JP2008304470A - Magnetic sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a magnetic sensor which can be miniaturized to achieve enhancement in property of production and assembly. <P>SOLUTION: In this sensor, magneto-sensing sections 3a, 3b for detecting external magnetic field are wedged between ferrite chips 4a/4b and ferrite substrates 2a/2b, respectively. These magneto-sensing sections 3a, 3b are arranged on magnetic substrate 1 at a regular distance from each other through the ferrite substrates 2a/2b. For example, hall element can be used as these magneto-sensing sections 3a, 3b. By obtaining sum and difference of outputs from the magneto-sensing sections 3a, 3b, magnetic flux density of perpendicular and horizontal directions to the magneto-sensing surface can be calculated. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a magnetic sensor, and is particularly suitable for application to an azimuth sensor that detects the azimuth of magnetic field lines due to geomagnetism.

Some conventional three-dimensional magnetic sensors constitute three-dimensional azimuth sensors by arranging three fluxgate sensors so as to be orthogonal to each other.
Here, the fluxgate sensor is widely used because of its excellent stability in terms of its operation principle and high magnetic field detection sensitivity of about 10 ⁻⁸ to 10 ⁻⁷ mT.

However, since the fluxgate sensor has a structure including an annular magnetic core, an excitation winding that is wound around the magnetic core and applies a magnetic field, and a detection winding that detects the magnetic flux density of the magnetic core, the shape is a lump. .
For this reason, when a three-dimensional magnetic sensor is configured using a fluxgate sensor, there is a problem that the apparatus becomes large and the fluxgate sensor needs to be arranged three-dimensionally and requires skill in assembly.
Accordingly, an object of the present invention is to provide a magnetic sensor that can be miniaturized and can improve productivity and assembly.

  In order to solve the above-described problem, according to the magnetic sensor according to claim 1, each of the magnetic body having a flat plate shape and the magnetic body are disposed in the vicinity of the end of the magnetic body, and Two or more magnetically sensitive portions that are two-dimensionally spaced apart by a predetermined interval, and each of the magnetically sensitive portions detects a magnetic flux in a direction perpendicular to the plane of the magnetic body, and It is characterized by detecting two- or three-dimensional magnetism comprising magnetism in a direction perpendicular to the plane of the magnetic material and magnetism in a direction horizontal to the plane of the magnetic material.

According to the magnetic sensor of claim 2, the magnetic sensor has three or more magnetic sensing parts, and any three of the magnetic sensing parts are arranged at the apex of a triangle, and the plane of the magnetic body The magnetism is detected in a three-dimensional direction consisting of magnetism in a direction perpendicular to the plane and magnetism in a direction horizontal to the plane of the magnetic body.
As a result, even when two or more magnetic sensing portions that detect magnetic flux in the direction perpendicular to the plane of the magnetic body are arranged on the same plane of the magnetic body, the magnetism in the direction perpendicular to the plane of the magnetic body It is possible to detect magnetism in a two- or three-dimensional direction consisting of the magnetism in the direction horizontal to the plane of the magnetic material.

For this reason, even when detecting two-dimensional or three-dimensional external magnetism composed of magnetism in a direction perpendicular to the plane of the magnetic material and magnetism in a direction horizontal to the plane of the magnetic material, the shape is lump Therefore, it is possible to reduce the size of the two-dimensional or three-dimensional magnetic sensor, and it is possible to improve the productivity and the assemblability and to reduce the cost.
Note that the vicinity of the end of the magnetic body is a position slightly inside from the end of the magnetic body, and a magnetic flux that is extremely concentrated at the end of the magnetic body is directly detected by the magnetic sensing section. This is a position where it is possible to avoid variations in sensitivity.

The magnetic sensor according to claim 3 is characterized in that the magnetic body has a substantially rectangular flat plate shape, and the magnetic sensing portions are arranged at four corners of the magnetic body.
As a result, it is possible to symmetrically arrange the four magnetic sensing portions on the same surface of the magnetic body while suppressing an increase in the size of the magnetic body, and the differential output of the two magnetic sensing portions arranged diagonally can be obtained. Since the rotation angle can be obtained by calculating, it is possible to reduce the size and cost of the three-dimensional magnetic sensor.

The magnetic sensor according to claim 4 is characterized in that a magnetic flux converging chip is disposed on the opposite side of the magnetic body with the magnetic sensing portions interposed therebetween.
As a result, the magnetic flux parallel to the magnetic sensitive surface inside the magnetic body can be efficiently converged to the magnetic flux converging chip side, and the external magnetism oriented parallel to the magnetic sensitive surface can be efficiently converted to the vertical direction. It is possible to detect by converting to.

The magnetic sensor according to claim 5 is characterized in that the magnetic body is a magnetic lead frame, a magnetic substrate, or a magnetic printed wiring board.
As a result, the signal processing chip can be disposed on the magnetic body on which the magnetic sensing portion is disposed, and further integration of the two- or three-dimensional magnetic sensor is enabled. Can be reduced in size and cost.

According to another aspect of the magnetic sensor of the present invention, the signal processing chip disposed in the center of the region formed by connecting the magnetic sensing portions, the magnetic sensing portion and the signal processing are formed on the magnetic body. And a wiring layer for connecting the chip.
As a result, it is possible to detect the magnetism in the two- or three-dimensional directions by arranging the magnetic sensing portion and the signal processing chip on the same surface, and form a wiring layer on the same surface, and each magnetic sensitivity It is possible to efficiently connect the signal processing chip and the signal processing chip, and it is possible to reduce the cost of the two- or three-dimensional magnetic sensor while improving the productivity and assembly.

  According to the present invention, even when two or more magnetic sensing portions for detecting magnetic flux in the direction perpendicular to the plane of the magnetic body are arranged on the same plane of the magnetic body, the perpendicular to the plane of the magnetic body is provided. It is possible to detect two- or three-dimensional magnetism consisting of direction magnetism and magnetism in a direction horizontal to the plane of the magnetic body, and the size of the magnetic sensor can be reduced and the size can be reduced. At the same time, it is possible to improve productivity and assemblability and to reduce costs.

Hereinafter, a magnetic sensor according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view showing a schematic configuration of the magnetic sensor according to the first embodiment of the present invention.
In FIG. 1, the magnetic sensor is provided with magnetic sensing parts 3a and 3b for detecting an external magnetic field, and the magnetic sensing parts 3a and 3b are sandwiched between ferrite chips 4a and 4b, which are magnetic bodies, and ferrite substrates 2a and 2b, respectively. It is.

These magnetic sensitive portions 3a and 3b are arranged on the magnetic substrate 1 with a predetermined interval therebetween via the ferrite substrates 2a and 2b, and the magnetism converged on the magnetic substrate 1 can penetrate the magnetic sensitive portions 3a and 3b. It is configured as follows.
Here, as the magnetic sensitive portions 3a and 3b, for example, a Hall element utilizing the Hall effect can be used, and InSb or the like can be used as the material.

In addition, as the magnetic substrate 1, various magnetic materials such as ferrite, iron, and permalloy can be used, and a magnetic lead frame may be used.
The ferrite chips 4a and 4b and the ferrite substrates 2a and 2b increase the magnetism converged on the magnetic sensitive portions 3a and 3b, and the ferrite chips 4a and 4b and the ferrite substrates 2a and 2b are not necessarily used. The magnetic sensitive parts 3a and 3b may be formed directly on the magnetic substrate 1.

The perpendicular component of the external magnetic field with respect to the magnetic sensitive surface passes through the magnetic sensitive portions 3a and 3b via the ferrite chips 4a and 4b and the ferrite substrates 2a and 2b. Can be obtained.
On the other hand, the parallel component of the external magnetic field with respect to the magnetic sensitive surface is bent in the vertical direction at both ends of the magnetic substrate 1, and penetrates the magnetic sensitive portions 3a and 3b via the ferrite chips 4a and 4b and the ferrite substrates 2a and 2b. And from the magnetic sensing parts 3a and 3b, it is possible to obtain magnetic sensing part electric outputs having the same absolute value and opposite signs.

Thereby, by taking the sum and difference of the outputs from the magnetic sensing parts 3a and 3b, the magnetic flux density in the direction perpendicular to and parallel to the magnetic sensing surface can be calculated, and the magnetic sensing parts 3a and 3b are identical. Even when arranged on a plane, two-dimensional external magnetism can be detected.
2A shows a magnetic simulation result when the geomagnetism is perpendicular to the magnetic sensor of FIG. 1, and FIG. 2B shows the geomagnetism parallel to the magnetic sensor of FIG. It is a figure which shows the magnetic simulation result in the case of facing.

Here, in the magnetic field simulation of FIG. 2, the finite element analysis method was used to calculate the magnetic flux density in the vertical direction in the magnetic sensitive portions 3a and 3b.
As the magnetic sensing parts 3a and 3b, Hall elements manufactured by Asahi Kasei Microdevices Corporation, HW-105A (trade name), were used, and the distance between the centers of the Hall elements was set to about 3 mm. Further, isotropic ferrite having a relative magnetic permeability of 8000 was used as the magnetic substrate 1.

In FIG. 2A, when there is geomagnetism perpendicular to the magnetosensitive surface, the magnetic flux incident on the magnetic substrate 1 enters the ferrite substrates 2a and 2b and exits from the ferrite chips 4a and 4b. For this reason, the magnetic flux converged by the magnetic substrate 1 and the ferrite substrates 2a and 2b penetrates the magnetic sensitive portions 3a and 3b vertically, and the magnetic flux density applied to the magnetic sensitive portions 3a and 3b becomes equal.
For this reason, a value twice the longitudinal magnetic flux density can be obtained by taking the sum of the outputs of the magnetic sensing units 3a and 3b.

For example, when -0.03 mT of geomagnetism is perpendicularly incident on the magnetic substrate 1, a magnetic flux of -0.058 mT can be detected by each of the magnetic sensing portions 3a and 3b.
On the other hand, in FIG. 2B, when there is geomagnetism parallel to the magnetic sensitive surface, the magnetic flux incident on the magnetic substrate 1 is converged by the magnetic substrate 1, and the magnetic flux incident on the magnetic substrate 1 at the end of the magnetic substrate. Is bent vertically.

The magnetic flux bent in the vertical direction by the magnetic substrate 1 is further converged by the ferrite chips 4a and 4b and the ferrite substrates 2a and 2b, and the magnetic flux is transferred from the ferrite chip 4a to the ferrite substrate 2a or from the ferrite substrate 2b to the ferrite chip 4b. Penetrates. For this reason, the magnetic flux converged by the magnetic substrate 1 vertically penetrates the magnetic sensitive portions 3a and 3b, and the magnetic flux density applied to the magnetic sensitive portions 3a and 3b has different signs and equal absolute values.
For this reason, a value twice as large as the parallel direction magnetic flux density can be obtained by taking the difference between the outputs of the magnetic sensing parts 3a and 3b.
For example, when −0.03 mT of geomagnetism is incident on the magnetic substrate 1 in parallel, −0.042 mT of magnetic flux can be detected by the magnetic sensing unit 3a, and 0.042 mT of magnetic flux can be detected by the magnetic sensing unit 3b. Can be detected.

FIG. 3 is a diagram showing a magnetic simulation result when the length of the magnetic substrate is changed in the case where the geomagnetism is oriented in a direction parallel to the magnetic sensor.
In FIG. 3A, Hall elements H1a and H1b are arranged on the magnetic substrate 11 with an interval of 0.8 mm.
When an external magnetic field of 0.03 mT is parallel to the magnetic substrate 11, a magnetic flux of −0.028 mT penetrates through the Hall element H 1 a and a magnetic flux of 0.028 mT penetrates through the Hall element H 1 b. .
For this reason, by arranging the Hall elements H1a and H1b symmetrically on the magnetic substrate 11 with a distance of 0.8 mm, the parallel external magnetic field can be converted into a vertical external magnetic field.

In FIG. 3B, Hall elements H2a and H2b are arranged on the magnetic substrate 12 with an interval of 1.6 mm.
When an external magnetic field of 0.03 mT is parallel to the magnetic substrate 12, a magnetic flux of −0.040 mT penetrates through the Hall element H2a, and a magnetic flux of 0.040 mT penetrates through the Hall element H2b. .
For this reason, by arranging the Hall elements H2a and H2b symmetrically on the magnetic substrate 12 with a distance of 1.6 mm, a parallel external magnetic field can be converted into a vertical external magnetic field, and an amplification effect can be obtained.

In FIG. 3C, Hall elements H3a and H3b are arranged on the magnetic substrate 13 with a spacing of 2.4 mm.
When an external magnetic field of 0.03 mT is parallel to the magnetic substrate 13, a magnetic flux of −0.048 mT penetrates the Hall element H3a, and a magnetic flux of 0.048 mT penetrates the Hall element H3b. .
Therefore, by arranging the Hall elements H3a and H3b symmetrically on the magnetic substrate 13 with a distance of 2.4 mm, a parallel external magnetic field can be converted into a vertical external magnetic field, and a larger amplification effect can be obtained.

As a result, when the Hall elements are arranged on the same substrate, it is possible to improve the sensitivity by arranging them as far as possible. From the viewpoint of improving the sensitivity, the Hall elements can be arranged at the end of the magnetic substrate. preferable.
However, if the Hall element is arranged at the end of the magnetic substrate, the magnetic flux that is extremely concentrated at the end of the magnetic body is directly detected by the Hall element, and if the positional relationship between the end of the magnetic body and the Hall element slightly deviates in manufacturing, the magnetic sensor Sensitivity of will vary.
For this reason, when the Hall element is disposed on the magnetic substrate, it is preferable that the Hall element is disposed slightly inside from the end of the magnetic substrate from the viewpoint of reducing variation in sensitivity.

FIG. 4 is a plan view showing a schematic configuration of a three-dimensional magnetic sensor according to the second embodiment of the present invention.
In FIG. 4, the magnetic lead frame is provided with a die pad DP and lead terminals R1 to R12.
Hall elements H11 to H14 are arranged at the four corners of the die pad DP, and a signal processing chip IC1 is arranged at the center of the die pad DP.
The signal processing chip IC1 is wire-bonded to the drive terminals and output terminals of the respective Hall elements by using the wire WB1, and is wire-bonded to the lead terminals R2 to R11.

The lead terminals R2 to R11 can be used as, for example, a power supply terminal, a ground terminal, a digital interface terminal × 4, a clock terminal, a reset terminal, and a spare terminal × 2.
Further, the die pad DP on which the Hall elements H11 to H14 and the signal processing chip IC1 are arranged and the inner lead portions of the lead terminals R1 to R12 are sealed with the mold resin MP.

The vertical component of the external magnetic field with respect to the lead frame surface passes through the Hall elements H11 to H14 via the die pad DP, and the magnetic sensor electrical outputs having the same absolute value and sign are obtained from the Hall elements H11 to H14. Can do.
On the other hand, the parallel component of the external magnetic field with respect to the lead frame surface is converged by the die pad DP, bent in the vertical direction at the end of the die pad DP, and penetrates the Hall elements H11 to H14.

Therefore, when the detected magnetic field B is deviated by an angle θ from the direction connecting the diagonally arranged Hall elements H12 and H13, the difference between the Hall elements H12 and H13 is an output proportional to B · cos θ, and the Hall element H11 As the difference of H14, an output proportional to B · sin θ can be obtained.
As a result, the three-dimensional magnetism can be measured by calculating the addition output of the four Hall elements H11 to H14 and the difference output of the two Hall elements H11 to H14 arranged diagonally. .

  Therefore, by arranging the Hall elements H11 to H14 on the same die pad DP, it becomes possible to measure three-dimensional magnetism, and the signal processing chip IC1 can be enclosed in the same mold resin MP. It is possible to reduce the size and weight of the 3D magnetic sensor, and to improve productivity and assemblability, thereby reducing costs. For various applications such as in-vehicle compass and portable navigation system It is possible to respond conveniently.

Here, in the Hall elements H11 to H14, the output in a low magnetic field such as geomagnetism is small, but the offset voltage is canceled and the output is amplified by using the signal processing chip IC1 to output at a practical level. Can be obtained.
As a method for canceling the offset voltage, for example, 90 ° chopper driving or 360 ° chopper driving can be used.

FIG. 5A is a plan view showing a schematic configuration of a three-dimensional magnetic sensor according to the third embodiment of the present invention, and FIG. 5B is a schematic diagram of the three-dimensional magnetic sensor according to the third embodiment of the present invention. It is sectional drawing which shows a structure.
In FIG. 5, magnetic sensitive portions 22 a to 22 d are arranged at the four corners of the magnetic substrate 21, and the signal processing chip IC <b> 2 is arranged at the center of the magnetic substrate 21. Here, for example, a ferrite substrate can be used as the magnetic substrate 21, and InSb can be used as the magnetic sensitive portions 22a to 22d.

Further, pads P1 to P8 for external output are formed at both ends on the magnetic substrate 21, and on the magnetic substrate 21, between the signal processing chip IC2 and the magnetic sensitive portions 22a to 22d and the signal processing chip. A wiring H1 for connecting between the IC2 and the pads P1 to P8 is provided.
Here, when the signal processing chip IC2 is arranged on the magnetic substrate 21, the signal processing chip IC2 may be arranged face down so as to be flip-chip connected to the wiring H1, or the signal processing chip IC2 may be face up. May be arranged so as to be wire-bonded to the wiring H1.

Furthermore, magnetic convergence chips 23a to 23d are arranged at the four corners of the magnetic substrate 21 on which the magnetic sensitive parts 22a to 22d are arranged. Here, as the magnetic focusing chips 23a to 23d, for example, ferrite chips can be used.
And the perpendicular | vertical component of the external magnetic field with respect to the magnetic board | substrate 21 can be obtained from each magnetic sensing part 22a-22d as a magnetic sensing part electric output with the same absolute value and code | symbol.

On the other hand, the parallel component of the external magnetic field with respect to the magnetic substrate 21 is converged by the magnetic substrate 21, bent by the magnetic substrate 21, and further converged by the magnetic focusing chips 23 a to 23 d, and penetrates the magnetic sensitive portions 22 a to 22 d.
Therefore, when the detected magnetic field B is deviated by an angle θ from the direction connecting the magnetically sensitive parts 22b and 22c arranged diagonally, the output proportional to B · cos θ and the As a difference between the magnetic parts 22a and 22d, an output proportional to B · sin θ can be obtained.

FIG. 6 is a plan view showing the operation of the three-dimensional magnetic sensor of FIG.
In FIG. 6, when the detected magnetic field B is deviated by an angle θ from the diagonal line connecting the magnetic sensing part 22b and the magnetic sensing part 22c, the difference between the diagonally arranged magnetic sensing part 22b and the magnetic sensing part 22c is expressed as B · cos θ. An output proportional to B · sin θ can be obtained as a difference between the magnetically sensitive portions 22a and 22d arranged diagonally.
As a result, it is possible to measure the three-dimensional magnetism by arranging the magnetic sensitive portions 22a to 22d on the same magnetic substrate 21, and the signal processing chip IC2 is also mounted on the same magnetic substrate 21, The wiring H1 connecting the magnetic sensitive portions 22a to 22d and the signal processing chip IC2 can be formed on the magnetic substrate 21, and the three-dimensional magnetic sensor can be reduced in size, and the productivity and assemblability can be improved. This makes it possible to reduce costs.

FIG. 7 is a cross-sectional view showing a manufacturing process of the three-dimensional magnetic sensor according to the third embodiment of the present invention.
In FIG. 7A, an InSb film is formed on the ferrite substrate 31 by, for example, transfer, vapor deposition, or sputtering.
Then, by using the lithography technique and the etching technique, the InSb film is patterned to form the magnetic sensitive parts 32 a and 32 b on the ferrite substrate 31.
Next, as shown in FIG. 7B, a conductive layer such as Cu or Al is formed on the ferrite substrate 31 by, for example, plating, sputtering, or vapor deposition.
Then, the wiring layer H2 is formed on the ferrite substrate 31 by patterning the conductive layer using the lithography technique and the etching technique.

FIG. 8 is a plan view showing the configuration of the three-dimensional magnetic sensor in the manufacturing stage of FIG.
In FIG. 8, the ferrite substrate 31 is divided into sections corresponding to the individual three-dimensional magnetic sensors, and the magnetic sensing portions 32 are arranged at the four corners of each divided area, and external outputs are provided at both ends of each divided area. The pad P11a is formed.
A wiring H2 is formed from each magnetic sensing portion 32 and the pad P11a toward the center of each partition region, and a pad P11b for flip-chip connection of the signal processing chip IC3 is formed at the tip of each wiring H2. Has been.
Next, in FIG. 7C, the signal processing chip IC3 provided with the bumps BP1 is disposed between the magnetic sensitive portions 32a and 32b, and is flip-chip connected to the wiring layer H2 formed on the ferrite substrate 31.

FIG. 9 is a plan view showing the configuration of the three-dimensional magnetic sensor in the manufacturing stage of FIG.
In FIG. 9, the signal processing chip IC3 is arranged for each partition region on the ferrite substrate 31 so that the bump BP1 provided on the signal processing chip IC3 corresponds to the position of the pad P11b.
Next, in FIG. 7D, magnetic focusing ferrite chips 33a and 33b are arranged on the magnetic sensitive portions 32a and 32b.

FIG. 10 is a plan view showing the configuration of the three-dimensional magnetic sensor in the manufacturing stage of FIG.
In FIG. 10, the ferrite chip 33 is disposed on the ferrite substrate 31 so as to straddle the magnetic sensitive parts 32 of the four partitioned regions adjacent to each other.
Then, the ferrite substrate 31 is cut along the dicing lines D1 to D5.
As a result, a plurality of three-dimensional magnetic sensors formed on one ferrite substrate 31 can be separated into individual chips, and one ferrite chip 33 can be divided into four parts. The number of arrangements can be reduced to almost ¼, and the assembly process of the three-dimensional magnetic sensor can be shortened.

FIG. 11A is a plan view showing a schematic configuration of the three-dimensional magnetic sensor according to the fourth embodiment of the present invention, and FIG. 11B is a schematic of the three-dimensional magnetic sensor according to the fourth embodiment of the present invention. It is sectional drawing which shows a structure.
In FIG. 11, an amorphous metal layer 42 and an insulating layer 43 are sequentially formed on an insulating substrate 41, and magnetic sensitive portions 44 a to 44 d are disposed at four corners of the insulating substrate 41, respectively. In the center of 41, a signal processing chip IC4 is arranged. Here, as the insulating substrate 41, for example, a ceramic substrate or a glass epoxy substrate can be used, and as the magnetic sensitive portions 44a to 44d, InSb can be used, and the thickness of the amorphous metal layer 42 is, for example, It can be set to 20-30 μm.

Further, external output pads P21 to P28 are formed at both ends on the insulating substrate 41, and between the signal processing chip IC4 and the magnetic sensing portions 44a to 44d and signals on the insulating substrate 41. A wiring H3 for connecting the processing chip IC4 and the pads P21 to P28, respectively, is provided.
Further, the signal processing chip IC4 arranged at the center of the insulating substrate 41 is wire-bonded to the wiring H3 by using the wire WB2.

And the perpendicular | vertical component of the external magnetic field with respect to the insulating substrate 41 penetrates the magnetic sensing parts 44a-44d through the amorphous metal layer 42, and from each magnetic sensing part 44a-44d, the absolute value and the magnetic sensing part where a code | symbol is equal. Electrical output can be obtained.
On the other hand, the parallel component of the external magnetic field with respect to the insulating substrate 41 is converged by the amorphous metal layer 42, bent by the amorphous metal layer 42, and penetrates the magnetic sensitive portions 44 a to 44 d.
Therefore, when the detected magnetic field B is deviated by an angle θ from the direction connecting the magnetically sensitive parts 44b and 44c arranged diagonally, the output proportional to B · cos θ and the As a difference between the magnetic parts 44a and 44d, an output proportional to B · sin θ can be obtained.

As a result, even when the sheet-like amorphous metal layer 42 is used, it is possible to arrange the magnetic sensitive portions 44a to 44d on the same plane, while reducing the influence of the hysteresis of the magnetic material and the magnetization offset, It is possible to reduce the size of the three-dimensional magnetic sensor.
Further, the signal processing chip IC4 is also mounted on the same insulating substrate 41, and the wiring H3 between the magnetic sensitive portions 44a to 44d and the signal processing chip IC4 can be formed on the insulating substrate 41. It is possible to reduce the maintenance work while reducing the size and cost of the sensor.

FIG. 12 is a cross-sectional view showing a manufacturing process of the three-dimensional magnetic sensor according to the fourth embodiment of the present invention.
In FIG. 12A, for example, an amorphous metal foil is attached to form an amorphous metal layer 52 on the ceramic substrate 51, and an insulating layer 53 is formed on the amorphous metal layer 52 by CVD or the like.
Next, as shown in FIG. 12B, an InSb film is formed on the insulating layer 53 by, for example, transfer, vapor deposition, or sputtering.

Then, by using the lithography technique and the etching technique, the InSb film is patterned to form the magnetic sensitive parts 54a and 54b on the ceramic substrate 51.
Next, as shown in FIG. 12C, a conductive layer such as Cu or Al is formed on the insulating layer 53 on which the magnetically sensitive portions 54a and 54b are disposed, for example, by plating, sputtering, or vapor deposition.
Then, the wiring layer H4 is formed on the insulating layer 53 by patterning the conductive layer using a lithography technique and an etching technique.

FIG. 13 is a plan view showing the configuration of the three-dimensional magnetic sensor in the manufacturing stage of FIG.
In FIG. 13, the ceramic substrate 51 is partitioned corresponding to each three-dimensional magnetic sensor, and the magnetic sensitive parts 54 are arranged at the four corners of each partitioned region via the amorphous metal layer 52 and the insulating layer 53. External output pads P31a are formed at both ends of each partition region.
And from each magnetic sensing part 54 and pad P31a, wiring H4 is formed toward the center of each division area, and pad P31b for wire-bonding signal processing chip IC5 is formed in the tip of each wiring H4. Has been.
Next, in FIG. 12D, the signal processing chip IC5 is disposed between the magnetic sensing portions 54a and 54b, and the wire WB is used to wire-connect the wiring layer H4 formed on the ceramic substrate 51. .

FIG. 14 is a plan view showing the configuration of the three-dimensional magnetic sensor in the manufacturing stage of FIG.
In FIG. 14, the signal processing chip IC <b> 5 is arranged for each partition region on the ceramic substrate 51. Then, by cutting the ceramic substrate 51 along the dicing lines D11 to D14, a plurality of three-dimensional magnetic sensors formed on one ceramic substrate 51 are separated into individual chips.

FIG. 15A is a plan view showing a schematic configuration of the three-dimensional magnetic sensor according to the fifth embodiment of the present invention, and FIG. 15B is a schematic of the three-dimensional magnetic sensor according to the fifth embodiment of the present invention. It is sectional drawing which shows a structure.
In FIG. 15, magnetic sensitive parts 62 a to 62 d are arranged at the four corners on the insulating substrate 61, respectively, and the signal processing chip IC 6 and the magnetic sensitive parts 62 a to 62 d are provided on the insulating substrate 61. A wiring H5 to be connected to each other is provided.
In addition, an amorphous metal layer 64 is attached to the insulating substrate 61 on which the magnetic sensitive portions 62 a to 62 d are disposed via an adhesive layer 63.
Further, the signal processing chip IC 6 is disposed on the back surface of the insulating substrate 61, and the through hole TH 1 that connects the front surface and the back surface of the insulating substrate 61 is formed in the insulating substrate 61.

Here, as the insulating substrate 61, for example, a ceramic substrate or a glass epoxy substrate can be used, and as the magnetic sensitive parts 62a to 62d, InSb can be used, and the thickness of the amorphous metal layer 64 is, for example, It can be set to 20-30 μm.
Further, the signal processing chip IC6 arranged on the back surface of the insulating substrate 61 is connected to the wiring H5 by flip chip connection or wire bond connection.

And the perpendicular | vertical component of the external magnetic field with respect to the insulating substrate 61 penetrates the magnetic sensitive parts 62a-62d through the amorphous metal layer 64, and each magnetic sensitive part 62a-62d has a magnetic sensitive part with the same absolute value and code | symbol. Electrical output can be obtained.
On the other hand, the parallel component of the external magnetic field with respect to the insulating substrate 61 is converged by the amorphous metal layer 64, bent by the amorphous metal layer 64, and penetrates the magnetic sensitive parts 62 a to 62 d.
Therefore, when the detected magnetic field B is deviated by an angle θ from the direction connecting the magnetically sensitive parts 62b and 62c arranged diagonally, the difference between the magnetically sensitive parts 62b and 42c is an output proportional to B · cos θ, and the As a difference between the magnetic parts 62a and 62d, an output proportional to B · sin θ can be obtained.

As a result, even when the sheet-like amorphous metal layer 64 is used, it is possible to arrange the magnetic sensitive portions 62a to 62d on the same plane, while reducing the influence of hysteresis and magnetization offset of the magnetic body, It becomes possible to measure three-dimensional magnetism.
Further, the signal processing chip I6 is also mounted on the same insulating substrate 61, so that the wiring H5 between the magnetic sensitive portions 62a to 62d and the signal processing chip IC6 can be formed on the insulating substrate 61, and three-dimensional magnetic The sensor can be reduced in size and cost, and maintenance work can be reduced.

FIG. 16 is a cross-sectional view showing a manufacturing process of the three-dimensional magnetic sensor according to the fifth embodiment of the invention.
In FIG. 16A, an InSb film is formed on the ceramic substrate 71 by, for example, transfer, vapor deposition, or sputtering.
Then, by using the lithography technique and the etching technique, the InSb film is patterned to form the magnetic sensitive parts 72a and 72b on the ceramic substrate 71.
Next, as shown in FIG. 16B, through holes TH1 are formed in the ceramic substrate 71, and a conductive layer such as Cu is formed on both surfaces of the ceramic substrate 71 and the side walls of the through holes TH1, for example, by plating.
Then, the wiring layer H5 is formed on the ceramic substrate 71 by patterning the conductive layer using a lithography technique and an etching technique.

FIG. 17 is a plan view showing the configuration of the three-dimensional magnetic sensor in the manufacturing stage 16 (b), and FIG. 18 (a) is a plan view showing the configuration when FIG. 17 (b) is viewed from the back.
In FIG. 17A, the ceramic substrate 71 is partitioned corresponding to each three-dimensional magnetic sensor, and the magnetic sensing portions 72 are arranged at the four corners of each partitioned region. A wiring H5 is formed on the ceramic substrate 71 toward the center of the partition region.

17B and 18A, the ceramic substrate 71 is formed with through holes TH1 for connecting both surfaces of the ceramic substrate 71, and both sides of the ceramic substrate 71 are formed on the sidewalls of the through hole TH1. Is formed.
Next, in FIG. 16C, the amorphous metal layer 74 is formed on the ceramic substrate 71 by, for example, attaching an amorphous metal foil on the ceramic substrate 71 via the adhesive layer 73.
Next, as shown in FIG. 16D, the signal processing chip IC7 provided with the bumps BP2 is disposed on the back surface of the ceramic substrate 71, and is flip-chip connected to the wiring layer H5 formed on the ceramic substrate 71.

FIG. 18B is a plan view showing the configuration of the three-dimensional magnetic sensor in the manufacturing stage of FIG.
In FIG. 18B, the signal processing chip IC 7 is disposed on the back surface of the ceramic substrate 71 so as to correspond to each partitioned region on the ceramic substrate 71.
Next, in FIG. 16E, the ceramic substrate 71 on which the signal processing chip IC7 is arranged is arranged on the die pad 81a of the lead frame so that the signal processing chip IC7 faces upward. Then, by using the wire WB4, the pad connected to the external output terminal of the signal processing chip IC7 is wire-bonded to the lead terminal of the lead frame.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea of the present invention.
For example, in the above-described embodiment, an InSb-based Hall element has been described as an example, but other compound semiconductor Hall elements such as InAs and GaAs may be used.
As the magnetic sensing part, various magnetic sensing parts such as those utilizing the magnetoresistive effect can be applied in addition to those utilizing the Hall effect.

It is sectional drawing which shows schematic structure of the magnetic sensor which concerns on 1st Embodiment of this invention. 2A shows a magnetic simulation result when the geomagnetism is perpendicular to the magnetic sensor of FIG. 1, and FIG. 2B shows the geomagnetism parallel to the magnetic sensor of FIG. It is a figure which shows the magnetic simulation result in the case of facing. It is a figure which shows the magnetic simulation result when changing the length of the magnetic board | substrate in case the geomagnetism has faced the parallel direction with respect to the magnetic sensor. It is a top view which shows schematic structure of the three-dimensional magnetic sensor which concerns on 2nd Embodiment of this invention. FIG. 5A is a plan view showing a schematic configuration of a three-dimensional magnetic sensor according to the third embodiment of the present invention, and FIG. 5B is a schematic diagram of the three-dimensional magnetic sensor according to the third embodiment of the present invention. It is sectional drawing which shows a structure. It is a top view which shows operation | movement of the three-dimensional magnetic sensor of FIG. It is sectional drawing which shows the manufacturing process of the three-dimensional magnetic sensor which concerns on 3rd Embodiment of this invention. It is a top view which shows the structure of the three-dimensional magnetic sensor in the manufacture stage of FIG.7 (b). It is a top view which shows the structure of the three-dimensional magnetic sensor in the manufacture stage of FIG.7 (c). It is a top view which shows the structure of the three-dimensional magnetic sensor in the manufacture stage of FIG.7 (d). FIG. 11A is a plan view showing a schematic configuration of the three-dimensional magnetic sensor according to the fourth embodiment of the present invention, and FIG. 11B is a schematic of the three-dimensional magnetic sensor according to the fourth embodiment of the present invention. It is sectional drawing which shows a structure. It is sectional drawing which shows the manufacturing process of the three-dimensional magnetic sensor which concerns on 4th Embodiment of this invention. It is a top view which shows the structure of the three-dimensional magnetic sensor in the manufacture stage of FIG.12 (c). It is a top view which shows the structure of the three-dimensional magnetic sensor in the manufacture stage of FIG.12 (d). FIG. 15A is a plan view showing a schematic configuration of the three-dimensional magnetic sensor according to the fifth embodiment of the present invention, and FIG. 15B is a schematic of the three-dimensional magnetic sensor according to the fifth embodiment of the present invention. It is sectional drawing which shows a structure. It is sectional drawing which shows the manufacturing process of the three-dimensional magnetic sensor which concerns on 5th Embodiment of this invention. It is a top view which shows the structure of the three-dimensional magnetic sensor in the manufacture stage of FIG.16 (b). 18A is a plan view showing the configuration when FIG. 17B is viewed from the back side, and FIG. 18B is a plan view showing the configuration of the three-dimensional magnetic sensor in the manufacturing stage of FIG. 16D. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 11-13, 21 Magnetic substrate 31 Ferrite substrate 41, 61 Insulating substrate 51, 71 Ceramic substrate 2a, 2b, 4a, 4b, 23a-23d, 33a, 33b Magnetic convergence chip | tip 3a, 3b, 22a-22d, 32a , 32b, 44a to 44d, 54a, 54b, 62a, 62b, 62 Magnetosensitive part H1a, H1b, H2a to H2c, H3a to H3d, H11 to H14 Hall element IC1 to IC8 Signal processing chip R1 to R12, 81b, 81c Lead Terminal DP, 81a Die pad WB1-WB4 Wire H1-H5 Wiring P1-P8, P11a, P11b, P21-P28, P31a, P31b Pad BP1, BP2 Bump 42, 52, 64, 74 Amorphous metal layer 43, 53 Insulating layer D1- D5, D11-D14 dicing line TH1 Through hole 63 Adhesive layer

Claims (6)

An integrally molded magnetic body having a flat plate shape;
Two or more magnetic sensitive portions arranged two-dimensionally on the magnetic material and arranged in the vicinity of the end of the magnetic material and spaced apart by a predetermined distance,
Each of the magnetic sensing portions detects a magnetic flux in a direction perpendicular to the plane of the magnetic body,
A magnetic sensor for detecting magnetism in a two- or three-dimensional direction comprising magnetism in a direction perpendicular to the plane of the magnetic body and magnetism in a direction horizontal to the plane of the magnetic body. There are three or more magnetic sensing portions, and any three magnetic sensing portions are arranged at positions that are the apexes of a triangle,
2. The magnetic sensor according to claim 1, wherein the magnetic sensor detects a three-dimensional magnetism comprising a magnetism in a direction perpendicular to the plane of the magnetic body and a magnetism in a direction horizontal to the plane of the magnetic body. .   The magnetic sensor according to claim 1, wherein the magnetic body has a substantially rectangular flat plate shape, and the magnetic sensitive portions are arranged at four corners of the magnetic body.   The magnetic sensor according to any one of claims 1 to 3, wherein a magnetic flux converging chip is disposed on the opposite side of the magnetic body with the magnetic sensing portions interposed therebetween.   The magnetic sensor according to claim 1, wherein the magnetic body is a magnetic lead frame, a magnetic substrate, or a magnetic printed wiring board. A signal processing chip disposed in the center of the region formed by connecting the magnetic sensing parts;
6. The magnetic sensor according to claim 1, further comprising: a wiring layer formed on the magnetic body and connecting the magnetically sensitive portion and the signal processing chip.

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