JP2008238365A - Polishing machine of glass substrate, production line of glass substrate with film, and polishing method of glass substrate - Google Patents

Polishing machine of glass substrate, production line of glass substrate with film, and polishing method of glass substrate Download PDF

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JP2008238365A
JP2008238365A JP2007084946A JP2007084946A JP2008238365A JP 2008238365 A JP2008238365 A JP 2008238365A JP 2007084946 A JP2007084946 A JP 2007084946A JP 2007084946 A JP2007084946 A JP 2007084946A JP 2008238365 A JP2008238365 A JP 2008238365A
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polishing
glass substrate
plate
film
pad
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Tatsuyuki Suzuki
龍之 鈴木
Akio Mogi
昭男 茂木
Hajime Konoue
肇 鴻上
Tadao Konno
忠雄 今野
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Mitsubishi Materials Techno Corp
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Mitsubishi Materials Techno Corp
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<P>PROBLEM TO BE SOLVED: To remove only all of abnormal protrusions by polishing for a short time without reducing a film thickness of a normal film thickness portion. <P>SOLUTION: In this polishing machine of a glass substrate, while a polishing plate 20 to a polishing surface plate face 20a of which a fixing abrasive polishing sheet 23 as a polishing pad is adhered, is pressed to a surface of a glass substrate, on which a film is formed, a polishing plate is orbitally moved to the glass substrate, so as to polish the film on the surface of the glass substrate by the fixing abrasive polishing sheet. A clearance-adjusting pad 24 for keeping an optimum clearance between the surface of the glass substrate and the fixing abrasive polishing sheet by contacting the surface of the glass substrate before the fixing abrasive polishing sheet 23 and being smashed and deformed according to a pressing force when the polishing plate is pressed to the surface, is provided on the polishing surface plate face of the polishing plate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、例えば、液晶表示装置用カラーフィルタ等のガラス基板に形成された膜を研磨するための研磨機、その研磨機を備えた膜付きガラス基板の製造ライン、前記研磨機を使用したガラス基板の研磨方法に関するものである。   The present invention includes, for example, a polishing machine for polishing a film formed on a glass substrate such as a color filter for a liquid crystal display device, a production line for a glass substrate with a film provided with the polishing machine, and a glass using the polishing machine The present invention relates to a method for polishing a substrate.

例えば、図10に断面を誇張して示す液晶表示装置用カラーフィルタCFは、フラットなガラス基板Wの表面にブラックマトリックスBMを形成し、その上にRGB(赤緑青)膜を形成した構造をなしているが、製造工程においてRGB膜に異常突起300が発生していたりすると、パネルの貼り合わせの障害となるので、図11に示すように、必ず膜の異常突起の有無を検査機120で検査して、異常突起がある場合は、いったんラインから外して、オフラインで設備した修正機130で異常突起を除去した後、搬送ラインに戻してカラーフィルタ(CF)完成品としている。異常突起が生じる原因は、色々なものが考えられるが、一番多くの原因は、人が介在して異物が混入することによるものと考えられる。   For example, the color filter CF for a liquid crystal display device shown in an exaggerated cross section in FIG. 10 has a structure in which a black matrix BM is formed on the surface of a flat glass substrate W, and an RGB (red green blue) film is formed thereon. However, if abnormal projections 300 are generated on the RGB film in the manufacturing process, it becomes an obstacle to the bonding of the panels. Therefore, as shown in FIG. If there is an abnormal protrusion, the abnormal protrusion is once removed from the line, and the abnormal protrusion is removed by the correction machine 130 installed off-line, and then returned to the conveyance line to obtain a finished color filter (CF). There are various causes for the occurrence of abnormal protrusions, but the most likely cause is that foreign matters are mixed in through human intervention.

一般的に図10に示すように、RGB膜厚S1+通常突起の高さは1.5μm〜2.0μm、異常突起300の高さS2は10〜40μmくらいである。図11に示すように、従来では、カラーフィルタCFを全数(100%)検査すると、10%〜20%の割合で異常を検出することになっており、修正工程を経てから搬送ラインに戻している。この際、1枚のカラーフィルタ内に複数の異常突起があると、異常突起を1個ずつ修正機130のテープで除去していく作業を行う必要があるので、非常に時間がかかる。例えば、1枚のカラーフィルタに20個の異常突起がある場合、5分程度の修正時間がかかるため、生産効率を高くできず、結果的にコスト高になっている。   Generally, as shown in FIG. 10, the height of the RGB film thickness S1 + normal protrusion is 1.5 μm to 2.0 μm, and the height S2 of the abnormal protrusion 300 is about 10 to 40 μm. As shown in FIG. 11, in the past, when all the color filters CF were inspected (100%), abnormalities were detected at a rate of 10% to 20%. Yes. At this time, if there are a plurality of abnormal protrusions in one color filter, it is necessary to perform an operation of removing the abnormal protrusions one by one with the tape of the correction device 130, which is very time consuming. For example, when there are 20 abnormal protrusions in one color filter, it takes about 5 minutes to correct, so the production efficiency cannot be increased, resulting in an increase in cost.

ところで、従来、カラーフィルタの着色層の研磨機として、特許文献1に記載のものが知られている。この研磨機は、静止した角型のガラス基板(カラーフィルタ)の着色層が形成された面上に、その長辺の長さがガラス基板の短辺の長さよりも長い角形の研磨プレートをガラス基板の短辺と平行に配置し、研磨プレートでガラス基板面を加圧しながら、研磨プレートにガラス基板の垂直方向を軸とした偏心回転をさせて研磨プレートをガラス基板の短辺方向に揺動させ、研磨プレートをガラス基板の長辺方向(短辺と直角方向)に移動させてカラーフィルタ表面を研磨するというものである。この研磨機によれば、従来のオスカータイプの研磨機に比べて、ガラス基板の全面を均一に研磨できる利点が得られる。   By the way, the thing of patent document 1 is known conventionally as a grinder of the colored layer of a color filter. In this polishing machine, a rectangular polishing plate having a long side longer than a short side of the glass substrate is formed on a surface of a stationary square glass substrate (color filter) on which a colored layer is formed. Placed parallel to the short side of the substrate, pressurizing the glass substrate surface with the polishing plate, and rotating the polishing plate in the short side direction of the glass substrate by rotating the polishing plate eccentrically about the vertical direction of the glass substrate The polishing plate is moved in the long side direction (perpendicular to the short side) of the glass substrate to polish the color filter surface. According to this polishing machine, an advantage that the entire surface of the glass substrate can be uniformly polished is obtained as compared with a conventional Oscar type polishing machine.

しかし、上述した異物の混入などによる異常突起については、従来の研磨機による通常の全面研磨プロセスでは、効率的に除去できないことが分かった。つまり、従来の研磨機は全面研磨用のものであるため、異常突起だけを研磨したいにも拘わらず、正常な膜厚部分の膜厚をも減らしてしまうおそれがあった。   However, it has been found that the above-described abnormal protrusions due to foreign matters and the like cannot be efficiently removed by a normal entire polishing process using a conventional polishing machine. In other words, since the conventional polishing machine is for polishing the entire surface, there is a possibility that the thickness of the normal film thickness portion may be reduced even though only the abnormal protrusion is desired to be polished.

特開2004−195602号公報JP 2004-195602 A

本発明は、上記事情を考慮し、正常な膜厚部分の膜厚を減らすことなく、異常突起のみを、短時間で全数研磨により除去できるようにしたガラス基板の研磨機、その研磨機を備えた膜付きガラス基板の製造ライン、前記研磨機を使用したガラス基板の研磨方法を提供することを目的とする。   In view of the above circumstances, the present invention includes a glass substrate polishing machine capable of removing all abnormal projections by polishing in a short time without reducing the film thickness of the normal film thickness portion, and the polishing machine. Another object is to provide a production line for a glass substrate with a film and a method for polishing a glass substrate using the polishing machine.

請求項1の発明のガラス基板の研磨機は、膜が形成されたガラス基板の表面に、研磨定盤面に研磨パッドを貼り付けた研磨プレートを押圧させつつ、該研磨プレートを前記ガラス基板に対して面内移動させることで、前記ガラス基板の表面の膜を前記研磨パッドで研磨するガラス基板の研磨機において、前記研磨プレートの研磨定盤面に、前記研磨プレートをガラス基板の表面に押圧させたとき、ガラス基板の表面に前記研磨パッドよりも先に当たり押圧力に応じて潰れ変形することにより、前記ガラス基板の表面と研磨パッドとの隙間を最適に保つクリアランス調整用パッドを設けたことを特徴としている。   The polishing machine for a glass substrate according to the invention of claim 1 is configured to press the polishing plate with a polishing pad attached to the surface of the polishing plate against the surface of the glass substrate on which the film is formed, In the glass substrate polishing machine that polishes the film on the surface of the glass substrate with the polishing pad, the polishing plate is pressed against the surface of the glass substrate against the polishing platen surface of the polishing plate. When the surface of the glass substrate is provided with a clearance adjustment pad that optimally maintains a gap between the surface of the glass substrate and the polishing pad by being crushed and deformed according to the pressing force before the polishing pad. It is said.

請求項2の発明は、請求項1に記載のガラス基板の研磨機であって、前記研磨パッドが、固定砥粒研磨シートよりなることを特徴としている。
ここで、固定砥粒としては、例えばダイヤモンドやアルミナが使用されるものであり、固定砥粒研磨シートとは、これらの固定砥粒を樹脂材料中に混入してシート状に成形したダイヤモンドシートやアルミナシートを意味するものである。
A second aspect of the present invention is the glass substrate polishing machine according to the first aspect, wherein the polishing pad is made of a fixed abrasive polishing sheet.
Here, as the fixed abrasive grains, for example, diamond or alumina is used, and the fixed abrasive polishing sheet is a diamond sheet formed by mixing these fixed abrasive grains into a resin material and forming into a sheet shape. An alumina sheet is meant.

請求項3の発明は、請求項2に記載のガラス基板の研磨機であって、前記固定砥粒研磨シートが、弾性シートを介して前記研磨プレートの研磨定盤面に貼り付けられていることを特徴としている。   The invention of claim 3 is the glass substrate polishing machine according to claim 2, wherein the fixed abrasive polishing sheet is attached to the polishing platen surface of the polishing plate via an elastic sheet. It is a feature.

請求項4の発明は、請求項1〜3のいずれか1項に記載のガラス基板の研磨機であって、前記ガラス基板をその面方向に沿って搬送する搬送経路の下側に、前記ガラス基板の載る下定盤を配置し、その下定盤の上方に、搬送されてきた前記ガラス基板の上側の表面を研磨するための研磨ヘッドを設け、この研磨ヘッドの本体に、前記研磨パッドおよび前記クリアランス調整用パッドを下に向けて、上定盤としての前記研磨プレートを上下方向移動自在に設けると共に、前記研磨ヘッドの本体と前記研磨プレートとの間に、前記研磨プレートをガラス基板に押圧させ且つその押圧力を調整する押圧調整機構を設け、更に、前記研磨ヘッドを、前記ガラス基板の搬送方向と直交する面内方向の運動成分を少なくとも含むようにオービタル運動させる駆動機構を設けたことを特徴としている。   The invention of claim 4 is the glass substrate polishing machine according to any one of claims 1 to 3, wherein the glass substrate is disposed below the conveyance path for conveying the glass substrate along the surface direction. A lower surface plate on which the substrate is placed is disposed, and a polishing head for polishing the upper surface of the glass substrate that has been conveyed is provided above the lower surface plate, and the polishing pad and the clearance are provided on the main body of the polishing head. The polishing plate as an upper surface plate is provided so as to be movable in the vertical direction with the adjustment pad facing downward, and the polishing plate is pressed against the glass substrate between the main body of the polishing head and the polishing plate; A pressing adjustment mechanism for adjusting the pressing force is provided, and the polishing head is orbitally moved so as to include at least a movement component in an in-plane direction perpendicular to the conveyance direction of the glass substrate. It is characterized in that a drive mechanism.

請求項5の発明は、請求項4に記載のガラス基板の研磨機であって、前記研磨ヘッドは、前記ガラス基板の搬送方向と直交する方向に自身の長さ方向を向けて配されており、その長さが、前記搬送経路上を搬送されてくる1枚、または、搬送方向と直交する方向に並んだ状態で搬送されてくる複数枚のガラス基板の全てを1度に研磨できる長さに設定されていることを特徴としている。   A fifth aspect of the present invention is the glass substrate polishing machine according to the fourth aspect, wherein the polishing head is arranged with its length direction directed in a direction perpendicular to the conveying direction of the glass substrate. The length is such that one of the glass substrates conveyed on the conveyance path or a plurality of glass substrates conveyed in a state of being arranged in a direction orthogonal to the conveyance direction can be polished at a time. It is characterized by being set to.

請求項6の発明は、請求項5に記載のガラス基板の研磨機であって、前記研磨プレートに、前記ガラス基板の搬送方向に並べて複数の研磨パッドが互いに間隔をあけて貼り付けられていることを特徴としている。   A sixth aspect of the present invention is the glass substrate polishing machine according to the fifth aspect, wherein a plurality of polishing pads are attached to the polishing plate in the transport direction of the glass substrate at intervals. It is characterized by that.

請求項7の発明は、請求項4〜6のいずれか1項に記載のガラス基板の研磨機であって、前記研磨プレートに、前記研磨パッドによる研磨面に液体を供給する液体供給口が設けられていることを特徴としている。   A seventh aspect of the present invention is the glass substrate polishing machine according to any one of the fourth to sixth aspects, wherein the polishing plate is provided with a liquid supply port for supplying a liquid to a polishing surface by the polishing pad. It is characterized by being.

請求項8の発明は、請求項4〜7のいずれか1項に記載のガラス基板の研磨機であって、前記研磨ヘッドの本体に、下面に開口を有した押圧室を設け、前記研磨プレートの上部を前記押圧室の内部に収容すると共に、研磨プレートの下部を前記開口より下方へ突出させて、その研磨プレートの下面の前記研磨定盤面を、搬送されてくるガラス基板の上側の表面に対向可能とし、更に、前記押圧調整機構として、前記押圧室の内部に、加圧気体の導入により膨張して前記研磨プレートの上端面を下に向けて押圧する加圧チューブと、前記研磨プレートの左右に張り出したフランジの下側に配され加圧気体の導入により膨張して前記フランジを上に向けて押圧する反力チューブとを設けると共に、前記加圧チューブと反力チューブに導入する加圧気体の圧力のバランスにより、前記ガラス基板に対する研磨プレートの押圧力を調整する圧力調整手段を設けたことを特徴としている。   The invention of claim 8 is the glass substrate polishing machine according to any one of claims 4 to 7, wherein the polishing plate is provided with a pressing chamber having an opening on a lower surface thereof, and the polishing plate The upper part of the polishing plate is accommodated in the pressing chamber, and the lower part of the polishing plate is protruded downward from the opening so that the polishing platen surface on the lower surface of the polishing plate is placed on the upper surface of the glass substrate being conveyed. Further, as the pressing adjustment mechanism, a pressurizing tube that expands into the pressing chamber by introducing pressurized gas and presses the upper end surface of the polishing plate downward, and the polishing plate A pressure tube is provided below the flange projecting to the left and right, expands by introduction of pressurized gas and presses the flange upward, and pressurizes the pressure tube and reaction tube. The pressure balance of the body, is characterized in that a pressure adjusting means for adjusting the pressing force of the polishing plate with respect to the glass substrate.

請求項9の発明は、請求項1〜8のいずれか1項に記載のガラス基板の研磨機であって、前記クリアランス調整用パッドが、前記ガラス基板の表面の膜上に存在する異常突起だけに前記研磨パッドが接触し且つ正常厚さの膜に対しては非接触となるように、前記ガラス基板の表面と研磨パッドとの隙間を保つためのものであることを特徴とする。   The invention of claim 9 is the glass substrate polishing machine according to any one of claims 1 to 8, wherein the clearance adjustment pad includes only abnormal projections present on the film on the surface of the glass substrate. Further, the gap between the surface of the glass substrate and the polishing pad is maintained so that the polishing pad is in contact with the film having a normal thickness and is not in contact with the film having a normal thickness.

請求項10の発明は、請求項1〜9のいずれか1項に記載のガラス基板の研磨機であって、前記膜が形成されたガラス基板が、ディスプレイパネルのカラーフィルタであり、前記膜がRGBの着色膜であることを特徴としている。   The invention of claim 10 is the glass substrate polishing machine according to any one of claims 1 to 9, wherein the glass substrate on which the film is formed is a color filter of a display panel, and the film is It is an RGB colored film.

請求項11の発明の膜付きガラス基板の製造ラインは、前記膜が形成されたガラス基板の搬入部から完成品のガラス基板の搬出部との間を結ぶ搬送ライン上に、ガラス基板の表面に形成した膜の状態を検査する検査機を配置し、前記搬送ライン外に、前記検査機で異常と判定されたガラス基板の修正機を配置し、前記搬送ライン上の前記検査機の手前に、請求項1〜10のいずれか1項に記載のガラス基板の研磨機を配置したことを特徴としている。   The production line for a glass substrate with a film according to the invention of claim 11 is provided on a surface of the glass substrate on a conveyance line connecting between the carry-in portion of the glass substrate on which the film is formed and the carry-out portion of the finished glass substrate. An inspection machine for inspecting the state of the formed film is arranged, and a correction device for the glass substrate determined to be abnormal by the inspection machine is arranged outside the conveyance line, before the inspection machine on the conveyance line, A glass substrate polishing machine according to any one of claims 1 to 10 is arranged.

請求項12の発明の膜付きガラス基板の製造ラインは、前記膜が形成されたガラス基板の搬送ライン上に、研磨仕様を異ならせた複数台の研磨手段を配置し、これら複数台の研磨手段のうち、ガラス基板の搬送方向の最上流の研磨手段として、請求項1〜10のいずれか1項に記載のガラス基板の研磨機を配置したことを特徴としている。   The production line for a glass substrate with a film according to the invention of claim 12 includes a plurality of polishing means having different polishing specifications arranged on a transport line of the glass substrate on which the film is formed, and the plurality of polishing means. Among them, the glass substrate polishing machine according to any one of claims 1 to 10 is arranged as the most upstream polishing means in the conveyance direction of the glass substrate.

請求項13の発明は、請求項1〜10のいずれか1項に記載のガラス基板の研磨機を用いてガラス基板の表面の膜を研磨する研磨方法であって、膜が形成されたガラス基板の表面に、研磨定盤面に研磨パッドおよびクリアランス調整用パッドを貼り付けた研磨プレートを押圧させ、その押圧力に応じて前記クリアランス調整用パッドを先に潰れ変形させることで、前記ガラス基板の表面と研磨パッドとの隙間を最適に保ち、その状態で、前記研磨プレートをガラス基板に対して面内移動させることで、ガラス基板の表面の膜を前記研磨パッドで研磨することを特徴としている。   The invention of claim 13 is a polishing method for polishing a film on the surface of a glass substrate using the glass substrate polishing machine according to any one of claims 1 to 10, wherein the glass substrate has a film formed thereon. The surface of the glass substrate is pressed by pressing a polishing plate having a polishing pad and a clearance adjustment pad affixed to the surface of the polishing platen, and the clearance adjustment pad is first crushed and deformed according to the pressing force. In this state, the polishing plate is moved in-plane with respect to the glass substrate, and the film on the surface of the glass substrate is polished with the polishing pad.

請求項1の発明によれば、研磨プレートの研磨定盤面に、研磨プレートをガラス基板の表面に押圧させたとき、ガラス基板の表面に研磨パッドよりも先に当たって潰れ変形するクリアランス調整用パッドを設けたので、クリアランス調整用パッドのストッパ機能により、ガラス基板と研磨パッドとの隙間を、異常突起だけを取り除くのに最適な隙間に保つことができる。従って、膜自体の正常な厚みを減らさずに、異常突起だけを研磨パッドによる研磨により短時間で効率よく取り除くことができる。従って、全数のガラス基板をこの研磨機に通すことにより、オフラインでの修正作業数を大幅に減らすことができ、低コスト生産に寄与することができる。また、研磨プレートに加える押圧力の調整により、研磨パッドを異常突起よりも低い膜上の突起に接触させることができる。従って、ガラス基板上の膜の平坦化や平滑化に利用することもできる。   According to the first aspect of the present invention, the surface of the polishing plate is provided with a clearance adjusting pad that is crushed and deformed before the polishing pad when the polishing plate is pressed against the surface of the glass substrate. Therefore, the clearance adjustment pad stopper function can keep the gap between the glass substrate and the polishing pad at an optimum gap for removing only abnormal protrusions. Therefore, only abnormal protrusions can be efficiently removed in a short time by polishing with the polishing pad without reducing the normal thickness of the film itself. Therefore, by passing all the glass substrates through this polishing machine, the number of offline correction operations can be greatly reduced, which can contribute to low-cost production. Further, by adjusting the pressing force applied to the polishing plate, the polishing pad can be brought into contact with the protrusion on the film that is lower than the abnormal protrusion. Therefore, it can be used for flattening or smoothing the film on the glass substrate.

請求項2の発明によれば、研磨パッドが固定砥粒研磨シートよりなるので、短時間で異常突起のみを取り除くことができる。   According to the invention of claim 2, since the polishing pad is made of a fixed abrasive polishing sheet, only abnormal protrusions can be removed in a short time.

請求項3の発明によれば、固定砥粒研磨シートを弾性シートを介して研磨プレートの研磨定盤面に貼り付けているので、弾性シートの弾性により、クリアランス調整用パッドに対する固定砥粒研磨シートの高さ調整を行うことができ、固定砥粒研磨シートをガラス基板に適切な押圧力で接触させることができる。   According to the invention of claim 3, since the fixed abrasive polishing sheet is attached to the polishing platen surface of the polishing plate via the elastic sheet, the elasticity of the elastic sheet allows the fixed abrasive polishing sheet to be adjusted relative to the clearance adjustment pad. The height can be adjusted, and the fixed abrasive polishing sheet can be brought into contact with the glass substrate with an appropriate pressing force.

請求項4の発明によれば、研磨ヘッドに研磨プレートを上下方向移動自在に設け、押圧調整機構により研磨プレートをガラス基板に押圧させるようにしているので、押圧調整機構により発生する押圧力と、クリアランス調整用パッドの潰れ変形に伴う弾性反力とのバランスにより、研磨パッドとガラス基板の隙間を調整することができる。   According to the invention of claim 4, since the polishing plate is provided in the polishing head so as to be movable in the vertical direction, and the polishing plate is pressed against the glass substrate by the press adjusting mechanism, the pressing force generated by the press adjusting mechanism, The gap between the polishing pad and the glass substrate can be adjusted by the balance with the elastic reaction force accompanying the deformation of the clearance adjustment pad.

請求項5の発明によれば、研磨ヘッドの長さを1枚または複数枚のガラス基板を1度に研磨できる大きさに設定しているので、短時間で効率よく異常突起を除去することができる。   According to the invention of claim 5, since the length of the polishing head is set to a size capable of polishing one or more glass substrates at a time, abnormal projections can be efficiently removed in a short time. it can.

請求項6の発明によれば、研磨プレートに、ガラス基板の搬送方向に並べて複数の研磨パッドを貼り付けたので、搬送されてきたガラス基板の一部にしか研磨プレートがかからない場合と、ガラス基板の全面に研磨プレートがかかる場合との、研磨パッドのガラス基板に対する当たり方を偏りの少ないものとすることができる。   According to the invention of claim 6, since a plurality of polishing pads are affixed to the polishing plate in the direction of transport of the glass substrate, the polishing plate only covers a part of the transported glass substrate, and the glass substrate When the polishing plate is applied to the entire surface, the method of hitting the polishing pad against the glass substrate can be made less biased.

請求項7の発明によれば、研磨面に液体(例えば、純水)を供給することにより、研磨かすを排除することができ、無用な傷の発生を防止することができる。   According to the seventh aspect of the present invention, by supplying a liquid (for example, pure water) to the polishing surface, polishing debris can be eliminated and generation of unnecessary scratches can be prevented.

請求項8の発明によれば、研磨ヘッドの本体と研磨プレートとの間に設けた加圧チューブに加圧気体を導入することにより、研磨プレートをガラス基板に押圧させることができる。また、その状態で、反力チューブに加圧気体を導入し、加圧チューブと反力チューブの圧力バランスを調整することにより、研磨プレートのガラス基板に対する押圧力を自由に調整することができる。また、加圧チューブの圧を抜き、反力チューブに圧を導入することにより、研磨プレートをガラス基板から離間させることができる。   According to the invention of claim 8, the polishing plate can be pressed against the glass substrate by introducing the pressurized gas into the pressure tube provided between the main body of the polishing head and the polishing plate. In this state, the pressing force of the polishing plate against the glass substrate can be freely adjusted by introducing a pressurized gas into the reaction tube and adjusting the pressure balance between the pressure tube and the reaction tube. Further, the polishing plate can be separated from the glass substrate by releasing the pressure of the pressure tube and introducing pressure into the reaction tube.

請求項9の発明によれば、クリアランス調整用パッドの働きにより、ガラス基板の表面の膜上に存在する異常突起だけに研磨パッドを当てることができ、膜厚を減らさずに異常突起だけを除去することができる。   According to the ninth aspect of the present invention, the polishing pad can be applied only to the abnormal protrusion existing on the film on the surface of the glass substrate by the function of the clearance adjusting pad, and only the abnormal protrusion is removed without reducing the film thickness. can do.

請求項10の発明によれば、カラーフィルタの着色膜に生じた異常突起を短時間で効率良く除去することができる。   According to the tenth aspect of the present invention, it is possible to efficiently remove abnormal protrusions generated on the colored film of the color filter in a short time.

請求項11の発明によれば、搬送ライン上の検査機の前段に研磨機を組み込んで、研磨後に全数検査を実施することにより、異常判定数を大幅に減らすことができ、生産効率の向上を図ることができる。   According to the invention of claim 11, by incorporating a polishing machine in front of the inspection machine on the transfer line and carrying out a total inspection after polishing, the number of abnormality determinations can be greatly reduced, and the production efficiency can be improved. Can be planned.

請求項12の発明によれば、ガラス基板の搬送ライン上に複数台の研磨手段を配置し、最上流の研磨手段として上述のクリアランス調整用パッドを有する研磨機を配置したので、前段の研磨手段で異常突起を除去し、後段の研磨手段で仕上研磨を行うことができ、1つの搬送ライン上で役割分担した研磨処理を行うことができ、生産効率の向上を図ることができる。   According to the invention of claim 12, a plurality of polishing means are arranged on the conveyance line of the glass substrate, and the polishing machine having the above-mentioned clearance adjustment pad is arranged as the most upstream polishing means. Thus, abnormal projections can be removed, and finish polishing can be performed by a subsequent polishing means, and polishing processing can be performed with a role shared on one transport line, thereby improving production efficiency.

請求項13の発明によれば、クリアランス調整用パッドの潰れ変形により、ガラス基板の表面と研磨パッドとの隙間を最適に保つようにしたので、膜自体の正常な厚みを減らさずに、異常突起だけを研磨パッドによる研磨により短時間で効率よく取り除くことができる。   According to the invention of claim 13, since the clearance between the surface of the glass substrate and the polishing pad is optimally maintained by the crushing deformation of the clearance adjustment pad, the abnormal protrusion is not reduced without reducing the normal thickness of the film itself. Can be efficiently removed in a short time by polishing with a polishing pad.

以下、本発明の実施形態を図面を参照して説明する。
この実施形態の研磨機は、液晶表示装置用カラーフィルタのRGB膜を研磨するためのものであり、図1は実施形態の研磨機を装備したガラス基板W(カラーフィルタ)の製造ラインの要部構成を示す平面図、図2は同要部構成を示す側面図、図3は上定盤としての研磨プレートの下部構成を示すガラス基板の搬送方向の側方から見た断面図、図4は図3のIV部の拡大図、図5はガラス基板に研磨プレートを押圧させたときの状態を示す図4と同様の拡大図、図6は研磨ヘッドの構成を示すガラス基板の搬送方向の側方から見た断面図で、(a)は研磨プレートをガラス基板に押圧させる前の状態、(b)は研磨プレートをガラス基板に押圧させた状態をそれぞれ示す断面図、図7はガラス基板の搬送方向の正面側から見た研磨ヘッドの概略断面図で、(a)は研磨プレートをガラス基板に押圧させる前の状態、(b)は研磨プレートをガラス基板に押圧させた状態をそれぞれ示す断面図、図8は製造ラインにオンラインで研磨機を組み込んだ場合のシステム構成を示すブロック図である。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
The polishing machine of this embodiment is for polishing the RGB film of the color filter for a liquid crystal display device, and FIG. 1 shows the main part of the production line of the glass substrate W (color filter) equipped with the polishing machine of the embodiment. FIG. 2 is a side view showing the structure of the main part, FIG. 3 is a cross-sectional view of the lower structure of the polishing plate as the upper platen, as viewed from the side in the conveyance direction of the glass substrate, and FIG. 3 is an enlarged view of a portion IV, FIG. 5 is an enlarged view similar to FIG. 4 showing a state when the polishing plate is pressed against the glass substrate, and FIG. 6 is a side of the glass substrate in the conveyance direction showing the configuration of the polishing head. It is sectional drawing seen from the direction, (a) is a state before pressing the polishing plate against the glass substrate, (b) is a sectional view showing a state where the polishing plate is pressed against the glass substrate, and FIG. Outline of polishing head viewed from the front side in the transport direction FIG. 8A is a cross-sectional view showing a state before the polishing plate is pressed against the glass substrate, FIG. 8B is a cross-sectional view showing a state where the polishing plate is pressed against the glass substrate, and FIG. It is a block diagram which shows the system configuration | structure at the time of incorporating.

図1、図2において、1はガラス基板W(カラーフィルタに相当)をその面方向に沿って矢印A方向に搬送する搬送コンベア(搬送経路)、3はガラス基板Wの搬送経路の下側に配置されたガラス基板Wの載る下定盤、10はその下定盤3の上方に配置され、搬送されてきたガラス基板Wの上側の表面を研磨する研磨ヘッド、20はこの研磨ヘッド10の本体11に設けられた上定盤としての研磨プレートである。この研磨機(研磨ヘッド10で代表される部分)は、RGB膜が形成されたガラス基板Wの表面に、研磨プレート20を押圧させつつ、研磨プレート20をガラス基板Wに対して面内移動させることで、ガラス基板Wの表面の膜を研磨するものである。ガラス基板Wは、長方形の平板状のもので、長辺を搬送方向Aと平行にした姿勢で一方の短辺を前端にして、上流側から研磨ヘッド10の下側に搬送されて来て、研磨ヘッド10による研磨後、そのままの姿勢と速度で下流側へ搬送されて行く。   1 and 2, reference numeral 1 denotes a transfer conveyor (transfer path) for transferring a glass substrate W (corresponding to a color filter) in the direction of arrow A along the surface direction, and 3 denotes a lower side of the transfer path of the glass substrate W. A lower surface plate 10 on which the placed glass substrate W is placed is disposed above the lower surface plate 3, and a polishing head for polishing the upper surface of the glass substrate W that has been conveyed, and 20 is a main body 11 of the polishing head 10. It is a polishing plate as an upper surface plate provided. This polishing machine (portion represented by the polishing head 10) moves the polishing plate 20 relative to the glass substrate W while pressing the polishing plate 20 against the surface of the glass substrate W on which the RGB film is formed. Thus, the film on the surface of the glass substrate W is polished. The glass substrate W is a rectangular flat plate having a long side parallel to the conveyance direction A, with one short side being the front end, and being conveyed from the upstream side to the lower side of the polishing head 10, After being polished by the polishing head 10, it is conveyed downstream with the same posture and speed.

図3〜図5に示すように、研磨プレート20の下面は研磨定盤面20aとなっており、研磨定盤面20aには研磨パッドとしての固定砥粒研磨シート23と、クリアランス調整用パッド24とが貼り付けられている。クリアランス調整用パッド24は、研磨プレート20をガラス基板Wの表面に押圧させたときに、ガラス基板Wの表面に固定砥粒研磨シート23よりも先に当たって押圧力に応じて潰れ変形し、それにより、ガラス基板Wの表面と固定砥粒研磨シート23との間に最適な隙間H2(図5参照。最適な隙間は数μm以下)を保つためのものである。固定砥粒研磨シート23としては、樹脂材料中にダイヤモンド砥粒又はアルミナ砥粒を混入してシート状に成形したダイヤモンドシート或いはアルミナシートが好適に用いられており、より好ましくはダイヤモンドシートが用いられる。   As shown in FIGS. 3 to 5, the lower surface of the polishing plate 20 is a polishing surface plate surface 20a, and a fixed abrasive polishing sheet 23 as a polishing pad and a clearance adjustment pad 24 are provided on the polishing surface plate surface 20a. It is pasted. When the polishing plate 20 is pressed against the surface of the glass substrate W, the clearance adjusting pad 24 comes into contact with the surface of the glass substrate W before the fixed abrasive polishing sheet 23 and is crushed and deformed according to the pressing force. In order to maintain an optimum gap H2 (see FIG. 5; the optimum gap is several μm or less) between the surface of the glass substrate W and the fixed abrasive polishing sheet 23. As the fixed abrasive polishing sheet 23, a diamond sheet or an alumina sheet formed by mixing diamond abrasive grains or alumina abrasive grains in a resin material into a sheet shape is preferably used, and more preferably a diamond sheet is used. .

クリアランス調整用パッド24は、ウレタン樹脂やウレタンゴム等よりなり、非押圧時には、固定砥粒研磨シート23の下面より所定寸法H1(20μm程度)だけ突出している。なお、固定砥粒研磨シート23は、研磨定盤面20aに、弾性シート(ウレタンゴムやウレタンシートなど)21を介して、両面テープ22により貼り付けられており、弾性シート21により、クリアランス調整用パッド24に対する高さが調整されて、ガラス基板Wに適切な押圧力で接触するようになっている。この場合の各要素の仕様は、次表1の通りである。   The clearance adjusting pad 24 is made of urethane resin, urethane rubber, or the like, and protrudes from the lower surface of the fixed abrasive polishing sheet 23 by a predetermined dimension H1 (about 20 μm) when not pressed. The fixed abrasive polishing sheet 23 is affixed to the polishing surface plate surface 20a by a double-sided tape 22 via an elastic sheet (urethane rubber, urethane sheet or the like) 21, and the elastic sheet 21 provides a clearance adjustment pad. The height with respect to 24 is adjusted to come into contact with the glass substrate W with an appropriate pressing force. The specifications of each element in this case are as shown in Table 1 below.

Figure 2008238365
Figure 2008238365

研磨ヘッド10は、ガラス基板Wの搬送方向Aと直交する方向に自身の長さ方向を向けて配されており、その長さが、搬送経路上を搬送されてくる1枚、または、搬送方向と直交する方向に並んだ状態で搬送されてくる複数枚(本図示例では2枚)のガラス基板Wの全てを1度に研磨できる長さに設定されている。また、研磨プレート20の研磨定盤面20aには、ガラス基板Wの搬送方向に並べて2枚の固定砥粒研磨シート23が平行に互いに間隔をあけて貼り付けられており、そのガラス基板Wの搬送方向の前後にクリアランス調整用パッド24が貼り付けられている。また、2枚の固定砥粒研磨シート23の間に位置させて、研磨プレート20には、固定砥粒研磨シート23による研磨部位に純水(液体)を供給する純水供給口(液体供給口)13が設けられている。   The polishing head 10 is arranged with its own length direction in a direction orthogonal to the conveyance direction A of the glass substrate W, and the length of the polishing head 10 is conveyed on the conveyance path, or the conveyance direction. The length is set such that all of a plurality of (two in the illustrated example) glass substrates W conveyed in a state of being arranged in a direction perpendicular to each other can be polished at a time. Further, two fixed abrasive polishing sheets 23 are affixed to the polishing platen surface 20a of the polishing plate 20 in parallel in the transport direction of the glass substrate W and spaced apart from each other in parallel. A clearance adjusting pad 24 is attached to the front and rear of the direction. Further, a pure water supply port (liquid supply port) for supplying pure water (liquid) to the polishing portion of the polishing plate 20 that is positioned between the two fixed abrasive polishing sheets 23. ) 13 is provided.

図3、図6に示すように、研磨プレート20は、固定砥粒研磨シート23およびクリアランス調整用パッド24を下に向けて、研磨ヘッド10の本体11に上下方向移動自在に設けられている。図6に示すように、研磨ヘッド10の本体11には、下面に開口14aを有した押圧室14が設けられており、研磨プレート20の上部がこの押圧室14の内部に収容されると共に、研磨プレート20の下部が開口14aより下方へ突出している。そして、研磨プレート20の下面の研磨定盤面20aが、搬送されてくるガラス基板Wの上側の表面に対向できるようになっている。   As shown in FIGS. 3 and 6, the polishing plate 20 is provided on the main body 11 of the polishing head 10 so as to be movable in the vertical direction with the fixed abrasive polishing sheet 23 and the clearance adjustment pad 24 facing downward. As shown in FIG. 6, the main body 11 of the polishing head 10 is provided with a pressing chamber 14 having an opening 14 a on the lower surface, and the upper portion of the polishing plate 20 is accommodated inside the pressing chamber 14. The lower part of the polishing plate 20 protrudes downward from the opening 14a. The polishing surface plate surface 20a on the lower surface of the polishing plate 20 can be opposed to the upper surface of the glass substrate W being conveyed.

また、研磨ヘッド10の本体11と研磨プレート20との間には、研磨プレート20をガラス基板Wに押圧させ且つその押圧力を調整する加圧チューブ(メインチューブとも言う)18と反力チューブ(サイドチューブとも言う)19とが設けられている。加圧チューブ18は、加圧エア(エア以外の気体でも可)の導入により膨張して、研磨プレート20を下に向けて押圧するもので、押圧室14の天井壁と研磨プレート20の上端壁との間に配置されている。また、反力チューブ19は、加圧エア(エア以外の気体でも可)の導入により膨張して研磨プレート20を、加圧チューブ18の圧力に抗するよう上に向けて押圧するもので、研磨プレート20の左右に張り出したフランジ25と研磨ヘッド10の本体11側の開口14aの左右の各フランジ15との間に配置されている。図6(b)に加圧チューブ18による下向き力P1と、反力チューブ19による上向き力P2の関係を示す。これら加圧チューブ18と反力チューブ19は、図7に示すように、研磨プレート20の長さ方向のほぼ全長にわたり配設されている。   Further, between the main body 11 of the polishing head 10 and the polishing plate 20, a pressure tube (also referred to as a main tube) 18 that presses the polishing plate 20 against the glass substrate W and adjusts the pressing force and a reaction force tube ( 19) (also referred to as a side tube). The pressurizing tube 18 is expanded by introducing pressurized air (or a gas other than air) and presses the polishing plate 20 downward. The ceiling wall of the pressing chamber 14 and the upper end wall of the polishing plate 20 are pressed. It is arranged between. The reaction force tube 19 is expanded by introducing pressurized air (or a gas other than air) and presses the polishing plate 20 upward against the pressure of the pressure tube 18. The plate 20 is disposed between the flange 25 projecting left and right of the plate 20 and the left and right flanges 15 of the opening 14 a on the main body 11 side of the polishing head 10. FIG. 6B shows the relationship between the downward force P1 due to the pressurizing tube 18 and the upward force P2 due to the reaction tube 19. As shown in FIG. 7, the pressurizing tube 18 and the reaction force tube 19 are disposed over substantially the entire length of the polishing plate 20.

また、これら加圧チューブ18と反力チューブ19に接続された加圧エア給排管(図示略)上には、圧力調整手段(図示略)が接続されている。圧力調整手段は、加圧チューブ18と反力チューブ19に導入する加圧エアの圧力バランスを調整することにより、ガラス基板Wに対する研磨プレート20の押圧力を調整するもので、この圧力調整手段と加圧チューブ18および反力チューブ19とにより、ガラス基板Wに対する研磨プレート20の押圧力を調整するための押圧調整機構が構成されている。   A pressure adjusting means (not shown) is connected to a pressurized air supply / discharge pipe (not shown) connected to the pressure tube 18 and the reaction force tube 19. The pressure adjusting means adjusts the pressing force of the polishing plate 20 against the glass substrate W by adjusting the pressure balance of the pressurized air introduced into the pressurizing tube 18 and the reaction force tube 19. The pressurizing tube 18 and the reaction force tube 19 constitute a pressing adjustment mechanism for adjusting the pressing force of the polishing plate 20 against the glass substrate W.

また、本実施形態の研磨機は、図示しないが、研磨ヘッド10の上端に突出した揺動軸12を介して、研磨ヘッド10を、ガラス基板Wの搬送方向と直交する面内方向の運動成分を少なくとも含むようオービタル運動させる駆動機構を備えている。   In addition, although not illustrated, the polishing machine of the present embodiment moves the polishing head 10 in the in-plane direction perpendicular to the conveyance direction of the glass substrate W via the swing shaft 12 protruding from the upper end of the polishing head 10. A drive mechanism for orbital movement is included so as to include at least.

図8はカラーフィルタCF(ガラス基板W)の製造ラインの概略を示しており、この図の製造ラインにおいては、カラーフィルタCFの搬入部101から完成品のカラーフィルタCFの搬出部102との間を結ぶ搬送ライン103上に、カラーフィルタのRGB膜の状態を検査する検査機120が配置され、搬送ライン103外(オフライン上)に、検査機120で異常と判定されたカラーフィルタの修正機130が配置され、搬送ライン103上の検査機120の手前に上述の構成の研磨機100が配置されている。   FIG. 8 shows an outline of a production line for the color filter CF (glass substrate W). In the production line in this figure, the space between the color filter CF carry-in part 101 and the finished color filter CF carry-out part 102 is shown. An inspection machine 120 for inspecting the state of the RGB film of the color filter is disposed on the conveyance line 103 connecting the two, and a color filter correction machine 130 determined to be abnormal by the inspection machine 120 outside the conveyance line 103 (on-line). Is disposed, and the polishing machine 100 having the above-described configuration is disposed in front of the inspection machine 120 on the conveyance line 103.

次に上記構成の研磨機を用いてガラス基板の表面の膜を研磨する方法について説明する。
搬送コンベヤ1によって、ガラス基板Wが研磨ヘッド10の下に搬送されてきたら、図6(b)、図7(b)に示すように加圧チューブ18に加圧エアを導入して、研磨プレート20を下降させる。また、反力チューブ19にも加圧エアを導入して、研磨プレート20の下降位置を調整し、ガラス基板Wの表面に研磨プレート20の下面を押圧させる。その際、加圧チューブ18と反力チューブ19の圧力バランスを調整して押圧力を調整し、図5に示すように、押圧力に応じてクリアランス調整用パッド24を潰れ変形させることで、ガラス基板Wの表面と固定砥粒研磨シート23との隙間を最適に調整する。そしてその状態で、研磨ヘッド10をガラス基板Wに対して偏心回転させることで、ガラス基板Wの表面の膜を固定砥粒研磨シート23で研磨する。
Next, a method for polishing the film on the surface of the glass substrate using the polishing machine having the above-described configuration will be described.
When the glass substrate W is transported under the polishing head 10 by the transport conveyor 1, as shown in FIGS. 6B and 7B, pressurized air is introduced into the pressure tube 18 to polish the polishing plate. 20 is lowered. Further, pressurized air is also introduced into the reaction tube 19 to adjust the lowered position of the polishing plate 20, and the lower surface of the polishing plate 20 is pressed against the surface of the glass substrate W. At that time, the pressure balance between the pressurizing tube 18 and the reaction force tube 19 is adjusted to adjust the pressing force, and the clearance adjusting pad 24 is crushed and deformed according to the pressing force as shown in FIG. The gap between the surface of the substrate W and the fixed abrasive polishing sheet 23 is optimally adjusted. In this state, the polishing head 10 is eccentrically rotated with respect to the glass substrate W, whereby the film on the surface of the glass substrate W is polished with the fixed abrasive polishing sheet 23.

この場合、押圧時のガラス基板Wの表面と固定砥粒研磨シート23との隙間H2は、ガラス基板Wの表面の膜上に存在する異常突起300(図10参照)だけに固定砥粒研磨シート23が接触し且つ正常厚さの膜に対しては非接触となるように調整する。それにより、膜自体の正常な厚みを減らさずに(つまり、研磨後のガラス基板Wの表面状態を研磨前と全く変えることなく)、異常突起だけを固定砥粒研磨シート23による研磨により短時間で効率よく取り除くことができる。例えば、10μm〜40μmあった異常突起部分の高さを1μm以下に収めることができ、異常突起の残数を限りなくゼロにすることができる。また、高速処理が可能であり、1枚のガラス基板Wの処理時間を30秒以下にすることができる。   In this case, the gap H2 between the surface of the glass substrate W and the fixed abrasive polishing sheet 23 at the time of pressing is only in the abnormal projection 300 (see FIG. 10) present on the film on the surface of the glass substrate W. It adjusts so that 23 may contact and it may become non-contact with respect to the film | membrane of normal thickness. Thereby, without reducing the normal thickness of the film itself (that is, without changing the surface state of the polished glass substrate W from that before polishing), only abnormal protrusions are polished by the fixed abrasive polishing sheet 23 for a short time. Can be removed efficiently. For example, the height of the abnormal projection portion that is 10 μm to 40 μm can be kept to 1 μm or less, and the remaining number of abnormal projections can be reduced to zero. Moreover, high-speed processing is possible, and the processing time of one glass substrate W can be reduced to 30 seconds or less.

従って、図8に示すように、全数のガラス基板Wをこの研磨機100に通すことにより、オフラインでの修正作業数を大幅に減らすことができ、歩留まりおよび生産効率の向上と低コスト生産に寄与することができる。また、研磨プレート20に加える押圧力の調整により、固定砥粒研磨シート23を異常突起よりも低い膜上の突起に接触させることができ、そうすることで、ガラス基板W上の膜の平坦化や平滑化も行うことができる。   Therefore, as shown in FIG. 8, by passing all the glass substrates W through the polishing machine 100, the number of off-line correction operations can be greatly reduced, contributing to improvement in yield and production efficiency and low-cost production. can do. Further, by adjusting the pressing force applied to the polishing plate 20, the fixed abrasive polishing sheet 23 can be brought into contact with a protrusion on the film lower than the abnormal protrusion, so that the film on the glass substrate W is flattened. And smoothing can also be performed.

また、上記研磨機では、研磨プレート20に、ガラス基板Wの搬送方向に並べて2枚の固定砥粒研磨シート23を間隔を開けて貼り付けているので、搬送されてきたガラス基板Wの一部にしか研磨プレート20がかからない場合と、ガラス基板Wの全面に研磨プレート20がかかる場合との、固定砥粒研磨シート23のガラス基板Wに対する当たり方を偏りないものとすることができる。   In the above polishing machine, two fixed abrasive polishing sheets 23 are affixed to the polishing plate 20 in the transport direction of the glass substrate W with a gap therebetween, so a part of the transported glass substrate W It is possible to prevent the fixed abrasive polishing sheet 23 from touching the glass substrate W between the case where only the polishing plate 20 is applied and the case where the polishing plate 20 is applied to the entire surface of the glass substrate W.

更に、研磨面に純水を常時供給することにより、研磨かすを排除することができるので、研磨かすによる無用な傷の発生を防止することができる。   Further, by constantly supplying pure water to the polishing surface, polishing debris can be eliminated, so that unnecessary scratches caused by the polishing debris can be prevented.

また、研磨が終わったら、図6(a)、図7(a)に示すように、加圧チューブ18の加圧エアを抜き、反力チューブ19に加圧エアを導入することにより、研磨プレート20を上昇させることができ、次のガラス基板Wの搬入に備えることができる。   When the polishing is finished, as shown in FIGS. 6A and 7A, the pressurized air from the pressure tube 18 is extracted and the pressurized air is introduced into the reaction tube 19 to thereby polish the polishing plate. 20 can be raised, and the next glass substrate W can be prepared for loading.

図9は製造ライン上に3台の研磨手段を設備した場合を示す側面図である。
この図示例においては、搬送ラインを構成する搬送コンベヤ1に沿って、研磨仕様を異ならせた3台の研磨手段100A、100B、100Cを配置すると共に、最上流の1台の研磨手段100Aとして、上述した本発明の実施形態のクリアランス調整用パッド24を有する研磨機を使用することにより、その研磨機で異常突起を除去するようにしている。また後段の2台の研磨手段100B、100Cは仕上研磨を行うようにしてある。そうすることにより、異常突起研磨除去プロセスと表面研磨プロセスをオンラインで連続して行うことができ、カラーフィルタのRGB膜の平坦化と平滑化が実現できて、生産効率を上げながら品質向上を図ることができる。
FIG. 9 is a side view showing a case where three polishing means are installed on the production line.
In this illustrated example, three polishing means 100A, 100B, and 100C with different polishing specifications are arranged along the transfer conveyor 1 that constitutes the transfer line, and the most upstream polishing means 100A is as follows. By using the polishing machine having the above-described clearance adjusting pad 24 of the embodiment of the present invention, the abnormal projections are removed by the polishing machine. Further, the two polishing means 100B and 100C in the latter stage are configured to perform finish polishing. By doing so, the abnormal protrusion polishing removal process and the surface polishing process can be continuously performed on-line, and the RGB film of the color filter can be flattened and smoothed to improve the quality while increasing the production efficiency. be able to.

例えば、仕上研磨である表面リフレッシュ研磨により、ブラックマトリックスBM上のRGB膜の突起を低く(0.4〜0.6μm→0.2μm以下)することができる(平坦化)と共に、表面粗度をRa=5〜8nm→2nm以下にすることができる(平滑化)。なお、研磨手段100A、100B、100Cは、それぞれ独立した研磨機として設置してもよいが、研磨ヘッドだけをそれぞれ各研磨手段100A、100B、100Cとして独立して設け、その他の構成を共通化させてもよい。   For example, by surface refresh polishing, which is finish polishing, the projections of the RGB film on the black matrix BM can be lowered (0.4 to 0.6 μm → 0.2 μm or less) (flattening) and the surface roughness can be reduced. Ra = 5 to 8 nm → 2 nm or less (smoothing). The polishing units 100A, 100B, and 100C may be installed as independent polishing machines, but only the polishing head is provided as each of the polishing units 100A, 100B, and 100C, and other configurations are made common. May be.

本発明の実施形態の研磨機を装備したガラス基板W(カラーフィルタ)の製造ラインの要部構成を示す平面図である。It is a top view which shows the principal part structure of the manufacturing line of the glass substrate W (color filter) equipped with the polisher of embodiment of this invention. 同要部構成を示す側面図である。It is a side view which shows the principal part structure. 上定盤としての研磨プレートの下部構成を示すガラス基板の搬送方向の側方から見た断面図である。It is sectional drawing seen from the side of the conveyance direction of the glass substrate which shows the lower part structure of the grinding | polishing plate as an upper surface plate. 図3のIV部の拡大図である。FIG. 4 is an enlarged view of a part IV in FIG. 3. ガラス基板に研磨プレートを押圧させたときの状態を示す図4と同様の拡大図である。FIG. 5 is an enlarged view similar to FIG. 4 showing a state when a polishing plate is pressed against a glass substrate. 研磨ヘッドの構成を示すガラス基板の搬送方向の側方から見た断面図で、(a)は研磨プレートをガラス基板に押圧させる前の状態、(b)は研磨プレートをガラス基板に押圧させた状態をそれぞれ示す断面図である。It is sectional drawing seen from the side of the conveyance direction of the glass substrate which shows the structure of a grinding | polishing head, (a) is the state before pressing a polishing plate against a glass substrate, (b) pressed the polishing plate against the glass substrate. It is sectional drawing which shows a state, respectively. ガラス基板の搬送方向の正面側から見た研磨ヘッドの概略断面図で、(a)は研磨プレートをガラス基板に押圧させる前の状態、(b)は研磨プレートをガラス基板に押圧させた状態をそれぞれ示す断面図である。It is a schematic sectional view of the polishing head viewed from the front side in the conveyance direction of the glass substrate, (a) is a state before pressing the polishing plate against the glass substrate, (b) is a state where the polishing plate is pressed against the glass substrate. It is sectional drawing shown, respectively. 製造ラインにオンラインで研磨機を組み込んだ場合のシステム構成を示すブロック図である。It is a block diagram which shows the system configuration | structure at the time of incorporating a grinder on-line on a production line. 製造ライン上に3台の研磨手段を設備した場合を示す側面図である。It is a side view which shows the case where the three grinding | polishing means are equipped on a production line. 液晶表示装置用カラーフィルタの断面図である。It is sectional drawing of the color filter for liquid crystal display devices. 従来のカラーフィルタの製造ラインのシステム構成を示すブロック図である。It is a block diagram which shows the system configuration | structure of the manufacturing line of the conventional color filter.

符号の説明Explanation of symbols

1 搬送コンベヤ(搬送経路)
3 下定盤
10 研磨ヘッド
11 研磨ヘッドの本体
13 純水供給口(液体供給口)
14 押圧室
18 加圧チューブ
19 反力チューブ
20 研磨プレート
20a 研磨定盤面
21 弾性シート
23 固定砥粒研磨シート(研磨パッド)
24 クリアランス調整用パッド
25 フランジ
100 研磨機
120 検査機
130 修正機
100A,100B,100C 研磨手段
H2 最適な隙間
W ガラス基板
CF カラーフィルタ
A ガラス基板の搬送方向
1 Conveyor (transport route)
3 Lower surface plate 10 Polishing head 11 Polishing head body 13 Pure water supply port (liquid supply port)
14 Pressing chamber 18 Pressurizing tube 19 Reaction tube 20 Polishing plate 20a Polishing surface plate surface 21 Elastic sheet 23 Fixed abrasive polishing sheet (polishing pad)
24 Clearance adjustment pad 25 Flange 100 Polishing machine 120 Inspection machine 130 Correction machine 100A, 100B, 100C Polishing means H2 Optimal gap W Glass substrate CF Color filter A Transport direction of glass substrate

Claims (13)

膜が形成されたガラス基板の表面に、研磨定盤面に研磨パッドを貼り付けた研磨プレートを押圧させつつ、該研磨プレートを前記ガラス基板に対して面内移動させることで、前記ガラス基板の表面の膜を前記研磨パッドで研磨するガラス基板の研磨機において、
前記研磨プレートの研磨定盤面に、前記研磨プレートをガラス基板の表面に押圧させたとき、ガラス基板の表面に前記研磨パッドよりも先に当たり押圧力に応じて潰れ変形することにより、前記ガラス基板の表面と研磨パッドとの隙間を最適に保つクリアランス調整用パッドを設けたことを特徴とするガラス基板の研磨機。
The surface of the glass substrate is moved by moving the polishing plate in-plane with respect to the glass substrate while pressing the polishing plate with a polishing pad attached to the surface of the polishing platen on the surface of the glass substrate on which the film is formed. In a glass substrate polishing machine for polishing the film of the film with the polishing pad,
When the polishing plate is pressed against the surface of the glass substrate on the polishing platen surface of the polishing plate, the surface of the glass substrate is crushed and deformed according to the pressing force before the polishing pad, and A glass substrate polishing machine comprising a clearance adjustment pad for optimally maintaining a gap between a surface and a polishing pad.
前記研磨パッドが、固定砥粒研磨シートよりなることを特徴とする請求項1に記載のガラス基板の研磨機。   The glass substrate polishing machine according to claim 1, wherein the polishing pad is made of a fixed abrasive polishing sheet. 前記固定砥粒研磨シートが、弾性シートを介して前記研磨プレートの研磨定盤面に貼り付けられていることを特徴とする請求項2に記載のガラス基板の研磨機。   The glass substrate polishing machine according to claim 2, wherein the fixed abrasive polishing sheet is attached to a polishing platen surface of the polishing plate via an elastic sheet. 前記ガラス基板をその面方向に沿って搬送する搬送経路の下側に、前記ガラス基板の載る下定盤を配置し、
その下定盤の上方に、搬送されてきた前記ガラス基板の上側の表面を研磨するための研磨ヘッドを設け、
この研磨ヘッドの本体に、前記研磨パッドおよび前記クリアランス調整用パッドを下に向けて、上定盤としての前記研磨プレートを上下方向移動自在に設けると共に、
前記研磨ヘッドの本体と前記研磨プレートとの間に、前記研磨プレートをガラス基板に押圧させ且つその押圧力を調整する押圧調整機構を設け、
更に、前記研磨ヘッドを、前記ガラス基板の搬送方向と直交する面内方向の運動成分を少なくとも含むようにオービタル運動させる駆動機構を設けたことを特徴とする請求項1〜3のいずれか1項に記載のガラス基板の研磨機。
The lower surface plate on which the glass substrate is placed is arranged below the conveyance path for conveying the glass substrate along the surface direction,
A polishing head for polishing the upper surface of the glass substrate that has been conveyed is provided above the lower surface plate,
In the main body of this polishing head, the polishing pad and the clearance adjustment pad are directed downward, and the polishing plate as an upper surface plate is provided so as to be movable in the vertical direction,
Provided between the main body of the polishing head and the polishing plate is a pressing adjustment mechanism that presses the polishing plate against the glass substrate and adjusts the pressing force;
The drive mechanism for orbitally moving the polishing head so as to include at least a movement component in an in-plane direction orthogonal to the conveyance direction of the glass substrate is provided. A polishing machine for a glass substrate as described in 1.
前記研磨ヘッドは、前記ガラス基板の搬送方向と直交する方向に自身の長さ方向を向けて配されており、その長さが、前記搬送経路上を搬送されてくる1枚、または、搬送方向と直交する方向に並んだ状態で搬送されてくる複数枚のガラス基板の全てを1度に研磨できる長さに設定されていることを特徴とする請求項4に記載のガラス基板の研磨機。   The polishing head is arranged with its length direction in a direction orthogonal to the transport direction of the glass substrate, and the length is one sheet transported on the transport path, or the transport direction 5. The glass substrate polishing machine according to claim 4, wherein the glass substrate polishing machine is set to a length capable of polishing all of a plurality of glass substrates conveyed in a state of being arranged in a direction orthogonal to the horizontal direction. 前記研磨プレートに、前記ガラス基板の搬送方向に並べて複数の研磨パッドが互いに間隔をあけて貼り付けられていることを特徴とする請求項5に記載のガラス基板の研磨機。   The glass substrate polishing machine according to claim 5, wherein a plurality of polishing pads are affixed to the polishing plate in the conveying direction of the glass substrate with a space therebetween. 前記研磨プレートに、前記研磨パッドによる研磨面に液体を供給する液体供給口が設けられていることを特徴とする請求項4〜6のいずれか1項に記載のガラス基板の研磨機。   The glass substrate polishing machine according to claim 4, wherein the polishing plate is provided with a liquid supply port for supplying a liquid to a polishing surface by the polishing pad. 前記研磨ヘッドの本体に、下面に開口を有した押圧室を設け、前記研磨プレートの上部を前記押圧室の内部に収容すると共に、研磨プレートの下部を前記開口より下方へ突出させて、その研磨プレートの下面の前記研磨定盤面を、搬送されてくるガラス基板の上側の表面に対向可能とし、
更に、前記押圧調整機構として、前記押圧室の内部に、加圧気体の導入により膨張して前記研磨プレートの上端面を下に向けて押圧する加圧チューブと、前記研磨プレートの左右に張り出したフランジの下側に配され加圧気体の導入により膨張して前記フランジを上に向けて押圧する反力チューブとを設けると共に、前記加圧チューブと反力チューブに導入する加圧気体の圧力のバランスにより、前記ガラス基板に対する研磨プレートの押圧力を調整する圧力調整手段を設けたことを特徴とする請求項4〜7のいずれか1項に記載のガラス基板の研磨機。
The main body of the polishing head is provided with a pressing chamber having an opening on the lower surface, the upper portion of the polishing plate is accommodated in the pressing chamber, and the lower portion of the polishing plate is protruded downward from the opening to polish the polishing plate. The polishing platen surface on the lower surface of the plate can be opposed to the upper surface of the glass substrate being conveyed,
Further, as the pressure adjusting mechanism, a pressure tube which expands by introducing pressurized gas and presses the upper end surface of the polishing plate downwards and protrudes to the left and right of the polishing plate as the pressure adjusting mechanism. A reaction force tube that is disposed under the flange and expands by introduction of pressurized gas and presses the flange upward, and the pressure of the pressurized gas introduced into the pressure tube and the reaction force tube The glass substrate polishing machine according to any one of claims 4 to 7, further comprising pressure adjusting means for adjusting a pressing force of the polishing plate against the glass substrate by balance.
前記クリアランス調整用パッドが、前記ガラス基板の表面の膜上に存在する異常突起だけに前記研磨パッドが接触し且つ正常厚さの膜に対しては非接触となるように、前記ガラス基板の表面と研磨パッドとの隙間を保つためのものであることを特徴とする請求項1〜8のいずれか1項に記載のガラス基板の研磨機。   The surface of the glass substrate so that the clearance adjustment pad is in contact with only the abnormal projections present on the film on the surface of the glass substrate and is not in contact with the film of normal thickness. The glass substrate polishing machine according to claim 1, wherein the glass substrate polishing machine is used for maintaining a gap between the polishing pad and the polishing pad. 前記膜が形成されたガラス基板が、ディスプレイパネルのカラーフィルタであり、前記膜がRGBの着色膜であることを特徴とする請求項1〜9のいずれか1項に記載のガラス基板の研磨機。   The glass substrate polishing machine according to claim 1, wherein the glass substrate on which the film is formed is a color filter of a display panel, and the film is an RGB colored film. . 前記膜が形成されたガラス基板の搬入部から完成品のガラス基板の搬出部との間を結ぶ搬送ライン上に、ガラス基板の表面に形成した膜の状態を検査する検査機を配置し、前記搬送ライン外に、前記検査機で異常と判定されたガラス基板の修正機を配置し、前記搬送ライン上の前記検査機の手前に、請求項1〜10のいずれか1項に記載のガラス基板の研磨機を配置したことを特徴とする膜付きガラス基板の製造ライン。   An inspection machine for inspecting the state of the film formed on the surface of the glass substrate is disposed on the conveyance line connecting the carry-in part of the glass substrate on which the film is formed to the carry-out part of the glass substrate of the finished product, The glass substrate correction apparatus of the glass substrate determined to be abnormal by the said inspection machine is arrange | positioned outside a conveyance line, and the glass substrate of any one of Claims 1-10 in front of the said inspection machine on the said conveyance line. A production line for a film-coated glass substrate, wherein a polishing machine is disposed. 前記膜が形成されたガラス基板の搬送ライン上に、研磨仕様を異ならせた複数台の研磨手段を配置し、これら複数台の研磨手段のうち、ガラス基板の搬送方向の最上流の研磨手段として、請求項1〜10のいずれか1項に記載のガラス基板の研磨機を配置したことを特徴とする膜付きガラス基板の製造ライン。   A plurality of polishing means having different polishing specifications are disposed on the glass substrate transfer line on which the film is formed, and among these multiple polishing means, the most upstream polishing means in the glass substrate transfer direction. A production line for a glass substrate with a film, wherein the glass substrate polishing machine according to any one of claims 1 to 10 is disposed. 請求項1〜10のいずれか1項に記載のガラス基板の研磨機を用いてガラス基板の表面の膜を研磨する研磨方法であって、
膜が形成されたガラス基板の表面に、研磨定盤面に研磨パッドおよびクリアランス調整用パッドを貼り付けた研磨プレートを押圧させ、その押圧力に応じて前記クリアランス調整用パッドを先に潰れ変形させることで、前記ガラス基板の表面と研磨パッドとの隙間を最適に保ち、その状態で、前記研磨プレートをガラス基板に対して面内移動させることで、ガラス基板の表面の膜を前記研磨パッドで研磨することを特徴とするガラス基板の研磨方法。
A polishing method for polishing a film on the surface of a glass substrate using the glass substrate polishing machine according to any one of claims 1 to 10,
Pressing a polishing plate with a polishing pad and a clearance adjustment pad affixed to the surface of a glass substrate on which a film is formed, and deforming the clearance adjustment pad first according to the pressing force In this state, the gap between the surface of the glass substrate and the polishing pad is optimally maintained, and in this state, the polishing plate is moved in-plane with respect to the glass substrate, thereby polishing the film on the surface of the glass substrate with the polishing pad. A method for polishing a glass substrate, comprising:
JP2007084946A 2007-03-28 2007-03-28 Polishing machine of glass substrate, production line of glass substrate with film, and polishing method of glass substrate Withdrawn JP2008238365A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101361122B1 (en) * 2011-07-29 2014-02-20 주식회사 엘지화학 Polishing Apparatus of Improved Productivity

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101361122B1 (en) * 2011-07-29 2014-02-20 주식회사 엘지화학 Polishing Apparatus of Improved Productivity

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