JP2008307873A - 接合方法、接合体、液滴吐出ヘッドおよび液滴吐出装置 - Google Patents
接合方法、接合体、液滴吐出ヘッドおよび液滴吐出装置 Download PDFInfo
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- JP2008307873A JP2008307873A JP2007160790A JP2007160790A JP2008307873A JP 2008307873 A JP2008307873 A JP 2008307873A JP 2007160790 A JP2007160790 A JP 2007160790A JP 2007160790 A JP2007160790 A JP 2007160790A JP 2008307873 A JP2008307873 A JP 2008307873A
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Images
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- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007160790A JP2008307873A (ja) | 2007-06-18 | 2007-06-18 | 接合方法、接合体、液滴吐出ヘッドおよび液滴吐出装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007160790A JP2008307873A (ja) | 2007-06-18 | 2007-06-18 | 接合方法、接合体、液滴吐出ヘッドおよび液滴吐出装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008307873A true JP2008307873A (ja) | 2008-12-25 |
| JP2008307873A5 JP2008307873A5 (enExample) | 2010-07-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007160790A Withdrawn JP2008307873A (ja) | 2007-06-18 | 2007-06-18 | 接合方法、接合体、液滴吐出ヘッドおよび液滴吐出装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008307873A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102001615A (zh) * | 2010-09-02 | 2011-04-06 | 浙江大学 | 一种高聚物纳流控芯片的制备方法 |
| JP2011235532A (ja) * | 2010-05-10 | 2011-11-24 | Seiko Epson Corp | 接合方法 |
| US8128202B2 (en) | 2008-07-29 | 2012-03-06 | Seiko Epson Corporation | Nozzle plate, method for manufacturing nozzle plate, droplet discharge head, and droplet discharge device |
| US8262837B2 (en) | 2008-04-01 | 2012-09-11 | Seiko Epson Corporation | Bonding method, bonded structure, liquid droplet discharging head, and liquid droplet discharging apparatus |
| JP2019199068A (ja) * | 2018-05-18 | 2019-11-21 | 国立大学法人大阪大学 | 樹脂材と金属材との接合体およびその製造方法 |
-
2007
- 2007-06-18 JP JP2007160790A patent/JP2008307873A/ja not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8262837B2 (en) | 2008-04-01 | 2012-09-11 | Seiko Epson Corporation | Bonding method, bonded structure, liquid droplet discharging head, and liquid droplet discharging apparatus |
| US8128202B2 (en) | 2008-07-29 | 2012-03-06 | Seiko Epson Corporation | Nozzle plate, method for manufacturing nozzle plate, droplet discharge head, and droplet discharge device |
| JP2011235532A (ja) * | 2010-05-10 | 2011-11-24 | Seiko Epson Corp | 接合方法 |
| CN102001615A (zh) * | 2010-09-02 | 2011-04-06 | 浙江大学 | 一种高聚物纳流控芯片的制备方法 |
| JP2019199068A (ja) * | 2018-05-18 | 2019-11-21 | 国立大学法人大阪大学 | 樹脂材と金属材との接合体およびその製造方法 |
| JP7239134B2 (ja) | 2018-05-18 | 2023-03-14 | 国立大学法人大阪大学 | 樹脂材と金属材との接合体およびその製造方法 |
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