a punching die. Thereafter, another composite sheet 107b is overlaid on the composite sheet 107a, and a hole for the via 10 is processed by a punching machine, and the hole is filled with a conductive paste.

In FIG.7 (e), it integrated by the hot press and incorporated components. The press conditions for the component built-in process were a temperature of 200 ° C., a pressure of 3 MPa, a time of 2 hours, and a vacuum atmosphere.
In FIG. 7F, the component mounting board 1 and the first support board 2a are separated to leave the pattern electrodes 103a and 103c, leaving the pattern electrode 103a of the component mounting board 1 and the pattern electrode 103c of the first support board 2a. A substrate with built-in components can be formed by exposing.

  In the state shown in FIG. 8G with the prepregs 101a and 101b disposed above and below being peeled, the resin component 109 of the component mounting board 1 and the resin components 109 of the first and second support boards 2a and 2b are the same. Since it was adhered to the surface, the resin component 109 was removed by polishing to expose the pattern electrodes 103a and 103c as shown in FIG.

  Further, as shown in FIG. 8I, surface mounting of resistors 104c and 104d as components and semiconductors 105c and 105d is performed on the pattern electrodes 103c and 103a on the upper and lower surfaces as necessary.

  Further, as shown in FIG. 8 (j), the upper surface pattern electrode 103c is surface-mounted with a resistor 104c and a semiconductor 105c as necessary, and the lower surface pattern electrode 103a is soldered for secondary mounting. The ball 100 may be mounted.

  Thus, since the prepreg 101a of the component mounting board 1 and the prepreg 101b of the first support board 2a are the same material, and the thermal expansion coefficients of the component mounting board 1 and the first support board 2a are the same, In the step of FIG. 7D, the amount of elongation of the component mounting substrate 1 and the first support substrate 2a when the insulating layer 3a is cured by pressing with the insulating layer 3a before being cured is integrated. Since they are the same, the via 10 is not inclined as in the prior art, and a highly reliable interlayer connection can be expected.

  Although the prepreg 101a of the component mounting board 1 and the prepregs 101b and 101c of the first support board 2a are made of the same material, the materials may be different when the thermal expansion coefficients are almost the same.

In FIG. 7D, the punching machine is used for the hole processing for the via 10, but other processing methods such as a laser processing machine may be used.
In FIG. 7D, the blank 108 is used for the composite sheet 107a, but other methods may be used.

In FIG. 7D, all of the copper foil on one side of the first support substrate 2a is removed, but it is not necessary to remove it.
Further, the surface of the pattern electrode 103a of the component mounting substrate 1 and the pattern electrode 103c of the first support substrate 2a may be plated with a metal such as gold.

  The component mounting board 1 and the prepreg 101b of the first support board 2a have the same thermal expansion coefficient, but the first support board 2a is made of a material that is almost similar to the thermal expansion coefficient of the component mounting board 1. But the same is true.

(Embodiment 3)
9 to 12 show a third embodiment of the present invention.
In the second embodiment shown in FIG. 5, the resistor 104a and the semiconductor 105a as components embedded in the insulating layer 3a are mounted on the pattern electrode 103a, and no component is mounted on the pattern electrode 103b. The third embodiment shown in FIG. 9 is different only in that a resistor 104b and a semiconductor 105b as components are also mounted on the pattern electrode 103b.

This component-embedded substrate is manufactured by the steps of FIGS. 10A to 10C, FIGS. 11D to 11F, and FIGS. 12G and 12H.
First, in FIGS. 10A to 10C, a first component mounting board 11 in which a resistor 104a and a semiconductor 105a as components are mounted on a pattern electrode 103a in the same manner as FIGS. 6A to 6C. Then, the second component mounting board 12 is prepared by mounting the resistor 104b and the semiconductor 105b as components on the pattern electrode 103b.

  In the component built-in process in FIG. 11D, the first and second component mounting boards 11 and 12 created in FIG. 10C are stacked and disposed so that the component mounting surfaces face each other, and the state before curing is performed therebetween. An insulating layer 30 is provided. A space 108 is formed in the insulating layer 30 corresponding to the positions of the vias 10 for interlayer connection, the resistors 104a and 104b mounted on the first and second component mounting boards 11 and 12, and the semiconductors 105a and 105b. Yes.

  The prepregs of the first and second component mounting boards 11 and 12 are made of the same material. Here, GEA-67BE (glass cloth thickness 80 μm) manufactured by Hitachi Chemical Co., Ltd. is used, and 9 μm copper foil is heated to 180 ° C. and pressure Integrated at 10 MPa. In this embodiment, GEA-67BE having good thermal conductivity is used. However, an inexpensive and general glass epoxy substrate may be used. The insulating layer 30 is a mixture of a thermosetting epoxy resin and silica.

In FIG.11 (e), it integrated by the hot press and incorporated components. The press conditions for the component built-in process were a temperature of 200 ° C., a pressure of 3 MPa, a time of 2 hours, and a vacuum atmosphere.
In FIG. 11 (f), the first and second component mounting boards 11 and 12 are peeled off while leaving the pattern electrode 103 a of the first component mounting board 11 and the pattern electrode 103 b of the second component mounting board 12. By exposing the electrodes 103a and 103b, a component-embedded substrate can be formed.

  In the state shown in FIG. 12G with the first and second component mounting boards 11 and 12 disposed above and below being peeled off, the prepregs 101a and 101b of the first and second component mounting boards 11 and 12 are provided. Since the resin component 109 was adhered to the surface, the resin component 109 was removed by polishing to expose the pattern electrodes 103a and 103b as shown in FIG.

  Further, as shown in FIG. 12 (i), surface mounting of resistors 104c and 104d as components and semiconductors 105c and 105d is performed on the pattern electrodes 103b and 103a on the upper surface and the lower surface as necessary.

  Further, as shown in FIG. 12 (j), the upper surface pattern electrode 103c is surface-mounted with a resistor 104c and a semiconductor 105c as components, and the lower surface pattern electrode 103a is soldered for secondary mounting. The ball 100 may be mounted.

(Embodiment 4)
13 and 14 show a fourth embodiment of the present invention.
The component built-in board created in the second embodiment or the third embodiment is used, and the built-in layer has a multi-stage configuration. Here, a case where the component built-in board created in the second embodiment is used as the interior board 4 will be described as an example.

FIG. 13 shows the finished shape of the component-embedded substrate.
Insulating layers 31 and 32 are integrated on the upper and lower surfaces of the interior substrate 4.
The insulating layer 31 is formed with vias 10 for interlayer connection that connect the pattern electrode 103 c of the interior substrate 4 and the pattern electrode 103 e attached to the upper surface of the insulating layer 31. The insulating layer 32 is formed with an interlayer connection via 10 that connects the pattern electrode 103 a of the interior substrate 4 and the pattern electrode 103 f attached to the lower surface of the insulating layer 32. Further, in the insulating layer 31, a resistor 104e and a semiconductor 105e are embedded as components mounted on the pattern electrode 103e. In the insulating layer 32, a resistor 104f and a semiconductor 105f as components mounted on the pattern electrode 103f are embedded.

This component-embedded substrate is manufactured by the steps shown in FIGS.
In FIG. 14A, the third component mounting board 21 in which the resistor 104e and the semiconductor 105e are mounted on the pattern electrode 103e, and the fourth component mounting board 22 in which the resistor 104f and the semiconductor 105f are mounted on the pattern electrode 103f. Are stacked with the interior substrate 4 as the center and the mounting surfaces inside, and an insulating layer 31 before curing is disposed between the third component mounting substrate 21 and the interior substrate 4, An insulating layer 32 before curing is disposed between the component mounting board 22 and the interior board 4.

  The insulating layer 31 is provided with a space 108 corresponding to the via 10, the resistor 104e, and the semiconductor 105e. The insulating layer 32 is provided with a space 108 formed corresponding to the resistor 104f and the semiconductor 105f.

In FIG. 14B, the third and fourth component mounting boards 21 and 22 are heated and pressed in the stacking direction to cure and integrate the insulating layers 31 and 32.
Thereafter, the pattern electrodes 103e and 103f are exposed by peeling off the third and fourth component mounting boards 21 and 22, leaving the pattern electrodes 103e and 103f of the third and fourth component mounting boards 21 and 22.

  In the state where the third and fourth component mounting boards 21 and 22 arranged above and below are peeled off, the resin components of the prepregs of the third and fourth component mounting boards 21 and 22 are attached to the surface. Therefore, the resin component is removed by polishing to expose the pattern electrodes 103e and 103f as shown in FIG. 14C, thereby completing the component-embedded substrate.

  Further, as shown in FIG. 14D, surface mounting of resistors 104g and 104h as components and semiconductors 105g and 105h is performed on the pattern electrodes 103e and 103f on the upper and lower surfaces as required.

  Further, if necessary, surface mounting of a resistor 104g or a semiconductor 105g as a component may be performed on the upper pattern electrode 103e, and a solder ball may be mounted on the lower pattern electrode 103f for secondary mounting.

  Although the internal expansion board 4 and the third and fourth component mounting boards 21 and 22 have the same thermal expansion coefficient, the third and fourth component mounting boards 21 and 22 that have a thermal expansion coefficient substantially similar to the internal expansion board 4 are The same applies when used.

(Embodiment 5)
15 and 16 show a fifth embodiment of the present invention.
The component built-in board created in the fourth embodiment is the interior board 4 on which the component is mounted on the central layer. However, in the fifth embodiment, the component is not mounted on the central layer in the component built-in substrate. Only the multi-layer circuit board 7 is different.

FIG. 15 shows the finished shape of the component-embedded substrate.
In the multilayer circuit board 7, vias 10 for interlayer connection and pattern electrodes 103g and 103h are formed. A pattern electrode 103e is provided on the upper surface of the multilayer circuit board 7 through an insulating layer 31 with the multilayer circuit board 7 as the center. A resistor 104e and a semiconductor 105e as components are mounted on the pattern electrode 103e. The resistor 104e and the semiconductor 105e are embedded in the insulating layer 31. A pattern electrode 103 f is provided on the lower surface of the multilayer circuit board 7 via an insulating layer 32. A resistor 104f and a semiconductor 105f as components are mounted on the pattern electrode 103f, and the resistor 104f and the semiconductor 105f are embedded in the insulating layer 32.

This component-embedded substrate is manufactured by the steps shown in FIGS.
In FIG. 16A, the third component mounting board 21 in which the resistor 104e and the semiconductor 105e are mounted on the pattern electrode 103e, and the fourth component mounting board 22 in which the resistor 104f and the semiconductor 105f are mounted on the pattern electrode 103f. Are laminated with the multilayer circuit board 7 in the center and the mounting surfaces inside, and an insulating layer 31 before curing is disposed between the third component mounting board 21 and the multilayer circuit board 7, An insulating layer 32 before curing is disposed between the component mounting board 22 and the multilayer circuit board 7.

  Here, the prepregs of the multilayer circuit board 7 and the third and fourth component mounting boards 21 and 22 are made of the same material. Here, GEA-67BE (glass cloth thickness 80 μm) manufactured by Hitachi Chemical Co., Ltd. is used, and the prepreg is 9 μm. The copper foil was integrated at a temperature of 180 ° C. and a pressure of 10 MPa. In this embodiment, GEA-67BE having good thermal conductivity is used. However, an inexpensive and general glass epoxy substrate may be used. The insulating layers 31 and 32 are a mixture of a thermosetting epoxy resin and silica.

  In the insulating layer 31, a space 108 formed corresponding to the interlayer connection via 10 between the pattern electrode 103g of the multilayer circuit board 7 and the pattern electrode 103e of the third component mounting board 21, the resistor 104e, and the semiconductor 105e. Is provided. In the insulating layer 32, a space 108 formed corresponding to the interlayer connection via 10 between the pattern electrode 103h of the multilayer circuit board 7 and the pattern electrode 103f of the fourth component mounting board 22, the resistor 104f, and the semiconductor 105f. Is provided.

In FIG. 16B, the third and fourth component mounting boards 21 and 22 are heated and pressed in the stacking direction to cure and integrate the insulating layers 31 and 32.
Thereafter, the pattern electrodes 103e and 103f are exposed by peeling off the third and fourth component mounting boards 21 and 22, leaving the pattern electrodes 103e and 103f of the third and fourth component mounting boards 21 and 22. Since the pattern electrodes 103e and 103f are glossy foils, they can be easily peeled off.

  In the state where the third and fourth component mounting boards 21 and 22 arranged above and below are peeled off, the resin components of the prepregs of the third and fourth component mounting boards 21 and 22 are attached to the surface. Therefore, the resin component is removed by polishing to expose the pattern electrodes 103e and 103f as shown in FIG. 16C, thereby completing the component-embedded substrate.

  Further, as shown in FIG. 16D, surface mounting of resistors 104g and 104h as components and semiconductors 105g and 105h is performed on the upper and lower pattern electrodes 103e and 103f as required.

  Further, if necessary, surface mounting of a resistor 104g or a semiconductor 105g as a component may be performed on the upper pattern electrode 103e, and a solder ball may be mounted on the lower pattern electrode 103f for secondary mounting.

  Here, as the resistors 104g and 104h and the semiconductors 105g and 105h, those having a chip size of 1005 or more and those having a size of 0603 or less had no voids. Chip size component mounting was performed using general solder. In consideration of the environment, lead-free solder was used.

  The multilayer circuit board 7 and the third and fourth component mounting boards 21 and 22 have the same thermal expansion coefficient. However, the third and fourth component mounting boards 21 and 22 have the same thermal expansion coefficient as the multilayer circuit board 7. The same applies to the use of materials that are close to each other.

  In Embodiments 2 to 4, since all insulating materials are composite sheets, there is no occurrence of substrate warpage due to temperature change or the like, so that a highly reliable component-embedded substrate can be provided. Further, in the first and fifth embodiments, since the insulating material is laminated in a symmetrical system, warping of the substrate and the like can be suppressed.

  In each of the above embodiments, the same solder may be used as the built-in component mounting solder and the surface mounting solder, but attention should be paid to the reflow temperature. If the solder for the built-in component is melted during surface mounting, the solder may flow out and a defect such as a short circuit may occur, but the above problem can be solved by increasing the melting point of the built-in solder.

  In each of the above embodiments, the semiconductor as a component is flip-chip mounted using a bare chip, but the mounting method is not limited. It is better to provide an underfill for the built-in semiconductor as a measure against the gap under the component. When mounting by wire bonding method, it is better to mold.

In each of the embodiments described above, the inorganic filler contains at least one selected from Al ₂ O ₃ , MgO, BN, AlN, and SiO ₂ .
In each of the above embodiments, the built-in component is a resistor or a semiconductor. However, a chip-shaped capacitor, an inductor, or the like may be used.

  The component-embedded substrate according to the present invention can easily meet the demands for small size, high functionality, and high density of electronic devices, and can be reduced in height, and thus can be applied to the use of a substrate for portable devices. .

Sectional drawing of the component built-in board | substrate in Embodiment 1 of this invention Sectional drawing of the manufacturing process of the embodiment Sectional drawing of the manufacturing process of the embodiment Sectional drawing of the manufacturing process of the embodiment Sectional drawing of the component built-in board | substrate in Embodiment 2 of this invention Sectional drawing of the manufacturing process of the embodiment Sectional drawing of the manufacturing process of the embodiment Sectional drawing of the manufacturing process of the embodiment Sectional drawing of the component built-in board | substrate in Embodiment 3 of this invention Sectional drawing of the manufacturing process of the embodiment Sectional drawing of the manufacturing process of the embodiment Sectional drawing of the manufacturing process of the embodiment Sectional drawing of the component built-in board | substrate in Embodiment 4 of this invention Sectional drawing of the manufacturing process of the embodiment Sectional drawing of the component built-in board | substrate in Embodiment 5 of this invention Sectional drawing of the manufacturing process of the embodiment Sectional drawing of process of component built-in substrate of Patent Document 1 Sectional drawing of process of component built-in substrate of Patent Document 2

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting board 2a, 2b 1st, 2nd support board 3a, 3b, 30, 31, 32 Insulating layer 4 Interior board 7 Multilayer circuit board 10 Via for interlayer connection 11, 12 1st, 2nd component mounting Substrates 21, 22 Third and fourth component mounting boards 100 Solder balls 101a, 101b, 101c Prepregs 102a, 102b Copper foils 103a, 103b, 103c, 103d, 103e, 103f Pattern electrodes 103g, 103h Pattern electrodes 104a, 104b, 104c 104d Resistance (components)
104e, 104f, 104g, 104h Resistance (components)
105a, 105b, 105c, 105d Semiconductor (component)
105e, 105f, 105g, 105h Semiconductor (component)
107a, 107b Composite sheet 108 Space 109 Resin component

Claims (8)

A component mounting board having components mounted on both sides is centered, and first and second supporting boards having a pattern electrode on the surface facing the component mounting board and having the same or almost the same thermal expansion coefficient as the component mounting board are stacked. In addition to the arrangement, a space is formed between the component mounting board and the first and second support boards corresponding to the positions of the vias for interlayer connection and the parts mounted on the component mounting board. Arrange the previous insulation layer,
The first and second support substrates are heated and pressed in the stacking direction to cure and integrate the insulating layer,
A method of manufacturing a component-embedded substrate in which, after the integration, the first and second support substrates are peeled off leaving the pattern electrode to expose the pattern electrode. The manufacturing method of the component built-in board | substrate of Claim 1 which comprises the prepreg sheet | seat of the said component mounting board | substrate with the mixture containing a thermosetting resin and an inorganic filler. The method for manufacturing a component built-in substrate according to claim 1, wherein the component mounting substrate is formed of a ceramic multilayer substrate. A first support substrate having a pattern electrode on the mounting surface of the component mounting substrate on which the component is mounted and having a pattern electrode on the surface facing the component mounting substrate and having a thermal expansion coefficient that is the same as or close to that of the component mounting substrate is stacked and disposed. In addition, an insulating layer in an uncured state in which a space corresponding to the position of the component mounted on the component mounting board is formed between the component mounting board and the first support board. Arranged,
The first support substrate is heated and pressed in the laminating direction to cure and integrate the insulating layer,
Built-in component that, after the integration, leaves the pattern electrode on the mounting surface of the component mounting substrate and the pattern electrode of the first support substrate, and peels off the component mounting substrate and the first support substrate to expose the pattern electrode. A method for manufacturing a substrate. The first and second component mounting boards having the same or nearly the same coefficient of thermal expansion as each other are stacked so that the mounting surfaces on which the components are mounted face each other, and the first and second component mounting boards Between the vias for interlayer connection and an insulating layer in a pre-curing state in which spaces are formed corresponding to the positions of the components mounted on the first and second component mounting boards,
The first and second component mounting boards are heated and pressed in the stacking direction to cure and integrate the insulating layer,
A method of manufacturing a component-embedded substrate in which, after the integration, the first and second component mounting boards are peeled off while leaving the pattern electrodes on the mounting surfaces of the first and second component mounting boards. The component-embedded substrate according to claim 4 or 5 is used as an interior substrate, the interior substrate is in the center, a pattern electrode is provided on a surface facing the interior substrate, and a thermal expansion coefficient is substantially the same as or substantially equal to that of the interior substrate. Near third and fourth component mounting boards are stacked and disposed between the interior board and the third and fourth component mounting boards, vias for interlayer connection and third and fourth component mounting boards. An insulating layer in a pre-curing state in which a space is formed corresponding to the position of the component mounted on is disposed,
The third and fourth component mounting boards are heated and pressed in the stacking direction to cure and integrate the insulating layer,
A method of manufacturing a component-embedded board in which, after the integration, the third and fourth component mounting boards are peeled off to leave the pattern electrodes on the mounting surfaces of the third and fourth component mounting boards, and the pattern electrodes are exposed. A multilayer circuit board having vias for interlayer connection and a pattern electrode is provided at the center, and the third and fourth fourth and fourth patterns have a pattern electrode on the surface facing the multilayer circuit board and have a thermal expansion coefficient that is the same as or substantially the same as that of the multilayer circuit board. And a component mounted on the third and fourth component mounting boards between the multilayer circuit board and the third and fourth component mounting boards. An insulating layer in a pre-curing state in which a space is formed corresponding to the position of
The third and fourth component mounting boards are heated and pressed in the stacking direction to cure and integrate the insulating layer,
A method of manufacturing a component-embedded board in which, after the integration, the third and fourth component mounting boards are peeled off to leave the pattern electrodes on the mounting surfaces of the third and fourth component mounting boards, and the pattern electrodes are exposed. 8. The method of manufacturing a component built-in board according to claim 7, wherein the multilayer circuit board is formed of a ceramic multilayer board.

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