JP2008306041A - Bonding pad arrangement method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize a bonding pad arrangement method that efficiently performs design processing using an arithmetic processing unit to arrange signal pads and ring pads in a balanced way on a substrate surface of a semiconductor package. <P>SOLUTION: The bonding pad arrangement method, which performs arrangement processing using an arithmetic processing unit to design the positions of signal pads or ring pads on a substrate surface of a semiconductor package on a virtual plane surface equivalent to the substrate surface of the semiconductor package, includes a determination step S100 for determining whether or not a position-to-be-determined signal pad, for which a position on a virtual plane surface is to be determined, belongs to a row different in terms of design data definition than a position-determined signal pad for which a position on a virtual plane surface has already been determined immediately before the position-to-be-determined signal pad in the arrangement sequence defined by the design data, and a decision step S200 for deciding the position on the virtual plane surface for the position-to-be-determined signal pad based on the determination result of the determination step S100. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a bonding pad arrangement method for designing an arrangement position of signal pads or ring pads on a substrate surface of a semiconductor package on a virtual plane corresponding to the substrate surface.

  In a semiconductor package such as PBGA or EBGA, a bonding pad that is electrically connected to an electrode terminal of a semiconductor chip includes a signal pad and a ring pad (see, for example, Patent Document 1).

  The arrangement positions of the signal pads or ring pads on the substrate surface of the semiconductor package are designed on a virtual plane corresponding to the substrate surface of the semiconductor package using a CAD system. FIG. 26 is a diagram illustrating an arrangement example of signal pads and ring pads on a virtual plane corresponding to the substrate surface of the semiconductor package created by the CAD system, and FIG. 27 is an enlarged view of FIG. Here, an example is shown in which 120 signal pads SP and 40 ring pads RP are composed of two signal pad rows and three ring pad rows. It should be noted that the number of rows in which the illustrated signal pads SP are arranged and the number of rows in which the ring pads RP are arranged are merely examples.

  For the signal pads SP, the columns to be arranged are defined in advance by design data, and in the illustrated example, the outer and inner arc-shaped two columns (referred to as A column and B column, respectively). Unless otherwise specified, the outer row is the A row and the inner row is the B row.) For the ring pad RP, the position of the ring is defined in advance by design data, and in the example shown in the figure, three rows are shown in the order of C row, D row and E row from the outside to the inside. A ring pad RP is disposed on these rings. In the example shown in the figure, the range in which the signal pad SP and the ring pad RP can be arranged is within an arc having a radius of 20 mm, a start angle of 45 degrees to the right, and an end angle of 135 degrees.

  FIGS. 28 and 29 are diagrams for explaining signal pad arrangement processing according to the prior art. The assignment of whether each signal pad is arranged on the outer A row or the inner B row is defined in advance by design data. In the illustrated example, it is assumed that the signal pad SP1 is preliminarily defined by the design data when the signal pad SP1 is arranged on the A row and the signal pad SP2 is arranged on the B row.

  As shown in FIG. 28A, first, all the signal pads SP1 and SP2 are provisionally arranged on the reference row (for example, B row) so that the adjacent signal pads have a constant interval. . This temporary arrangement will be described in detail with reference to FIG. That is, as shown in FIG. 29, each signal pad SP is sequentially provisionally maintained on the arcuate auxiliary line Q defined by the design data so that the distance between the contours of adjacent signal pads maintains a predetermined distance. Be placed.

  Next, among these, the signal pad SP1 defined by the design data to be arranged in the A column is drawn out and rearranged on the A column as shown in FIG. At this time, the interval between the signal pads SP1 on the outer A row is different from the interval between the signal pads SP2 on the inner B row. This is because the line connecting the chip and the signal pad does not pass through the center of the arc of the outer A row that is arcuate. In the example shown in the figure, the reference column is the B column. However, when the reference column is the A column, the signal pad SP2 defined by the design data is to be arranged in the B column. Is pulled back and arranged on the B row.

  On the other hand, the ring pad placement process is executed after the above-described signal pad placement process is executed to determine the position of the signal pad on the virtual plane. Unlike the case of the signal pad, with regard to the ring pad, the arrangement interval between the adjacent ring pads is not particularly considered. This is because the ring pad only needs to exist between the wires of the signal pad, and when there are a plurality of ring pads between the wires of the signal pad, the ring pads overlap each other and are electrically connected. There is no problem.

  Each signal pad and ring pad placement process described above is repeated until the signal pad and ring pad can be placed most widely within the arc-shaped placement range.

JP 2005-303086 A

  According to the prior art, as described above, in the signal pad arrangement process, first, all the signal pads are provisionally arranged on the reference row so that the adjacent signal pads have a constant interval. Then, each signal pad is allocated and arranged in a column defined in advance by design data. For this reason, the interval between the signal pads to be arranged other than the reference row becomes non-uniform, so that the signal pads are partially arranged as shown in FIGS.

  Further, according to the above-described conventional technology, the interval between the signal pads may be too narrow depending on the position of the chip pad. FIG. 30 is a diagram illustrating a case where adjacent signal pads intersect as a result of signal pad placement processing according to the conventional technique. As shown in the figure, the signal pad SP3 and the signal pad SP4 intersect to form a so-called “reverse C shape”. In such a case, it is necessary to redesign the arrangement of the signal pad related to the “inverted U” shape and the signal pad located in the vicinity thereof so as to eliminate the “inverted U” shape.

  Furthermore, in the arrangement process of the ring pad, the arrangement interval between the adjacent ring pads is not particularly considered. Therefore, when it is not possible to secure a place where the wire is hit on the ring pad, the arrangement process of the signal pad is performed. You must go back and start each placement process again.

  Accordingly, in view of the above problems, an object of the present invention is to provide a bonding pad arrangement method for efficiently executing a design process for arranging a signal pad and a ring pad so as not to be biased on a substrate surface of a semiconductor package by an arithmetic processing unit. There is to do.

  In order to achieve the above object, in the present invention, an arrangement process for designing a position of a signal pad or a ring pad as a bonding pad on a substrate surface of a semiconductor package on a virtual plane corresponding to the substrate surface of the semiconductor package is performed. The bonding pad placement method executed by the arithmetic processing unit sequentially determines the positions on the virtual plane of the signal pads and ring pads in which the placement order and the columns to be placed are defined in advance by the design data in the placement order. However, in this method, the position determination target signal pad whose position on the virtual plane is to be determined is already one virtual plane ahead of the position determination target signal pad according to the arrangement order defined by the design data. It differs from the first positioned signal pad that determined the upper position because of the design data definition. That comprises a whether the first judgment step of judging whether belonging to the column, based on the determination result of the first determination step, a determination step of determining a position on the virtual plane position determination target signal pad, a.

  ADVANTAGE OF THE INVENTION According to this invention, the design which arrange | positions a signal pad and a ring pad uniformly on the board | substrate surface of a semiconductor package can be automated using an arithmetic processing unit. Therefore, the work time of the semiconductor package designer is greatly shortened and the burden is also reduced. As a result, the manufacturing cost of the semiconductor package can be reduced.

  In addition, according to the present invention, as a result of the signal pad arrangement process, adjacent signal pads do not intersect to form an “inverted C” shape, and a place for placing a wire on the ring pad is secured. There is no such thing as impossible. Therefore, there is no need to redesign as in the prior art.

  FIG. 1 is a flowchart showing the basic operation of the bonding pad arrangement method according to the present invention. In the bonding pad arrangement method according to the present invention, the position determination target signal pad whose position on the virtual plane is to be determined is already on the virtual plane one ahead of the position determination target signal pad according to the arrangement order defined by the design data. Based on the determination result of the first determination step S100 for determining whether or not the first position-determined signal pad whose position has been determined belongs to a column different from the definition of the design data and the determination result of the first determination step S100. Determination step S200 for determining the position of the determination target signal pad on the virtual plane.

  Hereinafter, the bonding pad arrangement processing according to the embodiment of the present invention will be described with specific examples. Prior to executing the bonding pad arrangement process, various design data related to the signal pad and the ring pad must be defined in advance.

  FIG. 2 is a diagram for explaining an interval between a signal pad defined in advance as one of design data and a wire of a signal pad adjacent to the signal pad in the embodiment of the present invention. When adjacent signal pads are arranged in different rows, one signal pad will be close to the other signal pad wires, but with a certain clearance to prevent these shorts. There is a need. That is, as shown in FIG. 2, it is assumed that at least a minimum allowable interval m must be secured between the contour of the signal pad SP2 and the contour of the wire W1 of the signal pad SP1, and this minimum allowable interval m is set as design data. One of them is defined in advance.

  FIG. 3 is a diagram for explaining an interval between ring pads defined in advance as one of design data in the embodiment of the present invention. As shown in FIG. 3, a minimum allowable interval γ between the ring pad RP1 and the ring pad RP2 located on the same ring is defined in advance as one of design data.

  FIG. 4 is a diagram for explaining an interval between a wire of a signal pad and a ring pad that is defined in advance as one of design data in the embodiment of the present invention. As shown in FIG. 4, a minimum allowable interval α between the wire W of the signal pad SP and the ring pad RP is defined in advance as one of the design data.

  In the bonding pad placement processing according to the embodiment of the present invention, the signal pad placement processing is executed first, and then the ring pad placement processing is executed. The specific processing will be described with reference to FIGS. To do. In the design data, the arrangement order of the signal pads and ring pads on the virtual plane and the columns to be arranged are defined in advance, and the positions of the signal pads and ring pads on the virtual plane are sequentially determined according to the arrangement order. .

  FIG. 5 is a diagram for explaining the arrangement of the first signal pad in the embodiment of the present invention, and FIG. 6 is an enlarged view of FIG. In the signal pad placement process, the first signal pad (first signal pad) to be placed is an arc-shaped row (illustrated) defined in the design data as a row to place the signal pad as shown in the figure. In the example shown in FIG. A wire W is drawn from the chip pad CP of the semiconductor chip C to the signal pad SP.

  7 to 12 are flowcharts showing specific operations of the bonding pad arrangement method according to the embodiment of the present invention. 13 to 22 are diagrams showing specific examples of the arrangement of signal pads and ring pads based on the bonding pad arrangement method according to the embodiment of the present invention.

13 to 19, in order to facilitate understanding, a number is assigned to each signal pad based on the order of arrangement of the signal pad defined in advance by design data, and a reference numeral is assigned corresponding to this number. I will decide. For example, it is represented by reference number SP _i of “i-th signal pad”. Here, i is a positive integer. Further, a position determination target signal pad that is a signal pad whose position on the virtual plane is to be determined is assumed to be the (i + 1) th signal pad SP _{i + 1} . Therefore, the signal pad whose position on the virtual plane has already been determined in the arrangement processing one before (before) the position determination target signal pad SP _{i + 1} that is the i + 1 th signal pad is the positioned signal pad SP. _i is the signal pad SP _i−1 that has been determined in the second (previous) position in the virtual plane, and has already been determined. On the other hand, the position determination target signal pad SP _{i + 1} is represented by a signal pad reference symbol SP _{i + 2} whose position on the virtual plane is to be determined in the arrangement process.

First, in the first determination step S100 of FIG. 7, the position determination target signal pad whose position on the virtual plane is to be determined is 1 more than the position determination target signal pad according to the arrangement order of the signal pads defined in advance by the design data. It is determined whether or not the first position-determined signal pad whose position on the virtual plane has already been determined belongs to a column that is different from the definition of the design data. As shown in FIG. 14A, the position-determined signal pad SP _{i + 1} has already determined the position on the virtual plane one position ahead of the position-determination target signal pad SP _{i + 1.} If it is determined that it belongs to a column different from SP _i , the process proceeds to the second determination step S101. As shown in FIG. 13, the position determination target signal pad SP i _{+ 1,} the position determination target signal pad SP i _{+ 1} position determined signal pad SP _i determined already located on the virtual plane into one before the If it is determined that they belong to the same column, the process proceeds to a thirteenth determination step S105.

In the twelfth determination step S105, the interval between the position determination target signal pad and the position determined signal pad whose position on the virtual plane has already been determined one ahead of the position determination target signal pad is set to have a predetermined distance. Then, the position of the position determination target signal pad on the virtual plane is determined on the row defined by the design data. In the example shown in FIG. 13, the position determination target signal pad SP i _{+ 1,} the position determination target signal pad SP i _{+ 1} position determined signal pads already determined the position on the virtual plane into one before the SP _i In the meantime, the position on the virtual plane is determined on column B, which is a column defined by the design data, so as to have a predetermined distance previously defined by the design data. After the completion of the process of the thirteenth determination step S105, the process proceeds to the ninth determination step S123 of FIG.

In the second determination step S101, the signal pad whose position is to be determined next to the position determination target signal pad according to the arrangement order previously defined in the design data belongs to the same column as the position determination target signal pad in terms of the design data. It is determined whether or not. As shown in FIG. 14B, the signal pad SP _{i + 2} whose position is to be determined next to the position determination target signal pad SP _{i + 1} in accordance with the arrangement order previously defined in the design data is the position determination target signal pad. If it is determined that SP _{i + 1} and the design data belong to the same column, the process proceeds to the first provisional arrangement step S102. On the other hand, as shown in FIG. 14B, the signal pad SP _{i + 2} whose position is to be determined next to the position determination target signal pad SP _{i + 1} in accordance with the arrangement order defined in advance by the design data is the position determination target. If it is determined that the signal pad SP _{i + 1} and the design data do not belong to the same column, that is, it belongs to a different column, the process proceeds to a fifth determination step S110 in FIG.

In the first temporary placement step S102, the distance between the position-determined signal pad whose position on the virtual plane has already been determined one position ahead of the position-determination target signal pad and the wire of the position-determination target signal pad is a predetermined distance. The signal pads to be positioned are temporarily arranged on the rows defined by the design data so as to have them. In the example shown in FIG. 14B, the column is defined by the design data so that the distance between the position-determined signal pad SP _i and the wire W of the position determination target signal pad SP _{i + 1} has a predetermined distance. Position determining target signal pads SP _{i + 1} are temporarily arranged on the A row.

Next, in the third determination step S103, the design is such that the position determination target signal pad temporarily arranged in the first temporary arrangement step S102 belongs to the same column as defined in the design data and is adjacent to the position determination target signal pad. It is determined whether or not there is a position-determined signal pad whose position on the virtual plane has already been determined two ahead of the position determination target signal pad in accordance with the arrangement order defined in advance by the data. As shown in FIG. 15, the position determination target signal pad SP _{i + 1} provisionally arranged in the first provisional arrangement step S102 belongs to the same column (A column in the illustrated example) according to the design data, and the position determination is performed. as adjacent to the target signal pad SP i _{+ 1,} predefined position determined already determines the position on the virtual plane into two ahead position determination target signal pad SP i _{+ 1} according to the arrangement order in the design data If there is no signal pad, the process proceeds to the first determination step S104. On the other hand, as shown in FIG. 16A, the position determination target signal pad belonging to the same column A as defined by the design data and the position determination target signal pad SP _{i + 1} temporarily arranged in the first temporary arrangement step S102. SP i + ₁ in such adjacent predefined positions determined according to the arrangement order target signal pad SP i _{+ 1} 2 one previously already determined the position on the virtual plane position determined signal pad SP than the design data _{If i-1} exists, the process proceeds to the fourth determination step S106 in FIG.

In the first determination step S104, the position of the position determination target signal pad temporarily arranged in the first temporary arrangement step S102 is determined as the position on the virtual plane of the position determination target signal pad. For example, when the position of the position determination target signal pad SP _{i + 1} is temporarily arranged as shown in FIG. 15, this position is set as the position on the virtual plane of the position determination target signal pad SP _{i + 1.} Confirm as After the completion of the process of the first determination step S104, the process proceeds to the ninth determination step S123 of FIG.

In the fourth determination step S106 of FIG. 8, the position-determined signal pad and the position-determination target whose position on the virtual plane has already been determined two ahead of the position-determination signal pad in accordance with the arrangement order previously defined in the design data It is determined whether or not the distance from the signal pad has a predetermined distance. In the example shown in FIG. 16A, whether or not the interval between the position-determined signal pad SP _i-1 and the position-determination target signal pad SP _{i + 1} has a predetermined distance defined in advance by design data. Will be judged. If it is determined that the interval has a predetermined distance, the process proceeds to a second determination step S107. If it is determined that the interval does not have a predetermined distance, the process proceeds to a third determination step S108.

In the second determination step S107, the position of the position determination target signal pad temporarily arranged in the first temporary arrangement step S102 of FIG. 7 is determined as the position on the virtual plane of the position determination target signal pad. For example, when the position of the position determination target signal pad SP _{i + 1} is temporarily arranged as shown in FIG. 16A, this position is set as the virtual plane of the position determination target signal pad SP _{i + 1} . Confirm as the upper position. After the completion of the process of the second confirmation step S107, the process proceeds to the ninth determination step S123 of FIG.

In the third determination step S108, the position-determined signal pad, the position-determination-target signal pad, and the position-determination-target signal pad whose positions on the virtual plane have already been determined two ahead of the position-determination-target signal pad in accordance with the arrangement order previously defined in the design data The position is moved on the column defined by the design data so that the interval is a predetermined distance, and the position after the movement is determined as the position on the virtual plane of the position determination target signal pad. For example, the position determination target signal pad SP _{i + 1} at the position illustrated in FIG. 16A includes the position determined signal pad SP _i−1 and the position determination target signal pad SP _{i + 1 as} illustrated in FIG. 16B. Is moved on column A, which is a column defined by the design data, so that the position after the movement is on the virtual plane of the position determination target signal pad SP _{i + 1} Determined as position.

Next, in the fourth confirmation step S109, the position determination target signal pad whose position on the virtual plane is determined in the third determination step S108 and the position determination target signal pad according to the arrangement order defined in advance by the design data One more than the signal pad to be determined in accordance with the arrangement order defined in advance in the design data so as to be positioned in the middle of the wire of the already determined signal pad whose position on the virtual plane has already been determined two times ahead. The signal pad that has already been positioned on the virtual plane is moved on the column specified by the design data, and the position after the movement is determined according to the arrangement order specified in advance by the design data. As the position on the virtual plane of the signal pad that has already been determined, the position on the virtual plane is already one point ahead of the signal pad Re-constant. For example, the position-determined signal pad SP _{i at} the position shown in FIG. 16B is a position determination target signal pad whose position on the virtual plane is determined in the third determination step S108 as shown in FIG. 16C. It is moved on the row B which is a row defined by the design data so as to be positioned between the wire W1 of the SP _{i + 1} and the wire W2 of the signal pad SP _{i-1 which has been} determined. Is re-determined as the position on the virtual plane of the signal pad SP _i that has been determined. After the completion of the process of the fourth confirmation step S109, the process proceeds to the ninth determination step S123 of FIG.

In the fifth determination step S110 of FIG. 9, the signal pad whose position is to be determined next to the position determination target signal pad in accordance with the arrangement order previously defined by the design data in the second determination step S101 of FIG. This is executed when it is determined that the signal pad belongs to a different column from the design data. In the fifth determination step S110, the signal pad whose position is to be determined next to the position determination target signal pad in accordance with the arrangement order previously defined in the design data is determined as the position determination target signal in accordance with the arrangement order previously defined in the design data. Move on the line defined by the design data so that the distance to the positioned signal pad that has already determined the position on the virtual plane one ahead of the pad has a predetermined distance, and the position after the movement is The position of the signal pad to be determined next to the position determination target signal pad is determined as the position on the virtual plane in accordance with the arrangement order defined in advance by the design data. For example, as shown in FIG. 14B, the signal pad SP _{i + 2} whose position is to be determined next to the position determination target signal pad SP _{i + 1} according to the arrangement order defined in advance in the design data is the position determination target. If it is determined in the second determination step S101 that the signal pad SP _{i + 1} does not belong to the same column because of the design data definition, that is, it belongs to a different column, as shown in FIG. _{i + 2} is that spacing relative position determined signal pad SP _i has a predetermined distance, is moved a B column on a specified column in the design data, the position after the movement, signal pad SP _i It is determined as the position on the ₊₂ virtual plane.

Next, in the second provisional arrangement step S111, the position determination target signal pads are provisionally arranged on the row defined by the design data. When the position of the signal pad SP _{i + 2 on} the virtual plane is determined in the fifth determination step S110 as shown in FIG. 17A, it is defined by the design data as shown in FIG. The position determination target signal pad SP _{i + 1} is provisionally arranged on the A column which is the selected column.

Next, in the sixth determination step S112, the position determination target signal pad wire temporarily arranged in the second temporary arrangement step S111 and one position determination target signal pad in accordance with the arrangement order defined in advance by the design data. It is determined whether or not the interval between the position-determined signal pad that has already determined the position on the virtual plane has a predetermined distance. In the example shown in FIG. 17 (b), the position and determining the target signal pad SP i _{+ 1} of the wire W which has been temporarily arranged in the second provisional placement step S 111, 1 single than positioning target signal pad SP i _{+ 1} It is determined whether or not an interval between the position-determined signal pad SP _i that has already determined the position on the virtual plane has a predetermined distance. The predetermined interval is as described with reference to FIG. If it is determined that the interval has a predetermined distance, the process proceeds to a sixth determination step S113. If it is determined that the interval does not have a predetermined distance, the process proceeds to a third temporary arrangement step S114 in FIG. move on.

In the sixth determination step S113, the position of the position determination target signal pad temporarily arranged in the second temporary arrangement step S111 is determined as the position on the virtual plane of the position determination target signal pad. For example, when the position determination target signal pad SP _{i + 1} is temporarily arranged as shown in FIG. 17B by the second temporary arrangement step S111, this position is the position determination target signal pad SP _{i + 1} . It is determined as a position on the virtual plane. After the completion of the process of the fifth confirmation step S113, the process proceeds to the ninth determination step S123 of FIG.

Each third placement step S114 in FIG. 10 is preliminarily defined by the wire of the position determination target signal pad temporarily placed in the second provisional placement step S111 and the design data in the sixth determination step S112 in FIG. This process is executed when it is determined that the distance between the position-determined signal pad whose position on the virtual plane has already been determined one position ahead of the position-determined signal pad in accordance with the arrangement order is not a predetermined distance. In the third provisional arrangement step S114, a position-determined signal pad having a position on the virtual plane already determined one position ahead of the position-determination signal pad in accordance with the arrangement order defined in advance in the design data, The position determination target signal pad is moved on the row defined by the design data so that the distance between the signal pad wire and the wire of the signal pad has a predetermined distance, and the position after the movement is moved on the virtual plane of the position determination target signal pad. Temporarily arrange as the position. In the example shown in FIG. 17 (c) for example, the position and determining the target signal pad SP i _{+ 1} of the wire W which has been temporarily arranged in the second provisional placement step S111, from the position determination target signal pad SP i _{+ 1} 1 If the distance from the position-determined signal pad SP _i whose position on the virtual plane has already been determined does not have a predetermined distance, the position-determined signal pad SP _i is determined in the third temporary placement step S114. If, so that the wire W of the positioning target signal pad SP i _{+ 1,} the intervals have a predetermined distance, the position determination target signal pad SP i _{+ 1,} moves the upper row defined by the design data, the The position after the movement is temporarily arranged as the position on the virtual plane of the position determination target signal pad SP _{i + 1} .

Next, in the seventh determination step S115, the position determination target signal pad wire temporarily arranged in the third temporary arrangement step S114 and the position next to the position determination target signal pad in accordance with the arrangement order defined in advance by the design data. The signal pad whose position is to be determined next to the position determination target signal pad is defined in the design data according to the arrangement order previously defined in the design data so that the interval between the signal pad and the signal pad to be determined has a predetermined distance. The position after the movement is determined as the position on the virtual plane of the signal pad whose position is to be determined next to the position determination target signal pad according to the arrangement order defined in advance by the design data. For example, as shown in FIG. 18 (a), the wire positioning target signal pad SP i _{+ 1,} and the signal pad SP i _{+ 2} is to be determined following the position of the positioning target signal pad SP i _{+ 1,} the The signal pad SP _{i + 2} is moved on the row B which is a row defined by the design data so that the interval has a predetermined distance, and the position after the movement is moved on the virtual plane of the signal pad SP _{i + 2} The position is fixed.

Next, in the seventh determination step S116, two positions ahead of the position determination target signal pad according to the arrangement order such that they belong to the same column as the position determination target signal pad and are adjacent to the position determination target signal pad. It is determined whether or not there is a positioned signal pad whose position on the virtual plane has already been determined. Positioning the target signal pad SP i _{+ 1} and such as to be adjacent to belong and position determination target signal pad SP i _{+ 1} in the same column A, there is position determined signal pad SP i _{+ 2} shown in FIG. 18 (a) It is determined whether or not. If such a signal pad exists, the process proceeds to an eighth determination step S117, and if not, the process proceeds to an eighth determination step S118 in FIG.

In the eighth determination step S117, the position of the position determination target signal pad temporarily arranged in the third temporary arrangement step S114 is determined as the position on the virtual plane of the position determination target signal pad. For example, when the position determination target signal pad SP _{i + 1} is temporarily arranged at the position shown in FIG. 17C by the third temporary arrangement step S114, the position is the position determination target signal pad SP _{i + 1} . It is determined as a position on the virtual plane. After the completion of the eighth confirmation step S117, the process proceeds to the ninth determination step S123 of FIG.

In the eighth determination step S118 of FIG. 11, the distance between the position-determined signal pad and the position-determined signal pad that have already been determined on the virtual plane two positions ahead of the position-determined signal pad in accordance with the arrangement order. It is determined whether or not has a predetermined distance. For example, in the case shown in FIG. 18A, it is determined whether or not the interval between the position-determined signal pad SP _i-1 and the position determination target signal pad SP _{i + 1} has a predetermined distance. If it has the predetermined interval, the process proceeds to the ninth confirmation step S119, and if not, the process proceeds to the tenth confirmation step S120.

In the ninth determination step S119, the position of the position determination target signal pad temporarily arranged in the third temporary arrangement step S114 of FIG. 10 is determined as the position on the virtual plane of the position determination target signal pad. For example, in the case shown in FIG. 18A, when the interval between the position-determined signal pad SP _i-1 and the position-determination target signal pad SP _{i + 1} has a predetermined distance, this position is designated as the position-determination-target signal. The position of the pad SP _{i + 1} is determined as the position on the virtual plane. After the completion of the process of the ninth determination step S119, the process proceeds to the ninth determination step S123 of FIG.

In the tenth determination step S120, the interval between the position-determined signal pad that has already determined the position on the virtual plane two positions ahead of the position-determination signal pad in accordance with the arrangement order and the position-determination target signal pad is predetermined. The position determination target signal pad is moved on the column defined by the design data so as to have a distance, and the position after the movement is determined as the position on the virtual plane of the position determination target signal pad. For example, when the interval between the position-determined signal pad SP _i-1 and the position determination target signal pad SP _{i + 1} shown in FIG. 18A does not have a predetermined distance, as shown in FIG. The position determination target signal pad SP _{i + 1} is arranged on the line defined by the design data so that the interval between the position determined signal pad SP _i-1 and the position determination target signal pad SP _{i + 1} has a predetermined distance. The position after the movement is determined as the position of the position determination target signal pad SP _{i + 1 on} the virtual plane.

Next, in the eleventh determination step S121, the position determination target signal pad wire whose position on the virtual plane is determined in the tenth determination step S120 and the position determination target signal pad are already two ahead of the position determination target signal pad according to the arrangement order. The position on the virtual plane that has already been determined is one position ahead of the position determination target signal pad in accordance with the arrangement order so that it is positioned in the middle of the wire of the position-determined signal pad that has determined the position on the virtual plane. Positioned signal whose signal pad has been moved on the line defined by the design data, and the position after the movement has already been determined on the virtual plane one position ahead of the position determination target signal pad according to the arrangement order Redefine the position of the pad on the virtual plane. If the position on the virtual plane in Fig. 18 positioning in the position shown in (b) target signal pad SP i _{+ 1} is determined, as shown in FIG. 18 (c), position determined signal pad SP _i is It is moved on the row B, which is a row defined by the design data, so as to be positioned between the wire W1 of the position determination target signal pad SP _{i + 1} and the wire W2 of the position determined signal pad SP _i-1 . the position after the movement, is re-established as the position on the virtual plane position determined signal pad SP _i.

Next, in a twelfth determination step S122, the position determination target signal pad whose position on the virtual plane is determined in the tenth determination step S120 and the position determination target signal pad according to the arrangement order defined in advance by the design data The signal pad whose position is to be determined next to the signal pad to be determined is designed in accordance with the arrangement order previously defined in the design data so that the distance between the signal pad whose position is to be determined next to the signal pad has a predetermined distance. Move on the line specified by the data, and the position after the movement as the position on the virtual plane of the signal pad that should be determined next to the signal pad to be determined according to the arrangement order specified in advance by the design data Determine. When the position of the position-determined signal pad SP _{i on} the virtual plane is re-established at the position shown in FIG. 18C, as shown in FIG. 19, the signal pad SP _{i + 2} It is moved on the row B which is a row defined by the design data so that the distance between the wire W1 of the pad SP _{i + 1} and the signal pad SP _{i + 2} has a predetermined distance. The position of the signal pad SP _{i + 2} is determined as the position on the virtual plane. After the completion of the process of the twelfth determination step S122, the process proceeds to the ninth determination step S123 of FIG.

  With the above processing, the position of the signal pad on the virtual plane is determined. Next, ring pad arrangement processing will be described. It is preliminarily defined by the design data that the ring pad arranged on the ring is arranged between the wires of the signal pad. Thus, there is between two signal pad wires where no ring pads are arranged, or between two signal pad wires arranged one or more. As illustrated in FIG. 20, the position at which the ring pad can be arranged is a ring between the wire W <b> 1 of the signal pad SP <b> 1 and the wire W <b> 2 of the signal pad SP <b> 2 whose position on the virtual plane is determined (C row in the figure). And represented as column D).

  In the embodiment of the present invention, it is necessary to preliminarily define various design data related to the clearance of the ring pad as shown in FIG. Note that the distance from the ring pad is different from the case of the signal pad, and is measured from the center point where the wire is hit on the ring pad as shown in FIG.

  First, as shown in FIG. 21 (a), it is assumed that at least the minimum allowable distance α must be secured between the wire W1 of the signal pad SP and the ring pad RP. One of them is defined in advance.

  Further, as shown in FIG. 21B, it is assumed that at least a minimum allowable interval β must be secured between the wire W2 of the ring pad RP1 and the ring pad RP2. One of them is defined in advance.

  Further, as shown in FIG. 21 (c), it is assumed that at least a minimum allowable interval γ must be secured between the ring pad RP1 and the ring pad RP2, and this minimum allowable interval γ is set as one of design data. As previously defined.

  As described above, after the minimum allowable intervals α, β, and γ are set in advance, the signal pad placement processing in the embodiment of the present invention is executed.

  First, in the ninth determination step S123 in FIG. 12, the first determination step S104 or the thirteenth determination step S105 in FIG. 7, the second determination step S107 in FIG. 8 or the fourth determination step S109 in FIG. Two signals whose positions on the virtual plane are determined by any one of the sixth determination step S113, the eighth determination step S117 in FIG. 10, and the ninth determination step S119 or the twelfth determination step S122 in FIG. It is determined whether there is a ring pad whose position on the virtual plane is to be determined between the wires of the pad.

  In the ninth determination step S123, when it is determined that there is no ring pad whose position on the virtual plane is to be determined between the wires of the two signal pads, the ring pad arrangement process is terminated. Thereafter, the signal pad whose position on the virtual plane is to be determined is changed from the (i + 1) th signal pad to the (i + 2) th signal pad, and the signal from the first determination step S100 in FIG. The pad placement process is executed again.

  If it is determined in the ninth determination step S123 that there is one ring pad whose position on the virtual plane should be determined between the wires of the two signal pads, the process proceeds to a fourteenth determination step S124. In the fourteenth determination step S124, an intermediate position between the wires of the two signal pads is determined as a position on the virtual plane of the ring pad. This completes the ring pad placement process. Thereafter, the signal pad whose position on the virtual plane is to be determined is changed from the (i + 1) th signal pad to the (i + 2) th signal pad, and the signal from the first determination step S100 in FIG. The pad placement process is executed again.

If it is determined in the ninth determination step S123 that there are a plurality of ring pads whose positions on the virtual plane should be determined between the wires of the two signal pads, the process proceeds to a tenth determination step S125. In this tenth determination step S125, at least the minimum signal pad wire interval (hereinafter referred to as “L _min ”) among the signal pad wire intervals, which is the interval between the wires of the two signal pads in the ring of one or more stages. 2) the minimum allowable distance α between the wire and the ring pad of the signal pad specified by the design data, and the minimum allowable distance β of the wire and the ring pad of the ring pad specified by the design data, It is determined whether or not it is larger than the specified interval “2α + β” that is the sum of the two. Here, in the tenth determination step S125, at least the minimum signal pad wire interval L _min among the signal pad wire intervals in one or more stages of rings is used in the determination process. if only can be ensured space to place a ring pad on a ring with a spacing L _min, the well between the two signals pad wire in the ring other than the ring having a minimum signal pads wire spacing L _min, the ring pad This is because there should be enough area to place them.

The designated interval “2α + β” is a designated interval when two ring pads whose positions on the virtual plane are to be determined exist as an example between two signal pad wires. For example, as shown in FIG. 22, consider a case where there are two ring pads RP1 and RP2 whose positions on the virtual plane are to be determined between the wire W1 of the signal pad SP1 and the wire W2 of the signal pad SP2. Here, it is assumed that the ring pad RP1 is supposed to exist on the ring of the C row and the ring pad RP2 is supposed to exist on the ring of the D row. As shown, at least “α + β + α” between the wire W1 of the signal pad SP1 and the wire W2 of the signal pad SP2 in the ring of the D row where the wire W3 of the ring pad RP1 and the ring pad RP2 exist. If the distance is not secured, the ring pads RP1 and RP2 cannot be passed during this time. Therefore, in the embodiment of the present invention, the subsequent processing is executed by dividing the case depending on whether or not the minimum signal pad wire interval L _min is larger than the specified interval “2α + β”.

In this way, the specified interval uses the parameters α, β and / or γ depending on the number of ring pads to be determined on the virtual plane existing between the wires of the two signal pads. Is determined. For example, between the wire W1 of the signal pad SP1 and the wire W2 of the signal pad SP2, there are three ring pads whose positions on the virtual plane are to be determined, two of which are on the same ring, and the remaining When one exists on another ring, if a distance of at least “α + β + γ + α” is not secured between the wire W1 of the signal pad SP1 and the wire W2 of the signal pad SP2, the ring pads RP1 and RP2 are interposed between them. Cannot pass through. Therefore, in this case, the subsequent processing is executed by dividing the case depending on whether or not the minimum signal pad wire interval L _min is larger than the specified interval “2α + β + γ”.

If it is determined in the tenth determination step S125 that the minimum signal pad wire interval L _min is greater than the specified interval “2α + β”, a fifteenth determination step S126 is executed.

In the fifteenth determination step S126, the minimum signal pad wire interval L _min is proportionally calculated using the values of the minimum allowable interval α, the minimum allowable interval β, and the specified interval “2α + β”. Determine the position of the pad on the virtual plane. More specifically, by performing this proportional distribution calculation processing, the distance from one of the two signal pad wires is calculated for each ring pad, and each ring is calculated based on the calculation result. Determine the position of the pad on the virtual plane. The proportional distribution is calculated in this way because the electrical characteristics are better when the ring pads are evenly arranged between the wires of the two signal pads. For example, in the example shown in FIG. 22, the ring pad RP1 has a position on the virtual plane where the wire S3 of the ring pad RP1 is separated from the wire W1 of the signal pad SP1 by a distance “L _min × (α / (2α + β))”. The position of the ring pad RP2 is such that the distance from the wire W1 of the signal pad SP1 by the distance “L _min × ((α + β) / (2α + β))” (in other words, the distance “L _min × ( The position of the ring pad RP1 that is separated from the wire W3 by “β / (2α + β))” is determined as the position on the virtual plane. This completes the ring pad placement process. Thereafter, the signal pad whose position on the virtual plane is to be determined is changed from the (i + 1) th signal pad to the (i + 2) th signal pad, and the signal from the first determination step S100 in FIG. The pad placement process is executed again.

If it is determined in the tenth determination step S125 that the minimum signal pad wire interval L _min is smaller than the specified interval “2α + β”, a sixteenth determination step S127 is executed. In the sixteenth determination step S127, the values of the minimum allowable interval α, the minimum allowable interval β, and the minimum allowable interval γ are used as a reference for one of the two signal pad wires. The position on the virtual plane of each ring pad from is sequentially determined.

  Next, in the seventeenth determination step S128, the ring located farthest from one of the two signal pad wires among the ring pads whose positions on the virtual plane are determined in the sixteenth determination step S127. The first confirmation step S104 or thirteenth confirmation step S105 in FIG. 7 adjacent to the pad and the farthest ring pad, the second confirmation step S107 or the fourth confirmation step S109 in FIG. The signal pad whose position on the virtual plane is determined by any one of the sixth determination step S113, the eighth determination step S117 of FIG. 10, the ninth determination step S119 of FIG. 11, or the twelfth determination step S122 of FIG. The position of the signal pad on the virtual plane is confirmed so that the distance between Again. For the signal pad that has been re-established in the 17th determination step S128, the process returns to the eighth determination step S118 in FIG. 11 and the placement process is executed again.

  FIG. 23 is a diagram showing the arrangement of signal pads and ring pads on a virtual plane corresponding to the substrate surface of the semiconductor package created by the bonding pad arrangement method according to the embodiment of the present invention. FIG. 23 and 24 show the bonding pad processing according to the embodiment of the present invention based on the design data similar to the design data used in FIGS. 26 and 27 according to the prior art. As shown in FIGS. 23 and 24, according to the embodiment of the present invention, the signal pads and the ring pads can be arranged on the substrate surface of the semiconductor package more uniformly than in the case of the prior art shown in FIGS. I understand that.

  The above-described bonding pad arrangement processing according to the embodiment of the present invention is realized using an arithmetic processing device such as a computer or a CAD system. FIG. 25 is a system configuration diagram for explaining the operation on the computer of the computer program for executing the bonding pad arrangement processing according to the present invention stored in the recording medium.

  A computer program for causing a computer to execute the bonding pad arrangement processing according to the present invention is stored in a recording medium (external recording medium such as a flexible disk or a CD-ROM) 10 as shown in FIG. It is installed in a computer having a configuration as described and operates as a CAD system.

  The CPU 11 controls the entire bonding pad arrangement process. A ROM 13, a RAM 14, an HD (hard disk device) 15, an input device 16 such as a mouse and a keyboard, an external recording medium drive device 17, and a display device 18 such as an LCD and a CRT are connected to the CPU 11 via a bus 12. A control program for the CPU 11 is stored in the ROM 13.

  A computer program (bonding pad placement processing program) for executing the bonding pad placement processing is installed (stored) in the HD 15 from the recording medium 10. The RAM 14 has a work area when the CPU 11 executes the bonding pad arrangement process and an area for storing a part of a computer program for executing the bonding pad arrangement process. The HD 15 stores input data, final data, OS (operating system), and the like in advance.

  First, when the computer is turned on, the CPU 11 reads the control program from the ROM 10 and further reads the OS from the HD 15 to start the OS. As a result, the computer is ready to install the bonding pad arrangement processing program from the recording medium 10.

  Next, the recording medium 10 is mounted on the external recording medium drive device 17, a control command is input from the input device 16 to the CPU 11, and a bonding pad arrangement processing program stored in the recording medium 10 is read and stored in the HD 15 or the like. That is, the bonding pad arrangement processing program is installed in the computer.

  Thereafter, the bonding pad arrangement processing program according to the present invention operates on the computer in accordance with an instruction from the operator. The result of the bonding pad arrangement process may be recorded in a predetermined data format. This data is data for combining bonding pads that can be combined to synthesize one bonding pad and placing it on the substrate. For example, it is stored in the HD 15 so that it can be used when necessary. Alternatively, it may be used for visually displaying the processing result on the display device 18.

  In the computer of FIG. 25, the bonding pad arrangement processing program stored in the recording medium 10 is installed in the HD 15. However, the present invention is not limited to this, and is installed in the computer via an information transmission medium such as a LAN. Alternatively, it may be stored in advance in the HD 15 built in the computer.

  First, when the computer is turned on, the CPU 111 reads a control program from the ROM 110, further reads an OS from the HD 115, and starts the OS. As a result, the computer is ready to install the automatic wiring determination processing program from the storage medium 110.

  Next, the storage medium 110 is mounted on the external storage medium drive device 117, a control command is input from the input device 116 to the CPU 111, and the automatic wiring determination processing program stored in the storage medium 110 is read and stored in the HD 115 or the like. That is, the automatic wiring determination processing program is installed in the computer.

  Thereafter, when the automatic wiring determination processing program is started, the computer operates as an automatic wiring determination device. The operator can execute the automatic wiring determination process described above by operating the input device 116 in accordance with the interactive work content and procedure displayed on the display device 118. The “data relating to the optimal route of wiring” obtained as a result of the processing is stored in the HD 115 so that it can be used later, or is used for visually displaying the processing result on the display device 118. Also good.

  In the computer of FIG. 25, the program stored in the storage medium 110 is installed in the HD 115. However, the present invention is not limited to this, and the program may be installed in the computer via an information transmission medium such as a LAN. It may be installed in advance in the HD 115 built in the computer.

  The present invention can be applied to design of arrangement positions of signal pads and ring pads on a substrate surface of a semiconductor package. ADVANTAGE OF THE INVENTION According to this invention, the design which arrange | positions a signal pad and a ring pad uniformly on the board | substrate surface of a semiconductor package can be automated using an arithmetic processing unit.

3 is a flowchart showing a basic operation of a bonding pad arrangement method according to the present invention. In the Example of this invention, it is a figure explaining the space | interval of the signal pad prescribed | regulated beforehand as one of the design data, and the wire of the signal pad adjacent to this signal pad. In the Example of this invention, it is a figure explaining the space | interval of the ring pads previously prescribed | regulated as one of the design data. In the Example of this invention, it is a figure explaining the space | interval of the wire and ring pad of a signal pad prescribed | regulated previously as one of the design data. It is a figure explaining arrangement | positioning of the 1st signal pad in the Example of this invention. FIG. 6 is an enlarged view of FIG. 5. It is a flowchart (the 1) which shows the specific operation | movement of the bonding pad arrangement | positioning method by the Example of this invention. It is a flowchart (the 2) which shows the specific operation | movement of the bonding pad arrangement | positioning method by the Example of this invention. It is a flowchart (the 3) which shows the specific operation | movement of the bonding pad arrangement | positioning method by the Example of this invention. It is a flowchart (the 4) which shows the specific operation | movement of the bonding pad arrangement | positioning method by the Example of this invention. It is a flowchart (the 5) which shows the specific operation | movement of the bonding pad arrangement | positioning method by the Example of this invention. It is a flowchart (the 6) which shows the specific operation | movement of the bonding pad arrangement | positioning method by the Example of this invention. It is a figure which shows the specific example (the 1) of arrangement | positioning of the signal pad and ring pad based on the bonding pad arrangement | positioning method by the Example of this invention. It is a figure which shows the specific example (the 2) of arrangement | positioning of the signal pad and ring pad based on the bonding pad arrangement | positioning method by the Example of this invention. It is a figure which shows the specific example (the 3) of arrangement | positioning of the signal pad and ring pad based on the bonding pad arrangement | positioning method by the Example of this invention. It is a figure which shows the specific example (the 4) of arrangement | positioning of the signal pad and ring pad based on the bonding pad arrangement | positioning method by the Example of this invention. It is a figure which shows the specific example (the 5) of arrangement | positioning of the signal pad and ring pad based on the bonding pad arrangement | positioning method by the Example of this invention. It is a figure which shows the specific example (the 6) of arrangement | positioning of the signal pad and ring pad based on the bonding pad arrangement | positioning method by the Example of this invention. It is a figure which shows the specific example (the 7) of arrangement | positioning of the signal pad and ring pad based on the bonding pad arrangement | positioning method by the Example of this invention. It is a figure which shows the specific example (the 8) of arrangement | positioning of the signal pad and ring pad based on the bonding pad arrangement | positioning method by the Example of this invention. It is a figure which shows the specific example (the 9) of arrangement | positioning of the signal pad and ring pad based on the bonding pad arrangement | positioning method by the Example of this invention. It is a figure which shows the specific example (the 10) of arrangement | positioning of the signal pad and ring pad based on the bonding pad arrangement | positioning method by the Example of this invention. It is a figure which shows arrangement | positioning of the signal pad and ring pad on the virtual plane equivalent to the board | substrate surface of the semiconductor package produced by the bonding pad arrangement | positioning method by the Example of this invention. It is an enlarged view of FIG. It is a system configuration figure explaining operation on a computer of a computer program for performing bonding pad arrangement processing by the present invention stored in a recording medium. It is a figure which illustrates the signal pad and ring pad which were arrange | positioned on the virtual plane corresponded on the board | substrate surface of a semiconductor package with a CAD system. It is an enlarged view of FIG. It is FIG. (1) explaining the arrangement | positioning process of the signal pad by a prior art. It is FIG. (2) explaining the arrangement | positioning process of the signal pad by a prior art. It is a figure which illustrates the case where the adjacent signal pad cross | intersects as a result of the arrangement | positioning process of the signal pad by a prior art.

Explanation of symbols

10 recording medium 11 CPU
12 bus 13 ROM
14 RAM
15 Hard Disk Device 16 Input Device 17 External Storage Medium Drive Device 18 Display Device

Claims (16)

A bonding pad placement method for executing placement processing for designing a position of a signal pad or ring pad, which is a bonding pad on a substrate surface of a semiconductor package, on a virtual plane corresponding to the substrate surface by an arithmetic processing unit, In the bonding pad arrangement method for sequentially determining the positions on the virtual plane of the signal pads and ring pads whose arrangement order and columns to be arranged are defined in advance by design data in the arrangement order,
A position-determined signal pad whose position on the virtual plane should be determined is a first position-determined signal pad whose position on the virtual plane has already been determined one ahead of the position-determined signal pad according to the arrangement order; Is a first determination step for determining whether or not they belong to different columns in accordance with the definition of the design data;
A determination step of determining a position of the position determination target signal pad on a virtual plane based on a determination result of the first determination step;
A bonding pad arrangement method comprising: The determining step includes
When it is determined in the first determination step that the position determination target signal pad belongs to a different column, a signal pad whose position is to be determined next to the position determination target signal pad according to the arrangement order is the position determination A second determination step for determining whether or not the target signal pad and the design data belong to the same column according to the specification;
When it is determined in the second determination step that it belongs to the same column as the position determination target signal pad, a distance between the first position determined signal pad and the wire of the position determination target signal pad is a predetermined distance. A first provisional placement step of provisionally placing the position determination target signal pads on the columns defined by the design data,
The position determination target signal according to the arrangement order, which belongs to the same column as defined in the design data and is adjacent to the position determination target signal pad, which is provisionally arranged in the first temporary arrangement step. A third determination step of determining whether there is a second position-determined signal pad that has already determined a position on the virtual plane two ahead of the pad;
When it is determined in the third determination step that the second position-determined signal pad does not exist, the position temporarily arranged in the first temporary arrangement step is determined as a virtual plane of the position determination target signal pad. A first confirmation step for confirming as the upper position;
The bonding pad arrangement | positioning method of Claim 1 provided with. When it is determined in the third determination step that the second position determined signal pad exists, an interval between the second position determined signal pad and the position determination target signal pad has a predetermined distance. A fourth determination step for determining whether or not
When it is determined in the fourth determination step that the predetermined distance is included, the position temporarily arranged in the first temporary arrangement step is determined as the position on the virtual plane of the position determination target signal pad. A second confirmation step;
The bonding pad arrangement | positioning method of Claim 3 provided with these. Designed so that the interval between the second position-determined signal pad and the position determination target signal pad has a predetermined distance when it is determined that the predetermined distance is not included in the fourth determination step. A third determination step of moving on a line defined by data and determining the position after the movement as a position on a virtual plane of the position determination target signal pad;
The first position determination so as to be positioned between the wire of the position determination target signal pad whose position on the virtual plane is determined in the third determination step and the wire of the second position determined signal pad. A fourth determination step of moving the completed signal pad on the column defined by the design data and re-establishing the position after the movement as the position on the virtual plane of the first position-determined signal pad;
The bonding pad arrangement method according to claim 2, further comprising: When it is determined in the second determination step that the signal pad belongs to a different column from the position determination target signal pad, a signal pad whose position is to be determined next to the position determination target signal pad according to the arrangement order is determined. The position on the signal pad whose position is to be determined next is moved on the column defined by the design data so that the interval with respect to one positioned signal pad has a predetermined distance. A fifth confirmation step for confirming the position;
A second provisional arrangement step of provisionally arranging the position determination target signal pads on a row defined by design data;
A sixth determination step for determining whether or not a distance between the wire of the position determination target signal pad temporarily arranged in the second temporary arrangement step and the first position determined signal pad has a predetermined distance. When,
When it is determined in the sixth determination step that the predetermined distance is provided, the position temporarily arranged in the second temporary arrangement step is determined as the position on the virtual plane of the position determination target signal pad. A sixth confirmation step;
The bonding pad arrangement method according to claim 2, further comprising: When it is determined that the predetermined distance is not included in the sixth determination step, an interval between the first position-determined signal pad and the wire of the position determination target signal pad has a predetermined distance. A third temporary placement step of moving the position determination target signal pad on a row defined by design data and temporarily placing the position after the movement as a position on a virtual plane of the position determination target signal pad; ,
The next position is determined so that a distance between the wire of the position determination target signal pad temporarily arranged in the third temporary arrangement step and the signal pad whose position is to be determined next has a predetermined distance. A seventh determination step of moving the signal pad to be moved on the column defined by the design data and determining the position after the movement as the position on the virtual plane of the signal pad to be determined next;
The position determination target signal pad and the position determination target signal pad that belong to the same column and are adjacent to the position determination target signal pad are already on the virtual plane two ahead of the position determination target signal pad according to the arrangement order. A seventh determination step for determining whether or not the second position-determined signal pad whose position has been determined exists;
When it is determined in the seventh determination step that the second position-determined signal pad does not exist, the position temporarily arranged in the third temporary arrangement step is determined as a virtual plane of the position determination target signal pad. An eighth confirmation step to confirm as the upper position;
The bonding pad arrangement | positioning method of Claim 5 provided with these. When it is determined in the seventh determination step that the second position determined signal pad exists, an interval between the second position determined signal pad and the position determination target signal pad has a predetermined distance. An eighth determination step for determining whether or not
When it is determined in the eighth determination step that the predetermined distance is included, the position temporarily arranged in the third temporary arrangement step is determined as the position on the virtual plane of the position determination target signal pad. A ninth confirmation step;
The bonding pad arrangement method according to claim 6. When it is determined in the eighth determination step that the predetermined distance is not included, the interval between the second position-determined signal pad and the position determination target signal pad is set to have a predetermined distance. A tenth determining step of moving the position determination target signal pad on a column defined by the design data and determining the position after the movement as a position on a virtual plane of the position determination target signal pad;
The first position determination is performed so as to be positioned between the wire of the position determination target signal pad whose position on the virtual plane is determined in the tenth determination step and the wire of the second position determined signal pad. An eleventh determining step of moving the completed signal pad on the column defined by the design data and re-determining the position after the movement as the position on the virtual plane of the first positioned signal pad;
The next step is performed so that an interval between the wire of the position determination target signal pad whose position on the virtual plane is determined by the tenth determination step and the signal pad whose position is to be determined next has a predetermined distance. The signal pad whose position is to be determined is moved on the column defined by the design data, and the position after the movement is determined as the position on the virtual plane of the signal pad whose position is to be determined next. A confirmation step;
The bonding pad arrangement | positioning method of Claim 7 provided with. The determining step includes
When it is determined in the first determination step that the position determination target signal pad belongs to the same column, an interval between the position determination target signal pad and the first position determined signal pad has a predetermined distance. The bonding pad arrangement method according to claim 1, further comprising a thirteenth determination step of determining a position of the position determination target signal pad on a virtual plane on a row defined by design data.   Between the wires of two signal pads whose positions on the virtual plane are determined by any one of the first, second, fourth, sixth, eighth, ninth, twelfth and thirteenth determination steps, The bonding pad arrangement method according to any one of claims 4, 8 and 9, further comprising a ninth determination step of determining whether or not there is a ring pad whose position on the plane is to be determined.   In the ninth determination step, when it is determined that one ring pad whose position on the virtual plane is to be determined exists between the wires of the two signal pads, the intermediate between the wires of the two signal pads is determined. The bonding pad arrangement method according to claim 10, further comprising a fourteenth determining step for determining the position of the ring pad as a position of the ring pad on a virtual plane.   In the ninth determination step, when it is determined that there are a plurality of ring pads whose positions on the virtual plane are to be determined between the wires of the two signal pads, the two stages in the one-stage or multi-stage ring A first minimum allowable interval in which at least a minimum signal pad wire interval is a minimum allowable interval between a signal pad wire and a ring pad defined in the design data, among signal pad wire intervals, which is an interval between signal pad wires. 10th to determine whether or not it is larger than the specified interval that is the sum of the second minimum allowable interval that is the minimum allowable interval between the wire and the ring pad of the ring pad defined by the design data. The bonding pad arrangement method according to claim 11, further comprising:   When it is determined in the tenth determination step that the minimum signal pad wire interval is larger than the specified interval, the minimum signal pad wire interval is set to the first minimum allowable interval and the second minimum interval. The bonding pad arrangement according to claim 12, further comprising a fifteenth determination step of determining a position of each ring pad on a virtual plane by performing a proportional distribution calculation using each value of an allowable interval and the specified interval. Method.   The fifteenth determining step calculates the distance from one of the wires of the two signal pads for each of the ring pads by performing the proportional distribution calculation, and based on the calculation result The bonding pad placement method according to claim 13, wherein a position of each ring pad on a virtual plane is determined. When it is determined in the tenth determination step that the minimum signal pad wire interval is smaller than the specified interval, the first minimum allowable interval, the second minimum allowable interval, and design data are used. The position of each ring pad on the virtual plane from one of the wires of the two signal pads is determined using each value of the third minimum allowable interval, which is the minimum allowable interval between the ring pads. A sixteenth confirmation step to confirm;
Of the ring pads whose positions on the virtual plane have been determined by the sixteenth determination step, the ring pad positioned farthest from one of the wires of the two signal pads, and the farthest position A signal pad whose position on the virtual plane is determined by any of the first, second, fourth, sixth, eighth, ninth, twelfth and thirteenth determination steps adjacent to the ring pad to be A seventeenth determination step for re-determining the position of the signal pad on the virtual plane so that the interval of
The bonding pad arrangement method according to claim 12, further comprising:   By executing the process of the eighth determination step for the signal pad obtained by re-determining the position on the virtual plane by the seventeenth determination step, the seventeenth determination step performs the process on the virtual plane. The bonding pad arrangement method according to claim 15, wherein the position on the virtual plane of the signal pad obtained by re-determining the position is further re-determined.

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