JP2008523618A5 - - Google Patents
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- Publication number
- JP2008523618A5 JP2008523618A5 JP2007545499A JP2007545499A JP2008523618A5 JP 2008523618 A5 JP2008523618 A5 JP 2008523618A5 JP 2007545499 A JP2007545499 A JP 2007545499A JP 2007545499 A JP2007545499 A JP 2007545499A JP 2008523618 A5 JP2008523618 A5 JP 2008523618A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- surface modification
- exposed portion
- modification treatment
- aperture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 3
- 230000004048 modification Effects 0.000 claims 3
- 238000012986 modification Methods 0.000 claims 3
- 238000000059 patterning Methods 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 239000011368 organic material Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/010,846 US20060128165A1 (en) | 2004-12-13 | 2004-12-13 | Method for patterning surface modification |
| PCT/US2005/042307 WO2006065474A2 (en) | 2004-12-13 | 2005-11-22 | Method for patterning by surface modification |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008523618A JP2008523618A (ja) | 2008-07-03 |
| JP2008523618A5 true JP2008523618A5 (OSRAM) | 2009-01-15 |
Family
ID=36216851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007545499A Withdrawn JP2008523618A (ja) | 2004-12-13 | 2005-11-22 | 表面改質によるパターン化方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20060128165A1 (OSRAM) |
| EP (1) | EP1825327A2 (OSRAM) |
| JP (1) | JP2008523618A (OSRAM) |
| KR (1) | KR20080016781A (OSRAM) |
| CN (1) | CN101080670A (OSRAM) |
| WO (1) | WO2006065474A2 (OSRAM) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4892209B2 (ja) * | 2005-08-22 | 2012-03-07 | 日立化成デュポンマイクロシステムズ株式会社 | 半導体装置の製造方法 |
| JP2007129007A (ja) * | 2005-11-02 | 2007-05-24 | Hitachi Ltd | 有機半導体膜を有する半導体装置の製造方法 |
| US7666968B2 (en) * | 2006-04-21 | 2010-02-23 | 3M Innovative Properties Company | Acene-thiophene copolymers with silethynly groups |
| US8083953B2 (en) | 2007-03-06 | 2011-12-27 | Micron Technology, Inc. | Registered structure formation via the application of directed thermal energy to diblock copolymer films |
| US8557128B2 (en) | 2007-03-22 | 2013-10-15 | Micron Technology, Inc. | Sub-10 nm line features via rapid graphoepitaxial self-assembly of amphiphilic monolayers |
| US7959975B2 (en) | 2007-04-18 | 2011-06-14 | Micron Technology, Inc. | Methods of patterning a substrate |
| US8294139B2 (en) * | 2007-06-21 | 2012-10-23 | Micron Technology, Inc. | Multilayer antireflection coatings, structures and devices including the same and methods of making the same |
| US8097175B2 (en) | 2008-10-28 | 2012-01-17 | Micron Technology, Inc. | Method for selectively permeating a self-assembled block copolymer, method for forming metal oxide structures, method for forming a metal oxide pattern, and method for patterning a semiconductor structure |
| EP2137754A1 (en) * | 2007-04-19 | 2009-12-30 | Basf Se | Method for forming a pattern on a substrate and electronic device formed thereby |
| US8372295B2 (en) | 2007-04-20 | 2013-02-12 | Micron Technology, Inc. | Extensions of self-assembled structures to increased dimensions via a “bootstrap” self-templating method |
| US8404124B2 (en) | 2007-06-12 | 2013-03-26 | Micron Technology, Inc. | Alternating self-assembling morphologies of diblock copolymers controlled by variations in surfaces |
| US8080615B2 (en) | 2007-06-19 | 2011-12-20 | Micron Technology, Inc. | Crosslinkable graft polymer non-preferentially wetted by polystyrene and polyethylene oxide |
| US8999492B2 (en) | 2008-02-05 | 2015-04-07 | Micron Technology, Inc. | Method to produce nanometer-sized features with directed assembly of block copolymers |
| US8101261B2 (en) | 2008-02-13 | 2012-01-24 | Micron Technology, Inc. | One-dimensional arrays of block copolymer cylinders and applications thereof |
| US8425982B2 (en) | 2008-03-21 | 2013-04-23 | Micron Technology, Inc. | Methods of improving long range order in self-assembly of block copolymer films with ionic liquids |
| US8426313B2 (en) | 2008-03-21 | 2013-04-23 | Micron Technology, Inc. | Thermal anneal of block copolymer films with top interface constrained to wet both blocks with equal preference |
| US8114301B2 (en) | 2008-05-02 | 2012-02-14 | Micron Technology, Inc. | Graphoepitaxial self-assembly of arrays of downward facing half-cylinders |
| KR100997185B1 (ko) * | 2008-09-17 | 2010-11-29 | 삼성전기주식회사 | 인쇄회로기판 수지의 표면 처리 방법 및 상기 방법에 의해처리된 인쇄회로기판 수지 |
| ITMI20110363A1 (it) * | 2011-03-09 | 2012-09-10 | Cretec Co Ltd | Metodo per ricavare un percorso conduttivo mediante irradiazione laser |
| US8900963B2 (en) | 2011-11-02 | 2014-12-02 | Micron Technology, Inc. | Methods of forming semiconductor device structures, and related structures |
| US9087699B2 (en) | 2012-10-05 | 2015-07-21 | Micron Technology, Inc. | Methods of forming an array of openings in a substrate, and related methods of forming a semiconductor device structure |
| US9229328B2 (en) | 2013-05-02 | 2016-01-05 | Micron Technology, Inc. | Methods of forming semiconductor device structures, and related semiconductor device structures |
| US9177795B2 (en) | 2013-09-27 | 2015-11-03 | Micron Technology, Inc. | Methods of forming nanostructures including metal oxides |
| EP3055139A4 (en) * | 2013-10-11 | 2017-07-19 | 3M Innovative Properties Company | Plasma treatment of flexographic printing surface |
| JP2017507368A (ja) * | 2013-12-23 | 2017-03-16 | ソルベイ スペシャルティ ポリマーズ イタリー エス.ピー.エー. | ディスプレイデバイス |
| US20150257283A1 (en) * | 2014-03-06 | 2015-09-10 | Carolyn Rae Ellinger | Forming vertically spaced electrodes |
| US9244356B1 (en) | 2014-04-03 | 2016-01-26 | Rolith, Inc. | Transparent metal mesh and method of manufacture |
| WO2015183243A1 (en) | 2014-05-27 | 2015-12-03 | Rolith, Inc. | Anti-counterfeiting features and methods of fabrication and detection |
| CN104835721B (zh) * | 2015-03-31 | 2017-10-17 | 上海华力微电子有限公司 | 改善ArF光阻在硅片表面上的黏附性的方法 |
| US10768528B2 (en) | 2015-09-28 | 2020-09-08 | 3M Innovative Properties Company | Patterned film article comprising cleavable crosslinker and methods |
| US9969185B1 (en) * | 2017-02-16 | 2018-05-15 | Xerox Corporation | Pretreatment of UV cured ink under-layers |
| CN107240544B (zh) * | 2017-05-04 | 2019-10-15 | 中国科学院宁波材料技术与工程研究所 | 一种图形化薄膜、薄膜晶体管及忆阻器的制备方法 |
| EP3556911A1 (fr) * | 2018-04-19 | 2019-10-23 | Comadur S.A. | Procédé de structuration d'un motif décoratif ou technique dans un objet réalisé en un matériau amorphe, semi-cristallin ou cristallin au moins partiellement transparent |
| CN108682627B (zh) * | 2018-05-18 | 2019-05-21 | 清华大学 | 图案化柔性有机薄膜及制备方法、层叠体及图案化方法 |
| EP3934917B1 (en) * | 2019-03-06 | 2025-06-25 | Axalta Coating Systems IP Co. LLC | Controlled surface wetting resulting in improved digital print edge acuity and resolution |
| EP3835079B1 (de) * | 2019-12-12 | 2023-07-26 | Akzenta Paneele + Profile GmbH | Digitaldruckstrukturierte verschleissschutzfolie mit einstellbarem glanzgrad |
| US20220162118A1 (en) * | 2020-11-23 | 2022-05-26 | Innolux Corporation | Method for preparing cover substrate |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3906769A (en) * | 1973-05-02 | 1975-09-23 | Nasa | Method of making an insulation foil |
| US4338614A (en) * | 1979-10-22 | 1982-07-06 | Markem Corporation | Electrostatic print head |
| FR2530904A1 (fr) * | 1982-07-23 | 1984-01-27 | Dainippon Screen Mfg | Masque a ouvertures pour dispositifs d'exploration et d'enregistrement d'images |
| US4581753A (en) * | 1984-09-21 | 1986-04-08 | John K. Grady | Translatively driven X-ray aperture mask |
| US4581468A (en) * | 1985-05-13 | 1986-04-08 | Ultrasystems, Inc. | Boron nitride preceramic polymers |
| US4612737A (en) * | 1985-07-05 | 1986-09-23 | Rohr Industries, Inc. | Grit blast drilling of advanced composite perforated sheet |
| JPH06168919A (ja) * | 1992-11-30 | 1994-06-14 | Dainippon Printing Co Ltd | 半導体装置のパターニング方法 |
| GB2285411B (en) * | 1993-12-22 | 1997-07-16 | Kimberly Clark Co | Process of manufacturing a water-based adhesive bonded, solvent resistant protective laminate |
| JPH10172912A (ja) * | 1996-12-09 | 1998-06-26 | Furukawa Electric Co Ltd:The | 量子構造の形成方法 |
| JP4003273B2 (ja) * | 1998-01-19 | 2007-11-07 | セイコーエプソン株式会社 | パターン形成方法および基板製造装置 |
| JP2002512124A (ja) * | 1998-04-21 | 2002-04-23 | プレジデント・アンド・フェローズ・オブ・ハーバード・カレッジ | エラストマ・マスク、およびピクセル化されたエレクトロルミネセンス・ディスプレイを含む装置の製造における使用 |
| US6428650B1 (en) * | 1998-06-23 | 2002-08-06 | Amerasia International Technology, Inc. | Cover for an optical device and method for making same |
| AU778153B2 (en) * | 1998-12-08 | 2004-11-18 | Gene Logic, Inc. | Process for attaching organic molecules to silicon |
| AU2015901A (en) * | 1999-12-21 | 2001-07-03 | Plastic Logic Limited | Inkjet-fabricated integrated circuits |
| CN1245769C (zh) * | 1999-12-21 | 2006-03-15 | 造型逻辑有限公司 | 溶液加工 |
| US6281468B1 (en) * | 2000-03-13 | 2001-08-28 | Essilor International, Compagnie Generale D'optique | Method and apparatus for producing a marking on an ophthalmic lens having a low surface energy |
| JP2001272505A (ja) * | 2000-03-24 | 2001-10-05 | Japan Science & Technology Corp | 表面処理方法 |
| US6718532B2 (en) * | 2001-02-23 | 2004-04-06 | Kabushiki Kaisha Toshiba | Charged particle beam exposure system using aperture mask in semiconductor manufacture |
| US6433359B1 (en) * | 2001-09-06 | 2002-08-13 | 3M Innovative Properties Company | Surface modifying layers for organic thin film transistors |
| DE60212668T2 (de) * | 2001-09-27 | 2007-06-21 | 3M Innovative Properties Co., St. Paul | Halbleiter auf basis von substituiertem pentacen |
| US20030097010A1 (en) * | 2001-09-27 | 2003-05-22 | Vogel Dennis E. | Process for preparing pentacene derivatives |
| US6998068B2 (en) * | 2003-08-15 | 2006-02-14 | 3M Innovative Properties Company | Acene-thiophene semiconductors |
| US6946676B2 (en) * | 2001-11-05 | 2005-09-20 | 3M Innovative Properties Company | Organic thin film transistor with polymeric interface |
| US6617609B2 (en) * | 2001-11-05 | 2003-09-09 | 3M Innovative Properties Company | Organic thin film transistor with siloxane polymer interface |
| US6660177B2 (en) * | 2001-11-07 | 2003-12-09 | Rapt Industries Inc. | Apparatus and method for reactive atom plasma processing for material deposition |
| JP2003151960A (ja) * | 2001-11-12 | 2003-05-23 | Toyota Motor Corp | トレンチエッチング方法 |
| US6821348B2 (en) * | 2002-02-14 | 2004-11-23 | 3M Innovative Properties Company | In-line deposition processes for circuit fabrication |
| US6897164B2 (en) * | 2002-02-14 | 2005-05-24 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
| US20030151118A1 (en) * | 2002-02-14 | 2003-08-14 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
| EP1480762A1 (en) * | 2002-03-02 | 2004-12-01 | Polymeric Converting LLC | Removable labels, coupons and the like |
| US6667215B2 (en) * | 2002-05-02 | 2003-12-23 | 3M Innovative Properties | Method of making transistors |
| US7459098B2 (en) * | 2002-08-28 | 2008-12-02 | Kyocera Corporation | Dry etching apparatus, dry etching method, and plate and tray used therein |
| US7098525B2 (en) * | 2003-05-08 | 2006-08-29 | 3M Innovative Properties Company | Organic polymers, electronic devices, and methods |
| US7309731B2 (en) * | 2003-06-02 | 2007-12-18 | Avery Dennison Corporation | Ink-receptive coatings, composites and adhesive-containing facestocks and labels |
| US7109519B2 (en) * | 2003-07-15 | 2006-09-19 | 3M Innovative Properties Company | Bis(2-acenyl)acetylene semiconductors |
| US7304263B2 (en) * | 2003-08-14 | 2007-12-04 | Rapt Industries, Inc. | Systems and methods utilizing an aperture with a reactive atom plasma torch |
| US20050130422A1 (en) * | 2003-12-12 | 2005-06-16 | 3M Innovative Properties Company | Method for patterning films |
| WO2006043848A1 (en) * | 2004-10-15 | 2006-04-27 | Yuri Konstantinovich Nizienko | Method for modifying portions of a product surface layer and device for carrying out said method |
-
2004
- 2004-12-13 US US11/010,846 patent/US20060128165A1/en not_active Abandoned
-
2005
- 2005-11-22 EP EP05826648A patent/EP1825327A2/en not_active Withdrawn
- 2005-11-22 WO PCT/US2005/042307 patent/WO2006065474A2/en not_active Ceased
- 2005-11-22 KR KR1020077015909A patent/KR20080016781A/ko not_active Withdrawn
- 2005-11-22 CN CNA2005800428441A patent/CN101080670A/zh active Pending
- 2005-11-22 JP JP2007545499A patent/JP2008523618A/ja not_active Withdrawn
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