JP2008311347A5 - - Google Patents
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- Publication number
- JP2008311347A5 JP2008311347A5 JP2007156303A JP2007156303A JP2008311347A5 JP 2008311347 A5 JP2008311347 A5 JP 2008311347A5 JP 2007156303 A JP2007156303 A JP 2007156303A JP 2007156303 A JP2007156303 A JP 2007156303A JP 2008311347 A5 JP2008311347 A5 JP 2008311347A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- interposer
- wiring pattern
- tape substrate
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 9
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007156303A JP2008311347A (ja) | 2007-06-13 | 2007-06-13 | 半導体モジュール及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007156303A JP2008311347A (ja) | 2007-06-13 | 2007-06-13 | 半導体モジュール及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008311347A JP2008311347A (ja) | 2008-12-25 |
JP2008311347A5 true JP2008311347A5 (de) | 2010-07-22 |
Family
ID=40238719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007156303A Withdrawn JP2008311347A (ja) | 2007-06-13 | 2007-06-13 | 半導体モジュール及びその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2008311347A (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7989942B2 (en) * | 2009-01-20 | 2011-08-02 | Altera Corporation | IC package with capacitors disposed on an interposal layer |
JP6015144B2 (ja) | 2012-06-04 | 2016-10-26 | 富士通株式会社 | 電子機器及び半導体装置 |
-
2007
- 2007-06-13 JP JP2007156303A patent/JP2008311347A/ja not_active Withdrawn
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