JP2008290189A - Polishing machine - Google Patents

Polishing machine Download PDF

Info

Publication number
JP2008290189A
JP2008290189A JP2007138169A JP2007138169A JP2008290189A JP 2008290189 A JP2008290189 A JP 2008290189A JP 2007138169 A JP2007138169 A JP 2007138169A JP 2007138169 A JP2007138169 A JP 2007138169A JP 2008290189 A JP2008290189 A JP 2008290189A
Authority
JP
Japan
Prior art keywords
polishing
glass substrate
plate
film
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007138169A
Other languages
Japanese (ja)
Inventor
Tatsuyuki Suzuki
龍之 鈴木
Akio Mogi
昭男 茂木
Hajime Konoue
肇 鴻上
Tadao Konno
忠雄 今野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Techno Corp
Original Assignee
Mitsubishi Materials Techno Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Techno Corp filed Critical Mitsubishi Materials Techno Corp
Priority to JP2007138169A priority Critical patent/JP2008290189A/en
Publication of JP2008290189A publication Critical patent/JP2008290189A/en
Withdrawn legal-status Critical Current

Links

Images

Landscapes

  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing machine capable of polishing and removing only abnormal projections without damaging a film in a normal thickness with a polishing sheet in contact with the surface of a glass substrate. <P>SOLUTION: In this polishing machine, the film 200 on the surface of the glass substrate W is polished by the polishing sheet 23 by pressing a polishing plate 20 with the polishing sheet 23 stuck on the polishing surface plate face 20a, onto the surface of the glass substrate W formed with the film 200 and in-plane moving the polishing plate 20 in relation to the glass substrate W. The polishing sheet 23 includes: a polishing layer 26 composed of abrasive grains 27 and binder resin; and resin coating layers 24 integrally formed at least on the surface on the side of the polishing layer 26 in contact with the glass substrate W. The abrasive grains are projected from the side of the polishing layer 26. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、例えば、液晶表示装置用カラーフィルタ等のガラス基板に形成された着色膜を研磨するための研磨機に関するものである。   The present invention relates to a polishing machine for polishing a colored film formed on a glass substrate such as a color filter for a liquid crystal display device.

上記したカラーフィルタの着色層の研磨機として、例えば、特許文献1が提案されている。
この研磨機は、静止した角形のガラス基板(カラーフィルタ)の着色層が形成された面上に、その長辺の長さがガラス基板の短辺よりも長い角形の研磨プレートをガラス基板の短辺と平行に配置し、研磨プレートでガラス基板面を押圧しながら、研磨プレートにガラス基板の垂直方向を軸とした偏心回転をさせて研磨プレートをガラス基板の短辺方向に揺動させ、研磨プレートをガラス基板の長辺方向に移動させてカラーフィルタ表面を研磨するというものである。
この研磨機によれば、従来のオスカータイプの研磨機に比べて、ガラス基板の全面を均一に研磨できる利点が得られる。
For example, Patent Document 1 has been proposed as a polishing machine for the colored layer of the color filter described above.
In this polishing machine, a rectangular polishing plate whose long side is longer than the short side of the glass substrate is placed on the surface of the stationary square glass substrate (color filter) on which the colored layer is formed. Placed parallel to the side, while pressing the glass substrate surface with the polishing plate, the polishing plate is rotated eccentrically around the vertical direction of the glass substrate to swing the polishing plate in the short side direction of the glass substrate and polish The color filter surface is polished by moving the plate in the long side direction of the glass substrate.
According to this polishing machine, an advantage that the entire surface of the glass substrate can be uniformly polished is obtained as compared with a conventional Oscar type polishing machine.

ところで、液晶パネル用カラーフィルタCFは、図8に示しように、フラットなガラス基板Wの表面にブラックマトリックスBMを形成し、その上に着色膜(RGB膜)を形成した構造を有するが、製造工程においてこの着色膜に異物が混入すると、RGB膜に異常突起300が発生することがある。この異常突起300の高さS2は、図8に示すように、一般的に通常の突起を含むRGB膜厚S1の高さが1.5〜2.0μmであるのに対し、10〜40μm程と極めて大きいものであり、このような異常突起300が発生すると、製造工程においてパネルの貼り合わせに支障を来し、表示不良の要因となる。   By the way, the color filter CF for a liquid crystal panel has a structure in which a black matrix BM is formed on the surface of a flat glass substrate W and a colored film (RGB film) is formed thereon as shown in FIG. If foreign matters are mixed in the colored film in the process, abnormal projections 300 may be generated on the RGB film. As shown in FIG. 8, the height S2 of the abnormal protrusion 300 is generally about 10 to 40 μm while the RGB film thickness S1 including the normal protrusion is generally 1.5 to 2.0 μm. If such an abnormal protrusion 300 is generated, the panel is stuck in the manufacturing process, which causes a display defect.

ところが、従来の研磨機は、このような異常突起を除去するには不向きであった。これは、従来の研磨機は全面研磨用であるため、異常突起のみを研磨しようとしても正常な膜厚部分までが削られてしまう虞があるからである。   However, conventional polishing machines are not suitable for removing such abnormal protrusions. This is because a conventional polishing machine is for entire surface polishing, and even if only abnormal protrusions are to be polished, there is a risk that even a normal film thickness portion may be removed.

そこで、本出願人は、先に出願した特願2007−84946号において、研磨プレートの研磨定盤面に、研磨プレートをガラス基板に表面に押圧させた時に、ガラス基板の表面に研磨シートより先に当接して押圧力に応じて潰れ変形する弾性体で成るクリアランス調整用パッドを設けることにより、ガラス基板の表面と研磨シートとのクリアランを最適に保持するようにした研磨機を提案している。
このクリアランス調整用パッドを設けることにより、研磨の際、ガラス基板の表面の膜上に存在する異常突起だけに研磨シートが接触し、正常厚さの膜に対して非接触となるようにできるため、正常な膜厚を減らさずに異常突起だけを研磨・除去することが可能となる。
尚、このような異常突起の研磨には、ダイヤモンド砥粒やアルミナ砥粒が埋め込まれた研削力に優れる固定砥粒研磨シートが使用されている。
Therefore, in the previously filed Japanese Patent Application No. 2007-84946, the present applicant, when the polishing plate is pressed against the glass substrate against the polishing platen surface of the polishing plate, the surface of the glass substrate precedes the polishing sheet. There has been proposed a polishing machine that optimally holds the clear run between the surface of the glass substrate and the polishing sheet by providing a clearance adjustment pad made of an elastic body that abuts and deforms in response to the pressing force.
By providing this clearance adjustment pad, the polishing sheet can be brought into contact with only abnormal projections existing on the film on the surface of the glass substrate during polishing, and can be brought into non-contact with a film having a normal thickness. It is possible to polish and remove only abnormal protrusions without reducing the normal film thickness.
For polishing such abnormal protrusions, a fixed abrasive polishing sheet having excellent grinding force embedded with diamond abrasive grains or alumina abrasive grains is used.

しかしながら、クリアランス調整用パッドによる研磨には、以下のような問題点が残されていた。
すなわち、クリアランス調整用パッドは弾性体で構成されているため、その変形量が研磨毎に一定でなく、よって、研磨シートの表面と異常突起間のクリアランスを常に一定に保持することが難しく、且つ、クリアランス調整用パッドの厚みもロット毎にばらつくため、パッド交換毎に研磨条件の設定(例えば、研磨圧力の調整による最適クリアランスの確保)が必要であり、研磨再現性が低いという問題である。
また、特にダイヤモンド砥粒は、砥粒硬度が高く、且つ、粒子径も大きいことから、ガラス基板の表面と研磨シートとのクリアランスが小さくなり過ぎると、ガラス基板面の正常厚さの膜面に研磨シートの表面より突出した砥粒が接触して研磨傷が発生する。
特開2004−195602号公報
However, the following problems remain in the polishing with the clearance adjustment pad.
That is, since the clearance adjustment pad is made of an elastic body, the amount of deformation is not constant for each polishing, and thus it is difficult to always keep the clearance between the surface of the polishing sheet and the abnormal protrusion constant, and Further, since the thickness of the clearance adjusting pad varies from lot to lot, it is necessary to set polishing conditions (for example, to secure an optimum clearance by adjusting the polishing pressure) every time the pad is replaced, and this is a problem that polishing reproducibility is low.
In particular, diamond abrasive grains have a high abrasive hardness and a large particle diameter. Therefore, if the clearance between the surface of the glass substrate and the polishing sheet becomes too small, the normal thickness of the glass substrate surface is reduced. Abrasive grains protruding from the surface of the polishing sheet come into contact with each other to cause polishing scratches.
JP 2004-195602 A

本発明は、上記事情に鑑み成されたもので、ガラス基板の表面に研磨シートを接触させた状態で、正常厚さの膜を傷つけずに異常突起だけを研磨・除去することができる研磨機を提供することを目的としている。   The present invention has been made in view of the above circumstances, and is a polishing machine capable of polishing and removing only abnormal protrusions without damaging a film having a normal thickness in a state where a polishing sheet is in contact with the surface of a glass substrate. The purpose is to provide.

すなわち、請求項1に記載の研磨機は、膜が形成されたガラス基板の表面に、研磨定盤面に研磨シートを貼り付けた研磨プレートを押圧させつつ、該研磨プレートを前記ガラス基板に対して面内移動させることで、前記ガラス基板の表面の膜を前記研磨シートで研磨する研磨機において、前記研磨シートは、砥粒とバインダー樹脂とで成る研磨層と、少なくとも前記研磨層の前記ガラス基板に接触する側の面に一体形成された樹脂被膜層とを有し、且つ、前記研磨層の側面より前記砥粒が突出していることを特徴としている。   That is, the polishing machine according to claim 1 is configured such that the polishing plate is pressed against the glass substrate while pressing the polishing plate with the polishing sheet attached to the surface of the polishing platen on the surface of the glass substrate on which the film is formed. In the polishing machine that polishes the film on the surface of the glass substrate with the polishing sheet by moving in-plane, the polishing sheet comprises a polishing layer composed of abrasive grains and a binder resin, and at least the glass substrate of the polishing layer And a resin coating layer integrally formed on the surface in contact with the surface, and the abrasive grains protrude from the side surface of the polishing layer.

また、請求項2に記載の発明は、請求項1に記載の研磨機において、前記樹脂被膜層が前記バインダー樹脂より成ることを特徴としている。   According to a second aspect of the present invention, in the polishing machine according to the first aspect, the resin coating layer is made of the binder resin.

また、請求項3に記載の発明は、請求項1または請求項2に記載の研磨機において、前記樹脂被膜層の厚さが3〜5μmであることを特徴としている。   The invention according to claim 3 is the polishing machine according to claim 1 or 2, wherein the thickness of the resin coating layer is 3 to 5 μm.

また、請求項4に記載の発明は、請求項1から請求項3までの何れかに記載の研磨機において、前記ガラス基板をその面方向に沿って搬送する搬送経路の下側に、前記ガラス基板が載る下定盤を配置し、この下定盤の上方に、搬送されてきた前記ガラス基板の上側の表面を研磨するための研磨ヘッドを設け、この研磨ヘッドの本体に、前記研磨シートを下に向けて、上定盤としての前記研磨プレートを上下方向移動自在に設けると共に、前記研磨ヘッドの本体と前記研磨プレートとの間に、前記研磨プレートをガラス基板に押圧させ、且つその押圧力を調整する押圧調整機構を設け、さらに、前記研磨ヘッドを、前記ガラス基板の搬送方向と直交する面内方向の運動成分を少なくとも含むようにオービタル運動させる駆動機構を設けたことを特徴としている。   According to a fourth aspect of the present invention, there is provided the polishing machine according to any one of the first to third aspects, wherein the glass is disposed below the conveyance path for conveying the glass substrate along the surface direction. A lower surface plate on which the substrate is placed is disposed, and a polishing head for polishing the upper surface of the glass substrate that has been conveyed is provided above the lower surface plate, and the polishing sheet is placed below the main body of the polishing head. The polishing plate as an upper surface plate is provided so as to be movable in the vertical direction, and the polishing plate is pressed against the glass substrate between the main body of the polishing head and the polishing plate, and the pressing force is adjusted. And a drive mechanism for orbitally moving the polishing head so as to include at least a movement component in an in-plane direction orthogonal to the conveyance direction of the glass substrate. It is a symptom.

また、請求項5に記載の発明は、請求項1から請求項4までの何れかに記載の研磨機において、前記ガラス基板は、ディスプレイパネルのカラーフィルタであり、前記膜は、RGBの着色膜であることを特徴としている。   According to a fifth aspect of the present invention, in the polishing machine according to any one of the first to fourth aspects, the glass substrate is a color filter of a display panel, and the film is an RGB colored film. It is characterized by being.

請求項1の発明によれば、研磨シートの研磨層のガラス基板に接触する面にバインダー樹脂より成る樹脂被膜層を形成し、研磨シートの側面からのみ砥粒を突出させるように構成したので、ガラス基板との接触面においては、研磨層の砥粒が樹脂被覆層により被覆されており、ガラス基板側へ突出していないため、研磨の際に研磨シートがガラス基板に接触していても、膜面に砥粒の接触による研磨傷は生じ得ず、且つ、膜面の異常突起は研磨層の側面より突出した砥粒にて側方より研削されることになる。よって、ガラス基板の膜面を傷つけることなく、異常突起だけを効率良く確実に除去することが可能となる。
加えて、樹脂被膜層のガラス基板と接触する面は異常突起の研削に関与しないことから、研磨時の研磨圧力を小さくすることができ、その分、ガラス基板への接触圧による樹脂被膜層の摩耗を抑えることができ、研磨シートの高寿命化に寄与できる。
According to the invention of claim 1, since the resin coating layer made of the binder resin is formed on the surface of the polishing sheet that contacts the glass substrate of the polishing sheet, and the abrasive grains are projected only from the side surface of the polishing sheet. On the contact surface with the glass substrate, the abrasive grains of the polishing layer are covered with the resin coating layer and do not protrude to the glass substrate side, so even if the polishing sheet is in contact with the glass substrate during polishing, the film Polishing scratches due to the contact of abrasive grains cannot occur on the surface, and abnormal protrusions on the film surface are ground from the side by abrasive grains protruding from the side surface of the polishing layer. Therefore, it is possible to efficiently and surely remove only the abnormal protrusion without damaging the film surface of the glass substrate.
In addition, since the surface of the resin coating layer in contact with the glass substrate does not participate in the grinding of abnormal protrusions, the polishing pressure during polishing can be reduced. Abrasion can be suppressed, and the life of the polishing sheet can be extended.

また、請求項2の発明によれば、樹脂被膜層の材料として、研磨層を構成するバインダー樹脂を用いたので、樹脂被膜層と研磨層の密着性が向上し、両者を強固に固着させることができる。   According to the invention of claim 2, since the binder resin constituting the polishing layer is used as the material of the resin coating layer, the adhesion between the resin coating layer and the polishing layer is improved and both are firmly fixed. Can do.

また、請求項3の発明によれば、樹脂被膜層の厚さを3〜5μmとしたので、ガラス基板の膜面と研磨層の側部より突出した砥粒との間に少なくとも3μm以上のギャップが生じることにより、研磨の際、この突出砥粒がガラス基板の膜面に接触することを防止でき、且つ、異常突起については、突出砥粒により確実に研削・除去することができる。   According to the invention of claim 3, since the thickness of the resin coating layer is 3 to 5 μm, a gap of at least 3 μm or more is provided between the film surface of the glass substrate and the abrasive grains protruding from the side portion of the polishing layer. As a result, the protruding abrasive grains can be prevented from coming into contact with the film surface of the glass substrate during polishing, and abnormal protrusions can be reliably ground and removed by the protruding abrasive grains.

また、請求項4に記載の発明によれば、研磨ヘッドに研磨プレートを上下方向移動自在に設け、押圧調整機構により研磨プレートをガラス基板に押圧させるようにしているので、ガラス基板に対する研磨シートの押圧力を、異常突起を効率良く研磨できる好適な押圧力に調整することができる。   According to the fourth aspect of the invention, the polishing plate is provided on the polishing head so as to be movable in the vertical direction, and the polishing plate is pressed against the glass substrate by the press adjusting mechanism. The pressing force can be adjusted to a suitable pressing force that can efficiently polish the abnormal protrusion.

さらに、請求項5に記載の発明によれば、カラーフィルタの表面に傷をつけることなく、カラーフィルタの着色膜に生じた異常突起を効率良く確実に除去することができる。   Furthermore, according to the fifth aspect of the present invention, it is possible to efficiently and surely remove abnormal protrusions generated on the colored film of the color filter without damaging the surface of the color filter.

以下、本発明の研磨機の実施形態を図1〜図7に基づいて説明する。
本実施形態の研磨機は、液晶表示装置用カラーフィルタの着色膜(RGB膜)を研磨するためのものであり、図1は本実施形態の研磨機を装備したガラス基板の製造ラインの要部構成を示す平面図、図2は同、要部構成を示す側面図、図3は研磨プレートの下部構成を示すガラス基板の搬送方向の側方から見た断面図、図4はガラス基板に研磨プレートを押圧させた時の状態を示す要部拡大図、図5は研磨シートの構造を示し、(a)は平面図、(b)は側面図、図6は研磨プレートを下から見た図、図7は研磨ヘッドの構成を示すガラス基板の搬送方向の側方から見た断面図で、(a)は研磨プレートをガラス基板に押圧させる前の状態を示す図、(b)は研磨プレートをガラス基板に押圧させた状態を示す図である。
Hereinafter, an embodiment of a polishing machine of the present invention will be described with reference to FIGS.
The polishing machine of this embodiment is for polishing a colored film (RGB film) of a color filter for a liquid crystal display device, and FIG. 1 is a main part of a production line of a glass substrate equipped with the polishing machine of this embodiment. FIG. 2 is a side view showing the main part configuration, FIG. 3 is a cross-sectional view showing the lower configuration of the polishing plate, as viewed from the side in the conveyance direction of the glass substrate, and FIG. 4 is polished on the glass substrate. FIG. 5 shows the structure of the polishing sheet, (a) is a plan view, (b) is a side view, and FIG. 6 is a view of the polishing plate as seen from below. FIG. 7 is a cross-sectional view showing the structure of the polishing head as seen from the side of the glass substrate in the conveying direction, where (a) is a diagram showing a state before the polishing plate is pressed against the glass substrate, and (b) is the polishing plate. It is a figure which shows the state which pressed the glass substrate.

図1、図2において、符号1はガラス基板W(本実施形態ではカラーフィルタ)をその面方向に沿って矢印A方向に搬送する搬送コンベア(搬送経路)、符号3はこの搬送コンベア1の下側に配置され、研磨時にガラス基板Wが載る下定盤、符号10はこの下定盤3の上方に配置されて、搬送されてきたガラス基板Wの上側の表面を研磨する研磨ヘッド、符号20はこの研磨ヘッド10の本体11に設けられた上定盤となる研磨プレートである。   1 and 2, reference numeral 1 denotes a conveyance conveyor (conveyance path) that conveys a glass substrate W (in this embodiment, a color filter) in the direction of arrow A along the surface direction, and reference numeral 3 denotes a lower part of the conveyance conveyor 1. The lower surface plate on which the glass substrate W is placed during polishing, the reference numeral 10 is disposed above the lower surface plate 3, and a polishing head for polishing the upper surface of the conveyed glass substrate W, the reference numeral 20 is this A polishing plate serving as an upper surface plate provided in the main body 11 of the polishing head 10.

この研磨機(研磨ヘッド10で代表される部分)は、RGB膜が形成されたガラス基板Wの表面に、研磨プレート20を押圧させながら、研磨プレート20をガラス基板Wに対して面内移動させることで、ガラス基板Wの表面の着色膜(RGB膜)を研磨するものである。
ガラス基板Wは、長方形の平板状のもので、長辺を搬送方向Aと平行にした姿勢で一方の短辺を前端にして上流側から研磨ヘッド10の下側に搬送され、下定盤3上において研磨ヘッド10により研磨されながら、そのままの姿勢と速度で下流側へ搬送されて行く。
This polishing machine (portion represented by the polishing head 10) moves the polishing plate 20 in-plane with respect to the glass substrate W while pressing the polishing plate 20 against the surface of the glass substrate W on which the RGB film is formed. Thus, the colored film (RGB film) on the surface of the glass substrate W is polished.
The glass substrate W has a rectangular flat plate shape, and is conveyed from the upstream side to the lower side of the polishing head 10 with one short side at the front end in a posture in which the long side is parallel to the conveyance direction A. While being polished by the polishing head 10, it is conveyed to the downstream side with the same posture and speed.

図3、図4に示すように、研磨プレート20の下面20a(研磨定盤面20a)には、両面テープ等により固定砥粒研磨シート23が貼り付けられている。
この固定砥粒研磨シート23は、図5に示すように、砥粒27とバインダー樹脂とで成る研磨層26と、この研磨層26の上下両面に形成された樹脂被膜層24とで構成されており、研磨層26の外周部(側面)からのみ砥粒27の一部が突出するようになっている。また、樹脂被膜層24の端縁部24aはテーパー加工されて、搬送されてくるガラス基板Wの膜面200との接触性、摺動性を良好にしている。
As shown in FIGS. 3 and 4, a fixed abrasive polishing sheet 23 is attached to the lower surface 20 a (polishing surface 20 a) of the polishing plate 20 with a double-sided tape or the like.
As shown in FIG. 5, the fixed abrasive polishing sheet 23 is composed of a polishing layer 26 made of abrasive grains 27 and a binder resin, and a resin coating layer 24 formed on both upper and lower surfaces of the polishing layer 26. A part of the abrasive grains 27 protrudes only from the outer peripheral portion (side surface) of the polishing layer 26. Further, the edge portion 24a of the resin coating layer 24 is tapered to improve the contact property and slidability with the film surface 200 of the glass substrate W being conveyed.

ここで、本実施形態の固定砥粒研磨シート23では、研磨層26を形成する砥粒(研磨材粒子)27として研削力に優れるダイヤモンド粒子が用いられ、バインダー樹脂としてフェノール樹脂が用いられている。また、樹脂被膜層24として上記バインダー樹脂と同じフェノール樹脂が用いられている。樹脂被膜層24に研磨層26と同じ樹脂材を用いることにより、樹脂被膜層24と研磨層26の密着性が向上し、両者を強固に固着させることができる。
尚、研磨材粒子としては、上記ダイヤモンド砥粒の他、アルミナ砥粒等も使用可能である。
Here, in the fixed abrasive polishing sheet 23 of the present embodiment, diamond particles having excellent grinding power are used as the abrasive grains (abrasive material particles) 27 that form the polishing layer 26, and a phenol resin is used as the binder resin. . Further, the same phenol resin as the binder resin is used as the resin coating layer 24. By using the same resin material as the polishing layer 26 for the resin coating layer 24, the adhesion between the resin coating layer 24 and the polishing layer 26 can be improved, and both can be firmly fixed.
As the abrasive particles, alumina abrasive grains and the like can be used in addition to the diamond abrasive grains.

また、固定砥粒研磨シート23の厚さH2は、研磨すべき異常突起300の高さと研磨シートの機械的強度等を考慮して2mm程に設定されていると共に、樹脂被膜層24の厚さH1は3〜5μm程に設定されている。砥粒27の粒子径は2.5〜3.0μm程、砥粒27の突出粒径は1.0μm以下である。   The thickness H2 of the fixed abrasive polishing sheet 23 is set to about 2 mm in consideration of the height of the abnormal protrusion 300 to be polished, the mechanical strength of the polishing sheet, and the like, and the thickness of the resin coating layer 24. H1 is set to about 3 to 5 μm. The particle diameter of the abrasive grains 27 is about 2.5 to 3.0 μm, and the protruding particle diameter of the abrasive grains 27 is 1.0 μm or less.

ここで、樹脂被膜層24の厚さH1を3〜5.0μmに設定したのは、樹脂被膜層24の厚さH1が3μmより小さいと、ガラス基板Wの膜面200から研磨層26までの距離が少なくなるため、研磨層26の側面より突出した砥粒27がガラス基板Wの膜面200に接触して膜面200を傷つける虞があり、厚さH1が5μmより大きくなると、膜面200からの突出砥粒27の距離が大きくなり、その分、膜面200上の異常突起300を根元部分より完全に研削することが難しくなるためである(図4参照)。
因みに、異常突起300の高さS2は、図8に示すように、10〜40μm程度であるから、厚さ2mm弱の研磨層26の側面で十分に研削可能である。
Here, the thickness H1 of the resin coating layer 24 is set to 3 to 5.0 μm because the thickness H1 of the resin coating layer 24 is smaller than 3 μm from the film surface 200 to the polishing layer 26 of the glass substrate W. Since the distance decreases, the abrasive grains 27 protruding from the side surface of the polishing layer 26 may come into contact with the film surface 200 of the glass substrate W and damage the film surface 200. When the thickness H1 exceeds 5 μm, the film surface 200 This is because the distance of the protruding abrasive grains 27 from the base increases, and it becomes difficult to completely grind the abnormal protrusion 300 on the film surface 200 from the root portion (see FIG. 4).
Incidentally, as shown in FIG. 8, the height S2 of the abnormal protrusion 300 is about 10 to 40 μm, so that it can be sufficiently ground on the side surface of the polishing layer 26 having a thickness of less than 2 mm.

研磨ヘッド10は、ガラス基板Wの搬送方向Aと直交する方向に自身の長さ方向を向けて配されており、その長さが、搬送経路上を搬送されてくる1枚、または、搬送方向と直交する方向に並んだ状態で搬送されてくる複数枚(本図示例では2枚)のガラス基板Wの全てを1度に研磨できる長さに設定されている。
また、図1、図6に示すように、研磨プレート20の下面20aには、ガラス基板Wの搬送方向に並べて2枚の固定砥粒研磨シート23が平行に互いに間隔をあけて貼り付けられており、これら、2枚の固定砥粒研磨シート23の間に位置させて、研磨プレート20には、固定砥粒研磨シート23による研磨部位に純水を供給する液体供給口13が設けられている。
The polishing head 10 is arranged with its own length direction in a direction orthogonal to the conveyance direction A of the glass substrate W, and the length of the polishing head 10 is conveyed on the conveyance path, or the conveyance direction. The length is set such that all of a plurality of (two in the illustrated example) glass substrates W conveyed in a state of being arranged in a direction perpendicular to each other can be polished at a time.
As shown in FIGS. 1 and 6, two fixed abrasive polishing sheets 23 are affixed to the lower surface 20 a of the polishing plate 20 in parallel in the transport direction of the glass substrate W and spaced apart from each other in parallel. In addition, the polishing plate 20 is provided between the two fixed abrasive polishing sheets 23 and is provided with a liquid supply port 13 for supplying pure water to a portion polished by the fixed abrasive polishing sheet 23. .

研磨プレート20は、図3、図7に示すように、固定砥粒研磨シート23を下に向けて、研磨ヘッド10の本体11に上下方向移動自在に設けられている。
図7に示すように、研磨ヘッド10の本体11には、下面に開口14aを有した押圧室14が設けられており、研磨プレート20の上部がこの押圧室14の内部に収容されると共に、研磨プレート20の下部が開口14aより下方へ突出している。そして、研磨プレート20の下面の研磨定盤面20aが、搬送されてくるガラス基板Wの上側の表面に対向するようになっている。
As shown in FIGS. 3 and 7, the polishing plate 20 is provided on the main body 11 of the polishing head 10 so as to be movable in the vertical direction with the fixed abrasive polishing sheet 23 facing downward.
As shown in FIG. 7, the main body 11 of the polishing head 10 is provided with a pressing chamber 14 having an opening 14 a on the lower surface, and the upper portion of the polishing plate 20 is accommodated inside the pressing chamber 14. The lower part of the polishing plate 20 protrudes downward from the opening 14a. The polishing platen surface 20a on the lower surface of the polishing plate 20 faces the upper surface of the glass substrate W being conveyed.

また、研磨ヘッド10の本体11と研磨プレート20との間には、研磨プレート20をガラス基板Wに押圧させると共に、その押圧力を調整するための加圧チューブ18と反力チューブ19とが設けられている。   Further, a pressurizing tube 18 and a reaction force tube 19 are provided between the main body 11 of the polishing head 10 and the polishing plate 20 to press the polishing plate 20 against the glass substrate W and to adjust the pressing force. It has been.

加圧チューブ18は、加圧エア(エア以外の気体でも可)の導入により膨張して研磨プレート20を下方に押圧するもので、押圧室14の天井壁と研磨プレート20の上端壁との間に配置されている。
また、反力チューブ19は、加圧エア(エア以外の気体でも可)の導入により膨張して研磨プレート20を加圧チューブ18の圧力に抗して上方に押圧するもので、研磨プレート20の左右に張り出したフランジ25と研磨ヘッド10の本体11側の開口14aの左右の各フランジ15との間に配置されている。
図7(b)に、加圧チューブ18による下向き力P1と、反力チューブ19による上向き力P2の関係を示す。これら加圧チューブ18と反力チューブ19は、研磨プレート20の長さ方向のほぼ全長に渡って配設されている。
The pressurizing tube 18 is expanded by introducing pressurized air (a gas other than air may be used) and presses the polishing plate 20 downward, and between the ceiling wall of the pressing chamber 14 and the upper end wall of the polishing plate 20. Is arranged.
The reaction force tube 19 expands by introducing pressurized air (or a gas other than air) and presses the polishing plate 20 upward against the pressure of the pressure tube 18. It is arranged between the flange 25 projecting left and right and the left and right flanges 15 of the opening 14 a on the main body 11 side of the polishing head 10.
FIG. 7B shows the relationship between the downward force P1 caused by the pressurizing tube 18 and the upward force P2 caused by the reaction force tube 19. The pressurizing tube 18 and the reaction force tube 19 are disposed over almost the entire length of the polishing plate 20 in the length direction.

また、これら加圧チューブ18と反力チューブ19に接続された加圧エア給排管(図示せず)上には、圧力調整手段(図示せず)が接続されている。この圧力調整手段は、加圧チューブ18と反力チューブ19に導入する加圧エアの圧力バランスを調整するもので、この圧力調整手段と加圧チューブ18および反力チューブ19とにより、ガラス基板Wに対する研磨プレート20の押圧力(すなわち、研磨圧力)を調整するための押圧調整機構が構成されている。   A pressure adjusting means (not shown) is connected to a pressurized air supply / exhaust pipe (not shown) connected to the pressure tube 18 and the reaction force tube 19. The pressure adjusting means adjusts the pressure balance of the pressurized air introduced into the pressurizing tube 18 and the reaction force tube 19, and the pressure adjusting means, the pressurizing tube 18 and the reaction force tube 19 are used to adjust the glass substrate W. A pressing adjustment mechanism for adjusting the pressing force (that is, polishing pressure) of the polishing plate 20 with respect to is configured.

また、本実施形態の研磨機は、研磨ヘッド10の上端に突出した揺動軸12を介して、研磨ヘッド10を、ガラス基板Wの搬送方向と直交する面内方向の運動成分を少なくとも含むようオービタル運動させる駆動機構(図示せず)を備えている。   In addition, the polishing machine of this embodiment includes at least a motion component in the in-plane direction orthogonal to the conveyance direction of the glass substrate W via the swing shaft 12 protruding from the upper end of the polishing head 10. A drive mechanism (not shown) for orbital movement is provided.

次に上記構成の研磨機を用いてガラス基板Wの表面の膜(RGB膜)を研磨する方法について説明する。   Next, a method for polishing a film (RGB film) on the surface of the glass substrate W using the polishing machine having the above configuration will be described.

ガラス基板Wが搬送コンベア1により研磨ヘッド10の下に搬送されてくると、図7(b)に示すように、加圧チューブ18に加圧エアを導入すると共に、反力チューブ19にも加圧エアを導入して、研磨プレート20を下降させ、ガラス基板Wの膜面200に研磨プレート20の下面を押圧させる。この際、加圧チューブ18と反力チューブ19の圧力バランスを調整することにより、研磨プレート20のガラス基板Wに対する押圧力を好適値に設定することができる。   When the glass substrate W is transported under the polishing head 10 by the transport conveyor 1, as shown in FIG. 7 (b), pressurized air is introduced into the pressurizing tube 18 and also applied to the reaction force tube 19. The compressed air is introduced, the polishing plate 20 is lowered, and the lower surface of the polishing plate 20 is pressed against the film surface 200 of the glass substrate W. At this time, by adjusting the pressure balance between the pressurizing tube 18 and the reaction force tube 19, the pressing force of the polishing plate 20 against the glass substrate W can be set to a suitable value.

この時、図4に示すように、固定砥粒研磨シート23の表面とガラス基板Wの膜面200は従来と相違し、完全に接触しており、この状態で、研磨ヘッド10をガラス基板Wに対して偏心回転させることにより、ガラス基板Wの膜面200が固定砥粒研磨シート23にて研磨される。   At this time, as shown in FIG. 4, the surface of the fixed abrasive polishing sheet 23 and the film surface 200 of the glass substrate W are completely in contact with each other, and in this state, the polishing head 10 is attached to the glass substrate W. , The film surface 200 of the glass substrate W is polished by the fixed abrasive polishing sheet 23.

ここで、固定砥粒研磨シート23のガラス基板Wに接触する面は、樹脂被膜層24により被覆されており、研磨層26の砥粒27がガラス基板W側へは突出していないため、固定砥粒研磨シート23がガラス基板Wの膜面200に接触していても、膜面200には砥粒27の接触による研磨傷は発生せず、且つ、膜面200の異常突起300は、研磨層26の側面より突出した砥粒27にて側方より研削される。   Here, the surface of the fixed abrasive polishing sheet 23 that contacts the glass substrate W is covered with the resin coating layer 24, and the abrasive grains 27 of the polishing layer 26 do not protrude toward the glass substrate W. Even if the grain polishing sheet 23 is in contact with the film surface 200 of the glass substrate W, the film surface 200 is not damaged by the contact of the abrasive grains 27, and the abnormal protrusion 300 on the film surface 200 is formed by the polishing layer. The abrasive grains 27 protruding from the side surfaces 26 are ground from the side.

このように、ガラス基板Wの膜面200に接触する樹脂被膜層24の面は異常突起300の研削に何ら関与しないことから、上述した加圧チューブ18と反力チューブ19により設定されるガラス基板Wに対する研磨圧力を極力小さくでき、その分、接触圧による樹脂被膜層24の摩耗を抑制することができる。加えて、樹脂被膜層24は耐摩耗性に優れるフェノール樹脂であるから、この点からも固定砥粒研磨シート23は高寿命を維持できるものである。   Thus, since the surface of the resin coating layer 24 in contact with the film surface 200 of the glass substrate W is not involved in the grinding of the abnormal protrusion 300, the glass substrate set by the pressure tube 18 and the reaction force tube 19 described above. The polishing pressure for W can be reduced as much as possible, and the wear of the resin coating layer 24 due to the contact pressure can be suppressed accordingly. In addition, since the resin coating layer 24 is a phenol resin excellent in wear resistance, the fixed abrasive polishing sheet 23 can maintain a long life from this point.

このように、本実施形態の研磨機では、従来のようなクリアランス調整パッドを無くし、固定砥粒研磨シート23とガラス基板Wを直接接触させた全面研磨を行うため、研磨再現性が高く、且つ、使用部材が少なくて済み、コスト低減が図れる。   As described above, in the polishing machine of this embodiment, the conventional clearance adjustment pad is eliminated, and the entire polishing is performed by directly contacting the fixed abrasive polishing sheet 23 and the glass substrate W. Therefore, the polishing reproducibility is high, and The number of members used can be reduced, and the cost can be reduced.

また、研磨中、研磨面に液体供給口13より純水を供給することにより、研磨かすを排除することができるので、研磨かすに起因する研磨傷の発生を防止することができる。   Further, by supplying pure water from the liquid supply port 13 to the polishing surface during polishing, polishing debris can be eliminated, so that generation of polishing flaws due to polishing debris can be prevented.

研磨終了後は、図7(a)に示すように、加圧チューブ18の加圧エアを抜き、反力チューブ19に加圧エアを導入して、研磨プレート20を上昇させ、次のガラス基板Wの搬入に備える。   After the polishing is finished, as shown in FIG. 7A, the pressurized air from the pressure tube 18 is extracted, the pressurized air is introduced into the reaction tube 19, the polishing plate 20 is raised, and the next glass substrate. Prepare for W loading.

このように、本研磨機によれば、ガラス基板Wの膜面200を傷つけることなく、異常突起300だけを効率良く除去することが可能であり、よって、製品(カラーフィルタ)の歩留まり向上と品質向上に大いに貢献できるものである。   As described above, according to the present polishing machine, it is possible to efficiently remove only the abnormal protrusion 300 without damaging the film surface 200 of the glass substrate W. Therefore, the yield and quality of the product (color filter) can be improved. It can greatly contribute to improvement.

本発明の実施形態による研磨機を装備したガラス基板(カラーフィルタ)の製造ラインの要部構成を示す平面図。The top view which shows the principal part structure of the manufacturing line of the glass substrate (color filter) equipped with the polisher by embodiment of this invention. 同、製造ラインの要部構成を示す側面図。The side view which shows the principal part structure of a manufacturing line. 研磨プレートの下部構成を示すガラス基板の搬送方向の側方から見た断面図。Sectional drawing seen from the side of the conveyance direction of the glass substrate which shows the lower part structure of a grinding | polishing plate. ガラス基板に研磨プレートを押圧させた時の状態を示す要部拡大図。The principal part enlarged view which shows a state when pressing a grinding | polishing plate against a glass substrate. 研磨シートの構造を示す図で、(a)は平面図、(b)は側面図。It is a figure which shows the structure of an abrasive sheet, (a) is a top view, (b) is a side view. 研磨プレートを下から見た図。The figure which looked at the polishing plate from the bottom. 研磨ヘッドの構成を示すガラス基板の搬送方向の側方より見た断面図で、(a)は研磨プレートをガラス基板に押圧させる前の状態を示し、(b)は研磨プレートをガラス基板に押圧させた状態を示す。It is sectional drawing seen from the side of the conveyance direction of the glass substrate which shows the structure of a grinding | polishing head, (a) shows the state before pressing a polishing plate against a glass substrate, (b) presses a polishing plate against a glass substrate. Indicates the state of the 液晶表示装置用カラーフィルタの断面図。Sectional drawing of the color filter for liquid crystal display devices.

符号の説明Explanation of symbols

1 搬送経路(搬送コンベア)
3 下定盤
10 研磨ヘッド
11 研磨ヘッドの本体
20 研磨プレート
20a 研磨定盤面
23 研磨シート
24 樹脂被膜層
26 研磨層
27 砥粒
CF カラーフィルタ
W ガラス基板
1 Transport route (transport conveyor)
DESCRIPTION OF SYMBOLS 3 Lower surface plate 10 Polishing head 11 Main body of polishing head 20 Polishing plate 20a Polishing surface plate surface 23 Polishing sheet 24 Resin coating layer 26 Polishing layer 27 Abrasive grain CF Color filter W Glass substrate

Claims (5)

膜が形成されたガラス基板の表面に、研磨定盤面に研磨シートを貼り付けた研磨プレートを押圧させつつ、該研磨プレートを前記ガラス基板に対して面内移動させることで、前記ガラス基板の表面の膜を前記研磨シートで研磨する研磨機において、
前記研磨シートは、砥粒とバインダー樹脂とで成る研磨層と、少なくとも前記研磨層の前記ガラス基板に接触する側の面に一体形成された樹脂被膜層とを有し、且つ、前記研磨層の側面より前記砥粒が突出していることを特徴とする研磨機。
The surface of the glass substrate is moved by moving the polishing plate in-plane with respect to the glass substrate while pressing the polishing plate having a polishing plate attached to the surface of the glass substrate on which the film is formed. In a polishing machine for polishing the film of the film with the polishing sheet,
The polishing sheet has a polishing layer composed of abrasive grains and a binder resin, and a resin coating layer formed integrally with at least a surface of the polishing layer on the side in contact with the glass substrate, A polishing machine, wherein the abrasive grains protrude from a side surface.
前記樹脂被膜層が前記バインダー樹脂より成ることを特徴とする請求項1に記載の研磨機。 The polishing machine according to claim 1, wherein the resin coating layer is made of the binder resin. 前記樹脂被膜層の厚さが3〜5μmであることを特徴とする請求項1または請求項2に記載の研磨機。 The polishing machine according to claim 1, wherein the resin coating layer has a thickness of 3 to 5 μm. 前記ガラス基板をその面方向に沿って搬送する搬送経路の下側に、前記ガラス基板が載る下定盤を配置し、
この下定盤の上方に、搬送されてきた前記ガラス基板の上側の表面を研磨するための研磨ヘッドを設け、
この研磨ヘッドの本体に、前記研磨シートを下に向けて、上定盤としての前記研磨プレートを上下方向移動自在に設けると共に、
前記研磨ヘッドの本体と前記研磨プレートとの間に、前記研磨プレートをガラス基板に押圧させ、且つその押圧力を調整する押圧調整機構を設け、
さらに、前記研磨ヘッドを、前記ガラス基板の搬送方向と直交する面内方向の運動成分を少なくとも含むようにオービタル運動させる駆動機構を設けたことを特徴とする請求項1から請求項3までの何れかに記載の研磨機。
The lower surface plate on which the glass substrate is placed is disposed below the conveyance path for conveying the glass substrate along the surface direction,
A polishing head for polishing the upper surface of the glass substrate that has been conveyed is provided above the lower surface plate,
In the main body of this polishing head, with the polishing sheet facing downward, the polishing plate as an upper surface plate is provided movably in the vertical direction,
Between the main body of the polishing head and the polishing plate, a pressing adjustment mechanism for pressing the polishing plate against the glass substrate and adjusting the pressing force is provided,
4. The driving mechanism according to claim 1, further comprising an orbital movement that causes the polishing head to include at least a movement component in an in-plane direction orthogonal to a conveyance direction of the glass substrate. A polishing machine according to crab.
前記ガラス基板は、ディスプレイパネルのカラーフィルタであり、前記膜は、RGBの着色膜であることを特徴とする請求項1から請求項4までの何れかに記載の研磨機。 The polishing machine according to claim 1, wherein the glass substrate is a color filter of a display panel, and the film is an RGB colored film.
JP2007138169A 2007-05-24 2007-05-24 Polishing machine Withdrawn JP2008290189A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007138169A JP2008290189A (en) 2007-05-24 2007-05-24 Polishing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007138169A JP2008290189A (en) 2007-05-24 2007-05-24 Polishing machine

Publications (1)

Publication Number Publication Date
JP2008290189A true JP2008290189A (en) 2008-12-04

Family

ID=40165447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007138169A Withdrawn JP2008290189A (en) 2007-05-24 2007-05-24 Polishing machine

Country Status (1)

Country Link
JP (1) JP2008290189A (en)

Similar Documents

Publication Publication Date Title
JP4756709B2 (en) Polishing equipment
JP5211835B2 (en) Wafer polishing apparatus and wafer polishing method
JP5233888B2 (en) Method for manufacturing carrier for double-side polishing apparatus, carrier for double-side polishing apparatus and double-side polishing method for wafer
US9566687B2 (en) Center flex single side polishing head having recess and cap
JP2005019669A (en) Polishing pad, polishing device and method for polishing wafer
JP2005515904A (en) Chemical mechanical polishing apparatus and method having a retaining ring with a shaped surface for slurry distribution
JP2010234518A (en) Glass substrate and method for manufacturing the same
US20060246831A1 (en) Materials for chemical mechanical polishing
KR20150078122A (en) Film lamination method and apparatus
JP2009018363A (en) Polishing device
JP2007012918A (en) Polishing head
KR101523815B1 (en) Polishing device for plate-shaped body and polishing method for plate-shaped body
JP2014233797A (en) Glass plate manufacturing method and glass plate manufacturing apparatus
US20200258735A1 (en) Wafer polishing method and apparatus
JP2008290189A (en) Polishing machine
JP2008290207A (en) Polishing machine
KR101040811B1 (en) A compressor of polishing pad
JP2008238365A (en) Polishing machine of glass substrate, production line of glass substrate with film, and polishing method of glass substrate
JP2008290190A (en) Polishing machine
JP2008238366A (en) Flat surface polishing machine
KR20100026620A (en) Belt type edge polishing apparatus for flat glass
JP2008080443A (en) Single-side polishing device
JP2008290191A (en) Surface polishing machine
JP2002059346A (en) Method and device for chamfering plate-like work
CN111318958B (en) Film for holding glass substrate and method for polishing glass substrate

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20100803