JP2009004619A - Sealing method and sealing structure of light emitting diode chip having high efficient horizontal light emitting effect - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sealing method and a sealing structure of a light emitting diode chip having high efficient horizontal light emitting effect. <P>SOLUTION: The sealing structure of the light emitting diode chip having high efficient horizontal light emitting effect includes a substrate unit 1, a light emitting unit and a package colloid unit 3. The substrate unit contains a substrate main body 10, and a positive electrode conductive trace 11 and a negative electrode conductive trace 12 formed on the substrate main body, respectively. The light emitting unit has a plurality of light emitting diode chips provided to the substrate main body, wherein each the light emitting diode chip has a positive electrode end and a negative electrode end electrically connected to the positive and negative electrode conductive traces of the substrate unit, respectively. The package colloid unit includes a plurality of package colloids covering over these light emitting diode chips, respectively, wherein a top surface and a front surface of each package colloid have a colloid arcuate surface and a colloid light exiting surface, respectively. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light emitting diode chip sealing method and a sealing structure thereof, and more particularly, to a light emitting diode chip sealing method having a high-efficiency lateral light-emitting effect and a sealing structure thereof. It is what you point to.

  FIG. 1 is a flowchart illustrating a first sealing method of a conventional light emitting diode. From this flowchart, the first conventional method of sealing a light emitting diode is to first provide a plurality of packaged light emitting diodes (S800), and then to have a positive conductive trace and a negative conductive trace thereon. Providing a substrate body having a shape (S802), and finally, each packaged light emitting diode is sequentially provided on the substrate body of the strip shape, and the positive and negative ends of each packaged light emitting diode are formed in the strip shape. The step (S804) of electrically connecting to the positive and negative electrode conductive traces of the substrate body of FIG.

  FIG. 2 is a flowchart illustrating a second method for sealing a conventional light emitting diode. From this flowchart, the second method for sealing a conventional light emitting diode includes a step of providing a strip-shaped substrate body having a positive electrode conductive trace and a negative electrode conductive trace thereon (S900); A step of sequentially providing the light emitting diode chips on the strip-shaped substrate body and electrically connecting the positive and negative electrode ends of each light-emitting diode chip to the positive and negative electrode conductive traces of the strip-shaped substrate body (S902). And finally, a step of covering the strip-shaped package colloid on the strip-shaped substrate body and these light-emitting diode chips to form a light bar having a strip-shaped light emitting region (S904).

  However, with regard to the first conventional light emitting diode sealing method, each packaged light emitting diode is cut from the entire light emitting diode package, and then the light emitting diode packaged by surface mounting technology (SMT) is used as its band-shaped substrate. Since it must be provided on the main body, the manufacturing process time cannot be effectively reduced, and a dark band phenomenon exists between these packaged light emitting diodes during light emission, which is in the eyes of the user. An undesirable effect will occur.

  In addition, with respect to the second conventional sealing method of the light emitting diode, the completed light bar has a band-shaped light emitting region, and thus the second sealing method does not cause a dark band problem. However, this strip-shaped package colloid has a non-uniform excited region, which reduces the light bar's light efficiency (ie, the package colloid region near the LED chip generates a relatively strong excitation light source). The package colloid region away from the light emitting diode chip generates a relatively weak excitation light source).

  FIG. 3 is a diagram illustrating that a conventional light emitting diode is applied to horizontal light emission. As can be seen from the figure, when the conventional light emitting diode chip D is applied to the horizontal light emission (for example, the horizontal light source of the light guide plate M used in the notebook computer screen), the light guide plate M of the notebook computer screen is very thin. The length l1 of the base S1 of the light-emitting diode chip D must be correspondingly shortened. In other words, since the length S1 of the base S1 is too short, the conventional light emitting diode chip D cannot obtain an efficient heat dissipation effect, and the light emitting diode chip D is too hot and may be burned out.

  As described above, it can be seen that the conventional light-emitting diode sealing method and the sealing structure clearly have inconveniences and disadvantages and are expected to be improved.

  Therefore, the present inventor was interested in improving the above-mentioned drawbacks, and made extensive observations and researches based on the experience accumulated in this area since many years. The present invention has been proposed in which the above-mentioned drawbacks can be effectively improved.

  A technical problem to be solved by the present invention is to provide a sealing method and a sealing structure of a light emitting diode chip having a high-efficiency lateral light emitting effect. The light emitting diode structure of the present invention forms a continuous light emitting region at the time of light emission, there is no case of dark band and light decay, and the present invention includes a COB (Chip On Board) and a die mold. With the (die mold) method, the manufacturing process time can be effectively reduced and mass production can be achieved. In addition, the structural design of the present invention can be applied by various light sources such as a backlight module, a decorative lamp, an illumination lamp, or a scanner light source, all of which are within the scope and product to which the present invention is applicable.

  Further, the package colloid according to the present invention can generate a horizontal light emission effect when the light emitting diode chip sealing structure of the present invention is upright by a special mold die molding process. The case does not occur. In other words, the present invention can be applied not only to the function of horizontal projection but also to the application to the heat dissipation effect in the thin case.

  In order to solve the technical problem, one solution according to the present invention includes a step of providing a substrate unit having a substrate body and a positive electrode conductive trace and a negative electrode conductive trace formed on the substrate body, respectively. A method of sealing a light emitting diode chip having a horizontal light emitting effect is provided.

  Next, a plurality of light emitting diode chips are respectively installed in a matrix manner on the substrate body to form a plurality of rows of vertical light emitting diode chips, where each light emitting diode chip is connected to the positive and negative electrodes of the substrate unit. Each has a positive end and a negative end electrically connected to the trace.

  Next, each longitudinal light emitting diode chip row is covered with a plurality of strip-shaped package colloids through the first mold unit, and the upper surface of each strip-shaped package colloid corresponds to these light-emitting diode chips. A plurality of colloidal arc surfaces.

  Finally, the present invention has the following two subsequent embodiments.

  In the first aspect, first, a plurality of strip-shaped package colloids are cut in a transverse direction between two vertical light emitting diode chips, and a plurality of light emitting diode chips are separately covered and covered. Forming a package colloid, wherein the top surface of each package colloid is a colloid arc surface, and each package colloid has a colloid light exit surface formed at the tip of the colloid arc surface, and a second The frame unit is covered on the substrate body and the package colloid through the mold unit of the mold and filled between the package colloids, and finally, the frame is moved between two vertical light emitting diode chips. The unit and the substrate body are cut laterally to form a plurality of light bars, and this frame unit It is cut into a plurality of frames layer to expose only those colloids light exit surface of every package resin on the Itoba.

  In the second embodiment, a plurality of package colloids are formed by horizontally cutting these strip-shaped package colloids between two vertical light emitting diode chips, and separately covering the respective light emitting diode chips. Wherein the upper surface of each package colloid is a colloid arc surface, and each package colloid has a colloid light exit surface formed at the tip of the colloid arc surface, and a third mold Through the unit, a plurality of strip-shaped frame layers are covered on the substrate body and the package colloids, and are vertically filled between the package colloids, and finally, between two vertical light emitting diode chips. The strip-shaped frame layer and the substrate body are cut laterally along to form a plurality of light bars, and the strip-shaped frame Layer is cut into a plurality of frame bodies to expose only the colloid light exit surface of the package resin.

  In order to solve the above technical problem, another method according to the present invention provides a sealing structure of a light emitting diode chip having a high-efficiency lateral light emitting effect, which includes a substrate unit, a light emitting unit, and a package colloid unit.

  Among them, the substrate unit has a substrate body, and a positive electrode conductive trace and a negative electrode conductive trace formed on the substrate body, respectively. The light emitting unit has a plurality of light emitting diode chips provided on the substrate body, and each light emitting diode chip has a positive electrode end and a negative electrode end electrically connected to positive and negative electrode conductive traces of the substrate unit, respectively. Have. The package colloid unit includes a plurality of package colloids covering the light emitting diode chips, respectively, where the upper and front surfaces of each package colloid have a colloid arc surface and a colloid light emission surface, respectively.

  Moreover, the sealing structure of the light-emitting diode chip of the present invention further includes the following two structures.

  (1) The frame unit is a frame layer that covers the substrate body and covers each package colloid and exposes only the colloid light emission surface.

  (2) The frame unit has a plurality of frame bodies that respectively cover the package colloids and expose only the colloidal light emission surfaces, and these frame bodies are separated on the substrate body. Installed.

  For this reason, the light emitting diode structure of the present invention forms a continuous light emitting region when light is emitted, and no dark band or light decay occurs. The present invention is capable of mass production by effectively reducing the manufacturing process time by using a COB (Chip On Board) and a die mold. Further, when the light emitting diode chip sealing structure of the present invention is upright, the effect of horizontal light emission can be generated. Therefore, the present invention can be applied not only to the function of horizontal light emission but also to the application to the heat dissipation effect in the thin case.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to more specifically and specifically describe the techniques, means and effects adopted by the present invention to achieve a predetermined object, the following detailed description and accompanying drawings relating to the present invention will be used to describe the present invention. Moreover, although a specific understanding can be obtained, it is needless to say that the accompanying drawings are used only for reference and explanation and do not narrowly limit the scope of the present invention.

  Reference is made to FIGS. 4, 4a-4d and 4A-4D. FIG. 4 is a flowchart showing a first embodiment of the sealing method according to the present invention, and FIGS. 4a to 4d are diagrams showing package flows of the first embodiment of the sealing structure according to the present invention, respectively. 4A to 4D are cross-sectional views showing a package flow of the first embodiment of the sealing structure according to the present invention. As can be seen from the flowchart of FIG. 4, the first embodiment of the present invention provides a method for encapsulating a light-emitting diode chip having a high-efficiency lateral light-emitting effect including the following steps.

  First, as shown in FIGS. 4A and 4A, a substrate unit 1 having a substrate body 10 and a plurality of positive electrode conductive traces 11 and a plurality of negative electrode conductive traces 12 respectively formed on the substrate body 10 is provided (S100). . Among them, the board body 10 is a printed circuit board (PCB), a flexible board, an aluminum board, a ceramic board, or a Cu board according to different design requirements. Further, the positive and negative electrode conductive traces 11 and 12 employ an Al circuit or an Ag circuit, and the layout of the positive and negative electrode conductive traces 11 and 12 can be slightly changed according to different requirements.

  Next, as shown in FIGS. 4b and 4B, a plurality of light emitting diode chips 20 are respectively installed in a matrix manner on the substrate body 10 to form a plurality of rows of light emitting diode chip rows 2, and among them, Each light-emitting diode chip 20 has a positive end 201 and a negative end 202 electrically connected to the positive and negative conductive traces 11 and 12 of the substrate unit, respectively (S102).

  In the first embodiment according to the present invention, the positive electrode end 201 and the negative electrode end 202 of each light-emitting diode chip 20 are connected to the positive electrode of the substrate unit 1 by wire bonding via two corresponding wires W. Are electrically connected to the negative electrode conductive traces 11 and 12. Further, each vertical light emitting diode chip row 2 may be provided on the substrate body 10 of the substrate unit 1 in a linear array system, and each light emitting diode chip 20 may be a blue light emitting diode chip.

  Of course, the electrical connection system of the light-emitting diode chips 20 is not limited to the present invention. For example, as shown in FIG. 5 (this diagram shows the electrical connection according to the flip-chip system of the light-emitting diode chip of the present invention). The positive and negative electrode ends 201 ′ and 202 ′ of each light-emitting diode chip 20 ′ are flip-chip connected via a plurality of corresponding solder balls B, and the substrate unit 1 ′. The positive and negative electrode conductive traces 11 ′ and 12 ′ may be electrically connected. Further, according to different design requirements, the positive and negative ends of these light emitting diode chips (not shown) are connected in series connection, in parallel connection or in series / parallel manner, and the substrate unit (not shown) is positive, It can be electrically connected to the negative conductive trace.

  Thereafter, as shown in FIGS. 4c, 4C and 6, the vertical light emitting diode chip rows 2 are covered in the vertical direction with a plurality of strip-shaped package colloids 3 via the first mold unit M1, where The upper surface of each of the strip-shaped package colloids 3 has a plurality of colloid arc surfaces 300 corresponding to the respective light-emitting diode chips 20, and each of the strip-shaped package colloids 3 includes the corresponding colloid arc surfaces 300. It has a plurality of colloid front end surfaces 301 provided at the tip (S104).

  Among them, the first mold unit M1 includes a first upper mold M11 and a first low mold M12 on which the substrate body 10 is placed. The first upper mold M11 includes these longitudinal light emitting diode chips. A plurality of first channels M110 corresponding to the column 2 are provided. Among them, each first channel M110 has a plurality of concave grooves G, and the upper surface and the front surface of each concave groove G correspond to the mold arc surface G100 corresponding to the colloid arc surface 300 and the colloid front end surface 301. Each has a mold front end face G101.

  The sizes of these first channels M110 are the same as the sizes of these strip-shaped package colloids 3. Furthermore, for each of the strip-shaped package colloids 3, a fluorescent resin formed by mixing silicon and fluorescent powder or a fluorescent resin formed by mixing epoxy resin and fluorescent powder is selected according to different usage requirements. it can.

  Subsequently, as shown in FIG. 4C in combination with FIG. 4D and FIG. 4D, these strip-shaped package colloids 3 are laterally cut along the space between the two vertical light emitting diode chips 20, and each light emission A plurality of package colloids 30 are formed so as to separately cover and cover the diode chip 20. Here, the upper surface of each package colloid 30 is a colloid arc surface 300, and each package colloid 30 is formed of the colloid arc surface 300. A colloidal light emission surface 302 formed at the tip of the substrate (S106).

  4E and 4E, the frame unit 4 is covered on the substrate body 10 and the package colloids 30 via the second mold unit M2 and filled between the package colloids 30 (see FIG. 4E and FIG. 4E). S108). Among them, the second mold unit M2 includes a second upper mold M21 and a second low mold M22 on which the substrate body 10 is placed, and the second upper mold M21 corresponds to the frame unit 4. Two second channels M210, and the height of the second channel M210 is the same as the height of these package colloids 30, and the width of the second channel M210 is the same as the width of the frame unit 4. is there.

  Finally, referring to FIG. 4E in combination with FIG. 4F and FIG. 4F, the frame unit 4 and the substrate body 10 are cut laterally between two vertical light emitting diode chips 20, and a plurality of lights The frame unit 4 is cut to form a plurality of frame layers 40 that form the bar L1 and expose only these colloidal light exit surfaces 302 of all package colloids 30 on each light bar L1. (S110). Among these, these frame layers 40 are frame layers that do not transmit light, for example, white frame layers.

  Reference is made to FIGS. 7, 7a-7b and 7A-7B. FIG. 7 is a flowchart showing a second embodiment of the sealing method according to the present invention, and FIGS. 7a to 7b show a part of the package flow of the second embodiment of the sealing structure according to the present invention, respectively. 7A to 7B are cross-sectional views showing a part of the package flow of the second embodiment of the sealing structure according to the present invention. As can be seen from the flowchart of FIG. 7, steps S200 to S206 of the second embodiment are the same as steps S100 to S106 of the first embodiment, respectively. That is, step S200 corresponds to the description shown in FIGS. 4a and 4A of the first embodiment, step S202 corresponds to the description shown in FIGS. 4b and 4B of the first embodiment, and step S204. Corresponds to the description shown in FIGS. 4c and 4C of the first embodiment, and step S206 corresponds to the description shown in FIGS. 4d and 4D of the first embodiment.

  In addition, after step S206, the second embodiment of the present invention further includes the following steps. First, as shown in FIGS. 7a and 7A, a plurality of strip-shaped frame layers 4 'are covered on the substrate body 10 and the package colloids 30 through the third mold unit M3, and the package colloids 30 are formed. It is filled in the vertical direction between them (S208).

  Among them, the third mold unit M3 includes a third upper mold M31 and a third row mold M32 on which the substrate body 10 is placed, and the third upper mold M31 includes these longitudinal light emitting diode chips. A plurality of third channels M310 corresponding to row 2 are provided, and the height of the third channel M310 is the same as the height of these package colloids 30, and the width of the third channel M310 is set for each package. It is larger than the width of the colloid 30.

  Finally, referring to FIG. 7a in combination with FIG. 7b and FIG. 7B, these strip-shaped frame layers 4 ′ and the substrate body 10 are cut transversely between two vertical light emitting diode chips 20 each. Then, a plurality of light bars L2 are formed, and these strip-shaped frame layers 4 ′ are cut so as to become a plurality of frame bodies 40 ′ that expose only the colloidal light emission surface 302 of each package colloid 30. (S210). Among these, these frame bodies 40 'are frame bodies that do not transmit light, for example, white frame bodies.

  Please refer to FIG. 8a and FIG. 8A. FIG. 8a is a diagram showing a part of the package flow of the third embodiment of the sealing structure according to the present invention, and FIG. 8A shows a part of the third embodiment of the sealing structure according to the present invention. It is sectional drawing which shows a package flow. The difference between the third embodiment and the first and second embodiments is that the first part of step 106 of the first embodiment and the first part of step 206 of the second embodiment are both “2” in the third embodiment. These strip-shaped package colloids 3 ′ are cut in the vertical direction along the space between each lateral light emitting diode chip 20, and can be changed as follows.

  Further, the fourth mold unit M4 includes a fourth upper mold M41 and a fourth row mold M42 on which the substrate body 10 is placed. The fourth mold unit M4 is most different from the first mold unit M4 in that the upper surface and the front surface of each first channel M410 have a mold arc surface 300 ′ and a mold light emission surface 302 ′, respectively. is there. Therefore, the plurality of strip-shaped package colloids 3 ′ are respectively covered by the lateral light emitting diode chips 2 in the lateral direction.

  FIG. 9 is a view showing that the light emitting diode chip sealing structure according to the present invention is applied to horizontal light emission. As can be seen from the figure, when the light-emitting diode chip D according to the present invention is applied to horizontal light emission (for example, a horizontal light source of a light guide plate M used in a notebook computer screen), the length l2 of the base S2 of the light-emitting diode chip D is The length of the light guide plate M can be increased according to the demand for heat dissipation (not limited to the thickness of the light guide plate M as in the prior art). In other words, since the length l2 of the base S2 can be increased according to the heat dissipation requirement, the light emitting diode chip D of the present invention can obtain an efficient heat dissipation effect, and the light emitting diode chip D is too hot and is burned out. The case where it ends up is avoided.

  As described above, the light emitting diode structure of the present invention forms a continuous light emitting region at the time of light emission, the case of dark band and light attenuation does not occur, and the present invention includes a COB (Chip On Board) and a die mold. With the (die mold) method, the manufacturing process time can be effectively reduced and mass production can be achieved. In addition, since the sealing structure of the light emitting diode chip of the present invention can generate a horizontal light emission effect when standing upright, the present invention not only generates a function of horizontal light projection, but also a heat dissipation effect in a thin case. Can also be applied to the application.

  However, the foregoing description is merely a detailed description of the preferred specific embodiments and drawings of the present invention, and does not limit the scope of the claims of the present invention. Any expert who has ordinary knowledge in the field, who should be based on the scope of the claims, can make appropriate changes or modifications within the field of the present invention. It goes without saying that it should be delivered within the scope.

FIG. 1 is a flowchart illustrating a first sealing method of a conventional light emitting diode. FIG. 2 is a flowchart illustrating a second method for sealing a conventional light emitting diode. FIG. 3 is a diagram illustrating that a conventional light emitting diode is applied to horizontal light emission. FIG. 4 is a flowchart showing a first embodiment of the sealing method according to the present invention. FIG. 4a is a diagram showing a package flow of the first embodiment of the sealing structure according to the present invention. FIG. 4b is a diagram showing a package flow of the first embodiment of the sealing structure according to the present invention. FIG. 4c is a diagram showing a package flow of the first embodiment of the sealing structure according to the present invention. FIG. 4d is a diagram showing a package flow of the first embodiment of the sealing structure according to the present invention. FIG. 4e is a diagram showing a package flow of the first embodiment of the sealing structure according to the present invention. FIG. 4f is a diagram showing a package flow of the first embodiment of the sealing structure according to the present invention. FIG. 4A is a cross-sectional view showing the package flow of the first embodiment of the sealing structure according to the present invention. FIG. 4B is a cross-sectional view showing the package flow of the first embodiment of the sealing structure according to the present invention. FIG. 4C is a cross-sectional view showing the package flow of the first embodiment of the sealing structure according to the present invention. FIG. 4D is a cross-sectional view showing the package flow of the first embodiment of the sealing structure according to the present invention. FIG. 4E is a cross-sectional view showing the package flow of the first embodiment of the sealing structure according to the present invention. FIG. 4F is a cross-sectional view showing the package flow of the first embodiment of the sealing structure according to the present invention. FIG. 5 is a diagram showing that the light emitting diode chips of the present invention are electrically connected by a flip chip method. FIG. 6 is a diagram showing a state before the colloid is filled in FIG. 4C of the present invention. FIG. 7 is a flowchart showing a second embodiment of the sealing method according to the present invention. FIG. 7a is a diagram showing a part of the package flow of the second embodiment of the sealing structure according to the present invention. FIG. 7b is a diagram showing a part of the package flow of the second embodiment of the sealing structure according to the present invention. FIG. 7A is a sectional view showing a part of the package flow of the second embodiment of the sealing structure according to the present invention. FIG. 7B is a cross-sectional view showing a part of the package flow of the second embodiment of the sealing structure according to the present invention. FIG. 8a shows a part of the package flow of the third embodiment of the sealing structure according to the present invention. FIG. 8A is a sectional view showing a part of the package flow of the third embodiment of the sealing structure according to the present invention. FIG. 9 is a view showing that the light emitting diode chip sealing structure according to the present invention is applied to horizontal light emission.

Explanation of symbols

D light emitting diode M light guide plate S1 base l1 length 1 substrate unit 10 substrate body 11 positive electrode conductive trace 12 negative electrode conductive trace 1 'substrate unit 11' positive electrode conductive trace 12 'negative electrode conductive trace 2 vertical light emitting diode chip array 20 light emitting diode chip 201 positive electrode end 202 negative electrode end 20 ′ light emitting diode chip 201 ′ positive electrode end 202 ′ negative electrode end 3 strip package colloid 30 package colloid 300 colloid arc surface 301 colloid front end surface 302 colloid light emitting surface 3 ′ strip package colloid 300 ′ mold arc Surface 302 'Mold light exit surface 4 Frame unit 40 Frame layer 4' Band-shaped frame layer 40 'Frame body W Wire B Solder ball M1 First mold unit M11 First upper mold M12 First loom M110 first channel G concave groove G100 mold arc surface G101 mold front end surface M2 second mold unit M21 second upper mold M22 second low mold M210 second channel M3 third mold unit M31 third mold Upper mold M32 Third row mold M310 Third channel M4 Fourth mold unit M41 Fourth upper mold M42 Fourth row mold M410 Fourth channel L1 Light bar L2 Light bar D Light emitting diode M Light guide plate S21 Base l2 length

Claims (38)

Providing a substrate unit having a substrate body and a positive electrode conductive trace and a negative electrode conductive trace respectively formed on the substrate body;
A plurality of light emitting diode chips are respectively installed in the substrate body by a matrix method, and each light emitting diode chip has a plurality of rows having a positive electrode end and a negative electrode end electrically connected to positive and negative electrode conductive traces of the substrate unit, respectively. Forming a vertical light emitting diode chip array;
A plurality of strip-shaped package colloids are covered on each vertical light-emitting diode chip row via the first mold unit, and the upper surface of each strip-shaped package colloid has a plurality of colloid arc surfaces corresponding to the respective light-emitting diode chips. And a method for sealing a light-emitting diode chip having a high-efficiency horizontal light-emitting effect.   2. The method of encapsulating a light emitting diode chip having a high efficiency horizontal light emitting effect according to claim 1, wherein the substrate unit is a printed circuit board (PCB), a flexible substrate, an aluminum substrate, a ceramic substrate, or a Cu substrate.   2. The method of encapsulating a light-emitting diode chip having a high-efficiency lateral light-emitting effect according to claim 1, wherein the positive and negative electrode conductive traces are an Al circuit or an Ag circuit.   The positive and negative electrode ends of each light emitting diode chip are electrically connected to the positive and negative electrode conductive traces of the substrate unit by wire bonding via two corresponding wires. 2. A method for sealing a light-emitting diode chip having a high-efficiency horizontal light-emitting effect according to 1.   The positive and negative electrode ends of each light emitting diode chip are electrically connected to positive and negative electrode conductive traces of the substrate unit in a flip chip manner through a plurality of corresponding solder balls. 2. A method for sealing a light-emitting diode chip having a high-efficiency horizontal light-emitting effect according to 1.   2. The method of sealing a light-emitting diode chip having a high-efficiency horizontal light-emitting effect according to claim 1, wherein each of the vertical light-emitting diode chip rows is provided on a substrate body of the substrate unit in a linear array system.   2. The LED chip having high efficiency horizontal light emitting effect according to claim 1, wherein each of the strip-shaped package colloids has a plurality of colloid front end surfaces provided at the front ends of the corresponding colloid arc surfaces. Stop method.   The first mold unit includes a first upper mold and a first row mold on which the substrate main body is placed. The first upper mold includes a plurality of second molds corresponding to the vertical light emitting diode chip rows. 1 channel, each first channel has a plurality of concave grooves, and the upper surface and the front surface of each concave groove are a mold arc surface corresponding to the colloid arc surface and a mold front end corresponding to the colloid front end surface. 8. The LED chip having a high efficiency lateral light emitting effect according to claim 7, wherein each of the first channel and the first channel has the same size as the band-shaped package colloid. Method.   2. The method of encapsulating a light-emitting diode chip having a high-efficiency lateral light-emitting effect according to claim 1, wherein each of the strip-shaped package colloids is a fluorescent resin formed by mixing silicon and fluorescent powder.   2. The method for sealing a light-emitting diode chip having a high-efficiency lateral light-emitting effect according to claim 1, wherein each of the strip-shaped package colloids is a fluorescent resin formed by mixing an epoxy resin and a fluorescent powder. Further, the strip-shaped package colloid is cut in a lateral direction between two vertical light emitting diode chips to form a plurality of package colloids separately covering the light emitting diode chips. A top surface of each package colloid is a colloid arc surface, and each package colloid has a colloid light emitting surface formed at a tip of the colloid arc surface;
Covering a frame unit on the substrate body and the package colloid through a second mold unit and filling the package colloid between the frame unit;
The frame unit and the substrate body are cut in a lateral direction between two vertical light emitting diode chips to form a plurality of light bars, and the frame unit includes all the light bars on each light bar. 2. The method of claim 1, further comprising cutting a plurality of frame layers exposing only the colloidal light exit surface of the package colloid. Method. The second mold unit includes a second upper mold on which a second upper mold and a substrate body are placed,
The second upper mold includes one second channel corresponding to the frame unit,
The height of the second channel is the same as the height of the package colloid, and the width of the second channel is the same as the width of the frame unit. A method for sealing a light-emitting diode chip having a high-efficiency horizontal light-emitting effect.   12. The method of encapsulating a light emitting diode chip having a high efficiency lateral light emitting effect according to claim 11, wherein the frame layer is a frame layer that does not transmit light.   14. The method of sealing a light-emitting diode chip having a high-efficiency horizontal light emitting effect according to claim 13, wherein the frame layer that does not transmit light is a white frame layer. Further, the strip-shaped package colloid is cut in a lateral direction between two vertical light emitting diode chips, and a plurality of package colloids are formed to separately cover each of the light emitting diode chips. An upper surface of the package colloid is a colloid arc surface, and each package colloid has a colloid light emitting surface formed at a tip of the colloid arc surface;
Covering a plurality of strip-shaped frame layers on the substrate body and the package colloid through a third mold unit and filling the space between the package colloids in a vertical direction;
The strip-shaped frame layer and the substrate body are cut in a lateral direction between two vertical light-emitting diode chips, and a plurality of light bars are formed. 2. The method of claim 1, further comprising the step of cutting to form a plurality of frame bodies exposing only the colloidal light exit surface of the package colloid. Method. The third mold unit includes a third upper mold and a third row mold on which the substrate body is placed, and the third upper mold includes a plurality of third molds corresponding to the vertical light emitting diode chip rows. With channels
The height of the third channel is the same as the height of the package colloid, and the width of the third channel is larger than the width of each package colloid. A method for sealing a light-emitting diode chip having an efficient lateral light-emitting effect.   16. The method of encapsulating a light-emitting diode chip having a high-efficiency horizontal light-emitting effect according to claim 15, wherein the frame body is a frame body that does not transmit light.   18. The method of encapsulating a light-emitting diode chip having a high efficiency horizontal light emitting effect according to claim 17, wherein the frame body that does not transmit light is a white frame body.   The first mold unit includes a first upper mold and a first row mold on which the substrate body is placed, and the first upper mold includes a plurality of light emitting diode chip rows corresponding to the vertical light emitting diode chip rows. A first channel, wherein an upper surface and a front surface of each first channel have a mold arc surface and a mold front end surface, respectively, and the height and width of the first channel are the band-shaped package. 2. The method for sealing a light-emitting diode chip having a high-efficiency lateral light-emitting effect according to claim 1, wherein the height and width of the colloid are the same. Further, the strip-shaped package colloid is longitudinally cut between two lateral light emitting diode chips, and a plurality of package colloids are formed so as to separate and cover each of the light emitting diode chips. The upper surface of the package colloid is a colloid arc surface, and each package colloid has a colloid light exit surface formed at the tip of the colloid arc surface;
Covering a frame unit on the substrate body and the package colloid through a second mold unit, and filling between the package colloid;
The frame unit and the substrate body are cut in a lateral direction between two vertical light emitting diode chips to form a plurality of light bars, and the frame unit includes all the light bars on each light bar. 20. The method of claim 19, further comprising the step of cutting a plurality of frame layers to expose only the colloidal light exit surface of the package colloid. Method. The second mold unit includes a second upper mold on which a second upper mold and a substrate body are placed,
The second upper mold includes one second channel corresponding to the frame unit,
The height of the second channel is the same as the height of the package colloid, and the width of the second channel is the same as the width of the frame unit. A method for sealing a light-emitting diode chip having a high-efficiency horizontal light-emitting effect. Further, the strip-shaped package colloid is cut in the vertical direction along the gap between two lateral light emitting diode chips, and a plurality of package colloids are formed to cover each light emitting diode chip separately. An upper surface of the package colloid is a colloid arc surface, and each package colloid has a colloid light emitting surface formed at a tip of the colloid arc surface;
Covering a plurality of strip-shaped frame layers on the substrate body and the package colloid through a third mold unit and filling the space between the package colloids in a vertical direction;
A plurality of light bars are formed by horizontally cutting the band-shaped frame layer and the substrate main body between two vertical light emitting diode chips, and the band-shaped frame layer is formed in each package. 20. A method of encapsulating a light-emitting diode chip having a high-efficiency horizontal light-emitting effect according to claim 19, further comprising a step of cutting the colloidal light-emitting surface into a plurality of frame bodies exposing only the colloidal light exit surface. . The third mold unit includes a third upper mold and a third row mold on which the substrate body is placed, and the third upper mold includes a plurality of third molds corresponding to the vertical light emitting diode chip rows. With channels
The height of the third channel is the same as the height of the package colloid, and the width of the third channel is larger than the width of each package colloid. A method for sealing a light-emitting diode chip having an efficient lateral light-emitting effect. The substrate unit having a substrate body and a positive electrode conductive trace and a negative electrode conductive trace respectively formed on the substrate body;
A plurality of light emitting diode chips provided on the substrate body, each light emitting diode chip having a positive electrode end and a negative electrode end electrically connected to the positive and negative electrode conductive traces of the substrate unit, and
A light emitting device having a high-efficiency horizontal light-emitting effect, comprising: a plurality of package colloids covering each of the light emitting diode chips; and a package colloid unit having a colloid arc surface and a colloid light emission surface on the top and front surfaces of each package colloid. Diode chip sealing structure.   25. The sealing structure of a light-emitting diode chip having high-efficiency lateral light-emitting effect according to claim 24, wherein the substrate unit is a printed circuit board (PCB), a flexible substrate, an aluminum substrate, a ceramic substrate, or a Cu substrate.   25. The sealing structure of a light emitting diode chip having a high efficiency lateral light emitting effect according to claim 24, wherein the positive and negative electrode conductive traces are an Al circuit or an Ag circuit.   The positive and negative electrode ends of each light emitting diode chip are electrically connected to the positive and negative electrode conductive traces of the substrate unit by wire bonding via two corresponding wires. 24. A light-emitting diode chip sealing structure having a high-efficiency horizontal light-emitting effect according to 24.   The positive and negative electrode ends of each light emitting diode chip are electrically connected to positive and negative electrode conductive traces of the substrate unit in a flip chip manner through a plurality of corresponding solder balls. 24. A light-emitting diode chip sealing structure having a high-efficiency horizontal light-emitting effect according to 24.   25. The sealing structure of a light emitting diode chip having a high efficiency horizontal light emitting effect according to claim 24, wherein the light emitting diode chip is provided on a substrate body of the substrate unit in a linear array system.   25. The sealing structure of a light emitting diode chip having a high efficiency horizontal light emitting effect according to claim 24, wherein the light emitting diode chip is provided on a substrate body of the substrate unit in a plurality of linear arrangement.   25. The sealing structure of a light-emitting diode chip having a high-efficiency lateral light-emitting effect according to claim 24, wherein each package colloid is a fluorescent resin formed by mixing silicon and fluorescent powder.   25. The sealing structure of a light emitting diode chip having a high efficiency horizontal light emitting effect according to claim 24, wherein each of the package colloids is a fluorescent resin formed by mixing an epoxy resin and a fluorescent powder.   The high-efficiency horizontal light-emitting effect according to claim 24, further comprising a frame unit that is a frame layer that covers the substrate body and covers each package colloid and exposes only the colloidal light emission surface. Light emitting diode chip sealing structure.   34. The sealing structure of a light-emitting diode chip having a high-efficiency horizontal light-emitting effect according to claim 33, wherein the frame layer is a frame layer that does not transmit light.   35. The sealing structure of a light emitting diode chip having a high efficiency horizontal light emitting effect according to claim 34, wherein the frame layer that does not transmit light is a white frame layer.   And a plurality of frame bodies that cover the package colloid and expose only the colloidal light emission surface, and the frame bodies include frame units that are separately installed on the substrate body. 25. A light-emitting diode chip sealing structure having a high-efficiency lateral light-emitting effect according to claim 24.   37. The sealing structure of a light emitting diode chip having a high efficiency horizontal light emitting effect according to claim 36, wherein the frame body is a frame body that does not transmit light.   38. The sealing structure of a light-emitting diode chip having a high-efficiency horizontal light-emitting effect according to claim 37, wherein the frame body that does not transmit light is a white frame body.