JP2009004584A5 - - Google Patents

Download PDF

Info

Publication number
JP2009004584A5
JP2009004584A5 JP2007164440A JP2007164440A JP2009004584A5 JP 2009004584 A5 JP2009004584 A5 JP 2009004584A5 JP 2007164440 A JP2007164440 A JP 2007164440A JP 2007164440 A JP2007164440 A JP 2007164440A JP 2009004584 A5 JP2009004584 A5 JP 2009004584A5
Authority
JP
Japan
Prior art keywords
wiring board
insulating layer
inner via
electrical insulating
component built
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007164440A
Other languages
English (en)
Japanese (ja)
Other versions
JP5127315B2 (ja
JP2009004584A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007164440A priority Critical patent/JP5127315B2/ja
Priority claimed from JP2007164440A external-priority patent/JP5127315B2/ja
Publication of JP2009004584A publication Critical patent/JP2009004584A/ja
Publication of JP2009004584A5 publication Critical patent/JP2009004584A5/ja
Application granted granted Critical
Publication of JP5127315B2 publication Critical patent/JP5127315B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007164440A 2007-06-22 2007-06-22 部品内蔵モジュール Expired - Fee Related JP5127315B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007164440A JP5127315B2 (ja) 2007-06-22 2007-06-22 部品内蔵モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007164440A JP5127315B2 (ja) 2007-06-22 2007-06-22 部品内蔵モジュール

Publications (3)

Publication Number Publication Date
JP2009004584A JP2009004584A (ja) 2009-01-08
JP2009004584A5 true JP2009004584A5 (ko) 2010-05-13
JP5127315B2 JP5127315B2 (ja) 2013-01-23

Family

ID=40320642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007164440A Expired - Fee Related JP5127315B2 (ja) 2007-06-22 2007-06-22 部品内蔵モジュール

Country Status (1)

Country Link
JP (1) JP5127315B2 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130050967A1 (en) * 2010-03-16 2013-02-28 Nec Corporation Functional device-embedded substrate
JP5360425B2 (ja) * 2010-04-08 2013-12-04 株式会社村田製作所 回路モジュール、および回路モジュールの製造方法
JP2012049260A (ja) * 2010-08-25 2012-03-08 Ricoh Microelectronics Co Ltd 切断方法及び切断装置
JP5285819B1 (ja) * 2012-11-07 2013-09-11 太陽誘電株式会社 電子回路モジュール
KR102166048B1 (ko) * 2014-03-20 2020-10-15 엘지디스플레이 주식회사 다층회로기판
CN104270885A (zh) * 2014-05-05 2015-01-07 珠海越亚封装基板技术股份有限公司 具有聚合物基质的插件框架及其制造方法
JP6443458B2 (ja) * 2015-01-30 2018-12-26 株式会社村田製作所 電子回路モジュール
WO2016181706A1 (ja) 2015-05-14 2016-11-17 株式会社村田製作所 電子回路モジュール
KR101828317B1 (ko) 2017-07-20 2018-02-12 최현길 크기가 상이한 인쇄회로기판을 고정부재를 이용하여 고정하고 인쇄회로기판의 조립 공정을 실시간으로 모니터링하는 방법 및 장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2976049B2 (ja) * 1992-07-27 1999-11-10 株式会社村田製作所 積層電子部品
JP2006210870A (ja) * 2004-12-28 2006-08-10 Matsushita Electric Ind Co Ltd 部品内蔵モジュール及びその製造方法
JP4816647B2 (ja) * 2005-11-28 2011-11-16 株式会社村田製作所 回路モジュールの製造方法および回路モジュール

Similar Documents

Publication Publication Date Title
JP2009004584A5 (ko)
JP2012248703A5 (ko)
JP2014239186A5 (ko)
WO2009004855A1 (ja) 配線基板の製造方法
WO2009031522A1 (ja) 半導体素子およびその製造方法、ならびにその半導体素子を実装する実装構造体
JP2012028735A5 (ko)
WO2008078739A1 (ja) 多層回路基板およびモータ駆動回路基板
JP2007013092A5 (ko)
JP2008545964A5 (ko)
JP2008160160A5 (ko)
JP2009094195A5 (ko)
JP2009043777A5 (ko)
JP2011071315A5 (ko)
JP2009194322A5 (ko)
JP2009525614A5 (ko)
JP2014239187A5 (ko)
JP2015041630A5 (ko)
JP2009081356A5 (ko)
JP2013247353A5 (ko)
KR102158068B1 (ko) 임베디드 인쇄회로기판
JP2004327918A5 (ko)
JP2013219191A5 (ko)
JP2011097582A5 (ko)
JP2013247225A5 (ko)
JP2009283739A5 (ko)