JP2008544859A - レーザ溶接システム及び方法 - Google Patents

レーザ溶接システム及び方法 Download PDF

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Publication number
JP2008544859A
JP2008544859A JP2008519062A JP2008519062A JP2008544859A JP 2008544859 A JP2008544859 A JP 2008544859A JP 2008519062 A JP2008519062 A JP 2008519062A JP 2008519062 A JP2008519062 A JP 2008519062A JP 2008544859 A JP2008544859 A JP 2008544859A
Authority
JP
Japan
Prior art keywords
target
diffraction grating
optical axis
laser
rotatable diffraction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008519062A
Other languages
English (en)
Japanese (ja)
Inventor
ウェルネル ディー ピー カウウェンベルフ
サンデル ドレステイン
ヨハンネス エイチ エム ロースマレン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV, Koninklijke Philips Electronics NV filed Critical Koninklijke Philips NV
Publication of JP2008544859A publication Critical patent/JP2008544859A/ja
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/22—Spot welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/244—Overlap seam welding

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2008519062A 2005-06-29 2006-06-26 レーザ溶接システム及び方法 Withdrawn JP2008544859A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US69507205P 2005-06-29 2005-06-29
PCT/IB2006/052100 WO2007000717A1 (fr) 2005-06-29 2006-06-26 Systeme et procede de soudage par faisceau laser

Publications (1)

Publication Number Publication Date
JP2008544859A true JP2008544859A (ja) 2008-12-11

Family

ID=37223146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008519062A Withdrawn JP2008544859A (ja) 2005-06-29 2006-06-26 レーザ溶接システム及び方法

Country Status (5)

Country Link
EP (1) EP1910014A1 (fr)
JP (1) JP2008544859A (fr)
KR (1) KR20080017057A (fr)
CN (1) CN101291774A (fr)
WO (1) WO2007000717A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018045888A (ja) * 2016-09-15 2018-03-22 日立オートモティブシステムズ株式会社 密閉型電池の製造方法
JP2018520880A (ja) * 2015-06-26 2018-08-02 トヨタ モーター ヨーロッパ レーザ溶接のためのシステム及び方法
JP2020019023A (ja) * 2018-07-30 2020-02-06 株式会社タムロン レーザ加工方法、レーザ加工装置、及びレーザ照射ヘッド

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395630B (zh) * 2009-06-30 2013-05-11 Mitsuboshi Diamond Ind Co Ltd 使用雷射光之玻璃基板加工裝置
EP3184232A1 (fr) 2015-12-23 2017-06-28 Universität Stuttgart Dispositif de forage, procédé et utilisation
DE102020105540A1 (de) * 2019-10-11 2021-04-15 Trumpf Laser- Und Systemtechnik Gmbh Optisches Stanzen von Mikrolöchern in Dünnglas
WO2024078804A1 (fr) * 2022-10-13 2024-04-18 Robert Bosch Gmbh Procédé de soudage par faisceau laser de deux composants

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2547757B1 (fr) * 1983-06-27 1986-10-17 Sciaky Sa Procede et installation de soudage par point a faisceau laser
JP3293136B2 (ja) * 1993-06-04 2002-06-17 セイコーエプソン株式会社 レーザ加工装置及びレーザ加工方法
JP2003305585A (ja) * 2001-09-11 2003-10-28 Seiko Epson Corp レーザー加工方法および加工装置
JP3775410B2 (ja) * 2003-02-03 2006-05-17 セイコーエプソン株式会社 レーザー加工方法、レーザー溶接方法並びにレーザー加工装置
EP1550528A1 (fr) * 2003-12-30 2005-07-06 Advanced Laser Separation International (ALSI) B.V. Procédé, dispositif et réseau de diffraction pour séparer des semiconducteurs formés sur un substrat en altérant ledit réseau de diffraction

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018520880A (ja) * 2015-06-26 2018-08-02 トヨタ モーター ヨーロッパ レーザ溶接のためのシステム及び方法
JP2018045888A (ja) * 2016-09-15 2018-03-22 日立オートモティブシステムズ株式会社 密閉型電池の製造方法
JP2020019023A (ja) * 2018-07-30 2020-02-06 株式会社タムロン レーザ加工方法、レーザ加工装置、及びレーザ照射ヘッド
JP7185436B2 (ja) 2018-07-30 2022-12-07 株式会社タムロン レーザ加工方法

Also Published As

Publication number Publication date
KR20080017057A (ko) 2008-02-25
WO2007000717A1 (fr) 2007-01-04
CN101291774A (zh) 2008-10-22
EP1910014A1 (fr) 2008-04-16

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Effective date: 20090901